KR20090024602A - Blast processing method and apparatus - Google Patents

Abstract

An apparatus for a grinding process is provided to prevent non-uniformity of processing generated in an inner and an outer circumference surface of a rotation mark by installing a cam controlling the speed of a blow nozzle. An apparatus for a grinding process includes the followings: a blow nozzle(20) spraying an abrasive agent on a work; a rotation sending unit moving the work on a predetermined revolution mark; and a control unit(30) moving the blow nozzle to an intersection direction. The blow nozzle movement control unit comprises a swing arm moving the blow nozzle on an outer circumference line of the mark and an inner circumference line and a cam(35) moving the swing arm with a predetermined pattern.

Description

Grinding Method and Grinding Device {BLAST PROCESSING METHOD AND APPARATUS}

The present invention is to be processed to the surface to be processed by the injection of the abrasive particles and various abrasives (in the present invention, collectively referred to as "abrasive material"). ), And the grinding processing method and the grinding processing apparatus which perform grinding, cutting, cleaning, etc. (in this invention, these are collectively called "grinding."), For example, a silicon wafer A wafer processing method (hereinafter referred to simply as "wafer (W)"), such as a (silicon wafer), which is a processing target and can be used for grinding a film or a contaminant formed on the wafer. It relates to a grinding machine to be used.

For example, as a semiconductor device material such as a wafer, for example, a single crystal silicon wafer is manufactured by processing completed in a plurality of processes. However, in relation to the manufacture of such a semiconductor device, the state of each process may be changed. In order to monitor and examine conditions, etc. in each process, what is called a test wafer called a test wafer is put into a manufacturing process.

Hereinafter, a technical background and a subject are demonstrated using a test wafer as an example.

Such test wafers are used in such a large amount that it is said that about one third of the production amount of the wafers (prime wafers) used in the manufacture of the products actually sold are used, but such test wafers for inspection are Although it can be put into the manufacturing process of a semiconductor device, since it is not finally released as a product, even if it has a smooth surface like a prime wafer, even if it is a regenerated product, there is no problem in use.

Thereafter, such a test wafer is once used in a semiconductor device manufacturing process and used for various tests, and then a film or dirt formed on the surface is removed by etching and used repeatedly. Reduction and manufacturing cost reduction are aimed at.

In order to regenerate such used test wafers, a chemical etching method has conventionally been used as a method of removing a film or the like formed on the surface. However, when the film is removed by chemical etching, the rate of corrosion depends on the material. Because of this difference, when a test wafer containing a film composed of different materials is immersed in the etching solution, irregularities occur on the surface of the test wafer after etching due to the difference in corrosion rate due to the difference in the materials.

Therefore, if the unevenness generated in this way is to be processed into a flat surface such as a prime wafer, it is necessary to make a large part to be cut in the next polishing process. As a result, the test wafer has a large thickness when used once. The width is reduced, thereby limiting the number of reclamation uses.

In addition, in the case of the above-described chemical etching, the use of the etching solution is indispensable. Thus, the etching water, the washing water used for cleaning the silicon wafer after etching, etc. cannot be discarded as it is, and the treatment for harming the etching solution is necessary. Facilities for such treatment are needed.

Therefore, in recent years, the conversion from the chemical treatment using a potion etc. to the dry system which does not use a potion etc. is calculated | required.

As a method of etching a silicon wafer by such a dry method, a method of polishing and removing the film by spraying powder on the film formation surface of the silicon wafer has also been proposed (see Patent Document 1).

In addition to the test wafer, the wafer includes dummy wafers and prime wafers that can be reproduced and used.

Prior art document information of this invention includes the following.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2001-162535

As described above, in the method of removing the coating on the wafer by blowing out the powder, which is an abrasive, for example, when a plurality of wafers are to be processed simultaneously by one treatment, a predetermined number of wafers are placed on a turntable. For example, adjacent to the outer periphery of the turntable, the wafer is arranged so that the outer periphery of the wafer is inscribed within the outer periphery of the turntable, and the turntable is rotated around the center of the turntable (revolution; wafer does not rotate). It is efficient to rotate the wafer by transporting and to spray the abrasive on the moving wafer.

In addition, even when processing a single wafer, the wafer is a fixed point (e.g., a large one such as a wafer for cutting (dicing) a large number of chips, or a case such as a deposition tool or a mold). If the whole processing cannot be carried out by blowing the powder out to a fixed point, the center of the wafer is placed so as to overlap the center of the turntable, the wafer is placed on the turntable, and the center of the turntable is It is necessary to spray the abrasive while rotating (rotating; the wafer itself rotates) as the rotation center.

When the abrasive is sprayed on the entire surface of the wafer moving on the turntable in this manner, the injection nozzle is repeatedly reciprocated by the required number of times so as to traverse the rotation (idle) and return trajectory of the wafer W from the outer circumference to the inner circumference of the turntable. 15 (A), or the nozzles are repeated so as to traverse between the outer periphery lines that oppose each other through one of the rotating wafers or the worktable on the turntable via the periphery line → the center direction → the center of the periphery line. Solution reciprocating movement (refer to FIG. 15 (B)).

However, in the case of moving the spray nozzle by the above method, if the moving speed of the spray nozzle is made constant, the wafer processed by this in either case of Figs. 15 (A) and (B) is rotated ( (Conveyance) The workability (mainly the depth of grinding) is low on the outer circumferential side of the trajectory, and the workability increases on the center side.

That is, as shown in Fig. 16, when looking at the small circle of radius r ₁ and the concentric circles of radius r ₂ , r ₃ , r ₄ , r ₅ , the radius of which is increased by 2, 3, 4, 5 times, For a circle with radius r ₁ , a circle with radius r ₂ is 4 times, a circle with r ₃ is 9 times, a circle with radius r ₄ is 16 times, a circle with radius r ₅ is 25 times, and the area of each circle is The area of each of the multiples of the radius (r ₁ n ² ) is increased, and the area of each endless annular band formed on the outer periphery of the center circle of the radius r ₁ is As it faces the outer circumferential direction, the area increases by 3, 5, 7, 9 ... times (r _n = (2 _n -1) r ₁ ).

Therefore, by the injection nozzle which moves the wafer mounted on the turntable rotating at the constant speed of the angle (theta) per unit time, for example, between the said outer peripheral line and the inner peripheral line concentric with the said outer peripheral line at a constant speed of the distance r per unit time, When machining from the rotation center toward the outer circumferential direction, the machining area per unit time also increases at the magnification as shown in the black fill in the drawing as the moving distance from the center increases. In other words, the machining time per unit area decreases as it goes from the inner circumference side to the outer circumference side.

Therefore, as long as other processing conditions such as the material of the abrasive injected by the injection nozzle, the injection amount of the abrasive per unit time, the arc height or the injection pressure or the injection speed, the injection distance (the distance between the injection nozzle and the workpiece) are constant, as described above. When moving the injection nozzle at constant speed, when the rotational trajectory of one workpiece | work or the several workpiece | work is mounted on the concentric circle of a turntable as mentioned above, the workability is low on the outer peripheral side of the rotational trajectory of a turntable, On the inner circumferential side, there arises a problem that the workability increases, and the entire surface of the wafer cannot be ground uniformly.

As a result, if machining conditions such as machining time are set on the outer circumferential side with low workability, excessive grinding is performed on the inner circumferential side with high workability, and machining conditions are set on the inner circumferential side with high workability. In this case, the outer peripheral side with low workability cannot be completely removed and is left.

In particular, as the size of the silicon wafer is increased to 5, 6, and 8 inches, and shifted to 12 inches even now, the size of the silicon wafer is further increased year by year, and the processing irregularity as described above with the increase in size is even more remarkable. Will appear.

When a plurality of workpieces are placed on the concentric circle of the turntable, if the difference in the degree of workability on the inner circumferential side and the outer circumferential side of such a rotational trajectory is to be eliminated, the turntable is first ground after the wafer has been ground by the polishing apparatus described above. Remove the processed wafer from the upper jig, etc., and change the inside and the outer circumferential direction in the reverse direction from the previous processing, fix it again to the jig, and perform the grinding process again. The work to be divided in turn is required, which requires a long time for the grinding work and is complicated.

In the above description, the case where the test wafer is regenerated has been described as an example. However, this problem is not limited to the case where the test wafer is regenerated. For example, the uneven portions may be polished, ground or have a predetermined shape for the silicon wafer. The same occurs throughout the grinding operation performed by spraying abrasives on the surface of the silicon wafer moving on the circumferential trajectory, such as when forming or forming slits and trimming (dicing) by spraying abrasives. It is a problem.

In addition, not only the case where the object is a silicon wafer, but also the workpiece for moving the rotational trajectory, whether grinding for vapor deposition or mold cleaning, or any other workpiece for grinding. In this case, there is a fear that processing irregularities as described above may occur.

Accordingly, the present invention was devised to solve the above-described problems caused when the abrasive is sprayed on the workpiece moving on the rotational trajectory as described above. In the grinding of the workpiece performed by spraying the abrasive, An object of the present invention is to provide a grinding processing method capable of uniformly grinding the entire surface of a workpiece moving on a rotational trajectory by a relatively simple method, and a grinding apparatus for realizing the method.

In order to achieve the above object, in the grinding method of the present invention, in the grinding method of spraying an abrasive with an injection nozzle 20 on the surface of the workpiece W,

While moving the work W on a predetermined rotational trajectory,

The spray nozzle 20 for spraying abrasives under a certain processing condition is formed to be partitioned into a plurality of isosphere areas by concentric circles centered on the center of the rotation trajectory. Control the movement so that the crossing time of each isoarea area is constant, i.e., relatively fast as it is directed toward the center side of the rotational trajectory, and relatively slow as it is toward the outer circumferential side, It is characterized by moving or oscillating in the direction to intersect (invention of claim 1; see FIGS. 8, 10 and 11). It is also possible to repeat the above-described movements and swings as necessary.

In the planarity of such an area area, for example, when targeting a plurality of workpieces made of wafers whose outer circumference is located on the outer peripheral line side of the turntable, the rotational trajectory of the workpiece is determined from the outer peripheral line and the outer peripheral line. In the case of having a concentric inner circumferential line at a distance equal to the diameter of the workpiece, the distance between the outer circumferential line and the inner circumferential line can be defined as the equilateral area (invention 2 of claim 2; see FIGS. 8 and 10), or When rotating a single workpiece | work, you may create the space in the outer periphery line of the rotational trajectory of the said workpiece | work in the said area area (invention of Claim 5; see FIG. 11). In addition, even when the workpiece | work W has an annular rotation trace which has an inner peripheral line as shown to FIG. 8, 10, you may make this outer peripheral line inside the same area as shown in FIG. 11 (invention of Claim 1). ).

When the inner and outer circumferences of the rotational trajectory are formed into a plurality of isospheres having an area of ds, the movement of the injection nozzle toward the outer circumferential direction within a predetermined time at an arbitrary point of a radius r _n from the center of the rotational trajectory Distance dx, this,

Can be controlled to approximate (the invention of claim 3),

Further, the moving distance dx moving toward the inner circumferential direction is

It can be controlled to approximate with (the invention of claim 4).

In addition, the radius of the concentric circle of the minimum diameter when the inner circumference of the rotational trajectory is concentrically formed into a plurality of isospheres is set to r ₁ , and the injection nozzle on the n-th concentric circle from the center is rotated within a predetermined time. The distance dx _n moving in the direction,

The distance dx _n moving in the inner circumferential direction is

The injection nozzle can be moved so as to approximate (the inventions of claims 6 and 7).

The movement of the injection nozzle 20 may be performed within the range between the outer circumferential line and the inner circumferential line of the rotational trajectory (invention of claim 8), or the circumferential line → center → the outer circumference of the movement or swing. It may be carried out by crossing in the direction between the outer periphery which opposes through the center of a line (invention of Claim 9).

Moreover, the process by the said grinding processing method may be made into the workpiece | work W which revolves around the center of the said rotational trajectory, or may target the workpiece | work W which rotates around the center of the said rotational trajectory. You can do it.

Moreover, the grinding apparatus of this invention is a rotation / conveying means provided with the injection nozzle 20 which injects abrasive into the workpiece | work W, and the tambour 11 etc. which move the said workpiece | work W on a predetermined rotational trajectory. (10) and the injection nozzle 20 control the injection nozzle movement while defining the inside of the rotational trajectory into a plurality of isosphere areas defined by concentric circles centered on the (rotational) center of the rotational trajectory. The means 30 controls the movement of the injection nozzle 20 so that the crossing time of each isoarea is constant, relatively fast as it is directed toward the center side of the rotational trajectory, and relatively toward the outer circumferential side. An injection nozzle movement control means 30 for moving in the direction to intersect the rotation angle equilateral area while controlling the movement speed so as to be slow is provided (invention 10).

The injection nozzle movement control means 30 is concentric with the outer circumferential line of the rotational trajectory and the outer circumferential line by causing the spray nozzle 20 to oscillate with a predetermined axial position as a supporting point. Swing arm 31 for reciprocating between the inner circumference and the cam 35 swinging the swing arm 31 in a predetermined pattern by rotating externally or externally directly or indirectly to the swing arm 31; I can have it, and

When the injection nozzle 20 provided in the swing arm 31 is arrange | positioned in the position P1-P7 which the said injection nozzle 20 should be arrange | positioned at predetermined timing, respectively, of the said swing arm 31, The position where the contact part with the cam is arrange | positioned is calculated | required as reference input points p1-p7, respectively,

The outer shape of the cam 35 can be made to pass through the reference input points p1 to p7 one after another for each rotation angle corresponding to the timing (invention of claim 11; see FIGS. 8, 10, 11). ).

In the grinding apparatus of the said structure, the said swing arm 31 may make it rock in the surface orthogonal to the surface of the rotational trajectory of the said workpiece | work W (invention of Claim 12; see FIG. 13).

In addition, the rotational trajectory of the work W has an outer circumference line and an inner circumference line, and the gap between the outer circumference line and the inner circumference line is defined in the isoarea area,

The distance dx at which the injection nozzle movement control means moves in a predetermined time from the inner circumferential side of the rotational trajectory to the outer circumferential side at any point of the radius r _n at the center of the rotational trajectory,

Car

The distance dx that the injection nozzle moving in the inner circumferential side moves within a predetermined time is

Car

The spray nozzle may be moved to approximate (the invention of claims 13 and 14).

Further, when the inner periphery of the rotational trajectory of the work W is concentrically defined in a concentric manner to form n isospheric areas, the radius of the concentric circles of the smallest diameter that defines the isospheric area is r ₁ ,

The injection nozzle movement control means performs the injection nozzle on the nth concentric circle from the center in the circumferential direction within a predetermined time.

Inward direction, car

The injection nozzle may be moved so as to move at a distance close to the prescribed movement distance dx _n (inventions of claims 15 and 16).

According to the grinding method and the grinding device of the present invention, when the injection nozzle 20 is moved by the configuration of the present invention described above, the relative direction is moved from the outer circumference side to the inner circumference side of the rotational trajectory of the workpiece W to be rotated. In this way, the moving speed is increased, and on the contrary, the moving speed is relatively slowed from the inner circumferential side to the outer circumferential side, thereby reducing the change in the degree of workability occurring at the inner and outer circumferential sides of the rotational trajectory.

As a result, for example, in the regeneration of the test wafer, operations such as changing and processing the test wafers on the turntable over a plurality of times are unnecessary, so that the test wafers can be uniformly ground by one treatment. As a result, the amount of grinding (reduction in thickness) of the test wafer can be reduced, thereby making it possible to increase the number of times of reclaiming use of the test wafer.

Moreover, by providing the cam 35 which controls the moving speed of the injection nozzle 20 as mentioned above so that the injection nozzle 20 may traverse each said isoarea area | region at the constant speed, it is the one of the workpiece | work W which moves a rotation trajectory image. Also in the part, processing time per unit area became constant, and the processing nonuniformity which generate | occur | produces on the inner and outer peripheral sides of a rotational trajectory was almost completely eliminated.

The movement of the injection nozzle 20 does not require the injection of the abrasive against the center of the rotational trajectory, for example, when the workpiece W is orbiting about the center of the rotational trajectory of the turntable. It is achieved by carrying out the movement range of the said injection nozzle in the range between the outer periphery line and the inner periphery line of the said rotation trace, ie, within the workpiece diameter.

On the other hand, the movement of the injection nozzle is performed between the outer circumferential line of the rotational trajectory, the center, and the outer circumferential line replacing the center of the outer circumferential line. For example, grinding is performed on a single work W to be rotated. Even if it was, the uniform processing with respect to the workpiece | work could be performed.

When the injection nozzle 20 is moved by the swing arm 31, the injection nozzle is moved by performing the swing or swing direction of the swing arm in a plane perpendicular to the plane of the rotational trajectory of the workpiece W. It was possible to make a linear movement between the outer circumference of the outer circumference of the outer circumference of the outer circumference of the outer circumference. As a result, there is a difference between the width of the iso-area area and the travel distance of the injection nozzle required for the traversal of the iso-area area, which occurs when the spray nozzle is moved in a half-moon shape by oscillating in parallel with the rotational direction of the work W. It was possible to accurately control the movement of the spray nozzle 20.

In addition, when moving the injection nozzle by the movement distance dx (dx _n ) calculated | required by each above-mentioned formula, it was possible to move the injection nozzle so that the crossing time of the injection nozzle with respect to all the constant area area | regions may become constant.

Next, embodiment of this invention is described below.

In addition, in the following embodiment, although the case where all the workpiece | work W which is the object of grinding processing is made into a wafer is demonstrated as an example, the workpiece | work W in this invention is not limited to a wafer or a silicon wafer as mentioned above, A mold and a jig | tool And a wide variety of industrial machinery and tools, and parts thereof.

The grinding apparatus of this invention is a blast which injects an abrasive to the surface of the workpiece | work W (here, a silicon wafer W as an example and hereinafter only "wafer W" in description of this embodiment.) ) The processing apparatus 1, the rotation / conveying means 10 for moving the wafer W on a predetermined rotational trajectory, the spray nozzle 20 for spraying abrasives on the conveyed wafer W, and the spray nozzle 20 in a predetermined moving direction, At least the movement control means 30 of the injection nozzle for moving at a controlled movement speed of the vehicle (see FIG. 4).

In the blast processing apparatus 1 shown in FIGS. 1-3, the processing chamber 3 for performing blast processing is formed in the cabinet 2 formed by the metal plate etc., and the lower part of this cabinet 2 is carried out. Is formed in the shape of an inverted square pyramid narrowing downward, so that the abrasive injected in the processing chamber 3 can be recovered.

In the processing chamber 3 formed in this cabinet 2, the rotation W comprised by the turntable 11 etc. which move the said wafer W in the processing chamber 3 in a predetermined rotation trace by mounting and rotating the wafer W which is a process target. The conveying means 10 and the spray nozzle 20 which inject | pours an abrasive material with respect to the wafer W attached to this rotation and conveyance means 10 are arrange | positioned, and this spray nozzle 20 is moved in a predetermined movement direction at the controlled movement speed. The injection nozzle movement control means 30 to make it is provided over the inside of the said cabinet 2.

In the present embodiment, the rotation / conveying means 10 includes a turntable 11 that rotates in a horizontal direction in the processing chamber 3 formed in the cabinet 2, and in the illustrated embodiment, the turntable 11 is planar ( When viewed from a flat surface, it forms in the stepless annular shape which made the center part the opening (refer FIG. 5).

The wafer W to be processed may be directly placed on the turntable 11 and transported. However, in the present embodiment, a plurality of jig 12 which can be individually installed on the turntable 11 to be equipped with the wafer W to be processed are provided. It is provided so that the wafer W may be fixed on the jig 12 by fixing means such as a peelable adhesive or a vacuum zipper described later (see Fig. 4).

Here, in this embodiment, this jig | tool 12 forms the disk shape of the size which can mount the wafer W made into a process object, and the wafer W mounted on this jig 12 is injected by the injection nozzle 20 during a process. Means for fixing the wafer W, for example, a vacuum zipper for vacuum adsorption of the placed wafer W, or an electrostatic zipper for electrostatic bonding so as not to be blown off by abrasives or compressed air, or to cause a positional difference. It is preferable to provide such a light.

The jig 12 is positioned and fixed on the above-described turntable 11, whereby the wafer W on each jig 12 is fixed on the turntable 11 in a stable state, and with the rotation of the turntable 11, the turntable 11 Revolve around the rotation center of.

The above-mentioned injection nozzle 20 which injects an abrasive into the wafer W which is moved by the said rotation / conveying means 10 which consists of the said turntable 11 and the jig 12 provided in this turntable 11, In this embodiment, this injection nozzle 20 is referred to as the wafer W It is attached to the injection nozzle movement control means 30 which repeatedly moves in the direction which will traverse the rotation trajectory of this, The injection nozzle movement control means 30 repeatedly moves the injection nozzle 20 in the direction which will cross the rotation trajectory of the said wafer W. At the same time, the moving speed is controlled to be fast as it is directed toward the center side of the turntable 11, and to be slow as it is toward the outer peripheral side.

The injection nozzle movement control means 30 for controlling the movement of the injection nozzle 20 and the movement speed is, as shown in FIG. 5, a swing arm 31 (31 a to 31 c) which swings the injection nozzle 20. And the cam 35 which swings this swing arm 31, and by making the shape of this cam 35 into the shape based on this invention, the movement speed of the injection nozzle 20 is made in the inner to outer circumferential direction as mentioned above. The speed control can be made variable according to the position.

In this embodiment, the cam 35 mentioned above, the motor 36 which rotationally drives this cam, and the power transmission mechanism 37 which transmits the rotation of the said motor 36 to the said cam 35 (in the example shown to FIG. 6 and FIG. 7, a pulley ( pulley) 37a, 37b and the pulley belt 37c) penetrate the inside and outside of the cabinet 2 to the top plate of the cabinet 2 in order to be able to arrange it outside the processing chamber 3 where the influence of abrasives and dust is relatively low. In the structure which installs the bearing 38 to make, and this bearing 38 extends the rotating shaft 32 which penetrated the inside and outside of the cabinet 2, and gave the rotating shaft 32 to the said rotating shaft 32 outside cabinet 2 in the cabinet 2. Doing.

And it is provided so that it may orthogonally intersect with the said rotating shaft 32 in the cabinet 2 at the orthogonal direction to this rotating shaft 32 in cabinet 2, and it will contact with the said cam 35, and will be rocked according to the outer periphery shape of the cam 35. The cam arm 33 is provided, and the swing arm 31 (31 a, 31 b, 31 c) mentioned above is formed by the said rotating shaft 32, the injection nozzle fixing arm 34, and the cam arm 33, respectively.

In the embodiment shown in FIG. 5, three of these swing arms 31 (31 a, 31 b, 31 c) are provided for one blast processing apparatus, and two of these swing arms 31 a, 31 b are provided. By arranging the (two) cam arms 33 and 33 provided in the wall so as to sandwich the cam 35 to be described later (see FIGS. 6 and 7), the two swing arms 31 a and 31 b are rocked, By connecting the rotary shaft 32 of one swing arm 31 a and the rotary shaft 32 of the other swing arm 31 c by the link 39, the three swing arms 31 a, 31 b, and 31 c are connected. It is possible to swing to traverse the movement trajectory of the wafer W by the rotation of the single cam 35, and at the same time, the movement speed of the spray nozzle 20 due to this oscillation is directed to the center side of the rotation trajectory as described above, and to the outer peripheral side. It is controlled so as to be late.

In addition, in the illustrated embodiment, an example in which three swing arms 31 a, 31 b, and 31 c are provided in one blast processing apparatus as described above has been described. Depending on the size of the apparatus, the number of wafers W processed in one batch, and the like, it is possible to increase or decrease the number of injection nozzles 20 and the number of swing arms 31 that move them.

Moreover, in the embodiment shown, although two injection nozzles 20 are attached to each of the injection nozzle fixing arms 34 provided in each swing arm 31 (31a, 31b, 31c) (refer FIG. 4 and FIG. 5), The number of injection nozzles 20 attached to each swing arm 31 (31a, 31b, 31c) may be one, or may provide two or more injection nozzles 20.

As long as the swing arm 31 (31 a, 31 b, 31 c) can reciprocate the injection nozzle 20 so as to traverse the rotational trajectory of the wafer W, its installation position is not particularly limited, and it is not limited to any position of the cabinet 2. In the illustrated embodiment, the turntable 11 when the rotating shaft 32 serving as the support point in the swing of the swing arms 31 (31 a, 31 b, 31 c) is viewed in plan view. While the cam 35 is disposed on the inner circumferential side of the turntable 11 with respect to the rotational shaft 32 (see FIG. 5), on the contrary, the rotational shaft 32 serving as the support point of the swing arm 31 is disposed on the inner circumference. It may be arrange | positioned so that the side and cam 35 may become an outer peripheral side, and are not limited to embodiment shown in figure.

The movement of the injection nozzle 20 that intersects the rotational trajectory of the wafer W is relatively high in speed as it moves from the outer circumferential side to the inner circumferential side of the turntable 11, and the speed increases in the direction from the inner circumferential side to the outer circumferential side. Controlled to change late.

As shown in Fig. 8, the movement speed control of the injection nozzle 20 is divided into a plurality of isosphere areas so that the area is constant by the rotational trajectory and concentric circles of the wafer W, and injection is performed on each isoarea area. The crossing time of the nozzle 20 is controlled to be constant. Therefore, as a result, the moving speed of the injection nozzle 20 is high as it moves from the outer peripheral side to the inner circumferential side, and the moving speed is controlled so that the moving speed changes later as it moves from the inner circumferential side to the outer circumferential side. In this way, the processing area which can be processed per unit time by spraying the abrasive in the same processing conditions can be made constant on the inner circumferential side and the outer circumferential side of this trajectory.

In the example shown in FIG. 8, for convenience of explanation, an example in which the rotational trajectory of the wafer W is divided into six equal area regions formed in an endless annular band is shown. More preferably, the rotational trajectory of the wafer W is captured as a continuation of a myriad of fine isoarea regions, and the injection nozzle 20 is moved so that the crossing time of each isoarea region is a constant time τ. By controlling this, it becomes possible to make the processing area per unit time more accurately.

Thus, the change of the moving speed of the injection nozzle 20 which can eliminate a process nonuniformity and unevenness in the inner peripheral side and the outer peripheral side of a rotation trace can be computed as an example as follows.

In the case where the wafer W is moving on an annular rotation trajectory of which the radius of the inner circumference is r and the radius of the outer circumference is R, the injection nozzle is moved from the center side of the rotational trajectory of the wafer W toward the outer circumferential side. In the case of crossing between the outer circumference line and the inner circumference line of the rotation trajectory, the distance at which the injection nozzle moves between the predetermined time τ at an arbitrary point of radius r _n at the center of the rotation trajectory in dx and the predetermined time τ If the processing area of ds is ds,

Use the quadratic equation for dx and ignore the negative solution to get the solution below.

Here, in the case where the rotational trajectory of the wafer W is divided into n equal area areas,

Therefore, Spray nozzle for movement in the circumferential direction on ds in the above formula (1), the formula (2) is substituted and at the same time, written by substituting an arbitrary value point r _n of, from the arbitrary point r _n The distance dx which 20 moves per predetermined time (tau) can be calculated.

Using the above equations (1) and (2), the wafer W (diameter 400 mm) placed on a turntable with an outer diameter (diameter of outer circumference) of φ1400 mm and an inner diameter (diameter of inner circumference) of φ1000 mm can be ground. When the moving distance for each predetermined time τ of the spray nozzle is determined, the inner and outer circumferences of the turntable are the outer and inner circumferences of the rotational trajectory of the wafer W, where R = 700 mm in the formula (2), r If the rotational trajectory of the wafer W is partitioned into 18 equal area areas (n = 18) as = 500 mm,

According to the above formula (2),

Therefore, let the inner periphery of the turntable be the starting point r ₀ (r ₀ = r = 500 mm), and the moving distance dx ₁ , of the injection nozzle moving in the circumferential direction between this starting point r ₀ and a predetermined time τ. And when the position (radius from the center of the rotational trajectory) of the injection nozzle after the predetermined time τ elapses is r ₁ , according to equation (1),

To the same type, _n r in the r ₁ in the expression (1) As (starting point of spray nozzle 20)

The distance traveled between the predetermined time τ is determined by dx ₂ , the position of the injection nozzle after the predetermined time τ (radius from the center of the rotational trajectory) r _2, and the same operation is repeated by the number of divisions of the equal area (n = 18). If the solutions dx ₂ to dx ₁₈ and r ₂ to r ₁₈ are obtained, the width of each isosphere area, that is, the moving distance of the injection nozzle for each predetermined time τ can be obtained.

As an example, the moving distance dx ₁ to dx ₁₈ of the injection nozzle for every predetermined time τ determined by the above method, and the distance r ₀ from the center of the rotational trajectory. ~ R is _18, and is shown on Table 1 as follows, respectively.

In the above description, the moving distance of the injection nozzle 20 and the radius from the center for each predetermined time τ when the injection nozzle 20 moves from the center side of the rotational trajectory toward the outer circumferential side are determined, respectively. The same result can be obtained even when the nozzle 20 moves from the outer peripheral side of the rotational trajectory to the inner peripheral side.

That is, when the distance dx which the injection nozzle moves per predetermined time (tau), and the processing area are ds at the position of arbitrary radius r _n ,

Use the quadratic equation for dx and ignore the negative solution to get the solution below.

Here, the outer circumference of the turntable spray nozzle _{(r 18 = R = 700 mm} ) as the starting point distance dx ₁₈ to move between a certain time τ, the linear equation

Therefore, the position (radius r ₁₇ from the rotational locus center) of the injection nozzle after a predetermined time τ elapses from the start of the movement of the injection nozzle is

The distance to move every predetermined time τ and the distance from the rotational trajectory center after the movement are the same results as those obtained when the injection nozzle is moved from the center side to the outer peripheral side (see Table 1).

By concentric circles with the radius r ₁ to r ₁₇ obtained as described above, the area is divided on the turntable to form an equal area, and the spray nozzle traverses each of the defined iso area in the above-described constant time τ. By controlling the movement speed of the injection nozzle, the movement speed of the injection nozzle was controlled so that the processing area per unit time was constant.

As described above, the cam 35 for allowing the injection nozzle 20 to move at a controlled speed can use a cam called a "heart cam" with a heart shape as shown in FIG. 6 as an example. By specifying the shape as follows, as described above, it is possible to realize the movement of the spray nozzle 20 which makes the traversal time of each isoarea region obtained by dividing the rotational trajectory of the wafer W by the isoarea. .

FIG. 8 is an explanatory view for explaining a specific method of the outer diameter shape of the cam 35 that enables the movement speed control of the above-described injection nozzle 20, and the straight line connecting two circles in the figure is fixed to the injection nozzle of the swing arm 31 The arm 34 and the cam arm 33 are respectively shown. In this figure, for convenience of explanation, the spray nozzle fixing arm 34 and the cam arm 33 are moved in opposite directions about the support point (the rotation axis 32; represents about the middle of two circles). Although the state arrange | positioned at the linear form is assumed, the arrangement | positioning of the cam arm 33 and the injection nozzle fixing arm 34 can be made into the arrangement with angle like the V shape shown in FIG.

The concentric circles on the right side of the drawing are concentric circles partitioned by a predetermined number (six in the example) of the rotational trajectory of the wafer W, and the spray nozzle 20 passes through these isotropic areas. The cam shape which swings the swing arm 31 so that time becomes constant is shown on the left side in the figure.

In Fig. 8, points P1 to P7 represent the equilateral area formed between the movement trajectory of the injection nozzle 20 attached to the injection nozzle fixing arm 34, the outer and inner periphery lines of the movement trajectory of the wafer, and the inner and outer periphery lines. Intersect with the dividing line (equal area line), that is, the place where the spray nozzle 20 should be located at each predetermined time τ, and the points p1 to p7 indicate that the spray nozzle 20 is at the points P1 to P7. Is the position (reference input point) of the contact point (input point) with the outer periphery of the cam of the cam arm 33, and each point of the same number in P and p has a correspondence relationship with each other.

In addition, when the some injection nozzle 20 is attached to the injection nozzle fixing arm 34, either of these is the movement trace of one injection nozzle 20, or arbitrary on the injection nozzle fixing arm 34 in the arrangement | positioning section of the injection nozzle 20. The intersection of the movement trajectory of the point and the inner, outer circumference line, and the equilateral area line may be set as the points P1 to P7 described above respectively.

Incidentally, the positional relationship between the turntable 11, the swing arm 31, and the cam 35 may be any arrangement as long as the injection nozzle 20 can be moved at a predetermined speed change with the rotation of the cam 35. In the present embodiment, the cam In order to specify the outline shape of 35, the turntable 11, the swing arm 31, and the cam 35 were set as the arrangement | positioning shown in FIG. 9 as an example.

In FIG. 9, the swing arm 31 described above has the spray nozzle fixing arm 34 and the cam arm 33 arranged on the same straight line passing through the support point Q ₀ (rotation shaft 32), and the swing at the intermediate position of the swing range. The arm is placed on the tangent of the middle circle between the inner and outer circumferences of the turntable (circle having the center of rotation of the turntable and having a radius of (R + r) / 2) P _C , and the middle circle P _C and the The intersection point between the line perpendicular to the tangent line passing through the tangent line and the outer circumference and the inner circumference of the turntable 11 is the end of the moving range of the spray nozzle 20 attached to the spray nozzle fixing arm 34, respectively.

Further, the input points of the cam arm 33 at both ends of the movement range of the contact point (input point) with the cam outer circumference, that is, when the spray nozzle 20 is on the outer circumferential line of the turntable and on the inner circumferential line of the turntable ( The nozzle which meets on the extension of the straight line connecting the reference input points p1 and p7, and is located at the minimum radius C _min of the cam with respect to either of the input points (reference input points p1 and p7), in the example shown 20 in the short-side movement (端側) when in the phase of the turntable 11, the inner diameter, the minimum radius C _min the separated position of the cam, and place the center of rotation O of the cam.

Therefore, the arrangement of the rotation center O of the cam 35 with respect to the rotation center P ₀ of the turntable is

Becomes

In addition, arrangement | positioning of the rotation center O of a cam is not limited to the example shown in FIG. 8, FIG. 9, For example, as shown in FIG. 6, the extended image of the circular arc which the movement trace of the contact point of a cam arm and a cam outer periphery draws is shown. You may arrange | position to.

In FIG. 8, the outer circumference of the cam 35 sequentially contacts the input points p1 to p7 while the cam 35 rotates from 0 ° to 180 ° in a predetermined rotational direction, and the remaining 180 ° to 360 ° (0 °). It is configured to be in contact with p7 to p1 sequentially during the rotation, so that the spray nozzle 20 can be repeatedly rotated from P7 to P1 again with P1 to P7 by one rotation of the cam. have.

Then, the outer circumference of the cam 35 is sequentially turned at every predetermined rotation angle of the cam 35 (in the embodiment of the illustration in which the rotational trajectory of the wafer W is divided into six equally spaced regions, every 12 degrees divided by 12 twice). By setting it as the shape which passes p1-p7, it can control so that the injection nozzle 20 may pass each point of P1-P7 every fixed time.

The outer shape of these cams, it around the rotational center O of the aforementioned cam 35, at the same time drawing a concentric circle passing through each of the reference input point p1 ~ p7, respectively, to the concentric circles in isometric view (等角度) for each 30 ^o It is divided into an isometric line, one of which is called a reference isometric line L1, passes through an intersection point with a circle passing through the reference input point p1, and rotates clockwise and anticlockwise from the reference isometric line L1. Intersect with isolines L2, L12 and circle through reference input point p2, 30 ^o apart from clockwise rotation, with points L3, L11 and circle through reference input point p3, isolines L4, L10 Intersection with a circle passing through the reference input point p4, an intersection of the isometric lines L5, L9 with a circle passing through the reference input point p5, and an intersection with a circle passing through the isolines L6, L8 and the reference input point p6 Reference input at conformal line L7 at a position 180 ° relative to the reference conformal line L1. It amounts to a minimum circle that passes through the intersection point p7, can be controlled substantially by the cam surface to the outer circumference of the heart-shaped to form a shape of the injection nozzle 20 repeatedly moves to the above moving speed.

In addition, specification of the external shape of the cam 35 by the method mentioned above is applicable also when the arrangement | positioning of the rotation center O of the cam 35 with respect to the cam arm 33 is changed, In the description referring to FIG. 8, the reference input point p7 Although the example which arrange | positioned the rotation center O of the cam at the side was demonstrated, in contrast to this, even when the rotation center O of the cam is provided in the reference input point p1 side, the external appearance of the cam of the shape corresponding to this is easy. Can be specified (see FIG. 10).

In addition, in the description referring to FIG. 8, for convenience of explanation, the case where the movement trajectories of the wafer W are partitioned into six equilateral area areas has been described as an example, but the movement trajectories of the wafer W are, for example, 18 and 36 and In addition to dividing the surface into more detailed isosphere areas, it is possible to set it more finely every 10 ^o when the isometric lines are divided into 18 isoareas, or every 5 ^o when the compartments are divided into 36 isosphere areas. In this way, it is possible to specify the outer circumferential shape of the cam 35 in more detail. In implementation, the division number can be selected arbitrarily.

In the above description with reference to FIGS. 8 to 10, the repeating movement of the spray nozzle 20 is traversed in a direction to intersect the isotropic area (width of the endless annular trajectory) between the outer circumference line and the inner circumference line in the rotational trajectory of the turntable. As described above, even when the spray nozzle 20 is repeatedly moved so as to traverse the rotating turntable between the outer circumferential line → the center → the outer circumferential line which opposes through the center of the outer circumferential line, the turntable is formed in a plurality of isoareas to form the spray nozzle. By controlling the movement of the spray nozzle so that 20 traverses each isoarea region at a predetermined time tau, it is possible to realize a cutting process in which the machining area becomes constant per unit time.

As an example, in the case of moving the turntable 20 as described above, the moving speed (distance dx moving between the predetermined time τ) of the injection nozzle at a position r _n from the rotation center of the turntable is determined as follows. You can get it based.

If the outer diameter (work to wafer diameter) of the turntable is R and the area (total machining area) on the turntable is S,

Therefore, the area ds of each iso area in the case of forming n iso area on the turntable is given by

Becomes

Here, the radius of the smallest circle among the concentric circles dividing the turntable into n is set to r ₁ , and the radius of the concentric circle that is one (1) size larger than the minimum circle is r ₂ and two (2) larger. The radius of concentric circles is r ₃ . … In this case, the distance dx at which the injection nozzle moves in the circumferential direction at a predetermined time τ from the position of the radius r _n of the _nth circle and the radius r _n is as shown in the following _formula .

In addition, from the predetermined position r _n on the rotational trajectory, the movement distance dx _{n- 1} , in which the injection nozzle 20 moves at a predetermined time τ in the inner circumferential direction, is

Becomes

As an example, when a turntable with a diameter of 1400 mm (R = 700 mm) is set to 18, the dividing number n of the isosphere area is 18, the arbitrary positions r (r1 to r18) of the spray nozzles are defined at this position. The distance dx (dx ₁ to dx ₁₈ ) in which the injection nozzle 20 moves in the outer circumferential direction at time τ can be obtained as shown in the following formula, respectively (however, calculation of r ₄ to r ₁₈ and dx ₄ to dx ₁₈ is omitted). ).

By,

As described above with reference to Fig. 15 (B), the movement of the spray nozzle 20 with respect to the outer circumferential line → center → the outer circumferential line opposed to each other via the center of the outer circumferential line of the turntable is parallel to the rotational direction of the turntable. Although the swinging arm 31 may be rocked and the spraying nozzle 20 may cross the turntable in a half-moon shape, as shown in FIG. 13, the swinging nozzle 31 is swinging on the surface orthogonal to the plane of the rotational trajectory of the turntable. For example, it is possible to linearly move 20 over the diameter of a turntable.

An example of the cam-shaped specific method used when controlling the moving speed of the injection nozzle 20 by the swing arm 31 which oscillates in the surface orthogonal to the surface of the rotational trajectory of a turntable shown in FIG. 13 is shown in FIG. The outer shape of the cam in the concentric circle of the dashed line shown on the left side of the figure, and the rotational trajectory of the workpiece W in which the concentric circles of the solid line are divided into a plurality of isosphere areas on the right side of the drawing, respectively, and a straight line forming both swing The figure which shows typically the arm 31 is the explanatory drawing of the specific method of the cam shape demonstrated with reference to FIG. 8, FIG.

However, in the cam shape described with reference to Figs. 8 and 10, the position of the outer shape of the cam is plotted and checked at the contact position with the input point of the cam arm when the spray nozzle 20 is on the same area line. Although this confirmed point was put together and it demonstrated as specifying a cam shape, in embodiment shown in FIG. 11, the position (P1, P14) of the cam arm 33 when the injection nozzle 20 is in the both ends in the movement direction. Plots the point passing through the cam outline at the position corresponding to the position (P2 to P13) of the injection nozzle 20 at the midpoint of the width direction of each equilateral area, and at the same time connects the point of the cam. The external shape is different from the specific method of the external shape of the cam described with reference to FIGS. 8 and 10.

That is, in the example of illustration, in the rotation angle 15 ^o of the cam which the spray nozzle 20 traverses each isosphere area | region, at the time of the rotation of the intermediate point 7, 5 ^o , the injection nozzle is a The outer shape of the cam 35 is specified so that it is in the midpoint of the width direction.

In addition, in the cam described with reference to Figs. 8 and 10 described above, the rotation in the inner circumferential direction from the outer circumferential direction between the outer circumferential line of the turntable and the inner circumferential line which is concentric with the outer circumferential line by rotation of 180 ^o in a predetermined direction, by the rotation of the remaining 180 ^o, the inner periphery, but to restrict the movement of the outer peripheral direction from the direction, in the cam of this embodiment, the turntable the outline → the center as described above → confronting via the center of the outer peripheral line It is to regulate the movement of the spray nozzles crossing the outer circumference line. Therefore, by the rotation of 90 ^o in a predetermined direction, the movement from the rotation center to the rotation center, the rotation from the rotation center to the outer periphery is carried out by rotation of 90 to 180 ^o , and the reciprocating path of the injection nozzle (往 路) ), And then control the movement speed of the jet nozzle 20 from the outer periphery of the turntable to the outer periphery from the outer periphery of the turntable with a rotation of 180 ^o to 360 ^o (0 ^o ). It is comprised in the shape which can be made. Therefore, the cams described with reference to FIGS. 8 and 10 are plotted with respect to the number formed by the isoarea region where the rotational trajectory of the workpiece or the wafer is uniformly plotted at four times or more points. In comparison, the number of plots is increasing.

In addition, even when the injection nozzle 20 traverses between the periphery of the turntable, which is replaced by the periphery of the turntable, the center, and the center of the periphery of the turntable, as described above with reference to FIGS. Correspondingly to the position of the cam arm 33 when the injection nozzle 20 is present, the outer shape of the cam 35 may be plotted to specify the cam shape.

Each arrangement of the turntable, the swing arm 31, and the cam 35 in the embodiment of FIG. 11 which explains the cam-shaped specific method in the case of FIG. 13 in which the injection nozzle 20 oscillates in the orthogonal direction with respect to the plane of the rotational trajectory of the turntable. The relationship of is as shown in FIG. 12 as an example.

As shown in FIG. 12, in the swing arm 31 of this embodiment, the center position of the oscillation range between the outer periphery line of the rotational track → center → the outer periphery which opposes through the center of the said outer line has the rotation center P of a turntable. It is comprised so that it may be arrange | positioned on the straight line which passes, and the rotation center O of the cam 35 is arrange | positioned on the extension line which connects reference input points p1 and p14, On the other hand, rather than the reference input point p14 of the cam center O side, Radius of C _min It is arrange | positioned in the distant position, and the rotation center O of a cam becomes a position separated Ly and Lx shown below with respect to the rotation center P of a turntable.

In the structure of FIG. 11 demonstrated above, the external shape of the cam 35 is specified as follows.

First, on the movement trace of the position (input point) which contacts the cam 35 outer periphery of the cam arm 33, the corresponding position of the said input point when the injection nozzle 20 is arrange | positioned at the position of P1-P14 mentioned above is a reference input point. Specified as p1 to p14, the concentric circles passing through these reference input points p1 to p14 are drawn in the circle on the left side of the drawing (concentric circles indicated by dotted lines in FIG. 11).

And an angle line such as dividing the number of divisions of the circumferential trajectory of the workpiece W (6 in the embodiment of FIG. 11) (24 in every 15 ^{o in} the example of FIG. 11) and the circle on the left in the drawing at an equal angle. the L1 ~ L24 at the same time in the figure, passes through the center of rotation O of the cam, and an angle between the line L1 and L24, L12 and L13, and so the angle line between, and indexing the (in the example of FIG. 11 7. 5 ^o) Install baseline L0.

The intersection between the reference line L0 and the concentric circle passing through the reference input point p1 is the intersection of the position of the maximum diameter C _max of the cam and the concentric circle passing through the reference input point p14, and the position of the minimum diameter C _min of the cam. Plot as.

Further, as the equiangular line moves away from the reference line L0 in the rotational direction starting from the plot position of the maximum diameter C _max , the intersection of the concentric circles passing through L1, L24 and p2, and the concentric circles passing through L2, L23 and p3. , Concentric circles passing L3, L22 and p4 ... … Like the intersection of the concentric circles passing through L12, L13, and P13, the intersection of the concentric circles which become small diameters by one step and the back angle line is plotted, and the points of each plot are made to form an outer shape of the cam. have.

In addition, the blast processing apparatus 1 configured as described above is provided with an injection nozzle for air blow to remove abrasives and the like deposited on the wafer W at any position facing the turntable 11. Can be.

Hereinafter, one (1) cycle Example in a different processing method is shown about various workpieces or wafers.

The film formed on the test wafer surface was removed, and the wafer surface became a uniform smooth mirror surface without processing irregularities and spots, and no mirror polishing was necessary by a polishing apparatus. As a result, the time required for polishing the wafer can be extremely shortened, and a processing device is unnecessary. In addition, since the film formed on the wafer can be effectively removed, the wafer can be regenerated.

The blast processing apparatus 1 comprised as mentioned above is a dust collector which sucks in the compressed air supply source which is not shown, such as an air compressor, the abrasive sprayed in the processing chamber 3, the dust which arose at the time of cutting, etc. Collector 50 and cyclone 60 for recovering the abrasives from which dust was removed from the dust-permeable abrasives sucked from the processing chamber 3 by the dust collector 50 were connected, and the wafer W was blasted as shown in FIG. A machining system for blasting is constructed.

When the opening and closing door provided in the cabinet 2 of the blast processing apparatus 1 is opened, the wafer W is attached to the jig 12 on the turntable 11 arranged in the cabinet 2, and the blast processing apparatus 1 is started. The cam is sprayed from the spray nozzle 20 mounted on the arms 31 (31 a, 31 b, 31 c) and at the same time the cam contacts the outer circumference of the cam arm 33 provided on the swing arm 31 (31 a, 31 b, 31 c). 35 receives rotational driving force from a driving source such as a motor 36 and rotates in a constant direction at a constant speed.

The rotation of the cam 35 links the swing arm 31 a, 31 b in which the cam arm 33 is brought into contact with the outer circumference of the cam 35, and the rotation shaft 32 provided in one of 31 a which is one of the swing arms 31 a, 31 b. Through 39, all swing arms 31 c with the rotation axis 32 connected start swinging.

Due to the swing of the swing arms 31 (31 a, 31 b, 31 c), the spray nozzle 20 is repeatedly moved so as to traverse the movement trajectory of the wafer W which forms an endless annular shape, and the inner peripheral side from the outer peripheral side of the turntable 11. The speed is controlled so that the moving speed becomes relatively high when moving to the inside, and the moving speed is controlled so that the moving speed becomes relatively slow in the movement from the inner circumference side to the outer circumference side, thereby moving the injection nozzle 20 at a constant speed. The occurrence of the difference in the degree of workability on the outer circumferential side and the inner circumferential side of the turntable, which has been generated in some cases, is prevented.

In particular, assuming that isosphere areas divided into concentric circles are arranged so that the movement trajectory of the wafers W is equal, the wafer W is turnedtable by controlling the injection time of the spray nozzles 20 crossing each iso area to be constant. Irrespective of the position of the 11 phases, the processing area per unit time could be made constant.

As a result, it was possible to process the wafer W as a processing target evenly at any position, regardless of which position on the turntable 11. As described above, grinding was performed by the method of the present invention. In the case where the purpose of the grinding is to remove the film formed on the surface of the test wafer and regenerate the test wafer, for example, the wafer is cracked to a depth of about 18 μm on the surface of the wafer W by spraying the abrasive. cracks, etc. Therefore, it post-processes according to the objective of a process, such as lapping and removing this by existing mechanical polishing, mechanical-chemical polishing, etc.

1 is a front view of a blast processing apparatus.

2 is a right side view of a blast processing apparatus.

3 is a plan view of a blast processing apparatus;

4 is a front perspective view of the blast processing apparatus (explanatory diagram of injection nozzle movement control means).

5 is a plan perspective view (explanatory drawing of the spray nozzle movement control means) of a blast processing apparatus.

6 is an enlarged plan view of the spray nozzle movement control means (cam and cam arm portions).

7 is an enlarged rear view of the spray nozzle movement control means (cam and cam arm portions).

8 is an explanatory diagram of a method for specifying a cam shape.

9 is an explanatory diagram showing a positional relationship between a cam and a turntable.

10 is an explanatory diagram of a method for specifying a cam shape.

11 is an explanatory diagram of a method for specifying a cam shape.

12 is an explanatory diagram showing a positional relationship between a cam and a turntable.

Fig. 13 is an explanatory diagram showing an oversensational shape between the rotational direction of the turntable and the swinging direction of the swing arm.

It is a front view which shows the structural example of the silicon wafer grinding system provided with the blast processing apparatus of this invention.

15: is explanatory drawing which showed the movement direction of the injection nozzle with respect to a rotating workpiece, (A) is between the said outer periphery of the rotational trajectory of the workpiece | work, the said outer periphery and the inner periphery of concentric circles, (B) the outer periphery of the rotational locus of a workpiece | work An example in which the spray nozzle is moved between the outer circumferential line which is opposed to the line circumferential direction through the center of the outer circumferential line.

Fig. 16 is an explanatory diagram showing the relationship between the change of the injection nozzle and the processing area that moves at a constant moving speed from the outer circumference line to the inner circumference line (radial direction) of the rotation trajectory of the work.

♧ description of the symbols for the main parts of the drawing ♧

1. blast processing apparatus [grinding apparatus of workpiece (surface to be processed; silicon wafer or wafer)]

2 .... cabinet

3 .... processing room

10 .... Work piece (face to be processed; silicon wafer or wafer)

11 .... turntable

12 .... Jig

20 .... Spray Nozzle

30 .... spray nozzle movement control means

31 (31a, 31b, 31c) .... Swingarm

32..Rotating shaft

33 .... cam arm

34 .. Injection nozzle retaining arm

35 .... Cam

36 .... Motor (cam rotation)

37 .... Power Transmission Mechanism

37a, 37b .... Pulley

37c .... pulley belt

38 ... bearing

39 .... Link

50 ... dust collector

60 ... Cyclone

W .... Walk (surface to be processed; silicon wafer or wafer)

Claims (16)

In the grinding processing method which sprays an abrasive with an injection nozzle on the surface of a workpiece, While moving the workpiece on a predetermined rotational trajectory, A time for forming an injection nozzle for injecting abrasive material under constant processing conditions into a plurality of isosphere areas by concentric circles centered on the center of the rotation trajectory, and traversing each isosphere area. The grinding processing method characterized by making it constant and moving in the direction which cross | intersects each said equal area area | region. The method according to claim 1, And the rotational trajectory of the work has an inner circumferential line of the outer circumferential line and a concentric circle to define a distance between the outer circumferential line and the inner circumferential line into the respective isoareas. The method according to claim 2, When the area of the isoarea area is ds, the spray nozzle moving from the inner circumferential side to the outer circumferential side of the rotational trajectory is within a predetermined time at any point of a radius r _n at the center of the rotational trajectory.

And the injection nozzle is moved to approximate the movement distance dx. The method according to claim 2, When the area of the isoarea area is ds, the spray nozzle moving from the outer circumferential side to the inner circumferential side of the rotational trajectory is a predetermined time at any point of radius r _n at the center of the rotational trajectory.

And the injection nozzle is moved to approximate the movement distance dx. The method according to claim 1, The inner peripheral line of the rotation trajectory of the said workpiece | work is engraved concentrically, and it is set as the said equal area area | region, The grinding process characterized by the above-mentioned. The method according to claim 5, The distance dx at which the injection nozzle on the nth concentric circle from the center moves in the circumferential direction within a predetermined time is set to r ₁ as the radius of the concentric circle of the minimum diameter when the rotational trajectory is formed into a plurality of isoareas. ,

Grinding method characterized in that for moving the injection nozzle to approximate. The method according to claim 5, The distance dx at which the injection nozzle on the nth concentric circle from the center moves in the inner circumferential direction within a predetermined time is assumed to have r ₁ as the radius of the concentric circle of the minimum diameter when the rotational trajectory is formed into a plurality of equi-area areas. ,

Grinding method characterized in that for moving the injection nozzle to approximate. The method according to claim 2, And the movement of the injection nozzle is carried out within an isotropic area range of the outer circumference line and the inner circumference line of the rotational trajectory. The method according to claim 1, And the movement of the injection nozzle is performed by traversing the rotational trajectory between the outer circumferential lines which replace the rotating trajectory through the outer circumferential line → the center direction → the center of the outer circumferential line. An injection nozzle for injecting abrasive into the workpiece, Rotation and conveying means for moving the workpiece on a predetermined rotation trajectory, Injection which moves the said injection nozzle in the direction which the crossing time of the several isoarea area | region defined in the concentric circle centered on the center of the said rotational locus in the outer periphery line of the said rotational trajectory constantly intersects each said isosphere area | region A grinding apparatus comprising a nozzle movement control means. The method according to claim 10, The injection nozzle movement control means includes a swing arm for reciprocating the injection nozzle between the outer circumference line of the rotational trajectory and the inner circumference line concentric with the outer circumference line by oscillation using a predetermined axial position as a support point; And a cam which swings the swing arm in a predetermined pattern by externally rotating the swing arm. When the injection nozzles provided in the swing arm are disposed at positions where the injection nozzles should be arranged at predetermined timings, respectively, the position where the contact portion with the cam of the swing arm is arranged is used as a reference input point. , The outer shape of the said cam was made into the shape which passes the said reference input point in turn for every rotation angle corresponding to the said timing, The grinding machine characterized by the above-mentioned. The method according to claim 11, And the swing arm oscillates in a plane orthogonal to the plane of the rotational trajectory of the workpiece. The method according to claim 10, The rotational trajectory of the work has an outer circumference line and an inner circumference line, and the distance between the outer circumference line and the inner circumference line is defined in the isosphere area having an area of ds, The distance dx at which the injection nozzle movement control means moves within a predetermined time from the inner circumferential side of the rotational trajectory to the outer circumferential side at any point of a radius r _n at the center of the rotational trajectory,

Grinding apparatus, characterized in that for moving the injection nozzle to approximate. The method according to claim 10, The rotational trajectory of the work has an outer circumference line and an inner circumference line, and the distance between the outer circumference line and the inner circumference line is defined in the isosphere area having an area of ds, The distance dx at which the injection nozzle movement control means moves in a predetermined time from the outer circumferential side of the rotational trajectory to the inner circumferential side at any point of a radius r _n at the center of the rotational trajectory,

Grinding apparatus characterized in that for moving the injection nozzle to approximate. The method according to claim 10, When the inner periphery of the rotational trajectory of the workpiece is concentrically formed into concentric circles to form n isospheric areas, and the radius of the concentric circles of the smallest diameter that defines the isospheric area is r ₁ , The injection nozzle movement control means moves the injection nozzle on the nth concentric circle from the center in the circumferential direction within a predetermined time,

Grinding apparatus characterized in that for moving the injection nozzle to move at a moving distance close to the moving distance dx defined by. The method according to claim 10, When the inner periphery of the rotational trajectory of the workpiece is concentrically formed into concentric circles to form n isospheric areas, and the radius of the concentric circles of the smallest diameter that defines the isospheric area is r ₁ , The spray nozzle movement control means moves the spray nozzle on the nth concentric circle from the center in the inner circumferential direction within a predetermined time period.

Grinding apparatus characterized in that for moving the injection nozzle to move at a moving distance close to the moving distance dx defined by.

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