KR20090013718A - 프로브 조립체 - Google Patents

프로브 조립체 Download PDF

Info

Publication number
KR20090013718A
KR20090013718A KR1020080075284A KR20080075284A KR20090013718A KR 20090013718 A KR20090013718 A KR 20090013718A KR 1020080075284 A KR1020080075284 A KR 1020080075284A KR 20080075284 A KR20080075284 A KR 20080075284A KR 20090013718 A KR20090013718 A KR 20090013718A
Authority
KR
South Korea
Prior art keywords
probe
resin film
probe assembly
electrical terminal
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020080075284A
Other languages
English (en)
Korean (ko)
Inventor
군세이 기모토
Original Assignee
군세이 기모토
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 군세이 기모토 filed Critical 군세이 기모토
Publication of KR20090013718A publication Critical patent/KR20090013718A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020080075284A 2007-08-02 2008-07-31 프로브 조립체 Ceased KR20090013718A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007221740A JP5077794B2 (ja) 2007-08-02 2007-08-02 プローブ組立体
JPJP-P-2007-00221740 2007-08-02

Publications (1)

Publication Number Publication Date
KR20090013718A true KR20090013718A (ko) 2009-02-05

Family

ID=40331499

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080075284A Ceased KR20090013718A (ko) 2007-08-02 2008-07-31 프로브 조립체

Country Status (5)

Country Link
US (1) US7948253B2 (enExample)
JP (1) JP5077794B2 (enExample)
KR (1) KR20090013718A (enExample)
CN (1) CN101358999B (enExample)
TW (1) TW200907353A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5030060B2 (ja) * 2007-08-01 2012-09-19 軍生 木本 電気信号接続装置
JP2012058223A (ja) * 2010-09-10 2012-03-22 Isao Kimoto プローブ組立
JP5496852B2 (ja) 2010-10-26 2014-05-21 富士フイルム株式会社 電子内視鏡システム、電子内視鏡システムのプロセッサ装置、及び電子内視鏡システムの作動方法
CN103257255A (zh) * 2012-02-20 2013-08-21 木本军生 探针组装
US20130233099A1 (en) * 2012-03-08 2013-09-12 Gunsei Kimoto Probe assembly
TW201400818A (zh) * 2012-06-22 2014-01-01 Mpi Corp 探針空間轉換模組及其製作方法
US10266402B2 (en) * 2012-11-20 2019-04-23 Formfactor, Inc. Contactor devices with carbon nanotube probes embedded in a flexible film and processes of making such

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367178A (ja) * 1989-08-07 1991-03-22 Giga Puroobu Kk プローブカード
JPH10111316A (ja) * 1996-10-04 1998-04-28 Fujitsu Ltd 半導体検査装置及び半導体検査方法
JP4355074B2 (ja) 1999-12-27 2009-10-28 株式会社日本マイクロニクス プローブカード
JP2002296297A (ja) * 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体
JP4496456B2 (ja) * 2001-09-03 2010-07-07 軍生 木本 プローバ装置
JP2004138391A (ja) * 2002-10-15 2004-05-13 Renesas Technology Corp 半導体装置の製造方法
JP2004274010A (ja) * 2003-03-11 2004-09-30 Isao Kimoto プローバ装置
JP2004340654A (ja) 2003-05-14 2004-12-02 Micronics Japan Co Ltd 通電試験用プローブ
DE102004036407A1 (de) * 2003-08-27 2005-06-09 Japan Electronic Materials Corp., Amagasaki Prüfkarte und Verbinder für diese
JP4721099B2 (ja) * 2004-03-16 2011-07-13 軍生 木本 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置
TWI286606B (en) * 2004-03-16 2007-09-11 Gunsei Kimoto Electric signal connecting device, and probe assembly and prober device using it
JP4455940B2 (ja) 2004-06-17 2010-04-21 株式会社日本マイクロニクス 電気的接続装置
CN1821788B (zh) * 2005-02-16 2010-05-26 旺矽科技股份有限公司 嵌入式微接触元件及其制造方法
JP2006242774A (ja) * 2005-03-03 2006-09-14 Tokyo Electron Ltd プローブ及びプローブカード
TWI398640B (zh) * 2005-09-19 2013-06-11 木本軍生 Contact assembly and its LSI wafer inspection device
JP5030060B2 (ja) * 2007-08-01 2012-09-19 軍生 木本 電気信号接続装置

Also Published As

Publication number Publication date
TWI380024B (enExample) 2012-12-21
CN101358999B (zh) 2013-04-24
JP5077794B2 (ja) 2012-11-21
US20090033349A1 (en) 2009-02-05
TW200907353A (en) 2009-02-16
JP2009036743A (ja) 2009-02-19
US7948253B2 (en) 2011-05-24
CN101358999A (zh) 2009-02-04

Similar Documents

Publication Publication Date Title
US7622937B2 (en) Electrical signal connector
US7573281B2 (en) Probe for inspecting one or more semiconductor chips
KR101334795B1 (ko) 전기신호 접속용 좌표 변환장치
US7423441B2 (en) Contactor assembly
KR20090013718A (ko) 프로브 조립체
US8493086B2 (en) Electrical signal connector
US7898276B2 (en) Probe card with stacked substrate
JP2012093375A (ja) 接触子組立体を用いたｌｓｉチップ検査装置
US7382143B2 (en) Wafer probe interconnect system
JP2007218890A (ja) プローブ組立体
JP4936275B2 (ja) 接触子組立体
JP4962929B2 (ja) プローバ装置及びこれに用いるプローブ組立体
JP5333829B2 (ja) プローブ組立体
JP5077736B2 (ja) 接触子組立体及びこれを用いたｌｓｉチップ検査装置
KR101363368B1 (ko) 인쇄회로기판 검사장치
KR20240078322A (ko) 전기적 접속 장치
JP2010091542A (ja) プローブ組立体

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000