KR20090010588A - Method and apparatus of molding for manufacturing a semiconductor package - Google Patents

Method and apparatus of molding for manufacturing a semiconductor package Download PDF

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Publication number
KR20090010588A
KR20090010588A KR1020070073832A KR20070073832A KR20090010588A KR 20090010588 A KR20090010588 A KR 20090010588A KR 1020070073832 A KR1020070073832 A KR 1020070073832A KR 20070073832 A KR20070073832 A KR 20070073832A KR 20090010588 A KR20090010588 A KR 20090010588A
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KR
South Korea
Prior art keywords
molding
flow path
semiconductor chip
upper mold
lower mold
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KR1020070073832A
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Korean (ko)
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KR101327496B1 (en
Inventor
임재형
Original Assignee
세크론 주식회사
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Priority to KR1020070073832A priority Critical patent/KR101327496B1/en
Publication of KR20090010588A publication Critical patent/KR20090010588A/en
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Publication of KR101327496B1 publication Critical patent/KR101327496B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A molding method and a molding apparatus for manufacturing a semiconductor package are provided to separate the molded semiconductor chip from an upper mold and a lower mold by using the air. A molding unit(14) molds a member(10) mounting a semiconductor chip by providing molding resin to the member mounting the semiconductor chip positioned in a cavity. A path forming unit(21) forms the path composed of a micro gap between an upper mold(11) and a lower mold(13). An air injecting unit(23) separates the member mounting the molded semiconductor chip from the upper mold and the lower mold by injecting the air to the path.

Description

Molding method and apparatus for manufacturing semiconductor package TECHNICAL FIELD

The present invention relates to a molding method and apparatus for manufacturing a semiconductor package, and more particularly, to a molding method and apparatus for manufacturing a semiconductor package using a molding resin, including an upper mold and a lower mold.

In general, a semiconductor package is a package in which semiconductor chips separated from a semiconductor substrate (semiconductor wafer) are electrically connected to each other so as to be used as actual electronic components, and protected from external impact. Accordingly, in the manufacture of semiconductor packages, the individual semiconductor chips are mounted on a substrate such as a printed circuit board (PCB), a lead frame, and the like, and then wire bonding electrically connecting the substrate and the semiconductor chip. A process, a molding process of molding a semiconductor chip electrically connected to the substrate, and the like are performed.

Here, in the molding process for molding a semiconductor chip electrically connected to the aforementioned substrate, that is, a member on which the semiconductor chip is mounted, a molding apparatus mainly including an upper mold and a lower mold is used. Therefore, in the process using the above-mentioned molding apparatus, the member on which the semiconductor chip is mounted is placed in a cavity formed by the upper mold and the lower mold, and then the molding member is mounted by providing a molding resin to the cavity. Let's do it. In addition, in the process using the molding apparatus mentioned above, after molding the member on which the semiconductor chip is mounted, a member such as a pin is mainly separated from the molding apparatus by using a member such as a pin.

As described above, in the case of a molding apparatus using a pin, not only a plurality of pins mentioned above should be provided, but also a redundant or broken pin must be prepared. In addition, when the pin needs to be replaced, a situation arises in which the molding apparatus needs to be disassembled, so that a loss time due to the replacement of the pin may occur.

Therefore, in the case of a molding apparatus for manufacturing a conventional semiconductor package, there is a problem that not only the efficiency of the molding apparatus itself is lowered due to the defects of the pins mentioned, but also the productivity of manufacturing the semiconductor package is reduced.

It is a first object of the present invention to provide a molding method for manufacturing a semiconductor package capable of separating a member on which a semiconductor chip formed by molding is formed from an upper mold and a lower mold using air.

A second object of the present invention is to provide a molding apparatus for manufacturing a semiconductor package to which the molding method mentioned above can be applied.

A molding method for manufacturing a semiconductor package according to a preferred embodiment of the present invention for achieving the first object of the present invention mentioned above is to place a member on which a semiconductor chip is mounted in a cavity formed by joining an upper mold and a lower mold. Thereafter, a molding resin is provided to the cavity in which the member on which the semiconductor chip is mounted is provided to mold the member on which the semiconductor chip is mounted. Then, the upper mold and the lower mold are finely separated from each other up and down to form a flow path formed with a fine gap between the upper mold and the lower mold, and then air is injected into the flow path to mount the molded semiconductor chip. The separated member from the upper mold and the lower mold.

The molding apparatus for manufacturing a semiconductor package according to a preferred embodiment of the present invention for achieving the second object of the present invention includes an upper mold and a lower mold, and the semiconductor chip is formed by combining the upper mold and the lower mold. And a molding part which forms a cavity that can accommodate the mounted member, and provides a molding resin to the member on which the semiconductor chip placed in the cavity is mounted to mold the member on which the semiconductor chip is mounted. In addition, each of the upper mold and the lower mold is connected to each other so that the upper and lower molds can be moved finely, and the upper mold and the lower mold are finely separated by the fine movement of each of the upper mold and the lower mold to finely separate the upper mold. A flow path forming portion for forming a flow path formed between the lower mold and the lower mold, and a member on which the semiconductor chip on which the molding is formed is injected by injecting air into the flow path formed by the flow path forming portion from the upper mold and the lower mold; And an air inlet for separating.

In addition, the molding apparatus of the present invention is connected to each of the flow path forming portion and the air injection portion, the flow path forming portion and the air injection portion to inject air into the flow path when a flow path formed of a fine gap formed by the flow path forming portion It may further include a control unit for controlling each.

In the molding method and apparatus for manufacturing a semiconductor package according to the present invention, air is used to separate a molded semiconductor chip-mounted member from an upper mold and a lower mold. Therefore, in the present invention, even if a member such as a fin is omitted, a member on which the molded semiconductor chip is mounted can be easily separated from the upper mold and the lower mold.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar components. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the term "comprise" or "having" is intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Molding apparatus for manufacturing semiconductor package

First, a molding apparatus for manufacturing a semiconductor package will be described in detail.

1 is a schematic diagram illustrating a molding apparatus for manufacturing a semiconductor package according to an exemplary embodiment of the present invention, and FIG. 2 is a schematic diagram illustrating a state of using a molding apparatus for manufacturing a semiconductor package of FIG. 1. .

1 and 2, the molding apparatus 100 for manufacturing a semiconductor package includes a molding part 14 including an upper mold 11 and a lower mold 13. In particular, the molding part 14 including the upper mold 11 and the lower mold 13 mentioned above has an accommodation of the member 10 on which the semiconductor chip is mounted due to the coupling of the upper mold 11 and the lower mold 13. It has a structure to form a possible cavity 17. Therefore, in the molding of the member 10 on which the semiconductor chip is mounted using the molding apparatus 100 mentioned above, the semiconductor chip is mounted in the cavity 17 formed by the coupling of the upper mold 11 and the lower mold 13. The member 10 is positioned and has a structure in which a molding resin is provided to the cavity 17. Here, as an example of the molding resin mainly used in the above-mentioned molding, an epoxy molding compound (EMC) etc. can be mentioned. In addition, the molding resin is mainly located in the hole of the port block formed in the central portion of the lower mold 13, and has a configuration of providing it to the cavity 17 using a runner or the like.

Here, a mold apparatus having a configuration in which a molding resin is placed in a hole of a port block mentioned above and a molding resin is provided as a cavity using a runner or the like is filed by the present applicant as a patent application 2006-32634 on April 11, 2006. And, it is disclosed in the "mold apparatus for semiconductor manufacturing and a semiconductor molding method using the same" registered as a patent registration 716,053 on May 2, 2007.

In addition, the molding apparatus 100 for manufacturing a semiconductor package according to an exemplary embodiment of the present invention includes a flow path forming part 21. Here, the flow path forming part 21 may move the upper mold 11 and the lower mold 13 of the molding part 14 upwardly and downwardly to enable fine movement of the upper mold 11 and the lower part of the molding part 14. It is connected to each of the molds 13. Therefore, the flow path forming portion 21 may include a member such as a step motor, a cylinder, or the like. As described above, since the molding apparatus 100 for manufacturing the semiconductor package mentioned above may include a flow path forming portion 21 to finely separate the upper mold 11 and the lower mold 13 from the upper mold 11. It is possible to form a flow path (uro) 27 consisting of a fine gap between the lower mold (13). In particular, the flow path 27 formed between the upper die 11 and the lower die 13 using the flow path forming portion 21, that is, the fine gap is appropriately about 0.1 to 10 mm. If the aforementioned fine gap is less than about 0.1 mm, it is not preferable because air using the air injection unit 23 described later is not easily injected into the flow path 27, and if it exceeds about 10 mm, air injection described later Even if the air using the portion 23 is injected into the flow path 27, the molded member 10 mounted with the molded semiconductor chip from the upper die 11 and the lower die 13 cannot be easily separated from each other. not.

In addition, in one embodiment of the present invention, but described as the inlet of the flow path forming portion 21 is formed in the side of the molding portion 14, the position is not limited. That is, the inlet of the flow path forming part 21 is formed in a hole structure penetrating the upper mold 13 of the molding part 14, and air is injected into the flow path formed using the flow path forming part 21 mentioned above. It could be. In this case, it can be understood to have a structure in which air is injected to the upper surface of the mounted member 10 of the molded semiconductor chip.

In addition, the molding apparatus 100 for manufacturing a semiconductor package according to an embodiment of the present invention includes an air injection unit 23. Here, the air injection unit 23 is a member for injecting air into the aforementioned flow path 27 when forming the flow path 27 having a fine gap by using the flow path forming unit 21. Therefore, the air injection part 23 may include a spray nozzle or the like connected to the flow path 27 having a fine gap formed by using the flow path forming part 21. As described above, since the molding apparatus 100 for manufacturing the semiconductor package includes the air injection unit 23, air may be injected into the flow path 27 formed by using the flow path forming unit 21. The member 10 on which the formed semiconductor chip is mounted can be easily separated from the upper mold 11 and the lower mold 13.

In addition, the molding apparatus 100 for manufacturing a semiconductor package according to an embodiment of the present invention includes a controller 25. The controller 25 mentioned above has a configuration connected to each of the flow path forming portion 21 and the air injection portion 23. Thus, the control unit 25 controls the air injection into the aforementioned flow path 27 when the flow path 27 is formed by a fine gap formed by the flow path forming unit 21. That is, when a flow path 27 having a fine gap is formed from the flow path forming unit 21, the flow path forming unit 21 transmits a signal to the control unit 25, and transmits a signal of the flow path forming unit 21 mentioned above. The received control unit 25 is configured to control the air injection unit 23 to inject air into the flow path 27.

As such, the molding apparatus 100 for manufacturing a semiconductor package according to an exemplary embodiment of the present invention may include a molding part 14, a flow path forming part 21, and air including an upper mold 11 and a lower mold 13. By including the injection part 23 and the control part 25, the molded member 10 on which the molded semiconductor chip is mounted can be easily separated from the upper mold 11 and the lower mold 13, that is, the molding part 14. have. In other words, the molded member 10 on which the molded semiconductor chip is mounted can be easily separated from the upper mold 11 and the lower mold 13 without using a member such as a pin.

In addition, the molding apparatus 100 for manufacturing a semiconductor package according to an embodiment of the present invention is a mold having a configuration in which the molding resin is placed in the hole of the port block, and the molding resin is provided to the cavity using a runner or the like. Although the flow path forming unit 21, the air injection unit 23, the control unit 25, and the like have been described as being limited to the apparatus, the flow path forming unit also includes a mold apparatus including a tray or the like disclosed in Korean Patent Registration No. 729,025. 21, the air injection part 23, the control part 25, etc. are applicable.

Molding method for semiconductor package manufacturing

Hereinafter, a molding method using the molding apparatus for manufacturing the aforementioned semiconductor package will be described.

First, the member 10 on which the semiconductor chip is mounted is placed in the cavity 17 formed by the upper mold 11 and the lower mold 13 of the molding part 14 are coupled to each other. In other words, the semiconductor chip and the substrate (the printed circuit board or the lead frame) are positioned in the cavity 17 in which the member made of wire bonding is electrically connected using a wire.

Next, the molding resin is provided to the cavity 17 in which the member 10 on which the semiconductor chip is mounted is located. Here, the molding resin includes an epoxy molding compound or the like as mentioned. As such, when the molding resin is provided to the cavity 17, the member 10 on which the semiconductor chip is mounted is molded.

Subsequently, when the member 10 on which the semiconductor chip is mounted is molded, the upper mold 11 and the lower mold 13 of the molding part 14 are moved up and down using the flow path forming part 21 thereafter. Finely separate. As described above, when the upper mold 11 and the lower mold 13 of the molding part 14 are finely separated up and down using the flow path forming part 21, the upper mold 11 and the lower mold 13 are separated. ), A flow path 27 formed of a fine gap is formed. At this time, the flow path 27 formed between the upper mold 11 and the lower mold 13, that is, the fine gap is adjusted to be about 0.1 to 10mm.

As such, when the passage 27 is formed between the upper mold 11 and the lower mold 13 with a fine gap adjusted between the upper mold 11 and the lower mold 13, the passage forming unit 21 may be configured as a control unit. 25) to signal.

Accordingly, the control unit 25 receiving the signal controls the air injection unit 23 to supply air to the flow path 27 formed between the upper mold 11 and the lower mold 13 by the flow path forming unit 21. Have it injected. As such, when air is injected into the flow path 27 formed between the upper mold 11 and the lower mold 13 by using the air injection part 23, molding is performed from the upper mold 11 and the lower mold 13. The member 10 on which this semiconductor chip is mounted is easily separated.

Therefore, when molding is performed using the molding apparatus 100 for manufacturing a semiconductor package mentioned above, a semiconductor chip molded from the upper mold 11 and the lower mold 13 is mounted without using a member such as a pin. Can be easily separated.

In the molding method and apparatus for manufacturing a semiconductor package of the present invention, it is possible to separate a member on which a semiconductor chip mounted with molding is formed from an upper mold and a lower mold using air. Therefore, in the case of the molding method and apparatus for manufacturing the semiconductor package of the present invention, by solving the defects of the pins mentioned above, not only can the efficiency of the molding apparatus itself be improved, but also the productivity of the semiconductor package can be improved. You can also plan.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

1 is a schematic diagram illustrating a molding apparatus for manufacturing a semiconductor package according to an embodiment of the present invention.

FIG. 2 is a schematic diagram illustrating a state in which a molding apparatus for manufacturing the semiconductor package of FIG. 1 is used.

Claims (5)

Positioning a member on which a semiconductor chip is mounted in a cavity formed by joining an upper mold and a lower mold; Molding the member on which the semiconductor chip is mounted by providing a molding resin to a cavity in which the member on which the semiconductor chip is mounted is located; Finely separating each of the upper mold and the lower mold up and down to form a flow path formed of a minute gap between the upper mold and the lower mold; And injecting air into the flow path to separate the molding-mounted member on which the semiconductor chip is mounted, from the upper mold and the lower mold. The method of claim 1, wherein the fine gap is between 0.1 and 10 mm. Comprising an upper mold and a lower mold, the upper mold and the lower mold is combined to form a cavity that can accommodate the member on which the semiconductor chip is mounted, and to provide a molding resin to the member on which the semiconductor chip mounted in the cavity is mounted. Molding to mold the member on which the semiconductor chip is mounted; Each of the upper and lower molds of the molding part is connected to each other so that the upper mold and the lower mold can be moved finely, and the upper mold and the lower mold are finely separated by the fine movement of the upper mold and the lower mold. A flow path forming unit for forming a flow path formed of a fine gap between the molds; And Molding apparatus for manufacturing a semiconductor package including an air injection portion for injecting air into the flow path formed by the flow path forming portion to separate the member on which the molded semiconductor chip is mounted from the upper mold and the lower mold. The molding apparatus of claim 3, wherein the flow path forming part makes a fine gap between 0.1 and 10 mm. The flow path forming apparatus of claim 3, wherein the flow path forming unit and the air injection unit are connected to each of the flow channel forming unit and the air injecting unit. Molding apparatus for manufacturing a semiconductor package further comprising a control unit for controlling.
KR1020070073832A 2007-07-24 2007-07-24 Method and apparatus of molding for manufacturing a semiconductor package KR101327496B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070073832A KR101327496B1 (en) 2007-07-24 2007-07-24 Method and apparatus of molding for manufacturing a semiconductor package

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Application Number Priority Date Filing Date Title
KR1020070073832A KR101327496B1 (en) 2007-07-24 2007-07-24 Method and apparatus of molding for manufacturing a semiconductor package

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KR20090010588A true KR20090010588A (en) 2009-01-30
KR101327496B1 KR101327496B1 (en) 2013-11-08

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Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0163525B1 (en) * 1995-12-04 1999-02-01 김광호 Semiconductor chip package molding apparatus on which air vent was formed
JPH09262876A (en) * 1996-03-27 1997-10-07 Nippon Motorola Ltd Molding method, molding method of package for semiconductor integrated circuit device and molding device
KR200211278Y1 (en) * 1998-05-08 2001-03-02 김영환 Molding machine for manufacturing semiconductor package

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