KR20090023678A - Cutting apparatus - Google Patents

Abstract

This invention provides a cutting apparatus which can prevent the occurrence of cracks and can cut an object cutting material accurately and stably without sacrificing the quality of the object cutting material. The cutting apparatus is a cutting apparatus (10) for cutting an object cutting material (W) formed of a fragile material such as glass, ceramic, or a semiconductor material and comprises a cutting tool (12) disposed abuttably against a desired cutting site (i) in the object cutting material (W), and displacement means for causing relative movement between the cutting tool (12) and the object cutting material (W) along the cutting site (i). The cutting tool (12) comprises a cutting edge part (18) provided with an edge part (20) for cutting the object cutting material (W) and a heating element for heating the cutting edge part (18) at a temperature at or above the softening point of the object cutting material (W). The cutting site (i) in the object cutting material (W) is machined for cutting by causing relative movement between the object cutting material (W) and the edge part (20) heated by the heating element by the displacement means.

Description

Cutting device {CUTTING APPARATUS}

TECHNICAL FIELD This invention relates to a cutting device, and is applied to the to-be-cut material which consists of fragile materials, such as glass and a ceramic, Preferably, to cut the to-be-processed material of thin plates, Especially, for example, a liquid crystal or a plasma It is related with the cutting device suitable for cutting of a glass substrate in the manufacturing process of the display panel of a display.

In the prior art, which is the background of the present invention, a rubber plate or the like is pressed against a laminated glass plate formed by joining two glass substrates from an opposite side of a scribe groove formed of a glass cutter such as a cemented carbide cutter wheel, and a pressing force is applied along the scribe line. There was a cutting method of a laminated glass substrate characterized by advancing a vertical crack of the scribe groove to divide the glass substrate (see Patent Document 1, for example).

Moreover, in the prior art which becomes the background of this invention, the cutting scale (cutting line) inclined by the diamond disk saw, the disk type cutter, is formed in the one main surface side of a glass plate, and then it cuts The glass plate is deformed by heating the outside of the area enclosed by the cutting scale on the side where the scale is placed, and the area enclosed by the cutting scale is instantaneously reached by the deformed cutting scale to the side opposite to the heating surface. There has been a method of cutting glass characterized by being separated (see Patent Document 2, for example).

In addition, in the prior art which is the background of the present invention, the glass sheet surface is irradiated with a laser light such as a carbon dioxide laser, an HF laser, a YAG laser, and the like, and is locally supplied with heat, followed by quenching. The glass cutting method and apparatus which divide | segment a glass sheet without giving curvature deformation and an impact to a glass sheet are proposed (for example, refer patent document 3).

In addition, in the prior art which is the background of the present invention, at least two points in the vicinity of the end of the work material W made of brittle material such as glass and alumina ceramic, in this case, a cut line scheduled line (scribe groove scheduled line) Irradiation of a laser beam, such as a carbon dioxide gas laser or a YAG laser, at the same time to generate two cracks at the same time, generate an unusual thermal stress distribution between the laser beam irradiation positions, and provide one tensile stress. A method of cutting brittle materials and the like is also proposed, which is made larger than in the case of irradiating a laser beam and improves cutting control by controlling the state of stress generation (see Patent Document 4, for example).

Moreover, the prior art which becomes the background of this invention WHEREIN: The heating which irradiates the laser beam in which the energy density in each site | part is uniform, and the spot of a laser beam is long vertically in the cutting direction, and heats the cut part of a glass substrate. And a cooling step of quenching the cut portion heated by irradiation of the laser beam to form microcracks, whereby the production of microcracks can be activated and the productivity of the glass substrate cutting method can be improved. It is proposed (for example, refer patent document 5).

Moreover, the prior art which becomes the background of this invention WHEREIN: The process of shape | molding a process site | part thinly compared with another site | part in the processing method of a glass product or a crystallized glass product, and a laser irradiation with respect to the said process site | part There is also proposed a processing method and a manufacturing method of a glass product or a crystallized glass product, including a step of performing a perforation or a cutting process (see Patent Document 6, for example).

In addition, in the prior art which is the background of the present invention, grinding means for putting a fine crack at the starting point of cutting the glass plate, irradiation heating means by at least one laser beam absorbed by the glass plate, and at least one laser beam In the cutting apparatus of the glass plate containing cooling means of a glass plate by a cooling fluid, and a braking means after irradiation heating, the irradiation control whose laser beam is a 1st carbon dioxide laser beam, and 1st control which controls an irradiation means to a predetermined range. The glass plate cutting device etc. which carry out the braking process of a glass plate after providing a means and the 1st cooling means by the cooling fluid provided in the back part of a 1st carbon dioxide laser beam irradiation means to generate a scribe line are proposed. (For example, refer patent document 7).

Patent Document 1: Japanese Patent Application Publication No. 1994-48755

Patent Document 2: Japanese Patent Application Publication No. 1995-223828

Patent Document 3: Japanese Patent Application Publication No. 1997-12327

Patent Document 4: Japanese Patent Application Publication No. 1995-328781

Patent Document 5: Japanese Patent Application Publication No. 2005-247603

Patent Document 6: Japanese Patent Application Publication No. 2000-219528

Patent Document 7: Japanese Patent Application Laid-Open No. 2006-513121

However, in the prior art which is the background of the present invention described above, there are the following problems. That is, in the technique of Patent Document 1, when the rubber is pressed from the opposite side of the scribe groove, the glass substrate is impacted, so that defects or cracks are likely to occur in the glass plate under the influence of the impact, and the wiring is cut. There is a problem of lowering the quality of the glass plate.

In the technique of Patent Literature 2, it is difficult to control the direction in which the cutting scale is generated, so that cracks are generated inside the glass plate, and there is a problem of poor quality as a product.

In the techniques of Patent Literature 3 and Patent Literature 4, it is necessary to increase the irradiation output of the laser light, so that unevenness in the scribe groove may be affected, and cracks may occur in the inward direction of the glass plate, and furthermore, Therefore, there exists a problem that the performance of the glass plate used as a product falls, for example, a glass piece peels off.

In addition, in the technique of Patent Document 3, when the crack is guided along the path of the laser beam, the crack may shift and follow from the movement path of the laser beam irradiation position, so that the machining accuracy may be deteriorated.

Further, in the technique of Patent Document 4, the laser beam is irradiated and generated by local concentrated stress caused by the steep temperature gradient generated between the beam center and the periphery. Nonuniformity may occur in the thermal stress (tensile stress) generated depending on scattering conditions and light conditions in the material, and local concentrated stress may not exceed the allowable stress of the material. There is also a problem of low. In addition, similarly to the technique of Patent Document 3, when the crack is induced, the crack may shift and follow from the path of the movement of the laser beam irradiation position, so that the problem of deterioration of machining accuracy remains.

In the technique of Patent Literature 5, a step of forming a processed portion thinner than other portions is required before performing a punching or cutting process on a machined part by irradiating a laser. Since a press machine and the like are also required, there is a problem such as high manufacturing cost.

In the technologies such as Patent Document 6 and Patent Document 7, the configuration of the laser device and the optical peripheral device required therein is complicated, so that the cost of the device is very high and the cost is very high.

Therefore, the main object of the present invention is to provide a cutting device capable of cutting the cutting object accurately and stably without preventing the occurrence of cracks and impairing the quality of the cutting object.

The present invention according to claim 1 is a cutting device for cutting a cut object formed of a brittle material such as glass, ceramic, semiconductor material, etc., the cutting tool is arranged to be in contact with the desired cut portion of the cut object, and according to the cut portion A displacement means for generating a relative movement between the cutting tool and the cut object, the cutting tool including a cutting blade portion having an edge portion for cutting the cutting object, and the cutting blade at least a softening point of the cutting object. A heating element comprising a heating element heated to a high temperature, and by means of the displacement means, a relative movement is generated between the cutting object and the cutting blade portion heated by the heating element, whereby the cutting portion of the cutting object is cut and cut. Device.

In this invention which concerns on Claim 1, the cutting tool arrange | positioned so that contacting the desired cutting | disconnection site | part of a to-be-cut is heated by the heat generating body. In this case, the edge portion of the cutting blade portion is heated to a temperature higher than the softening point of the cutting object. The cutting tool generates relative movement between the cuttings by the displacement means. That is, the cutting edge and / or the cutting object of the cutting tool are relatively displaced according to the desired cutting portion. Therefore, at the desired cutting portion of the cutting object, a groove portion corresponding to the shape of the edge portion is formed by the edge portion of the cutting blade portion. At the same time, the cut portion is heated by the heated edge portion locally and the temperature is rapidly increased above the softening point of the cut portion, so that the cut portion at the portion where the edge portion contacts (butts) is fired. (塑性) Deformation. The plastic deformation part becomes a cutting chip and is scraped off from the cutting object, and finally, the cutting object is cut (in a narrow sense, "cutting") in accordance with a desired cutting portion.

In this way, when the cutting tool is pressed strongly at a high temperature locally according to a desired cutting site so that the cutting object has a temperature equal to or more than the softening point, the cutting tool is directed toward its periphery around the area where the cutting tool is in contact with (contacted) by thermal expansion. Compressive stress occurs. In this case, the contact and abutment portions of the cutting tool are rapidly heated above the softening point of the cutting object, so that the cutting object at the contact portion is plastically deformed, whereby the compressive stress is opened. Therefore, cracks, such as cracks, do not occur in the cutting object due to the compressive stress generated around the contact portion.

Therefore, in the present invention according to claim 1, the edge portion of the cutting blade heated above the softening point of the cutting object is brought into contact with the desired cutting portion of the cutting object, and a relative movement between the cutting tool and the cutting object is exerted. It is possible to cut water accurately and stably without a cutting defect.

This invention which concerns on Claim 2 is invention which depends on invention which concerns on Claim 1, The temperature control which controls the temperature of a heat generating body so that the temperature of a cutting edge part may be maintained at predetermined temperature, while cutting a to-be-cut object with a cutting tool. It is a cutting device, characterized in that it further comprises means.

In this invention which concerns on Claim 2, the temperature of a cutting blade part is hold | maintained at predetermined temperature, while cutting a to-be-cut object with a cutting tool by a temperature control means. Therefore, it is possible to stably apply the thermal expansion force to the groove portion and the groove portion, and it is possible to cut the cut object more accurately and stably without a defective cutting.

This invention which concerns on Claim 3 is invention which depends on invention which concerns on Claim 2, Comprising: The temperature control means is provided in the vicinity of a heat generating body, and includes the temperature detection sensor which detects the temperature of the edge part of a cutting blade part, While cutting the cutting object, a control unit controls the speed of the relative movement occurring between the cutting tool and the cutting object and / or the cutting depth of the cutting blade with respect to the cutting object according to a detection signal from the temperature detection sensor. It is a cutting device characterized in that it further comprises.

In the present invention according to claim 3, the controller controls the speed of the relative movement occurring between the cutting tool and the cutting object and / or the cutting depth of the cutting blade with respect to the cutting object according to a detection signal from the temperature detection sensor. It can be controlled appropriately. Therefore, while cutting the cutting object with the cutting tool, the cutting conditions of the cutting object due to the temperature condition of the cutting edge of the cutting tool and the relative movement between the cutting tool and the cutting object always become optimal. Furthermore, it becomes possible to cut a to-be-cut object correctly and stably without a cutting defect.

This invention which concerns on Claim 4 is invention which is dependent on the invention as described in any one of Claims 1-3, It is a cutting device which further includes heating means which preheats preliminarily the site | part to cut with a cutting tool.

In this invention which concerns on Claim 4, the site | part to cut with a cutting tool is preliminarily heated by a heating means. Therefore, it becomes possible to heat a to-be-processed object to the temperature more than a softening point more simply by a cutting tool. Therefore, new improvement of cutting speed and stabilization of machinability are attained, and it becomes possible to ensure more stable workability.

This invention which concerns on Claim 5 is invention which depends on invention which concerns on Claim 4, Comprising: It further includes cooling means which cools the heating site heated by a heating means, The site | part made to cut | disconnect a site | part made to cut with a cutting tool by a heating means. It is a cutting device characterized by cutting while cooling while cooling by a cooling means.

In the present invention according to claim 5, the portion to be cut by the cutting tool is heated by the heating means and cooled by the cooling means. Therefore, the spread of heat in the cutting object in the portion (cutting portion) to be cut by the cutting tool is prevented from spreading in the plane direction of the cutting object. Therefore, in the case of the liquid crystal panel, for example, in the case of the liquid crystal panel, diffusion in the plane direction of heat that adversely affects various electrode patterns such as driving electrodes, liquid crystal, sealing material, adhesive, and the like can be prevented, thereby improving the performance of the liquid crystal panel. The problem of lowering can be prevented.

According to the cutting device according to the present invention, the cutting object can be cut accurately and stably without preventing the occurrence of cracks and impairing the quality of the cutting object.

The foregoing and other objects, features and advantages of the present invention will become more apparent from the following description of the best mode for carrying out the following invention which is made with reference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS It is a principal part perspective view drawing which shows an example of the Example of the cutting device which concerns on this invention.

FIG. 2 is a plan view schematically showing an example of a cutting tool applied to the embodiment of FIG. 1. FIG.

3 shows an example of a manufacturing method of a cutting tool applied to the embodiment of FIG. 1, in particular, (A) is a perspective view showing a state in which a temperature detection sensor is formed on a ceramic substrate, (B) It is a side view.

4 shows an example of a manufacturing method of a cutting tool applied to the embodiment of FIG. 1, in particular, (A) is a perspective view showing a state in which an insulating layer is formed on a temperature detection sensor, (B) It is a side view.

5 shows an example of a manufacturing method of a cutting tool applied to the embodiment of FIG. 1, in particular, (A) is a perspective view showing a state in which a heating element is formed, and (B) is a side view.

FIG. 6 shows an example of a manufacturing method of a cutting tool applied to the embodiment of FIG. 1, in particular, (A) is a perspective view showing a state where a wear resistant layer is formed on a heating element, and (B) is a side view thereof. It is a diagram.

FIG. 7 shows an example of a manufacturing method of a cutting tool applied to the embodiment of FIG. 1, in particular, (A) is a perspective view showing a state where an electrode is formed at an end portion of a heating element, and (B) is a side view thereof. It is also.

Fig. 8 shows an example of a manufacturing method of a cutting tool applied to the embodiment of Fig. 1, in particular, (A) is a perspective view showing a state where a cutting blade is formed by blade attachment polishing or the like, (B) Side view.

It is a principal part perspective view which shows an example of another Example of the cutting device which concerns on this invention.

Fig. 10 is a perspective view of a main part showing an example of still another embodiment of a cutting device according to the present invention.

Fig. 11 is an enlarged schematic view of a main part showing the action and effect of the embodiment shown in Fig. 10, (A) is the spread of heat in the glass plate (cut material) at the cut part when the cut part is not cooled by the cooling means. It is a principal part enlarged diagram which showed the state, (B) is a principal part enlarged diagram which showed the spread state of the heat in the glass plate (cut material) in a cut part when a cut part is cooled by a cooling means.

FIG. 12 (A) is an enlarged cross-sectional view of an essential part showing an example of an effective liquid crystal panel by applying the cutting device shown in the embodiment of FIG. 10, and (B) using the cutting device, shown in (A) Is an enlarged cross-sectional schematic view of the main part showing the process of cutting | disconnecting to desired size, (C) is an enlarged cross-sectional schematic drawing of the main part of the liquid crystal panel cut | disconnected using the said cutting device.

[Explanation of symbols for the main parts of the drawing]

(10) Cutting Equipment (12) Cutting Tools

(14) cutting tool body (16) ceramic substrate

(18) Cutting edge (20) Blade tip

(22) Temperature sensor 22a, 22b electrode

(24) Insulation Layer (26) Heating Element

(28) Wear Resistant Layers (30a, 30b) Electrodes

(40) Groove (50) Laser Machine

(52) Laser Light Source (54) Laser Light

(56) Beam spots (laser irradiation) (60) Cooling means

(62) Cooling gas blowing duct (62a) blower

70 Liquid Crystal Panel 72 Upper Glass Substrate

72a Common Glass 74 Lower Glass Substrate

(74a) Drive Electrode 76 Liquid Crystal

(78) Sealing Material (80) Mounting Base

(ω) Cut site (W) Glass plate (cut material)

(c) cutting chips

BRIEF DESCRIPTION OF THE DRAWINGS It is a principal part perspective view drawing which shows an example of the Example of the cutting apparatus concerning this invention, and FIG. 2 is a top view schematic which shows an example of the cutting tool applied to the Example of FIG. The cutting device according to the present invention is applicable to cutting brittle materials such as optical glass, quartz glass, other glass, ceramics, silicon, semiconductor materials and the like, but in the present embodiment, for example, liquid crystals and The cutting device 10 suitable for use for cutting of a glass plate in a panel manufacturing process of a plasma display, etc. will be described.

The cutting device 10 includes a cutting tool 12. The cutting tool 12 is, for example, as shown in FIG. 1, for example, as a cut object (workpiece), for example, a desired cut portion ω (referred to as "cutting" of a rectangular glass plate W). It is arranged so as to be in contact with the site?. In general, this cutting tool 10 has a high temperature equal to or higher than the softening point of the glass plate W in a localized portion (corresponding to the blade edge of the cutting blade portion described later) for cutting the glass plate W. For example, a temperature detection sensor and a heating element are formed on a ceramic substrate to enable temperature control at a high temperature in the range of about 60 ° C. to 1000 ° C., accurately and at high speed, and the glass plate W is formed on the cutting edge of the cutting blade heated to a predetermined temperature. The predetermined cutting | disconnection site | part (omega) of this is comprised so that it may cut | disconnect.

In other words, the cutting tool 12 includes, for example, a cutting tool body 14 having a pentagonal shape in plan view, for example, as shown in FIG. 2. The cutting tool body 14 includes a ceramic substrate 16 made of, for example, ceramic. The ceramic substrate 16 includes, for example, a V-shaped cutting edge portion 18 on one end side in the longitudinal direction thereof. The cutting blade portion 18 has a portion for cutting the glass plate W, which is a to-be-cut object, that is, a blade tip portion 20 as an edge portion. The blade tip 20 is located at the top end of the cutting blade 18 on one main surface side of the ceramic substrate 16.

And as the cutting tool main body 14, insulating materials, such as a silicon oxide, aluminum oxide, a zirconia, titanium oxide, a lite, can be used suitably, for example.

On one main surface of the ceramic substrate 16, a U-shaped temperature detection sensor 22 is formed in plan view. The electrodes 22a and 22b are connected to one end and the other end of the temperature detection sensor 22, respectively. The electrodes 22a and 22b are made of gold, gold, a copper alloy, or the like, respectively. In this case, as the temperature detection sensor 22, for example, a thermocouple made of chromel aluminel, platinum rhodium, or the like, or an electric resistor made of platinum, gold-tantalum, or the like can be suitably used.

Moreover, the insulating layer 24 which consists of silicon dioxide is formed in the one main surface side of the ceramic substrate 16 so that the temperature detection sensor 22 may be covered. As the material for forming the insulating layer 24, besides silicon dioxide, for example, an insulating material such as silicon oxide, aluminum oxide, zirconia, titanium oxide, or lite may be appropriately used.

In addition, on one main surface side of the ceramic substrate 16, a "c" shaped heating element 26 is provided on the upper surface of the insulating layer 24, for example. The heat generating element 26 is formed of resistance heating elements, such as silicon carbide. In this case, the temperature detection sensor 22 is provided in the vicinity of the heat generating element 26. As the material for forming the heat generating element 26, in addition to silicon carbide, for example, zirconia or the like can be used.

Moreover, the wear-resistant layer 28 is formed in the upper surface of the heat generating body 26 except the one end part 26a and the other end part 26b of the heat generating body 26 at the one main surface side of the ceramic substrate 16. The wear resistant layer 28 is made of titanium oxide, titanium nitride, or the like. As the material for forming the wear resistant layer 28, tungsten carbide, titanium carbide, boron carbide, or the like can be suitably used in addition to titanium oxide and titanium nitride.

Further, on one main surface side of the ceramic substrate 16, electrodes 30a and 30b made of gold, gold and copper alloys, etc., respectively, on the upper surfaces of one end portion 26a and the other end portion 26b of the heat generating element 26, respectively. ) Is connected.

Next, an example of the manufacturing method of the cutting tool 12 is demonstrated below, referring FIG. 3, FIG. 4, FIG. 5, FIG. 6, FIG. 7, and FIG.

First, for example, a ceramic substrate 16 made of zirconia or the like in the form of a cuboid is prepared, and, for example, a temperature made of gold-tantalum or the like on the upper surface of the ceramic substrate 16 as shown in FIG. 3. The detection sensor 22 is formed, and the electrode 22a and the electrode 22b which consist of gold and a copper alloy, respectively, are connected to the one end and the other end of the temperature detection sensor 22, respectively. The temperature detection sensor 22 and the electrodes 22a and 22b are integrally formed on the upper surface of the ceramic substrate 16 by a thin film formation method such as sputtering.

Next, the upper surface of the ceramic substrate 16 is covered with the temperature detection sensor 22 and the electrodes 22a and 22b, for example, as shown in FIG. 4, for example, insulated from silicon dioxide. The layer 24 is formed into a thin film by a method such as sputtering.

In addition, on the upper surface side of the ceramic substrate 16, for example, as shown in FIG. 5, a resistive heating element made of, for example, silicon carbide is formed on the upper surface of the insulating layer 24 by sputtering. A thin film is formed by.

In addition, on one main surface side of the ceramic substrate 16, for example, as shown in FIG. 6, the upper surface of the heat generating body 26 except the one end 26a and the other end 26b of the heat generating body 26 is an example. For example, the wear-resistant layer 28 which consists of titanium nitride is formed into a thin film by methods, such as sputtering.

In addition, on one main surface side of the ceramic substrate 16, for example, gold, gold, and copper, respectively, on the upper surfaces of one end portion 26a and the other end portion 26b of the heat generating element 26, as shown in FIG. Electrodes 30a and 30b made of an alloy or the like are formed into a thin film by a method such as sputtering.

Thereafter, one end side in the longitudinal direction of the cutting tool main body 14 is polished with a blade, so that, for example, as shown in FIG. 8, a V-shaped cutting edge portion 18 is formed in plan view. . In this case, the edge part 20 used as the site | part which cuts the glass plate W which is a to-be-cut object is formed in the top edge part of the cutting blade part 18 on the one main surface side of the ceramic substrate 16. As shown in FIG.

In the cutting device 10 according to the present embodiment, when a direct current voltage is applied to the electrodes 30a and 30b of the cutting tool 12, for example, a resistance heating element as the heating element 26 generates heat to generate a surface temperature. A predetermined temperature, in this case, can be raised to the high temperature of about 600 degreeC-1000 degreeC, for example. In addition, it is also possible to make the rising temperature of the heating element 26 higher by changing the DC voltage application to, for example, pulse voltage application and increasing the applied voltage.

In the cutting device 10 which concerns on a present Example, relative movement is produced between the cutting tool 12 and the glass plate W (cut material) by a suitable displacement means (not shown). That is, the displacement means (not shown) is constituted by, for example, a drive mechanism (not shown) including a motor (not shown) and an actuator (not shown), and a cutting blade portion of the cutting tool 12. (18) and / or glass plate W (cut material) is relatively displaced according to a desired cutting | disconnection site | part. In this embodiment, for example, the glass plate W (cut material) is fixed to a mounting table (not shown) or the like, and the cutting tool 12 is configured to move along the desired cutting portion ω. .

Therefore, in the desired cutting | disconnection site | part (o) of the glass plate W (cut material), for example, as shown in FIG. 1, by the blade edge part 20 of the cutting blade part 18 heated to predetermined | prescribed temperature. For example, the V-shaped groove portion 40 corresponding to the shape of the blade tip portion 20 is formed, and the cut portion ω is locally and furthermore by the heated blade tip portion 20. The temperature is rapidly heated above the softening point of the glass plate W (cut material). Therefore, the glass plate W (cut material) at the portion where the blade tip portion 20 is in contact with (butting) is plastically deformed, and the portion that caused the plastic deformation is a cutting chip c, and the glass plate W ( It cuts off from a to-be-cut object, and finally, the glass plate W (cut material) is cut | disconnected (it is "cutting" by negotiation) according to the desired cut part (omega).

In this case, the contact (butting) portion where the blade tip portion 20 is strongly pressurized generates compressive stress toward the periphery around the portion where the blade tip portion 20 is contacted by thermal expansion. Since the temperature at which the portion 20 is in contact is rapidly heated above the softening point of the glass plate W (cut material), the glass plate W (cut material) of the contact portion is plastically deformed, and thus compressed. The stress is open. In addition, since the glass plate W (cut material) itself has a strong compressive force property, cracking or the like may occur in the glass plate W (cut material) due to the compressive stress generated around the contact portion. Do not.

Therefore, according to the cutting device 10 which concerns on a present Example, the generation | occurrence | production of a crack is prevented and the glass plate W (cut to cut) is carried out correctly and stably, without damaging the quality of the glass plate W (cut to cut). Water) can be cut.

In addition, in the cutting device 10 which concerns on a present Example, since the temperature detection sensor 22 is controlled by the temperature control means (not shown), with this temperature control means, it is a cutting tool 12 with a glass plate ( It is comprised so that the temperature of the blade edge part 20 of the cutting blade part 18 may be maintained at predetermined | prescribed temperature, while cutting W) (cut object). In this case, since the glass plate W (cut material) differs in physical properties depending on the type of the glass material and the softening point is also different, the temperature of the cutting edge portion 20 is appropriately set in accordance with the softening point of the cut material to be cut. This is done.

In addition, in the cutting device 10 which concerns on a present Example, while cutting the glass plate W (cut material) with the cutting tool 12, according to the detection signal from the temperature detection sensor 22, the cutting tool 12 The control unit (not shown) which controls the speed with respect to the relative movement which arises between glass plate W (cut object), and / or the cutting depth of a cutting edge with respect to a to-be-cut object is comprised. In this embodiment, the moving speed of the cutting tool 12 and the depth of the groove portion 40 can be properly controlled by the controller.

Therefore, in the cutting device 10 which concerns on a present Example, the cutting edge part 20 heated beyond the softening point of the glass plate W (cut to cut) is made into the desired cutting | disconnection site | part of the glass plate W (cut to cut) ( in contact with ω and by applying a relative movement between the glass plate W (the cut object) with the cutting tool 12, so as not to impact the cut portion ω of the desired glass plate W (the cut object). Instead, the glass plate W (cut material) can be cut accurately and stably and cut.

In addition, since the temperature of the blade edge part 20 of the cutting blade part 18 is maintained at predetermined temperature during the cutting of the glass plate W (cut material) with the cutting tool 12 by a temperature control means, the groove part According to 40, the plastic deformation can be stably caused, and the glass plate W (cut material) can be cut more accurately and stably without cutting defects.

In addition, by the control unit, the speed and / or the glass plate W related to the relative movement occurring between the cutting tool 12 and the glass substrate W (the cut object) in accordance with the detection signal from the temperature detection sensor 22. Since the cutting depth of the blade end portion 20 of the cutting blade portion 18 with respect to the to-be-cut object can be appropriately controlled, the cutting tool 12 cuts while cutting the glass plate W (cut material). Cutting conditions of the glass plate W (cut material) due to the temperature condition of the blade tip 20 of the blade part 18 and relative movement of the cutting tool 12 and the glass plate W (cut material) are always optimal. It becomes the phosphorus state, and can further cut and cut the glass plate W (cut material) more correctly and stably without a cutting defect.

And in the above-mentioned embodiment, since the abrasion-resistant layer 28 of the cutting tool 12 is formed of titanium oxide, titanium nitride, etc., the glass plate W (cut material) is cut | disconnected with this cutting tool 12. As shown in FIG. In one case, it becomes possible to prevent the glass material of a cut part from sticking to the blade edge | tip 20. And as a method of preventing adhesion of the glass material to the blade tip 20, mold release oil is apply | coated to the site | part of the blade tip 20, for example, so that a mold release layer may be formed. You may also

Moreover, in this cutting tool 12, although the edge part as a site | part which cuts a to-be-cut object is formed in part at the top end of the cutting blade part 18, as a site | part (edge part) which cuts a to-be-cut object, a cutting blade part An edge portion may be formed in the entire V-shaped ridge portion of (18).

It is a principal part perspective view which shows an example of another Example of the cutting device which concerns on this invention.

In the embodiment shown in FIG. 9, compared with the above-mentioned embodiment shown in FIGS. 1-8, in particular, when cutting and cutting the glass plate W (cut material) with the cutting tool 12, a cutting tool ( Prior to the cutting path of 12), the site | part to be cut with the cutting tool 12 differs in the point comprised so that it preliminarily heats previously by heating means, such as a laser. And the cutting tool 12 used for the cutting device 10 which concerns on the Example shown in FIG. 9 has the same structure as the cutting tool 12 shown in the Example mentioned above, and can acquire the same effect | action and effect. It is.

That is, the cutting device 10 according to the present embodiment shown in FIG. 9 further includes a laser device 50 such as a carbon dioxide laser as the heating means with respect to the configuration of the cutting device 10 according to the embodiment described above. Include. The laser device 50 outputs the laser light output by, for example, a cylindrical lens (not shown) or a cylindrical mirror (not shown) on the glass plate W (cut material). Iii) (beam spot) has a laser light source 52 that becomes elongated, for example. In this case, the laser beam 54 irradiated from the laser light source 52 forms an elongated elliptical beam spot 56 in front of the cutting tool 12, as shown in FIG. 9, and the beam spot 56. ) Becomes an area to be preliminarily heated.

Therefore, in the embodiment shown in FIG. 9, the portion where the cutting tool 12 is to be cut is preliminarily heated by the beam spot 56, and the cutting tool 12 is more simply compared to the above-described embodiment. It becomes possible to heat glass plate W (cut material) to the temperature more than a softening point by this. Therefore, in the cutting device 10 according to the present embodiment shown in FIG. 9, the cutting speed is improved and the machinability is stabilized more than in the embodiment shown in FIGS. 1 to 8, and the workability is more stable. can do.

It is a principal part perspective view which shows an example of another Example of the cutting device which concerns on this invention.

In the embodiment shown in FIG. 10, compared with the above-mentioned respective embodiments shown in FIGS. 1 to 8 and 9, in particular, when the glass plate W (cut material) is cut and cut by the cutting tool 12. Prior to the cutting path of the cutting tool 12, the cutting portion (in a narrowly termed "cutting portion") to be cut by the cutting tool 12 is cooled by heating means such as a laser and simultaneously cooled. It differs in that it is comprised so that it may cool by means.

And the cutting tool 12 used for the cutting device 10 which concerns on the Example shown in FIG. 10 has the same structure as the cutting tool 12 shown in each Example mentioned above, and acquires the same effect | action and an effect. It can be.

That is, in addition to the structure of the cutting device 10 which concerns on the Example shown in FIG. 9 mentioned above, the cutting device 10 which concerns on this embodiment shown in FIG. 10 is equipped with the cooling means 60 further. The cooling means 60 includes the gas blowing duct 62 for cooling which has the ventilation port 62a, for example. The cooling gas blowing duct 62 is, for example, compressed to be a cooling gas through a pipeline (not shown) having a conveying pipe (not shown) such as a pipe or a tube for transferring the cooling gas. It is connected to the compressed air supply source (not shown), such as a compressor and blower which supply air. In the embodiment of FIG. 10, the ventilation path 62a of the gas blowing duct 62 for cooling corresponds to the length of the cutting part of the glass plate W (cut object) cut by the cutting tool 12, It is formed as a series of ventilation paths extended in the longitudinal direction.

In addition to the compressed air described above, for example, nitrogen gas may be suitably used as the gas for cooling. In addition, as the air blower 62a of the gas blowing duct 62 for cooling, it is not limited to the series of air blowers shown in FIG. 10, For example, many air blow nozzles arranged in a line in the longitudinal direction of the air blower It may be formed of (not shown).

In the embodiment shown in FIG. 10, the site | part (cutting part (ω)) which the cutting tool 12 is made to cut is heated preliminarily by the beam spot 56, and the heated site | part (cutting part (ω)). )) Can be more efficiently removed as the cutting chip c while cutting by the cutting tool 12, and in addition, in the present embodiment, the cooling means 60 is operated by operating the cooling means 60. Compressed air for cooling is blown into the site | part (cutting-part (omega)) heated by the laser beam 54 from the tuyeres 62a of 62. In FIG. Therefore, in the Example shown in FIG. 10, when the predetermined cutting part (o) of the glass plate W (cut material) is cut | disconnected with the cutting tool 12, the glass plate W (from the said cutting part (omega)) is cut. Diffusion of heat in the plane direction of the cutting object can be prevented.

On the other hand, in the case where the cut portion ω is not cooled by the cooling means 60, the glass plate W (cut material) in the portion (cut portion ω) heated by the laser light 54. Spread of the heat inside is set to the distribution state which spreads to the surface direction of glass plate W (cut material), for example as shown to FIG. 11 (A).

On the other hand, as shown to the cutting device 10 of FIG. 10, the site | part (cutting part (ω)) made to cut with the cutting tool 12 is heated by a heating means, and is cooled by the cooling means 60 at the same time. In this case, the spread of heat in the cut object at the cut portion ω is prevented from spreading in the plane direction of the cut object. In this case, since the cut | disconnection site | part (omega) is cooled by the cooling means 60, as shown, for example in FIG. 11B, the spread of the said heat is the thickness of the glass plate W (cut material). It becomes a distribution state extended in a direction.

Therefore, in the cutting device 10 according to the embodiment shown in FIG. 10, in addition to the effects achieved in the embodiments shown in FIGS. 1 to 8 and 9, the cutting device 10 is a liquid crystal (LCD) or a plasma. Flat panel display devices such as displays (PDPs), organic ELs, field emission displays (FEDs), digital micromirror devices (DMDs), electrophoretic display devices, and the like. In this case, it is possible to prevent diffusion of heat in the plane direction of the substrate which adversely affects various electrodes such as drive electrodes and common electrodes formed on mother substrates such as glass substrates and ceramic substrates, liquid crystals, sealing materials, adhesives and the like.

FIG. 12A is an enlarged cross-sectional view of an essential part showing an example of a liquid crystal panel which is effective for applying the cutting device shown in the embodiment of FIG. 10, and FIG. 12B is a (A) using the cutting device. It is a principal part enlarged cross-sectional diagram which shows the process of cutting the liquid crystal panel shown in FIG. 12 (C) is a principal part enlarged cross-sectional diagram of the liquid crystal panel cut | disconnected using the said cutting device.

In general, the liquid crystal panel 70 includes a liquid crystal 76 such as a resin between the upper glass substrate 72 having the common electrode 72a and the lower glass substrate 74 having the driving electrode 74a. The sealing member 78 is sealed. One liquid crystal panel 70 having a unit size is a common electrode 72a, a driving electrode 74a, and other electrodes (not shown) on a large substrate capable of taking each of the liquid crystal panels 70 having the size of the unit separately. And forming a plurality of large-sized substrates on which the electrode patterns are formed, and then cutting them to a desired size by means of the cutting device 10 shown in FIG. 10. ) Are manufactured.

In this liquid crystal panel 70, the desired cutting | disconnection site | part (ω) of the upper glass substrate 72 and the lower glass substrate 74 is cut | disconnected by the cutting device 10 shown in FIG. As shown in FIG. 12B, first, for example, a mounting table (1) so that the cut portion ω of the lower glass substrate 74 faces the blade tip portion 20 of the cutting tool 12. After being mounted and fixed to 80, it is cut by the cutting tool 12. And when the cutting | disconnection of the lower glass substrate 74 is complete | finished, it is mounted in the mounting base 80 so that the cut part (ω) of the upper glass substrate 72 may face the blade edge part 20 of the cutting tool 12. As shown in FIG. And it is fixed and it cut | disconnects in the same way according to the cutting | disconnection site | part (ω).

In this case, in the cutting device 10 shown in FIG. 10, as already demonstrated, the site | part cut with the said cutting tool 12 and the site | part which let it cut with the said cutting tool 12 are cooled by the cooling means 60. As shown in FIG. Therefore, the upper glass substrate 72 and the lower glass substrate 7 of heat that adversely affect the common electrode 72a, the driving electrode 74a, the liquid crystal 76, the sealing material 78, and the adhesive agent (not shown). Diffusion in the plane direction can be prevented.

Therefore, due to the adverse effect of heat diffused in the plane direction of the upper glass substrate 72 and the lower glass substrate 74, a crack occurs in the inner surface direction of the glass plate W (cut material), Therefore, the problem that the said glass plate W (cut object) peels partially, what is called a glass piece, peels off, etc. can reduce the performance of the liquid crystal panel used as a product. Therefore, in the manufacturing process of the liquid crystal panel to which the cutting device 10 shown in FIG. 10 was applied, the efficient cutting method which does not reduce the performance of the glass substrate of the liquid crystal panel used as a product can be obtained.

Claims (5)

A cutting device for cutting a cut object formed of brittle material such as glass, ceramic, semiconductor material, A cutting tool disposed to be in contact with the desired cutting portion of the cutting object; Displacement means for generating a relative movement between the cutting tool and the cut object according to the cutting portion; The cutting tool, Cutting blade portion having an edge portion for cutting the cutting object, and A heating element for heating the cutting blade to a high temperature equal to or higher than the softening point of the cutting object, And the cutting portion cuts and cuts the cut portion of the cut object by generating a relative movement between the cut object and the cut blade portion heated by the heating element by the displacement means. The method of claim 1, And a temperature control means for controlling the temperature of the heating element so that the temperature of the cutting blade portion is maintained at a predetermined temperature while cutting the cutting object with the cutting tool. The method of claim 2, The temperature control means is provided in the vicinity of the heating element, and includes a temperature detection sensor for detecting the temperature of the edge portion of the cutting blade portion, During cutting of the cutting object with the cutting tool, a speed and / or relative to the cutting object with respect to a relative movement occurring between the cutting tool and the cutting object according to a detection signal from the temperature detection sensor. Cutting device further comprises a control unit for controlling the cutting depth of the cutting blade portion. The method according to any one of claims 1 to 3, And a heating means for preliminarily heating a portion to be cut by the cutting tool. The method of claim 4, wherein And cooling means for cooling the heating portion heated by the heating means, and cutting the portion to be cut by the cutting tool while heating by the heating means and cooling by the cooling means. Cutting device.

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