KR20090021158A - Device for mounting electronic part - Google Patents
Device for mounting electronic part Download PDFInfo
- Publication number
- KR20090021158A KR20090021158A KR1020087029514A KR20087029514A KR20090021158A KR 20090021158 A KR20090021158 A KR 20090021158A KR 1020087029514 A KR1020087029514 A KR 1020087029514A KR 20087029514 A KR20087029514 A KR 20087029514A KR 20090021158 A KR20090021158 A KR 20090021158A
- Authority
- KR
- South Korea
- Prior art keywords
- cassette
- mounting
- tool
- main body
- mounting position
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
Abstract
Description
TECHNICAL FIELD This invention relates to the mounting apparatus of the electronic component which presses and compresses an electronic component to a board | substrate.
For example, TCP (Tape Carrier Package) which is an electronic component is crimped | bonded to the liquid crystal cell as a board | substrate through the anisotropic conductive member as an adhesive material. The said liquid crystal cell is comprised by bonding two glass plates at the predetermined space | interval through a sealing compound, these sealing a liquid crystal between glass plates, and adhering a polarizing plate to the outer surface of each glass plate, respectively. The tape-shaped anisotropic conductive member is attached to an upper surface of one side portion of the liquid crystal cell configured as described above, and the TCP is press-bonded on the anisotropic conductive member, followed by main compression.
The mounting apparatus for press-bonding or main-bonding TCP to a board | substrate contains an apparatus main body as well-known. The apparatus main body is provided with a backup tool and a pressing tool which can be driven in the vertical direction so as to face upward of the backup tool.
When the side lower surface of the substrate on which the TCP is pressed through the anisotropic conductive member is mounted on the upper surface of the backup tool, the pressing tool is driven in the downward direction. Accordingly, the TCP is pressed or main pressed on the substrate.
In the case of main compression of TCP on a substrate, the pressing tool is heated to a high temperature because the anisotropic conductive member is heated and melted by the pressing tool. Therefore, when TCP is pressurized and heated by the pressurizing tool, a part of the anisotropic conductive member melted by heating may come out of TCP and adhere to the pressurizing tool.
If the anisotropic conductive member is attached to the pressing tool, it is not preferable because the pressing tool may be unable to pressurize the TCP evenly by the pressing tool, or the anisotropic conductive member attached to the pressing tool may be transferred to TCP and cause contamination. not.
Thus, in the case of main compression of TCP, the molten anisotropic conductive member is prevented from adhering to the pressing tool when the TCP is pressurized and heated by interposing a heat resistant sheet formed of a silicone resin or a fluorine resin between the TCP and the pressing tool. I'm trying to.
As a means for interposing the sheet between the TCP and the pressing tool at the time of pressing, a cassette including the sheet is used. When the cassette is attached to the apparatus main body, the sheet provided in the cassette is interposed between the pressing tool and the backup tool. Therefore, when the pressing tool is driven in the downward direction, the TCP can be pressurized and heated by the pressing tool through the sheet. Such prior art is disclosed in Patent Document 1.
By the way, the board | substrate has enlarged in recent years. Therefore, as the size of the substrate increases, the width dimension of the sheet interposed between the TCP and the crimping head at the time of crimping also increases. The larger the width dimension of the sheet, the larger the cassette and the larger the weight.
When a large and heavy cassette is set in the apparatus main body, if the operator lifts and sets the cassette by himself, there is a possibility that the burden on the operator increases and workability becomes poor.
Thus, conventionally, a cart for delivering a cassette to the apparatus main body has been used. That is, after the used cassette is taken out from the main body of the apparatus to the upper surface of the trolley, the trolley is moved to a predetermined place, that is, the accumulation place of the cassette, and the cassette is unloaded, and then the unused cassette is mounted on the upper surface of the trolley. Then, the trolley was run to position the front side of the apparatus main body, and the cassette mounted on the upper surface of the trolley was attached to the apparatus main body.
[Patent Document 1] Japanese Patent Application Publication No. 2001-28382
In this way, when the balance is used, the burden on an operator can be reduced. However, the device cannot be operated until the cassette used is detached from the main body of the apparatus and the unused cassette is mounted on the main body of the apparatus, i. Therefore, it takes time to replace the cassette, and the operation rate of the apparatus is lowered.
The present invention provides a mounting apparatus for an electronic component that can reduce the burden on the operator and allow the cassette replacement work to be performed quickly without lowering the operation rate of the apparatus.
The present invention is a mounting apparatus for crimping electronic components on a substrate,
With the device body,
A backup tool installed in the main body of the apparatus and supporting a lower surface of the portion on which the electronic component of the substrate is pressed;
A pressurizing tool disposed above the backup tool so as to be driven in an up and down direction and pressurizing the electronic component to press the electronic component;
A cassette mounted to be detachable from the mounting position between the backup tool and the pressing tool of the apparatus main body, the cassette including a sheet interposed between the pressing tool and the electronic component in a mounted state;
A plurality of holding portions provided in front of the backup tool of the main body of the apparatus to hold the cassette so that the cassette can be detached, and when the used cassette is recovered from the mounting position to one holding portion, An elevator mechanism that sets the height of each holding portion, respectively, when the retained unused cassette is mounted in the mounting position.
It is a device for mounting an electronic component, characterized in that it comprises a.
1 is a side view showing a schematic configuration of a mounting apparatus of an embodiment of the present invention.
2 is a front view of the apparatus main body showing the elevator mechanism.
3 is a view schematically showing a cassette positioned at a mounting position.
4 is a block diagram showing a control system.
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1 shows a schematic configuration of a mounting apparatus, which includes an apparatus body 1. The mounting table 2 is provided in the apparatus main body 1. The mounting table 2 is driven by the
To the mounting table 2, for example, a substrate W such as a liquid crystal cell is supplied in a state in which at least one side circumference located at the front side of the apparatus main body 1 from the peripheral circumference protrudes from the upper surface of the mounting table 2. And retained by means such as vacuum adsorption. As shown in FIG. 3, TCP 5 as an electronic component is press-bonded to one side circumferential portion of the substrate W through the anisotropic
The apparatus main body 1 is provided with the
The pressing tool 7 is provided on the lower surface of the
As shown in FIG. 1, a pair of rail members 11 (only one side) is provided at the height position slightly above the
In the apparatus main body 1, the
In other words, the
The
When the
Accordingly, when the pressing tool 7 descends and pressurizes and heats the upper surface of one side circumference of the substrate W supported by the top surface of the
Therefore, when the TCP 5 is pressurized and heated by the pressing tool 7, the molten anisotropic
In the mounting
An
The
Therefore, when the
In either of the left and right
The
The
Since the
In addition, the
As shown in FIG. 4, the
In the mounting apparatus configured as described above, when the main body 5 is press-bonded to the upper surface of one side of the substrate W, the
That is, as shown in FIG. 3, the
As a result, the anisotropic
Every time one TCP 5 is crimped | bonded, the sheet |
Then, the control device 19 raises the pressurizing tool 7 and then drives the
In the mounting
When the used
Next, the
When the
In this way, when the used
When the main crimping operation is resumed, the operator holds the
Thus, since the
That is, when replacing the
That is, the replacement work of the
In addition, since the
The used
Therefore, by this, not only the burden on the operator can be reduced, but also the replacement work of the
In the above embodiment, two holding portions are provided in the elevator mechanism. However, the number of holding portions provided in the elevator mechanism is not limited to two, but may be three or more. That is, the support member which collect | recovers the used cassette and the support member which hold | maintains the unused cassette should just be included.
Moreover, although the cassette supply mechanism was provided in order to attach / detach a cassette with respect to a mounting position, an operator may supply and discharge a cassette with respect to a mounting position, without providing a cassette supply mechanism.
In addition, the means for driving the support member of the elevator mechanism in the vertical direction is not limited to the cylinder, but may be performed by a belt, a wire or a chain.
In addition, in the above embodiment, the case of supplying a sheet having heat resistance such as silicone resin or fluorine resin contained in the cassette when the main compression of TCP is described, but the sheet not only has heat resistance such as silicone resin or fluorine resin. Instead, it may be an anisotropic conductive member adhered to the substrate. That is, the present invention can also be applied to a case in which the anisotropic conductive member is housed in a cassette and the unused cassette is replaced with the cassette used by an elevator mechanism.
According to the present invention, since the cassette used by the elevator mechanism can be held or an unused cassette held in advance can be mounted on the main body of the apparatus, the cassette replacement operation can be performed quickly.
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006157621A JP4643495B2 (en) | 2006-06-06 | 2006-06-06 | Electronic component mounting equipment |
JPJP-P-2006-157621 | 2006-06-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090021158A true KR20090021158A (en) | 2009-02-27 |
KR101065346B1 KR101065346B1 (en) | 2011-09-16 |
Family
ID=38801231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020087029514A KR101065346B1 (en) | 2006-06-06 | 2007-04-20 | Apparatus for bonding electronic parts |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4643495B2 (en) |
KR (1) | KR101065346B1 (en) |
CN (1) | CN101461049B (en) |
TW (1) | TWI392033B (en) |
WO (1) | WO2007141966A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140009318A (en) | 2011-02-02 | 2014-01-22 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Patterned substrates with darkened mutlilayered conductor traces |
CN102595820B (en) * | 2012-03-11 | 2014-09-17 | 郑小玲 | Photoelectric packaging mechanism |
JP6244550B2 (en) * | 2014-02-10 | 2017-12-13 | パナソニックIpマネジメント株式会社 | Method for replacing protective sheet in component mounting apparatus |
CN110228681A (en) * | 2019-06-25 | 2019-09-13 | 东莞市德速达精密设备有限公司 | Open type multilayer loader |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05310325A (en) * | 1992-05-08 | 1993-11-22 | Matsushita Electric Ind Co Ltd | Multiple kind parts supplying device |
JP3560706B2 (en) * | 1995-11-06 | 2004-09-02 | 松下電器産業株式会社 | Component mounting equipment |
JP3459540B2 (en) | 1997-06-05 | 2003-10-20 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting device |
EP1535143A4 (en) * | 2002-06-19 | 2010-05-05 | Brooks Automation Inc | Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists |
KR100496631B1 (en) * | 2002-06-25 | 2005-06-20 | 미래산업 주식회사 | Electronic Elements Feeding Method |
KR100491161B1 (en) * | 2002-11-26 | 2005-05-24 | 주식회사 테라세미콘 | Semiconductor manufacturing system for thermal process |
JP4262168B2 (en) * | 2004-08-13 | 2009-05-13 | 芝浦メカトロニクス株式会社 | Mounting device |
-
2006
- 2006-06-06 JP JP2006157621A patent/JP4643495B2/en active Active
-
2007
- 2007-04-20 WO PCT/JP2007/058675 patent/WO2007141966A1/en active Application Filing
- 2007-04-20 KR KR1020087029514A patent/KR101065346B1/en active IP Right Grant
- 2007-04-20 CN CN2007800210417A patent/CN101461049B/en active Active
- 2007-04-30 TW TW096115345A patent/TWI392033B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2007141966A1 (en) | 2007-12-13 |
CN101461049B (en) | 2010-09-29 |
JP2007329198A (en) | 2007-12-20 |
CN101461049A (en) | 2009-06-17 |
KR101065346B1 (en) | 2011-09-16 |
TWI392033B (en) | 2013-04-01 |
JP4643495B2 (en) | 2011-03-02 |
TW200805516A (en) | 2008-01-16 |
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