CN101380726B - Grinding processing method and grinding processing device - Google Patents

Abstract

The invention provides a ground finish method and a ground finish device for evenly spaying an abrasive substance on a finished surface of a work piece (W) moving on a rotary track. When the work piece is rotated on the predetermined rotary track, the moving speed of a nozzle (20) for spraying quantitative abrasive substance each time is controlled, and the nozzle (20) is moved repeatedly to and fro between a peripheral line and an inner circumference line of the rotary track or among the peripheral line, the central direction and the peripheral line; and the moving speed of the nozzle (20) is controlled as relative quick along with the moving speed towards the central side of the rotary track and relative slow along with the moving speed towards the peripheral side. The control for the moving speed of the nozzle (20) divides the rotary track of the work piece (W) into a plurality equal areas in a concentric circle shape, so that the nozzle (20) passes across each equal area respectively in constant time.

Description

Grinding processing method and abrasive machining device

Technical field

The present invention relates to (in the present invention, these are referred to as " grinding-material " through spraying various removing materials, sand-blast material, grinding-materials such as abrasive particle.), (be called in the present invention, " workpiece (W) " to being processed object and even processed object face.) grind, cutting, sandblast, cleaning etc. (in the present invention, these are referred to as " grinding ", with the method for using in them be called grinding processing method, the device that will use is called abrasive machining device.) grinding processing method and abrasive machining device, for example, relate to can be used in wafers such as silicon wafer (below, abbreviate " workpiece (W) " as.) as process object, the abrasive machining device that film or the dirt that is formed on this wafer carried out the grinding processing method of grinding and use said method for grinding.

Background technology

For example, for semiconductor device materials such as wafers, through for example silicon single crystal wafer is implemented to be made by the processing that a plurality of operations are formed.When making such semiconductor devices, for the state of keeping watch on each operation, condition in each technical process etc. is discussed, in manufacturing process, use the so-called test that is called as testing wafer to use wafer.

Below, be example with the testing wafer, technical background and problem are described.

The use amount of this testing wafer is very big, nearly is used to make the wafer (raw wafers of goods such as actual sale; Prime wafer) about about 1/3 of output.Because the testing wafer of this inspection usefulness only is the wafer that in the manufacturing process of semiconductor devices, uses; Do not dispatch from the factory as resultant articles; Therefore so long as the wafer that has with the same even surface of raw wafers get final product, even regenerate does not hinder use yet.

Therefore, for this testing wafer, in case after in the manufacturing process of semiconductor devices, being used in the various tests, removing the overlay film or the dirt that form from the teeth outwards through corrosion and reuse afterwards.Seek to make use amount, the reduction manufacturing cost that is used for reducing expensive wafer through the regeneration of this wafer.

For this used testing wafer of regenerating,, used chemical attack (etching) method as the method for removing from the teeth outwards the overlay film that forms etc. in the past always.But; Removing through chemical attack under the situation of overlay film; Because corrosion rate is different and different according to material; Be immersed in the corrosive liquid if therefore will be mixed with the testing wafer of the overlay film that constitutes by those unlike materials,, thereby on the surface of the testing wafer after the corrosion, produce concavo-convex then owing to the difference by this material causes that corrosion rate is different.

Therefore; Concavo-convex be processed into the tabular surface same if want with what produce like this with raw wafers; Then need increase the processing capacity (tab for polishing) of the polishing (polishing) of subsequent processing; Consequently, the thickness of testing wafer significantly reduces in once using, and the access times of regenerating thus are restricted.

And; Under the above-mentioned situation of carrying out chemical attack; The use of corrosive liquid is indispensable, thus corrosive liquid or be used to clean rinse water of the silicon wafer after the corrosion etc. all contaminated, can not directly discard; Need make the innoxious processing of corrosive liquid, also need be used to equipment that carries out this processing etc.

Therefore, in recent years, seek from the chemical treatment of using soup etc. conversion to the dry process of not using soup etc.

As utilizing this dry process to carry out the silicon wafer corroding method, spray the method (with reference to TOHKEMY 2001-162535 communique) that overlay film is removed in the coccoid grinding thereby propose to have through overlay film formation face to silicon wafer.

In above-mentioned wafer, except testing wafer, also comprise the false sheet (dummy wafer), the raw wafers that supply regeneration.

As stated; Remove said workpiece W through the coccoid of jet grinding material is in the method for the overlay film on the wafer, for example, comes to handle simultaneously a plurality of wafers if want through single treatment; Then following method is effective: on turntable;, be that (revolution, wafer does not rotate in the pivot rotation with the center of this turntable for example through making this turntable with adjacent with the outer circumferential side of turntable and make the mode that connects in the outer peripheral edges inboard of periphery and turntable of wafer dispose the wafer of predetermined quantity side by side.) and carry and the wafer rotation is moved, to this wafer jet grinding material that moves.

And,, for example, be to cut out (the cutting of a plurality of chips at this wafer even when handling single wafer; Dicing or die cutting) under the situation of the large-scale wafers such as wafer of usefulness; Perhaps inferior in the situation that adopts deposition jig or mould etc.; Through being sprayed coccoid, a place that confirms to carry out under the situation of whole processing; Need so that the mode that the center of this wafer overlaps with the center of turntable is configured wafer carried puts on turntable, one side be that pivot rotates (rotation with the center of this turntable; Wafer rotation itself) material of jet grinding on one side.

And then; If want whole jet grinding material to the wafer that on turntable, moves like this; Then need carry out following processing: the line (in present specification, being called " outer peripheral lines ") that makes the to be processed most peripheral of nozzle from the said rotational trajectory of said workpiece W in the said rotational trajectory of said workpiece W to be processed in the line (in present specification, being called " interior contour ") in week even nozzle moves back and forth pre-determined number [with reference to Figure 15 (A)] with the mode that (diametric(al) of one or more workpiece W of configuration) crosses outer peripheral lines → interior contour repeatedly, perhaps make nozzle move back and forth [with reference to Figure 15 (B)] in the mode of outer peripheral lines → center position → between the opposed outer peripheral lines of direction opposite, cross repeatedly with diametric(al) across the said center of said outer peripheral lines with the wafer of a rotation and even the workpiece on the turntable.

But; Under the situation that nozzle is moved; If making the translational speed of nozzle is constant speed, then under any situation in Figure 15 (A), (B), the wafer of processing in this way; Outer circumferential side degree of finish (mainly being the degree of depth of grinding) at rotation (and conveying) track is low, and is high at the central side degree of finish.

That is, shown in figure 16, be r if establish radius ₁Small circle and radius increase to r ₁2 times, 3 times, 4 times, 5 times radius be r ₂, r ₃, r ₄, r ₅Concentric circles, then area than in, be r with respect to radius ₁Circle, radius is r ₂Circle be its 4 times, radius is r ₃Circle be its 9 times, radius is r ₄Circle be its 16 times, radius is r ₅Circle be its 25 times, each the circle enlarged areas be square (r of the multiple of radius ₁n ²), be r with respect to radius ₁The area of center circle, the area of band-like portions of each closed hoop that is formed on its periphery is along with increase to 3 times, 5 times, 7 times, 9 times towards the peripheral direction area ... (r _n=(2n-1) r ₁).

Therefore; Put the wafer on the turntable that the constant speed with unit interval anglec of rotation θ is rotated for carrying; For example, if utilize nozzle to process towards peripheral direction from pivot, through make said nozzle with the constant speed of unit interval displacement r said outer peripheral lines and and this outer peripheral lines be to move between the contour in concentrically ringed; Then the displacement along with distance center increases, and the working (finishing) area of unit interval is also such shown in the part of blacking among the figure to be increased according to above-mentioned multiplying power.Say on the contrary that mutually the process time of unit are is along with reducing towards outer circumferential side from interior all sides.

Therefore; If wait other processing conditions constant by emitted dose, camber and even the expulsion pressure of the material of the grinding-material of nozzle ejection, the grinding-material of unit interval or jet velocity, jet length (distance between nozzle and the workpiece); Then make under the situation that nozzle moves with constant speed in above-mentioned that kind; Can produce following problems and can't carry out uniform grinding: as stated the whole surface of wafer; Upload when putting on concentric circles at turntable at the rotational trajectory of a workpiece and even with a plurality of workpiece, low at the outer circumferential side degree of finish of the rotational trajectory of turntable, high at interior all side degree of finish.

Consequently; If with the low outer circumferential side of degree of finish is that benchmark is set processing conditions such as process time; Then will exceedingly carry out grinding in the high interior all sides of degree of finish; In addition, if set processing conditions, then overlay film will be removed fully and residual to some extent at the low outer circumferential side of degree of finish according to the high interior all side of degree of finish.

Particularly the size of silicon wafer is large-scale turns to 5 inches, 6 inches, 8 inches, and then to increase again now be 12 inches, maximizes year by year, is accompanied by this maximization, and said processing is inhomogeneous to show more significantly.

Put under the situation on the concentric circles (Figure 15 (A)) in that a plurality of workpiece are uploaded at turntable,, then utilizing above-mentioned grinding attachment in case after wafer carried out grinding if want to eliminate interior all sides and the degree of finish between the outer circumferential side poor of above-mentioned rotational trajectory; Anchor clamps from the turntable etc. unload the wafer after the processing; Again arrange this wafer, itself and last time are added compare man-hour interior periphery (diameter) direction towards on the contrary, and stationary fixture once more; Carry out ground etc. once more; In order to make whole of wafer evenly need be divided into and repeatedly carry out operations, the grinding operation needs for a long time and becomes numerous and diverse.

In addition; In above explanation, the situation of the regeneration testing wafer of having given an example is illustrated, the situation of testing wafer but this problem is not limited only to regenerate; For example to the surface of silicon wafer grind, grinding; Or give with predetermined roughness concavo-convex, further through the jet grinding material carry out slit formation, cut out under the situation of (cutting) etc., the grinding operation of carrying out through the jet surface grinding-material to silicon wafer mobile on circular path all can produce same problem.

And; Be not limited in the silicon wafer is the situation of processing object; Even the grinding of the cleaning of deposition jig or mould etc., with the grinding that is object of other any workpiece; Under the situation of processing at the workpiece that moves on the rotational trajectory, the processing that all might produce above-mentioned that kind is inhomogeneous.

Summary of the invention

Therefore; The present invention accomplishes the problem of the above-mentioned that kind that under the situation of the workpiece jet grinding material that moves on the rotational trajectory, produces in order to solve above-mentioned that kind; Purpose is the abrasive machining device that a kind of grinding processing method is provided and is used to realize said method; Make in the grinding of the workpiece that carries out through the jet grinding material, can carry out uniform grinding to the whole face of the workpiece that on rotational trajectory, moves through fairly simple method.

In order to reach above-mentioned purpose; Grinding processing method of the present invention with nozzle 20 to the jet surface grinding-material of workpiece W to carry out grinding; It is characterized in that; Said workpiece W rotation on predetermined rotational trajectory is moved; And, in the said rotational trajectory of said workpiece W in interior all sides (in the outer peripheral lines) of the line of most peripheral to be processed (being outer peripheral lines), suppose that utilization is that the concentric circles at center forms or be divided into the zone (being called " homalographic zone " among the application) that a plurality of areas equate (being called " homalographic " among the application) respectively with the center of this rotational trajectory; In other words; Divide the homalographic zone with the mode concentric circles of homalographic ground, to carry out following control with the nozzle of constant processing conditions jet grinding material mobile: it is constant to make this nozzle cross time in each homalographic zone in said a plurality of homalographics zone, promptly along with accelerating relatively towards the central side of said rotational trajectory; Along with towards outer circumferential side and slack-off relatively, make said nozzle on the direction of intersecting with said each homalographic zone, move and even swing (the invention of first aspect; With reference to Fig. 8, Figure 10, Figure 11).

And, can carry out said moving or swing as required repeatedly.

For such division homalographic zone; For example; In the time of will being positioned at a plurality of workpiece that the wafer of (turntable) outer peripheral lines side constitutes as object by outer peripheral edges; Rotational trajectory at said workpiece has under the situation of said outer peripheral lines and interior contour; Can with said outer peripheral lines and said in interval between the contour be divided into said homalographic zone, said in the equal diameters of distance and said workpiece of the said outer peripheral lines of all linear distances, be in the said rotational trajectory of concentrically ringed said workpiece W to be processed in the line (invention of second aspect in week; With reference to Fig. 8,10), perhaps, make single workpiece time rotational, also can the spatial division in the outer peripheral lines of the rotational trajectory of said workpiece be become the said homalographic zone (invention of the 5th aspect; With reference to Figure 11).In addition, like Fig. 8, shown in Figure 10, even the rotational trajectory of workpiece W be have under the situation of ring-type rotational trajectory of contour, also can shown in figure 11ly divide (invention of first aspect) to carrying out homalographic ground in this outer peripheral lines.

For moving of nozzle 20; Can make and move (invention of eight aspect) in the scope between its outer peripheral lines → interior contour at said rotational trajectory; Perhaps; Can with cross outer peripheral lines → center → across the said center of said outer peripheral lines and the opposed outer peripheral lines of diametric(al) rightabout between mode carry out said move so that swing (invention aspect the 9th, Figure 11).

And then; For the processing that utilizes above-mentioned grinding processing method; Can be with a plurality of workpiece W of the periphery that is configured in turntable 11, promptly the center with said rotational trajectory is that the workpiece W that revolves round the sun in the center is an object, perhaps; Also can be so that the workpiece W that the center of its center and turntable 11 is configured accordingly, be that the workpiece W that rotation is carried out at the center is an object promptly with the center of said rotational trajectory.

And abrasive machining device of the present invention is characterised in that said abrasive machining device has: nozzle 20, and it is to workpiece W jet grinding material; Rotation, supply unit 10, it has turntable 11 etc., and said workpiece W is moved on predetermined rotational trajectory; And nozzle mobile control unit 30; It is controlled the mobile of said nozzle 20; Control through said nozzle mobile control unit 30; It is constant to make said nozzle 20 cross time in each homalographic zone; It is that the concentric circles at center is divided said rotational trajectory inside and is formed with a plurality of that said homalographic zone passage utilizes (rotation) center with this rotational trajectory; Said nozzle mobile control unit 30 is controlled the translational speed of said nozzle 20 in the following manner, and makes nozzle 20 mobile on the direction of intersecting with each homalographic of said rotation zone: along with accelerating relatively towards the central side of said rotational trajectory, along with towards outer circumferential side and slack-off relatively (invention of the tenth aspect).

Said nozzle mobile control unit 30 has: rocking arm 31, it is through being that fulcrum is swung with a predetermined axle bearing position, make said nozzle 20 the said outer peripheral lines of said rotational trajectory and and this outer peripheral lines be to move back and forth between the contour in concentrically ringed; And cam 35; It is external with said rocking arm 31 directly or indirectly; Make said rocking arm 31 with predetermined figure swing through rotation; Will be located at nozzle 20 on the said rocking arm 31 be configured in respectively this nozzle 20 in position that predetermined timing should be disposed (P1～P7) last time; With the position of the contact site branch between said rocking arm 31 and said cam configuration respectively as the benchmark input point (p1～p7) obtain, the outer shape of said cam 35 can form following shape: when the rotation anglec of rotation corresponding with said timing successively through said benchmark input point (p1～the p7) (invention of the tenth one side; With reference to Fig. 8, Figure 10, Figure 11).

According to grinding processing method of the present invention and abrasive machining device; When the structure of more than utilizing, having explained of the present invention moves nozzle 20; The translational speed of nozzle 20 is described below changes, can reduce the variation of the degree of finish that produces between interior all sides and the outer circumferential side of rotational trajectory: along with the outer circumferential side from the rotational trajectory that rotates mobile workpiece W accelerates towards interior all side shifting speed relatively, and; In contrast, along with slack-off relatively towards periphery side shifting speed from interior all sides.

Consequently; For example in regeneration during testing wafer, need not carry out repeatedly arranging the operation that testing wafer is handled etc. again with respect to turntable, can carry out grinding equably to testing wafer through single treatment; Thus; The stock removal (minimizing of thickness) of testing wafer can be reduced, therefore, the regeneration access times of testing wafer can be increased.

In addition; The translational speed of 35 pairs of nozzles 20 of cam is carried out above-mentioned control; So that nozzle 20 crosses said each homalographic zone with the speed that equates; Through said cam 35 is set, make on rotational trajectory the process time of unit are in the arbitrary portion of the workpiece W that moves constant, can basically thoroughly eliminate in the processing of the interior outer circumferential side generation of rotational trajectory inhomogeneous.

For moving of such nozzle 20; For example; Making said workpiece W carry out center with the rotational trajectory of said turntable is that the revolution at center is moved etc.; Under need not situation, reach: make in the scope of the moving range of said nozzle between the outer peripheral lines → interior contour of said rotational trajectory, promptly, the moving range that makes said nozzle is in the diameter of workpiece through following manner to the central part jet grinding material of rotational trajectory.

On the other hand; Through make said nozzle at the outer peripheral lines → center of said rotational trajectory → between the opposed outer peripheral lines in the center of said outer peripheral lines, move; Even for example carry out also can processing equably under the situation of grinding to workpiece at single workpiece W to rotation.

Utilizing rocking arm 31 to carry out under the situation about moving of nozzle 20; Through make this rocking arm move so that swaying direction is positioned at the face with the face quadrature of the rotational trajectory of workpiece W, can make thus nozzle at the outer peripheral lines → center of workpiece → moving to straight line between the opposed outer peripheral lines in the center of said outer peripheral lines move.Consequently; Eliminated in the direction of rotation that makes nozzle and workpiece W and swung abreast and the width in the homalographic zone that nozzle is produced under the situation that arcuation moves and cross the difference between the displacement of the needed nozzle of these surface areas, can correctly control the mobile of nozzle 20.

In addition, utilizing the above-mentioned various displacement dx (dx that tries to achieve _n) make under the situation that nozzle moves, can be so that nozzle be moved with respect to all constant mode of the time of crossing of the nozzle in arbitrary homalographic zone.

Description of drawings

Fig. 1 is the front view that sprays (blast) processing unit (plant).

Fig. 2 is the right side view of jet processing apparatus.

Fig. 3 is the vertical view of jet processing apparatus.

Fig. 4 is that the master of jet processing apparatus looks perspective view (key diagram of nozzle mobile control unit).

Fig. 5 is the birds-eye perspective (key diagram of nozzle mobile control unit) of jet processing apparatus.

Fig. 6 is the amplification plan view of nozzle mobile control unit (cam and cam arm part).

Fig. 7 is the amplification rearview of nozzle mobile control unit (cam and cam arm part).

Fig. 8 is the key diagram of definite method of cam face.

Fig. 9 is the key diagram that the position relation of cam and turntable is shown.

Figure 10 is the key diagram of definite method of cam face.

Figure 11 is the key diagram of definite method of cam face.

Figure 12 is the key diagram that the position relation of cam and turntable is shown.

Figure 13 is the key diagram that concerns that illustrates between the swaying direction of direction of rotation and rocking arm of turntable.

Figure 14 is the front view that the structure example of the silicon wafer grinding system of having assembled jet processing apparatus of the present invention is shown.

Figure 15 illustrates the key diagram of nozzle with respect to the workpiece movement direction of rotation; (A) be make nozzle the said outer peripheral lines of the rotational trajectory of workpiece and and this outer peripheral lines be the example that moves between the contour in concentrically ringed, (B) be to make the example of nozzle at the outer peripheral lines → center position of the rotational trajectory of workpiece → between the opposed outer peripheral lines in the center of said outer peripheral lines, move.

Figure 16 is the key diagram that outer peripheral lines → interior contour (radial direction) of being illustrated in the rotational trajectory of workpiece is gone up the relation between the variation of the nozzle that moves with constant translational speed and working (finishing) area.

Label declaration

1: jet processing apparatus (workpiece (processed object face; Silicon wafer or wafer) grinding attachment);

2: casing;

3: Processing Room;

10: workpiece (processed object face; Silicon wafer or wafer) rotation, supply unit;

11: turntable;

12: anchor clamps;

20: nozzle;

30: the nozzle mobile control unit;

31 (31a, 31b, 31c): rocking arm;

32: rotating shaft;

33: cam arm;

34: the nozzle hold-down arm;

35: cam;

36: motor (the cam rotation is used);

37: Poewr transmission mechanism;

37a, 37b: belt wheel;

37c: conveyer belt;

38: bearing;

39: connecting rod;

50: dust arrester;

60: cyclone separator;

W: workpiece (processed object face; Silicon wafer or wafer etc.)

The specific embodiment

Secondly, describe in the face of embodiment of the present invention down.

In addition; In following embodiment; All be to be that workpiece W is that example describes as the object of grinding with wafer; But the workpiece W among the present invention not as previously mentioned that kind only limit to wafer or silicon wafer, can be with various industrial machine widely utensil such as mould or anchor clamps and instrument and their parts etc. as object.

Abrasive machining device of the present invention is that workpiece W (as the silicon wafer W that gives an example out, only is called in the explanation of this following embodiment " wafer W " here.) the jet processing apparatus 1 of jet surface grinding-material, said jet processing apparatus has at least: rotation, supply unit 10, it moves wafer W rotation on predetermined rotational trajectory; Nozzle 20, it is to this wafer W jet grinding material that is transferred; And the mobile control unit 30 of nozzle, it makes said nozzle 20 move (with reference to Fig. 4) towards predetermined moving direction with predetermined controlled translational speed.

Fig. 1～jet processing apparatus 1 shown in Figure 3 constitutes: the inside at the casing 2 that is formed by metallic plate etc. is formed with the Processing Room 3 that is used to spray processing; And the bottom of this casing 2 forms (four) pyramid-shaped of the narrowed width towards the below, can be recovered in the grinding-materials that spray in the Processing Room 3.

Dispose in the Processing Room 3 in being formed at this casing 2: rotation, conveyance unit 10, it is made up of turntable 11 grades, and the wafer W that said turntable was put as processing object in 11 years is rotated, and said wafer W is moved in Processing Room 3 on predetermined rotational trajectory; And nozzle 20; It is to being installed in the wafer W jet grinding material on this rotation, the supply unit 10; And across being provided with nozzle mobile control unit 30 inside and outside the said casing 2, this nozzle mobile control unit 30 makes this nozzle 20 move with controlled translational speed towards predetermined moving direction.

In this embodiment; Described rotation, supply unit 10 have turntable 11; Along continuous straight runs rotation in the Processing Room 3 of said turntable 11 in being formed at casing 2, this turntable 11 forms the closed hoop (with reference to Fig. 5) of middle body opening in vertical view in the illustrated embodiment.

Can directly carry to put on this turntable 11 as the wafer W of processing object and carry; But in this embodiment; On said turntable 11, be provided with a plurality of anchor clamps 12; Said anchor clamps 12 form can distinguish the wafer W of independent installation as processing object, constitutes on these anchor clamps 12 and can peel off the fixed cell fixed wafer W (with reference to Fig. 4) such as vacuum chuck that state after bonding wafer W in ground or the utilization respectively.

Here; In this embodiment; These anchor clamps 12 form to have to carry puts discoid as the size of the wafer W of processing object; And the unit of fixed wafer W preferably is set, and for example carry out the vacuum chuck of vacuum suction or carry out the fixing electrostatic chuck of static etc. carrying the wafer W of putting, be utilized grinding-material that nozzle 20 sprays or compressed air etc. and blow and fly or cause offset to avoid carrying the wafer W work in-process of putting on these anchor clamps 12.

This anchor clamps 12 location also are fixed on the above-mentioned turntable 11, and thus, the wafer W on each anchor clamps 12 is fixed on the turntable 11 with stable status, and along with the rotation of turntable 11 is the center revolution with the pivot of this turntable 11.

Said nozzle 20 is to through by said turntable 11 and be located at the rotation that the anchor clamps 12 on this turntable 11 constitute, the wafer jet grinding material that supply unit 10 moves; In this embodiment; Said nozzle 20 is installed on the nozzle mobile control unit 30; Said nozzle mobile control unit 30 makes this nozzle 20 repeated moving on the direction of the rotational trajectory that crosses wafer W; Nozzle 20 utilizes this nozzle mobile control unit 30 repeated moving on the direction of the rotational trajectory that crosses said wafer W, and simultaneously the translational speed of nozzle 20 is controlled as: translational speed is along with accelerating towards the central side of turntable 11, and translational speed is along with towards outer circumferential side and slack-off.

As shown in Figure 5, such being used for has the said nozzle mobile control unit of controlling with translational speed 30 that moves of nozzle 20: the rocking arm 31 (31a～31c) that makes said nozzle 20 swings; And the cam 35 that makes these rocking arm 31 swings, form based on shape of the present invention through the shape that makes this cam 35, thereby can carry out following speed controlling: the translational speed of nozzle 20 is changed corresponding to the position of interior → peripheral direction as above-mentioned.

In this embodiment; For the Poewr transmission mechanism 37 that can be rotated drive electric motor 36 and the rotation of this motor 36 is passed to said cam 35 with said cam 35, to this cam (in Fig. 6 and example shown in Figure 7; Belt wheel 37a, 37b and conveyer belt 37c) be configured in less Processing Room 3 outsides of influence that receive grinding-material or dust etc.; On the top board of said casing 2, be provided with and connect the inside and outside bearing 38 of casing 2; This bearing 38 constitutes: carry out the axle supporting to connecting the casing 2 inside and outside rotating shafts 32 that are provided with, the revolving force that will outside casing 2, give said rotating shaft 32 is passed in the casing 2.

Further be provided with: in casing 2, be installed in the nozzle hold-down arm 34 on the direction with this rotating shaft 32 quadratures; And cam arm 33; It is installed in outside the said casing 2 with the mode with said rotating shaft 32 quadratures; Contact with said cam 35 and along the peripheral shape swing of cam 35, form described rocking arm 31 (31a, 31b, 31c) respectively through said rotating shaft 32, nozzle hold-down arm 34 and cam arm 33.

In embodiment shown in Figure 5; This rocking arm 31 (31a, 31b, 31c) is provided with 3 with respect to a jet processing apparatus 1; Be located at wherein the last cam arm 33,33 of 2 rocking arm 31a, 31b with across after the mode of the cam 35 stated dispose (with reference to Fig. 6, Fig. 7); When making 2 rocking arm 31a, 31b swing; Through utilizing connecting rod 39 that the rotating shaft 32 of the side's in said 2 rocking arms rocking arm 31a and the rotating shaft 32 of remaining 1 rocking arm 31c are coupled together; Thereby 3 rocking arm 31a, 31b, 31c are swung with the mode of the motion track that crosses wafer W, and the translational speed of the nozzle 20 that will be caused by this swing simultaneously is controlled to be as above-mentioned along with towards the central side of rotational trajectory and accelerate, along with towards outer circumferential side and slack-off.

In addition; In the illustrated embodiment; The example that above-mentioned that kind is provided with 3 rocking arm 31a, 31b, 31c on a jet processing apparatus 1 is illustrated; But according to quantity of the wafer W of the size of jet processing apparatus 1 and every batch processing etc., the quantity that can increase and decrease the quantity of nozzle 20 and make the rocking arm 31 that nozzle 20 moves.

And; In the illustrated embodiment; On the nozzle hold-down arm 34 that is located on each rocking arm 31 (31a, 31b, 31c), be separately installed with 2 nozzles 20 (with reference to Fig. 4 and Fig. 5), but for the quantity that is installed in the nozzle 20 on each rocking arm 31 (31a, 31b, 31c); Can be provided with 1, the nozzle 20 more than 2 also can be set.

For this rocking arm 31 (31a, 31b, 31c),, do not limit its installation site is special as long as can said nozzle 20 moved back and forth with the mode of the rotational trajectory that crosses wafer W; Can be installed on certain position of casing 2, in the illustrated embodiment, as the rotating shaft 32 of rocking arm 31 (31a, 31b, 31c) swing fulcrum; In vertical view, be configured in the outer circumferential side of turntable 11; And cam 35 is configured in interior all sides (with reference to Fig. 5) of turntable 11 with respect to this rotating shaft 32, but in contrast, all sides in also can the rotating shaft 32 as rocking arm 31 fulcrums being configured in; Cam 35 is configured in outer circumferential side, is not limited in illustrated embodiment.

Moving of the said nozzle 20 that intersects for rotational trajectory with said wafer W, as above-mentioned, its be controlled as along with from the outer circumferential side of turntable 11 towards interior all sides and speed accelerates relatively, along with from interior all sides towards outer circumferential side and speed is slack-off relatively.

As shown in Figure 8, the control of the translational speed of such nozzle 20 is performed such control: utilize the concentric circles rotational trajectory of wafer W is divided into a plurality of homalographics zone of constant area, and it is constant to make nozzle 20 cross time in each homalographic zone.Therefore, the result is, the translational speed of nozzle 20 is controlled as in such a way and changes: translational speed is along with accelerating towards interior all side shiftings from outer circumferential side, translational speed along with from interior all sides towards outer circumferential side and slack-off.Like this, thus can make the working (finishing) area that under same process conditions, can process constant at the interior all sides and the outer circumferential side of this track through the jet grinding material unit interval.

In example shown in Figure 8; For the ease of explanation, show the example that the rotational trajectory of wafer W is divided into 6 homalographic zones of the band shape that forms closed hoop, still; Be divided into more homalographic zone through rotational trajectory with this wafer W; More preferably, with the rotational trajectory of wafer W as countless small homalographics zone continuously, the mobile of nozzle 20 controlled; So that nozzle 20 crosses the time in each homalographic zone is constant time τ, can more correctly make the working (finishing) area of unit interval constant thus.

Like this, can eliminate the variation of the translational speed of interior all sides of rotational trajectory and the uneven nozzle 20 of processing between the outer circumferential side,, can calculate by following mode as an example.

Is that r, peripheral radius are in the situation about moving on the rotational trajectory of ring-type of R in wafer W at interior all radiuses; Crossing towards outer circumferential side from the central side of the rotational trajectory of wafer W at nozzle under the situation between the outer peripheral lines → interior contour of this rotational trajectory, is being r apart from this rotational trajectory radius centered _nThe arbitrfary point on, the working (finishing) area that to establish the distance that nozzle moves in the τ at the fixed time be dx, establish in the scheduled time τ is ds, can access following formula

ds＝π{(r _n+dx) ²-r _n ²}＝π(2r _ndx+dx ²)

${\mathrm{<figure-callout\; id="2"\; label="dx"\; filenames="S2008101280998E00031.png,S2008101280998E00082.png"\; state="\{\{state\}\}">dx</figure-callout>}}^2+{2r}_n\mathrm{dx}-\frac{\mathrm{ds}}{\mathrm{\&pi;}}=0$

${\mathrm{<figure-callout\; id="2"\; label="dx"\; filenames="S2008101280998E00031.png,S2008101280998E00082.png"\; state="\{\{state\}\}">dx</figure-callout>}}^2+2r_b\mathrm{dx}={(\mathrm{dx}+r_n)}^2-{\mathrm{<figure-callout\; id="2"\; label="r\; n"\; filenames="S2008101280998E00031.png,S2008101280998E00082.png"\; state="\{\{state\}\}">r</figure-callout>}}_n^{}=\frac{\mathrm{ds}}{\mathrm{\&pi;}}$

$\mathrm{dx}+r_n=\sqrt{{\mathrm{<figure-callout\; id="2"\; label="r\; n"\; filenames="S2008101280998E00031.png,S2008101280998E00082.png"\; state="\{\{state\}\}">r</figure-callout>}}_n^{}+\frac{\mathrm{ds}}{\mathrm{\&pi;}}}$

As quadratic equation about dx, ignore negative separating, can access following separating:

$\mathrm{Dx}=\sqrt{{{\mathrm{<figure-callout\; id="2"\; label="r\; n"\; filenames="S2008101280998E00031.png,S2008101280998E00082.png"\; state="\{\{state\}\}">r</figure-callout>}}_n}^2+\frac{\mathrm{Ds}}{\mathrm{\&pi;}}}-r_n$ Formula (1)

, be divided in the situation in n homalographic zone at rotational trajectory with wafer W here,

$\mathrm{Ds}=\frac{\mathrm{\&pi;}(R^2-r_n^2)}{n}$ Formula (2)

Therefore, through with among the ds in the above-mentioned formula of above-mentioned formula (2) substitution (1), the arbitrfary point r of substitution simultaneously _nValue, can calculate thus from said arbitrfary point r _nTowards nozzle 20 that peripheral direction moves in each scheduled time τ, move apart from dx.

Use above-mentioned formula (1), formula (2); Calculating is in that to put at external diameter (diameter of outer peripheral lines) be Φ 1400mm to carrying; Internal diameter (diameter of interior contour) is the wafer W (diameter is 400mm) on the turntable of Φ 1000mm when carrying out grinding during the displacement of nozzle in each scheduled time τ; Then with interior week of this turntable and periphery periphery and interior week as the rotational trajectory of wafer W; Make R=700mm, r=500mm in the above-mentioned formula (2), give an example out and the rotational trajectory of said wafer W is divided into the situation in 18 homalographic zones

Then according to above-mentioned formula (2),

$\mathrm{ds}=\frac{\mathrm{\&pi;}(R^2-r^2)}{n}=\frac{\mathrm{\&pi;}({700}^2-{500}^2)}{18}=41888\left({\mathrm{mm}}^2\right)$

The periphery of therefore, establishing turntable is starting point r ₀(r ₀=500mm), establish nozzle from this starting point r ₀The displacement that moves to peripheral direction in the τ at the fixed time is dx ₁, establish nozzle and be r through the position (apart from the radius centered of rotational trajectory) behind the scheduled time τ ₁, then according to formula (1)

${\mathrm{<figure-callout\; id="1"\; label="dx"\; filenames="S2008101280998E00011.png,S2008101280998E00021.png"\; state="\{\{state\}\}">dx</figure-callout>}}_1=\sqrt{{r_0}^2+\frac{\mathrm{ds}}{\mathrm{\&pi;}}}-r_0=\sqrt{{500}^2+\frac{41888}{\mathrm{\&pi;}}}-500=13.2$

r ₁＝r ₀+dx ₁＝500+13.2＝513.2

Equally, establish above-mentioned r ₁Be the r in the formula (1) _n(starting point of nozzle 20), calculate that nozzle moves in the τ at the fixed time apart from dx ₂, nozzle is through position (apart from the rotational trajectory radius centered) r behind the scheduled time τ ₂If repeat same operation calculating dx with the quantity (=18) of cutting apart in homalographic zone ₂～dx ₁₈, r ₂～r ₁₈, then can obtain the regional width of each homalographic, i.e. the displacement of the nozzle in each scheduled time τ.

As an example, the displacement dx of the nozzle that each scheduled time τ that utilizes said method to obtain is interior ₁～dx ₁₈, and apart from the center of rotational trajectory apart from r ₀～r ₁₈Respectively shown in the following table 1.

[table 1]

Displacement (mm)	The radius of distance center (mm)	Displacement (mm)	The radius of distance center (mm)
				?	r 0＝500	dx 10＝10.9	r 10＝619.3
dx 1＝13.2	r 1＝513.2	dx 11＝10.7	r 11＝630.0
				dx 2＝12.8	r 2＝526.0	dx 12＝10.5	r 12＝640.5
dx 3＝12.5	r 3＝538.5	dx 13＝10.3	r 13＝650.8
				dx 4＝12.2	r 4＝550.8	dx 14＝10.2	r 14＝661.0
dx 5＝12.0	r 5＝562.8	dx 15＝10.0	r 15＝670.8
				dx 6＝11.7	r 6＝574.5	dx 16＝9.9	r 16＝680.7
dx 7＝11.5	r 7＝586.0	dx 17＝9.7	r 17＝690.4
				dx 8＝11.3	r 8＝597.3	dx 18＝9.6	r 18＝700.0
dx 9＝11.1	r 9＝608.4	?	?

In above explanation; Calculated respectively nozzle 20 from the central side of rotational trajectory under the situation of periphery side shifting; Displacement and the radius of distance center of nozzle 20 in each scheduled time τ; But in contrast, even under the situation of the inside all side shiftings of outer circumferential side of rotational trajectory, also can access same effect at nozzle 20.

That is, in any radius r _nThe position, to establish the distance that nozzle moves in each scheduled time τ be dx, establish working (finishing) area is ds, can obtain following formula:

ds＝π{r _n ²-(r _n-dx) ²}＝π(2r _ndx-dx ²)

${\mathrm{dx}}^2-2r_n\mathrm{dx}+\frac{\mathrm{ds}}{\mathrm{\&pi;}}=0$

As quadratic equation about dx, ignore negative separating, can obtain following separating:

$\mathrm{dx}=r_n-\sqrt{{r_n}^2-\frac{\mathrm{ds}}{\mathrm{\&pi;}}}$

Here, nozzle is with the periphery (r of turntable ₁₈=R=700mm) as starting point, the displacement dx in the τ at the fixed time ₁₈Can draw by following formula:

${\mathrm{dx}}_{18}=r_{18}-\sqrt{{r_{18}}^2-\frac{\mathrm{ds}}{\mathrm{\&pi;}}}=700-\sqrt{{700}^2-\frac{41888}{\mathrm{\&pi;}}}=9.6$

Therefore, from position that nozzle begins to move through scheduled time τ rear nozzle (apart from rotational trajectory radius centered r ₁₇) can draw by following formula:

r ₁₇＝r ₁₈-dx ₁₈＝700-9.6＝690.4

The distance that moves in each scheduled time τ and mobile afterwards all identical with result's (with reference to table 1) that nozzle is tried to achieve from the situation that center side direction outer circumferential side moves apart from the distance at rotational trajectory center.

Utilization each r as above to try to achieve ₁～r ₁₇For the concentric circles of radius is cut apart on turntable and is divided into the homalographic zone; And the translational speed of nozzle controlled; So that nozzle crosses each homalographic zone after the division with described constant time τ; Thus, can control, so that the working (finishing) area of unit interval is constant the translational speed of nozzle.

Like this; The cam 35 that is used to make nozzle 20 to move with controlled speed; An example as shown in Figure 6 can use to form the heart-shaped cam that is called as " heart-shaped cam ", through its outer shape is confirmed as following shape; As above-mentioned, can make nozzle 20 cross that rotational trajectory with wafer W is divided into homalographic and the traveling time in each homalographic zone of obtaining is constant.

Fig. 8 is the key diagram of definite method of external diameter shape that is used to explain the cam 35 of the translational speed control that can carry out described nozzle 20; The straight line that connects two circles among the figure is represented the nozzle hold-down arm 34 and cam arm 33 of rocking arm 31 respectively; In the figure; For the ease of explanation; Suppose with nozzle hold-down arm 34 and cam arm 33 with fulcrum (rotating shaft 32, be illustrated in two circles roughly in the middle of) be the state that is configured to linearity on the rightabout at center, but, also can form the configuration that has angle of V word shape shown in Figure 5 for the configuration of cam arm 33 and nozzle hold-down arm 34.

The concentric circles on right side is the concentric circles that the rotational trajectory of wafer W is divided into the homalographic zone of predetermined quantity (being 6 in illustrated example) among the figure; Expression cam face in left side among the figure; Said cam makes said rocking arm 31 swings, so that the pass through time of nozzle 20 in this each homalographic zone is constant.

In Fig. 8; Point P1～P7 illustrate the nozzle 20 that is installed on the nozzle hold-down arm 34 motion track and said wafer motion track outer peripheral lines and interior contour and be formed on said in intersection point between the line (homalographic line) in the said homalographic of division zone between the outer peripheral lines; It is the every place that should locate during through scheduled time τ of nozzle 20; Point p1～p7 is that nozzle 20 is when being positioned at said some P1～P7; There is mutual corresponding relation in the position (benchmark input point) of the contact point (input point) of the periphery of said cam arm 33 and cam between the each point of same numbers in P, p.

In addition; Be equipped with on the nozzle hold-down arm 34 under the situation of a plurality of nozzles 20, also can the motion track of the arbitrfary point on the nozzle hold-down arm 34 between the configuring area of the motion track of any nozzle 20 wherein or nozzle 20 and the intersection point between said inside and outside contour and the homalographic line be set at said some P1～P7 respectively.

In addition; The position relation of turntable 11, rocking arm 31 and cam 35 moves with predetermined velocity variations as long as can make nozzle 20 be accompanied by the rotation of cam 35, can arbitrarily dispose; But in this embodiment; In order to confirm the outer shape of cam 35, as an example, such configuration turntable 11, rocking arm 31 and cam 35 as shown in Figure 9.

In Fig. 9, said rocking arm 31 is that nozzle hold-down arm 34 and cam arm 33 are configured in through fulcrum Q ₀The parts that form on the same straight line of (rotating shaft 32) will be configured in middle circle (pivot with turntable is the center of circle, is the circle of radius with (R+r)/2) P between the interior periphery of said turntable at the said rocking arm in the centre position of hunting range _CTangent line on, simultaneously, line is through said middle circle P _CAnd the point of contact between the said tangent line and meet at right angles with said tangent line, with the periphery and the intersection point between interior week of said line and said turntable 11, respectively as the end that is installed in the moving range of the nozzle 20 on the nozzle hold-down arm 34.

And; The pivot O of cam is configured on the following position: said pivot O on the extended line of the straight line at the two ends of the moving range that connects the contact point (input point) between said cam arm 33 and the said cam periphery, be the pivot O of said cam be positioned at when being connected on the outer peripheral lines that nozzle 20 is positioned at turntable and the extended line of the straight line of the said input point (benchmark input point p1, p7) of nozzle 20 when being positioned on the contour of turntable on, and the pivot O of said cam to be arranged in apart from any nearer point of said input point (benchmark input point p1, p7) be the least radius C of cam _MinThe position on, in illustrated example, the pivot O of said cam is positioned at when nozzle 20 is positioned on the internal diameter of turntable 11 distance, and to move distolateral distance be the least radius C of cam _MinThe position on.

Therefore, the pivot O of cam 35 is with respect to the pivot P of turntable ₀Configuration, can be expressed from the next:

L _x＝L ₁cosθ+L ₂cosθ＝(L ₁+L ₂)cosθ

L _y＝r ₁+C _min+(L ₁+L ₂)sinθ

$\mathrm{\&theta;}={\sin }^{-1}\left(\frac{r_c-r_1}{L_1}\right)$

In addition, the configuration of the pivot O of cam is not limited to Fig. 8, example shown in Figure 9, for example also can be as shown in Figure 6, the pivot O of cam is configured on the extended line of the circular arc that the motion track of the contact point between cam arm and the cam periphery describes.

In Fig. 8; The peripheral shape of cam 35 becomes following shape: contact input point p1～p7 at this cam 35 successively to the periphery of the process cam 35 of 0 °～180 ° of predetermined direction of rotation rotations; The periphery of rotating the process cam 35 of remaining 180 °～360 ° (0 °) contacts p7～p1 successively, constitute thus cam rotation once then nozzle 20 can carry out P1～P7 and turn back returning the reciprocating motion of P1 once more at P7.

And then; The predetermined anglec of rotation that becomes every interval cam 35 through the peripheral shape that makes said cam 35 (is divided in 6 uniformly-spaced regional illustrated embodiments at the rotational trajectory with wafer W; Be 2 times 12 to cut apart be 30 ° at every interval) shape through p1～p7 successively; Can control nozzle 20, make the constant time of its every process just through P1～P7 each point.

The outer shape of such cam is to be center and concentrically ringed while through each benchmark input point p1～p7 respectively describing pivot O with described cam 35; Using isogonal line that this concentric circles is divided into each is 30 ° equal angles; Make wherein an isogonal line through benchmark isogonal line L1 and through the intersection point between the circle of said benchmark input point p1; Through begin from said benchmark isogonal line L1 clockwise, counterclockwise respectively at interval 30 ° isogonal line L2, L12 with through the intersection point between the circle of benchmark input point p2, through isogonal line L3, L11 with through the intersection point between the circle of benchmark input point p3, through isogonal line L4, L10 with through the intersection point between the circle of benchmark input point p4, through isogonal line L5, L9 with through the intersection point between the circle of benchmark input point p5, through isogonal line L6, L8 with pass through the intersection point between the circle of benchmark input point p6; Up to be positioned at phase place with respect to said benchmark isogonal line L1 is on 180 ° the isogonal line L7 of position; The intersection point of isogonal line L7 and the smallest circle through benchmark input point p7; Form the cam surface shape with roughly heart-shaped periphery thus; Thereby can make nozzle 20 repeated moving, and can carry out above-mentioned control translational speed.

In addition; Utilize the outer shape of the definite cam 35 of above-mentioned method; Even also can use under with respect to the situation of the configuration of cam arm 33 at the pivot O that has changed cam 35; With reference in the explanation of Fig. 8, being configured in benchmark input point p7 side with the pivot O with cam is that example is illustrated, even but in contrast; Be located at pivot O under the situation of benchmark input point p1 side, also can easily confirm to have the profile of the cam of corresponding shape (with reference to Figure 10) therewith cam.

In addition, with reference in the explanation of Fig. 8, for the ease of explanation; The situation that is divided into 6 homalographic zones with the motion track with wafer W is that example is illustrated; But for example when the motion track with wafer W is divided into 18,36 and thinner homalographic zone, under the situation that is divided into 18 homalographics zones, establish an isogonal line for per 10 °, under the situation that is divided into 36 homalographics zones, establish an isogonal line etc. for per 5 °; Through more carefully setting isogonal line; The peripheral shape of cam 35 can be confirmed in more detail, when implementing, the suitable said quantity of cutting apart can be selected arbitrarily.

In above reference in the explanation of Fig. 8～Figure 10; The motion repeatedly of nozzle 20 is illustrated as on the direction of intersecting with the outer peripheral lines of the rotational trajectory of turntable and each homalographic zone (width of the track of closed hoop) between the interior contour, crossing the regional situation of each homalographic; But make nozzle 20 at outer peripheral lines → center → under the situation with the mode repeated moving of the turntable that crosses rotation between the opposed outer peripheral lines in the center of said outer peripheral lines; Through following method; Also can realize making the constant cut of the working (finishing) area of unit interval, promptly: turntable is divided into a plurality of homalographics zone; And the mobile of nozzle controlled, so that nozzle 20 crosses each homalographic zone with scheduled time τ.

As an example,, be r for the pivot any distance that is positioned at apart from turntable making nozzle 20 under situation about moving in the above described manner on the turntable _nThe translational speed (scheduled time τ in displacement dx) of locational nozzle, can obtain based on following formula.

If the area (total working (finishing) area) that the external diameter of turntable (workpiece and even wafer diameter) is R, establish on the turntable is S, then

S＝πR ²

Therefore, on this turntable, be divided under the situation in n homalographic zone, the area ds in each homalographic zone can be expressed from the next

$\mathrm{ds}=\frac{S}{n}=\frac{{\mathrm{\&pi;R}}^2}{n}$

Turntable is divided into minimum radius of a circle is r in the concentric circles of n if establish here, ₁, establish than said smallest circle big one the circle concentrically ringed radius be r ₂, big two the circle concentrically ringed radius be r ₃, be r then for n radius of a circle _n, and nozzle at the fixed time in the τ from radius r _nThe position to peripheral direction move apart from dx, can be expressed from the next respectively:

πr ₁ ²＝ds

${\mathrm{<figure-callout\; id="1"\; label="r"\; filenames="S2008101280998E00011.png,S2008101280998E00021.png"\; state="\{\{state\}\}">r</figure-callout>}}_1=\sqrt{\frac{\mathrm{ds}}{\mathrm{\&pi;}}}$

πr ₂ ²＝2ds

${\mathrm{<figure-callout\; id="2"\; label="r"\; filenames="S2008101280998E00031.png,S2008101280998E00082.png"\; state="\{\{state\}\}">r</figure-callout>}}_2=\sqrt{\frac{2\mathrm{ds}}{\mathrm{\&pi;}}}=\sqrt{2}{\mathrm{<figure-callout\; id="1"\; label="r"\; filenames="S2008101280998E00011.png,S2008101280998E00021.png"\; state="\{\{state\}\}">r</figure-callout>}}_1$

${\mathrm{<figure-callout\; id="1"\; label="dx"\; filenames="S2008101280998E00011.png,S2008101280998E00021.png"\; state="\{\{state\}\}">dx</figure-callout>}}_1=\sqrt{2}{r}_1-\sqrt{\frac{\mathrm{ds}}{\mathrm{\&pi;}}}$

πr _n ²＝nds

$r_n=\sqrt{\frac{\mathrm{nds}}{\mathrm{\&pi;}}}=\sqrt{\mathrm{<figure-callout\; id="1"\; label="n\; r"\; filenames="S2008101280998E00011.png,S2008101280998E00021.png"\; state="\{\{state\}\}">n</figure-callout>}}{r}_{}{}_1$

$\mathrm{dx}=\sqrt{n+1}{r}_1-\sqrt{\mathrm{<figure-callout\; id="1"\; label="n\; r"\; filenames="S2008101280998E00011.png,S2008101280998E00021.png"\; state="\{\{state\}\}">n</figure-callout>}}{r}_{}{}_1$

In addition, the precalculated position r of nozzle 20 from the rotational trajectory _nThe displacement dx that moves in the τ at the fixed time of Zhou Fangxiang inwardly _N-1Can be expressed from the next:

${\mathrm{dx}}_{n-1}=\sqrt{n}{r}_1-\sqrt{n-1}{\mathrm{<figure-callout\; id="1"\; label="r"\; filenames="S2008101280998E00011.png,S2008101280998E00021.png"\; state="\{\{state\}\}">r</figure-callout>}}_1$

As an example, be under 18 the situation, for the r (r of position arbitrarily of nozzle at the quantity n of cutting apart that makes turntable with diameter 1400mm (R=700mm) be divided into the homalographic zone ₁～r ₁₈) and nozzle 20 in this position at the fixed time in the τ to peripheral direction move apart from dx (dx ₁～dx ₁₈), can as followsly obtain respectively and (still, omit r ₄～r ₁₈, dx ₄～dx ₁₈Calculating).

$S=\frac{\mathrm{\&pi;}}{4}{1400}^2=1539380\left({\mathrm{mm}}^2\right)$

$\mathrm{ds}=\frac{S}{n}=\frac{1539380}{18}=85521\left({\mathrm{mm}}^2\right)$

πr ₁ ²＝ds

${\mathrm{<figure-callout\; id="1"\; label="r"\; filenames="S2008101280998E00011.png,S2008101280998E00021.png"\; state="\{\{state\}\}">r</figure-callout>}}_1=\sqrt{\frac{\mathrm{ds}}{\mathrm{\&pi;}}}=\sqrt{\frac{85521}{\mathrm{\&pi;}}}=165\left(\mathrm{mm}\right)$

$r_n=\sqrt{\mathrm{<figure-callout\; id="1"\; label="n\; r"\; filenames="S2008101280998E00011.png,S2008101280998E00021.png"\; state="\{\{state\}\}">n</figure-callout>}}{r}_{}{}_1$

Can get thus

${\mathrm{<figure-callout\; id="2"\; label="r"\; filenames="S2008101280998E00031.png,S2008101280998E00082.png"\; state="\{\{state\}\}">r</figure-callout>}}_2=\sqrt{2}{\mathrm{<figure-callout\; id="1"\; label="r"\; filenames="S2008101280998E00011.png,S2008101280998E00021.png"\; state="\{\{state\}\}">r</figure-callout>}}_1=\sqrt{2}\&times;165=233.3---\left(\mathrm{mm}\right)$

dx ₁＝r ₂-r ₁＝233.3-165＝68.3(mm)

${\mathrm{<figure-callout\; id="3"\; label="r"\; filenames="S2008101280998E00031.png,S2008101280998E00051.png"\; state="\{\{state\}\}">r</figure-callout>}}_3=\sqrt{3}{\mathrm{<figure-callout\; id="1"\; label="r"\; filenames="S2008101280998E00011.png,S2008101280998E00021.png"\; state="\{\{state\}\}">r</figure-callout>}}_1=\sqrt{3}\&times;165=285.8\left(\mathrm{mm}\right)$

dx ₂＝285.8-233.3＝52.5(mm)

As stated; For outer peripheral lines → center → the moving across the center of said outer peripheral lines opposed outer peripheral lines between of nozzle 20 at turntable; Can constitute as having explained with reference to Figure 15 (B), rocking arm 31 is swung on the direction parallel with the direction of rotation of turntable, nozzle 20 crosses turntable with being arcuation; Also can through make rocking arm 31 shown in figure 13 with the face of the face quadrature of the rotational trajectory of turntable on swing, thereby nozzle 20 is for example moved on the diameter of turntable point-blank.

Illustrated among Figure 11 shown in Figure 13 pass through with the face of the face quadrature of the rotational trajectory of turntable on the example of definite method of the cam face that uses when controlling of the translational speed of 31 pairs of nozzles 20 of rocking arm of swinging; The outer shape of representing cam among the figure shown in the left side in the concentric circles of dotted line; The concentric circles of the solid line on right side representes to be divided into the rotational trajectory of the regional workpiece W of a plurality of homalographics respectively among the figure; The straight line that connects both is the straight line that schematically shows rocking arm 31, and this respect is identical with the key diagram of definite method of the cam face of having explained with reference to Fig. 8, Figure 10.

But; In the cam face of having explained with reference to Fig. 8, Figure 10; Explained that contact position place between the input point of cam and cam arm when utilizing nozzle 20 on the homalographic line describes the position on the profile of cam; Confirm cam face thereby connect these points of describing, but in embodiment shown in Figure 11, describe following each point; The position that these points are cam arms 33 when nozzle 20 is positioned at the two ends of its moving direction (p1～p14) and be positioned at (the pairing position of P2～P13), position of intermediate point of the width in each homalographic zone with nozzle 20; Through the point on the profile of cam, and connect the outer shape that these points of depicting are confirmed cam, the method with the outer shape of definite cam of having explained with reference to Fig. 8, Figure 10 is different in this respect.

Promptly; In illustrated example, confirm the outer shape of cam 35: when nozzle 20 crosses each homalographic zone in the anglec of rotation (15 °) of cam through following mode; When promptly having rotated 7.5 ° therebetween, nozzle is positioned at the intermediate point of the width in homalographic zone.

And; In the above-mentioned cam of having explained with reference to Fig. 8, Figure 10; Through with respect to predetermined direction Rotate 180 °; The restriction turntable is in said outer peripheral lines and become with this outer peripheral lines and move towards interior Zhou Fangxiang from peripheral direction between the contour in concentrically ringed, through remaining 180 ° rotation, limits and moves towards peripheral direction from interior Zhou Fangxiang; But in the cam of this embodiment, limit such as stated nozzle at outer peripheral lines → center → between the opposed outer peripheral lines in the center of said outer peripheral lines, cross moving of turntable.Therefore, cam 35 constitutes following shape: through with respect to the predetermined direction half-twist, carry out moving from outer circumferential side to the pivot of turntable; Through 90 °～180 ° rotation, carry out moving the translational speed of going journey of limits nozzle from pivot to periphery; Thereafter; Utilization rotation of (0 °) from 180 ° to 360 ° arrives periphery from the periphery of turntable through central authorities once more, can control the translational speed of the backhaul of nozzle 20.Therefore, with respect to the quantity of the rotational trajectory homalographic ground of workpiece and even wafer being divided formed homalographic zone, describe the outer shape of cam with the point more than 4 times, compare with the cam of having explained with reference to Fig. 8, Figure 10 in this respect, it is many that the described point number becomes.

In addition; Even cross the outer peripheral lines → center of turntable → under the situation between the opposed outer peripheral lines in the center of said outer peripheral lines at nozzle 20; Also can be as having explained with reference to Fig. 8, Figure 10; When nozzle 20 is positioned on the homalographic line that is divided into each homalographic zone, describes the outer shape of cam 35 corresponding to the position of cam arm 33, thereby confirm cam face.

Figure 11 explained nozzle 20 with the direction of the face quadrature of the rotational trajectory of turntable on the definite method of cam face under the situation of Figure 13 of swinging; Each configuration relation of turntable in the embodiment of this Figure 11, rocking arm 31, cam 35, Figure 12 illustrate an example.

Shown in figure 12; Rocking arm 31 for this embodiment; Rotational trajectory outer peripheral lines → center → between the opposed outer peripheral lines in the center of said outer peripheral lines, the center of its hunting range is configured on the straight line through the pivot P of turntable, and the pivot O of cam 35 is configured on the extended line that connects benchmark input point p1 and p14; And the distance that is configured in the benchmark input point p14 of the center O side of leaving cam is the least radius C of cam _MinThe position on, the distance that the pivot O of cam is positioned at the pivot P that leaves turntable is the position of Ly, Lx, Ly, Lx calculate as follows:

L _y＝(L ₁+L ₂)cosθ

L _x＝L ₂sinθ+C _min

$\mathrm{\&theta;}={\sin }^{-1}\left(\frac{R}{L_1}\right)$

In the structure of above Figure 11 that has explained, for the outer shape of cam 35, as following, confirm.

At first; On cam arm 33 and motion tracks cam 35 periphery position contacting (input point); The correspondence position of the said input point when making nozzle 20 be configured in the position of above-mentioned P1～P14 is confirmed as benchmark input point p1～p14, depicts the concentric circles (concentric circles that dots among Figure 11) through this benchmark input point p1～p14 in the circle in left side in the drawings.

Then; With the 4 multiple amounts of cutting apart quantity (in the embodiment of Figure 11 being 6) of the circular path of workpiece W (in the example of Figure 11; Per 15 ° one totally 24), describe equal angles line L1～L24 that the circle in left side among the figure is cut apart on equal angles ground, and pass through the pivot O of cam; Between equal angles line L1 and the L24 and between equal angles line L12 and the L13, the datum line L0 that equal angles is cut apart (in the example of Figure 11 being 7.5 °) is set.

Then, with datum line L0 and through the maximum radius C of the intersection point between the concentric circles of benchmark input point p1 as this cam _MaxThe position describe, with datum line L0 and concentrically ringed intersection point through benchmark input point p14 least radius C as this cam _MinThe position describe.

And, with said maximum radius C _MaxDescribe the position as starting point; Along with the equal angles line leaves said datum line L0 on direction of rotation; Describe following radius the diminish concentric circles of one-level and the intersection point of said equal angles line: L1, L24 and the concentrically ringed intersection point through p2 at every turn; L2, L23 and the concentrically ringed intersection point through P3, L3, L22 and the concentrically ringed intersection point that passes through p4 ... L12, L13 and the concentrically ringed intersection point through p13 connect the outer shape that the each point of describing forms cam.

In addition, in the jet processing apparatus 1 that as above constitutes, the optional position of the face on said turntable 11 can be provided with air blast and use nozzle, is used to remove the grinding-material that is deposited on the wafer W etc.

[embodiment]

Below, the embodiment that various workpiece and even wafer is carried out the time processing circulation with different processing methods is shown.

[table 2]

(embodiment 1; Processing method: Figure 15 (A))

Remove the film that is formed on testing wafer surface, and formed the level and smooth minute surface that wafer surface is not processed uneven homogeneous, need not utilize burnishing device to carry out mirror ultrafinish.Therefore, can shorten wafer very significantly and grind the needed time, and not need burnishing device.And,, therefore can make wafer regeneration owing to can remove the film that is formed on the wafer effectively.

[table 3]

(embodiment 2; Processing method: Figure 15 (B))

(embodiment 2; Processing method: Figure 15 (B))

For the jet processing apparatus that constitutes aforesaid way 1, be connected with following apparatus etc.: the compressed air supply source that air compressor etc. are not shown; Dust arrester 50, the dust that it produces during with cutting the grinding-material that in Processing Room 3, sprays etc. aspirates; And cyclone separator 60, it is used for reclaiming from having removed the grinding-material behind the dust through this dust arrester 50 from the grinding-material that is mingled with dust that Processing Room 3 interior suctions come, and constructs the system of processing that is used for wafer W is sprayed processing shown in figure 14.

And then; In the shutter door on opening wide the casing 2 that is located at said jet processing apparatus 1; Wafer W is installed on the anchor clamps 12 on the turntable 11 that is configured in the casing 2; Start jet processing apparatus 1, then utilize the nozzle 20 that is installed on the rocking arm 31 (31a, 31b, 31c) to come the jet grinding material, and; The cam 35 that periphery contacts with cam arm 33 on being located at this rocking arm 31 (31a, 31b, 31c) is accepted to rotate towards certain orientation with constant speed from the rotary driving force of motor 36 drive sources such as grade.

Rotation through this cam 35; rocking arm 31c and rocking arm 31a, 31b that cam arm 33 is contacted with the periphery of cam 35 begin swing, and the rotating shaft 32 of said rocking arm 31c is connected on the rotating shaft 32 of being located at the side 31a among said rocking arm 31a, the 31b via connecting rod 39.

Swing through this rocking arm 31 (31a, 31b, 31c); Nozzle 20 is with the mode repeated moving of the motion track that crosses the wafer W that forms closed hoop; And its speed is controlled as: nozzle 20 during from the inside all side shifting of the outer circumferential side of turntable 11 translational speed accelerate relatively; Slack-off relatively in nozzle 20 translational speed when interior all side direction outer circumferential sides move; Thus, can prevent under the situation that nozzle 20 is moved with constant speed, to be produced in the outer circumferential side of turntable 11 and the degree of finish different problems of interior all sides.

Especially; Suppose the homalographic zone that the motion track of wafer W is divided into concentric circles with the homalographic mode; And nozzle 20 controlled, it is constant to make this nozzle 20 cross time in each homalographic zone, thus; No matter wafer W is configured in any position on the turntable 11, can both make the working (finishing) area of unit interval constant.

Consequently, no matter will carry and put on the optional position on the turntable 11, can both process with the uniform processing degree at an arbitrary position as the wafer W of process object.

As stated; For the wafer that carries out with method of the present invention after the grinding; Purpose in said grinding for example is to remove the overlay film on the surface that is formed on testing wafer; So that under the situation of testing wafer regeneration, be the vestige etc. about 18 μ m producing the degree of depth on the surface of wafer W through the jet grinding material.Therefore, state processing after can carrying out according to the purpose of processing, as utilize known mechanical lapping, mechanical-chemical grinding etc. to grind to remove this vestige etc.

Claims (16)

1. grinding processing method, said grinding processing method carries out grinding with nozzle to the jet surface grinding-material of workpiece, it is characterized in that,

The rotation on predetermined rotational trajectory of said workpiece is moved, and

In the outer peripheral lines of said rotational trajectory, be divided into a plurality of homalographics zone by the concentric circles that with the center of this rotational trajectory is the center; The time of crossing said each homalographic zone with the nozzle of constant processing conditions jet grinding material is constant, and mobile on the direction of intersecting with said each homalographic zone.

2. grinding processing method, said grinding processing method carries out grinding with nozzle to the jet surface grinding-material of workpiece, it is characterized in that,

The rotation on predetermined rotational trajectory of said workpiece is moved, and

The rotational trajectory of said workpiece has the outer peripheral lines of this rotational trajectory and is contour in center concentrically ringed with the center of said rotational trajectory; Interval between said outer peripheral lines and the interior contour is divided into a plurality of homalographics zone; The time of crossing said each homalographic zone with the nozzle of constant processing conditions jet grinding material is constant, and mobile on the direction of intersecting with said each homalographic zone.

3. grinding processing method according to claim 2 is characterized in that,

When if the area in said homalographic zone is ds, mobile in the following manner towards the nozzle that the periphery side direction moves from interior all sides of rotational trajectory: the center at the said rotational trajectory of distance is a radius r _nArbitrfary point place, the displacement dx of said nozzle is similar to following formula in the given time,

$\mathrm{dx}=\sqrt{{r_n}^2+\frac{\mathrm{ds}}{\mathrm{\&pi;}}}-r_n.$

4. grinding processing method according to claim 2 is characterized in that,

When if the area in said homalographic zone is ds, mobile in the following manner towards the nozzle that interior all side directions move from the outer circumferential side of rotational trajectory: the center at the said rotational trajectory of distance is a radius r _nArbitrfary point place, the displacement dx of said nozzle is similar to following formula in the given time,

$\mathrm{dx}=r_n-\sqrt{{r_n}^2-\frac{\mathrm{ds}}{\mathrm{\&pi;}}}.$

5. grinding processing method according to claim 1 is characterized in that,

Make single said workpiece rotation, be concentric circles in the outer peripheral lines with the rotational trajectory of said workpiece and be divided into equal areas, as said homalographic zone.

6. grinding processing method according to claim 1 is characterized in that,

If the minimum concentrically ringed radius of diameter when said rotational trajectory is divided into a plurality of homalographics zone is r ₁, said nozzle moves in the following manner: is positioned at and begins n the nozzle on the concentric circles from the center and be similar to following formula to what peripheral direction moved apart from dx in the given time,

$\mathrm{dx}=\sqrt{n+1}{r}_1-\sqrt{n}{r}_1.$

7. grinding processing method according to claim 5 is characterized in that,

If the minimum concentrically ringed radius of diameter when said rotational trajectory is divided into a plurality of homalographics zone is r ₁, said nozzle moves in such a way: be positioned at begin from the center that the inside in the given time Zhou Fangxiang of n the nozzle on the concentric circles moves apart from dx _N-1Be similar to following formula,

${\mathrm{dx}}_{n-1}=\sqrt{n}{r}_1-\sqrt{n-1}{r}_1.$

8. grinding processing method according to claim 2 is characterized in that,

Said nozzle moves in the said outer peripheral lines of said rotational trajectory and the homalographic regional extent between the interior contour.

9. grinding processing method according to claim 1 is characterized in that,

Said nozzle crosses the outer peripheral lines → center position of said rotational trajectory → between the opposed outer peripheral lines in the center of said outer peripheral lines, move.

10. an abrasive machining device is characterized in that,

Said abrasive machining device has:

Nozzle, it is to workpiece jet grinding material;

Rotation, supply unit, it moves the rotation on predetermined rotational trajectory of said workpiece; And

The nozzle mobile control unit; In the outer peripheral lines of said rotational trajectory, be formed with a plurality of homalographics zone; Said homalographic zone is that the concentric circles at center is divided and to be formed by the center with this rotational trajectory; It is constant that said nozzle mobile control unit makes said nozzle cross time in said homalographic zone, and make said nozzle mobile on the direction of intersecting with said homalographic zone.

11. abrasive machining device according to claim 10 is characterized in that,

Said nozzle mobile control unit has:

Rocking arm, it is through being that fulcrum is swung with a predetermined axle bearing position, make said nozzle the said outer peripheral lines of said rotational trajectory and and this outer peripheral lines be to move back and forth between the contour in concentrically ringed; And

Cam, itself and said rocking arm are external, make said rocking arm with predetermined figure swing through rotation,

Be configured in this nozzle respectively on the position that predetermined timing should be disposed the time will being located at nozzle on the said rocking arm; Respectively as the benchmark input point, the outer shape of said cam is with the position of the contact site branch between said rocking arm and said cam configuration: during every rotation anglec of rotation corresponding with said timing successively through said benchmark input point.

12. abrasive machining device according to claim 11 is characterized in that,

Make said rocking arm with the face of the face quadrature of the rotational trajectory of said workpiece in swing.

13. an abrasive machining device is characterized in that,

Said abrasive machining device has:

Nozzle, it is to workpiece jet grinding material;

Rotation, supply unit, it moves the rotation on predetermined rotational trajectory of said workpiece;

The rotational trajectory of said workpiece has outer peripheral lines and interior contour, and the interval between this outer peripheral lines and the interior contour is divided into a plurality of homalographics zone that area is ds; And

The nozzle mobile control unit, it is constant that it makes said nozzle cross time in said homalographic zone, and make said nozzle mobile on the direction of intersecting with said homalographic zone; And

Said nozzle mobile control unit moves said nozzle in the following manner: the center radius at the said rotational trajectory of distance is r _nThe arbitrfary point on, what the nozzle that moves from interior all sides of rotational trajectory towards the periphery side direction moved in the given time is similar to following formula apart from dx,

$\mathrm{dx}=\sqrt{{r_n}^2+\frac{\mathrm{ds}}{\mathrm{\&pi;}}}-r_n.$

14. an abrasive machining device is characterized in that,

Said abrasive machining device has:

Nozzle, it is to workpiece jet grinding material;

Rotation, supply unit, it moves the rotation on predetermined rotational trajectory of said workpiece;

The rotational trajectory of said workpiece has outer peripheral lines and interior contour, and the interval between this outer peripheral lines and the interior contour is divided into a plurality of homalographics zone that area is ds; And

The nozzle mobile control unit, it is constant that it makes said nozzle cross time in said homalographic zone, and make said nozzle mobile on the direction of intersecting with said homalographic zone; And

Said nozzle mobile control unit moves said nozzle in the following manner: the center radius at the said rotational trajectory of distance is r _nThe arbitrfary point on, what the nozzle that moves from all inwardly side directions of the outer circumferential side of rotational trajectory moved in the given time is similar to following formula apart from dx,

$\mathrm{dx}=r_n-\sqrt{{r_n}^2-\frac{\mathrm{ds}}{\mathrm{\&pi;}}}.$

15. abrasive machining device according to claim 10 is characterized in that,

With dividing and form n said homalographic zone with concentric circles homalographic ground in the outer peripheral lines of the rotational trajectory of said workpiece, establishing the minimum concentrically ringed radius of diameter that is divided into said homalographic zone is r ₁, said nozzle mobile control unit moves said nozzle in the following manner: is positioned at and begins n the nozzle on the concentric circles from the center and be similar to following formula to peripheral direction displacement that moves and the displacement dx that utilizes following formula to stipulate in the given time,

$\mathrm{dx}=\sqrt{n+1}{r}_1-\sqrt{n}{r}_1.$

16. abrasive machining device according to claim 10 is characterized in that,

With being divided into concentric circles in the outer peripheral lines of the rotational trajectory of said workpiece homalographic, form n said homalographic zone, establishing the minimum concentrically ringed radius of diameter that is divided into said homalographic zone is r ₁, said nozzle mobile control unit moves said nozzle in the following manner: be positioned at and begin n the nozzle on the concentric circles inside Zhou Fangxiang displacement that moves and the displacement dx that utilizes following formula to stipulate in the given time from the center _N-1Be similar to following formula,

${\mathrm{dx}}_{n-1}=\sqrt{n}{r}_1-\sqrt{n-1}{r}_1.$

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