KR20090004296A - Electric signal connecting system between tester and test handler - Google Patents

Abstract

An electric signal connecting system is provided to fix a connecting substrate with being inserted into a substrate inserting hole by using a secondary member. An adiabatic material(210) is installed between a test chamber of a test handler and a test head of a tester. A substrate inserting hole(212) is formed in the adiabatic material. The height of the substrate inserting hole is H1. A connecting substrate(220) is inserted into the substrate inserting hole and electrically contacts a system board and a test board. When the connecting substrate is inserted into the substrate inserting hole, the inserted height of the part is H2. H1 is greater than H2. With being inserted into the substrate inserting hole, a secondary member(230) fixes the connecting substrate.

Description

ELECTRIC SIGNAL CONNECTING SYSTEM BETWEEN TESTER AND TEST HANDLER}

The present invention relates to an electrical signal connection system between a tester for testing a manufactured semiconductor device and a test handler for supporting a test of the semiconductor device by the tester.

The tester is a device for determining whether a semiconductor device is defective by determining an electrical signal returned from the semiconductor device. The test handler is a device for electrically contacting the semiconductor device to the tester and classifying the tested semiconductor device by test grade. Testers and test handlers form a semiconductor device inspection system in pairs.

In general, the tester is a central processing unit that determines whether the semiconductor device is defective by determining a test head electrically connected to the semiconductor device side supplied by the test handler in combination with the test handler and an electric signal from the test head. It is composed.

The test handler loads the semiconductor devices from the customer tray to the carrier board, and then supports the semiconductor devices to be electrically connected to the test head so that the semiconductor devices loaded on the carrier board can be tested by the tester. Tested semiconductor devices are classified by test class and unloaded from a carrier board to a customer tray. Here, the carrier board is a loading element provided to support a plurality of semiconductor devices to be tested at once in a loaded state, and the carrier board includes a test tray of a conventional concept and a test board of a new concept newly proposed in the near field. The present invention relates to a technology to which a new concept test board is applied.

Regarding the test board, as previously introduced through the applicant's prior application (Application No. 10-2007-46265, the name of the invention: test handler), the test socket provided in the conventional test head is provided in the loading part of the test board. The terminal group corresponding to the test socket is collected on one side of the test board.

That is, according to the conventional semiconductor device inspection system to which the test tray is applied, the test handler contacts the semiconductor device directly with the test socket provided in the test head, whereas the semiconductor device inspection system to which the test board is applied The device is indirectly contacted with the terminal groups of the system board provided in the test head through the terminal groups collected on one side of the test board without directly contacting the test head. To this end, a semiconductor device inspection system using a test board requires a connecting device for electrically connecting the system board and terminal groups of the test board. Here, the system board is provided in the test head in correspondence with the test board, and one system board is a central processing unit that performs electrical test with the semiconductor elements loaded on one test board.

As regards the connecting device considered before the time when the present invention was created, as shown in FIG. 1, a plurality of pogo pin groups 110 and one pogo pin group 110 are illustrated on FIG. 1, but a plurality of pogo pin groups 110 are illustrated in a direction perpendicular to the ground. Dog)), the wiring board 120, the plurality of first connecting terminal groups 130 on the wiring board 120 side (the first connecting terminal group consists of a plurality of first connecting terminals), and the system board SB The second connecting terminal group 140 (the second connecting terminal group includes a plurality of second connecting terminals) is included.

The plurality of pogo pin groups 110 are provided to correspond one-to-one with a plurality of terminal groups 11 provided on one side of the test board TB, and the lifting and lowering of the test board TB (see arrow direction in FIG. 1). Therefore, the pogo pin group 110 is in electrical contact with the terminal group 11 or the contact is released.

The wiring board 120 is provided with a pogo pin group 110 at one side of the test chamber TC, and a wire for electrically connecting the pogo pin group 110 to the first connecting terminal group 130 ( Not shown).

The connecting terminals of the first connecting terminal group 130 and the second connecting terminal group 140 positioned in the test head TH are contacted or released from each other in the horizontal direction.

On the other hand, the system board (SB) is provided with a pair of guide pins (GP) to the upper and lower sides of the second connecting terminal group 140, for thermally blocking the test chamber (TC) and the test head (TH) The heat insulator 150 is formed with a guide groove 151 into which the guide pin GP can be inserted, thereby inducing proper coupling between the first connecting terminal group 130 and the second connecting terminal group 140. Of course, the insulation 150 may be omitted depending on the cover material or the test environment of the test chamber TC and the test head TH, and in this case, the guide groove should be formed in the cover of the test chamber TC.

However, in general, one semiconductor device is provided with dozens to about 50 electrical terminals, and one electrical terminal is ultimately electrically connected to one second connecting terminal. Since the test board TB is loaded with dozens of semiconductor devices (currently designed as 64), and terminal groups are provided with the number of semiconductor devices loaded, the direction perpendicular to the ground of the terminal groups (Fig. 1). Spacing) is inevitably very dense, which means that the spacing between the second connecting terminal groups 140 must also be very dense. On the other hand, the width of the test head TH and the system board SB (the width in the direction perpendicular to the ground in FIG. 1) is inevitably limited, resulting in the second connecting terminal of the second connecting terminal group 140. Even if they are provided in a plurality of rows in a direction perpendicular to the ground, this results in a structure in which a plurality of rows are arranged within a predetermined width w in the vertical direction. If the number of semiconductor devices that can be loaded on the test board TB increases or the number of electrical terminals of the semiconductor devices increases, the width w in the vertical direction should be longer. In particular, since a width in which a pair of guide pins GP may be provided above and below the second connecting terminal groups 140 may also be secured, a plurality of system boards SB may be provided in the test head TH. An interval w + h of the upper and lower widths of the connecting terminal group 140 and a width provided to the pair of guide pins GP must be secured as the minimum installation interval of the system board SB.

The above points eventually cause a decrease in the number of system boards SB provided in the test head TH, and of the test board TB accommodated in the test chamber TC so as to correspond one-to-one to the system board SB. The number is also small, which in turn reduces the processing capacity of the semiconductor device inspection system.

Therefore, in order to solve the above problems, the applicant of the present invention proposes an invention (hereinafter referred to as 'first invention') of an application filed (Application No. 10-2007-0065775, name of the invention: electrical signal connection system between the tester and the test handler). There is a bar.

According to the present invention, the proposed connecting substrate includes a first pogo pin group and a second pogo pin group protruding upward or downward in an area located in the test chamber and an area located in the test head, respectively, or a test The pogo pin group is installed in the region located in the chamber and the system board is integrally coupled to the region located in the test head.

It is an object of the present invention to provide a technique required for inserting and connecting a connecting substrate according to the present invention to a heat insulating material.

The electrical signal connection system between the tester and the test handler according to the present invention for achieving the above object is provided between the test chamber of the test handler and the test head of the tester, the substrate insertion hole is formed with a top and bottom width 'H1' insulator; Inserted into the substrate insertion hole formed in the heat insulating material mediates electrical contact between the test board located in the test chamber and the system board located in the test head, the upper and lower widths of the portion inserted into the substrate insertion hole is' H2 (H1> H2) 'connecting substrate; An auxiliary member configured to assist the connecting substrate to be fixed while being inserted into the substrate insertion hole; Characterized in that it comprises a.

The connecting substrate may include N pogo pin groups electrically contacting or releasing contact with the N terminal groups in a one-to-one correspondence with the N terminal groups of the test board; And a wiring board having N pogo pin groups installed in one region of the test chamber, the wires electrically connecting the N pogo pin groups to the system board. It includes a specific feature to include.

The N pogo pin groups are installed to protrude in the upward or downward direction of the wiring board, and the connecting substrate has the upper and lower widths of 'H3 (H1 ?? H3> H2)' where the N pogo pin groups are installed. It is characterized by more specific features.

The auxiliary member is provided with a substrate coupling hole into which the connecting substrate is inserted and coupled, and the connecting substrate is inserted into the substrate insertion hole in a state where the connecting substrate is inserted into and coupled to the substrate coupling hole of the auxiliary member. Another specific feature is that the connecting substrate is inserted into the substrate insertion hole.

The auxiliary member may include an upper plate covering an upper surface of the connecting substrate; And a lower plate covering a lower side of the connecting substrate and coupled to the upper plate. It includes, wherein the substrate coupling hole is characterized in that it is formed over the lower surface of the upper plate and the upper surface of the lower plate.

The auxiliary member may further include an insertion positioning means for determining a position to be inserted into the substrate insertion hole.

The auxiliary member is further characterized in that it comprises a coupling positioning means for determining the position where the connecting substrate is coupled.

The auxiliary member is characterized in that one more specific feature is formed with an air passing hole through which air can pass in the vertical direction.

The connecting substrate may include: N first pogo pin groups electrically contacting or releasing contact with the N first terminal groups in a one-to-one correspondence with the N first terminal groups of the test board; N second pogo pin groups electrically contacting or releasing contact with the N second terminal groups in a one-to-one correspondence with the N second terminal groups of the system board; And the N first pogo pin groups are installed at one side area positioned in the test chamber, and the N second pogo pin groups are installed at the other side area located at the test head. A wiring board having wiring for electrically connecting a pogo pin group and the N second pogo pin groups; It is another specific feature to include a.

The system board is another specific feature that is integrally coupled to the connecting substrate.

According to the present invention described above, when the pogo pin groups are provided on both sides of the connecting substrate, or the pogo pin groups are provided on one side and the system board is integrally coupled to the other side, the connecting substrate is insulated while maintaining the insulation state by the insulation. There is an effect that can be properly fixed in the inserted state.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For brevity of description, redundant descriptions will be omitted or compressed as much as possible.

Figure 2 is a cross-sectional view of the major portion of the electrical signal connection system (hereinafter referred to as 'electrical signal connection system') between the tester and the test handler according to a preferred embodiment of the present invention, Figure 3 is an electrical signal according to this embodiment An exploded perspective view of the major parts of the connection system.

First, as shown in FIG. 2, the electrical signal connection system according to the present embodiment includes a heat insulating material 210, a connecting substrate 220, an auxiliary member 230, and the like.

The heat insulator 210 is generally made of an epoxy material having good thermal insulation properties, and is provided between the test chamber TC of the test handler and the test head TH of the tester to provide a space between the test chamber TC and the test head TH. It is provided for thermally blocking. In the heat insulator 210, the heat insulation space 211 may be formed inside, as in the first invention, the substrate insertion hole 212 into which the connecting substrate 220 to be described later is inserted into the upper and lower width 'H ₁ ' Formed.

The connecting substrate 220 includes N first pogo pin groups 221, N second pogo pin groups 222, a wiring board 223, and the like.

The N first pogo pin groups 221 correspond to the N first terminal groups 11 of the test board TB positioned in the test chamber TC in a one-to-one correspondence with the N first pogo pin groups 221 according to the elevation of the test board TB. Each of the one terminal group 11 is electrically contacted or released from contact.

The N second pogo pin groups 222 correspond to the N second terminal groups 21 of the system board SB provided in the test head TH in one-to-one correspondence with the N second pogo pin groups 222 according to the elevation of the system board SB. Each of the two terminal groups 21 is electrically contacted or released from contact.

The wiring board 223 is fixed while the interruption is inserted into the substrate insertion hole 212 of the heat insulating material 210 with the auxiliary member 230 interposed therebetween, and protrudes downward in one region located in the test chamber TC. The N first pogo pin groups 221 described above are installed, and the N second pogo pin groups 222 described above protruding downward are installed in the other region located in the test head TH. The upper and lower widths of the wiring board 223 are H ₂ (H ₂ <H ₁ ), and ultimately, the upper and lower widths of the interruption portions of the connecting board 220 are H ₂ . In the site where the first pogo pin group 221 is installed, the vertical width of the connecting substrate becomes H ₃ (H ₂ <H ₃ <H ₁ ) because the first pogo pin group 221 protrudes downward. Of course, depending on the implementation it may be considered that the first pogo pin group and the second pogo pin group is installed to protrude upward.

The auxiliary member 230 is a state in which the connecting substrate 220 is inserted into the substrate insertion hole 212, more specifically, so that the interruption portion of the wiring board 223 can be fixed in the state inserted into the substrate insertion hole 212 It is provided to assist, the portion inserted into the substrate insertion hole 212 to maintain the insulation state between the test chamber (TC) and the test head (TH) by the heat insulating material 210 is the upper and lower width of the substrate insertion hole (212) It has the same upper and lower width as (H ₁ ). The auxiliary member 230, as described more clearly in Figure 3, comprises a top plate 231 and a lower plate 232 that can be separated from each other, the upper plate 231 and the lower plate 232 of the An air passing hole 230a is formed in the interruption portion so that air can pass in the up and down direction so that the air in the insulation space 211 can be uniformly spread in the up and down direction regardless of the provision of the auxiliary member 230. have. For reference, in order for the air to move up and down through the air passing hole 230a, the diameter of the air passing hole 230a is larger than the width of the cutout portion of the wiring board 223 as in the present embodiment, or the cutoff of the wiring board is performed. It may also be considered to deflect the portion to form at least one air through hole.

Substrate coupling grooves 231b and 232b are formed in pairs on the bottom surface of the upper plate 231 and the upper surface of the lower plate 232 so that the upper plate 231 and the lower plate 232 are coupled to each other. ), The pair forms a substrate bonding hole 230b. That is, the substrate coupling hole 230b is formed over the bottom surface of the upper plate 231 and the upper surface of the lower plate 232, and the upper and lower widths of the substrate coupling hole 230b are the same as the upper and lower widths of the interruption portions of the wiring board 223. H ₂ .

In addition, the fitting plate 232c is formed in the lower plate 232, and the fitting hole 231c in which the fitting protrusion 232c is fitted is formed in the upper plate 231 so that the fitting protrusion 232c and the fitting hole 231c are provided. By the upper plate 231 and the lower plate 232 is to maintain the fitted state. Of course, a configuration in which the fitting protrusions are formed on the upper plate and the fitting holes are formed on the lower plate is also possible.

Furthermore, the auxiliary member 230 (lower plate in this embodiment) has a positioning protrusion 232d as a coupling positioning means for determining a position at which the connecting substrate 220 is coupled. More specifically, the wiring board has a positioning groove 223d corresponding to the positioning protrusion 232d. Of course, depending on the implementation, the positioning projection may be formed on the connecting substrate and the positioning groove may be formed on the auxiliary member, and at least a portion of the substrate coupling hole may be formed in the same shape corresponding to the concave shape of the interruption portion of the wiring board. By doing so, it is also possible for the substrate joining hole to have a role as a joining positioning means.

And the other side of the auxiliary member 230, that is, the test head (TH) side has an extended end (230e) extended to have a width larger than the width of the substrate insertion hole 212, this expansion end (230e) The silver serves as insertion positioning means for determining the position to be inserted when the auxiliary member 230 is inserted into the substrate insertion hole (212). Of course, in this embodiment, the expansion end 230e is shown to protrude to the test head (TH) side, as shown in Figure 4 one side of the substrate insertion hole 212 in the heat insulating material 210 is extended end The expansion end 230e of the auxiliary member 230 may be configured to be inserted into the extended one side of the substrate insertion hole 212 by being extended to accommodate the 230e. In addition, the insertion positioning means may be provided in a configuration other than the expansion stage.

As described above, the positioning protrusion 232d and the positioning groove 223d determine the exact coupling position of the auxiliary member 230 and the connecting substrate 220, and the expansion end 230e is inserted into the substrate insertion hole 230b. By accurately determining the insertion position of the auxiliary member 230 to be made, between the N first pogo pin groups 221 and the N first terminal groups 11 and the N second pogo pin groups 222 and N agents The mutual position between the two terminal groups 21 can be accurately determined.

The following describes the assembly of the electrical signal connection system according to the above configuration.

First, the operator combines the lower plate 232 and the connecting substrate 220, wherein the lower plate 232 and the connecting substrate 220 are coupled at the correct position by using the positioning protrusion 232d and the positioning groove 223d. To be possible.

And the upper plate 231 is coupled to the lower plate 232. In this case as well, the upper plate 231 and the lower plate 232 may be properly fitted by using the relationship between the fitting protrusion 232c and the fitting hole 231c.

When the auxiliary member 230 is coupled to the connecting substrate 220, the operator inserts the connecting substrate 220 having the auxiliary member 230 inserted therein into the substrate insertion hole 212. At this time, the portion of the first pogo pin group 221 is passed from the test head (TH) side to the test chamber (TC) side, because H ₃ is smaller than H ₁ , the first pogo pin group 221 is installed Since no interference occurs between the portion and the inner wall surface of the substrate insertion hole 212, the damage of the first pogo pin group 221 does not occur. The test chamber TC is coupled to the connecting substrate 220 to which the auxiliary member 230 is coupled until the extended end 230e of the auxiliary member 230 is in close contact with the wall surface of the heat insulating material 210 or the wall surface of the test head TH. ) To complete the installation of the connecting substrate 220.

On the other hand, in the present embodiment, although the first pogo pin group 221 is installed is assembled by passing through the substrate insertion hole 212 in the test chamber (T) side direction from the test head (TH), In some embodiments, the second pogo pin group 222 may be assembled by passing the portion having the second pogo pin group 222 through the substrate insertion hole 212 in the test head TH in the test chamber TC. Of course, in the case of the latter example, the upper and lower widths of the connecting substrate 220 of the portion where the second pogo pin group 222 is installed should be H ₃ .

That is, the above configuration features, the first insertion pogo pin group 221 and the second pogo pin group 222 on both sides of the connecting substrate 220 is installed to protrude in the downward direction by the substrate insertion hole 212 The upper and lower widths of the interruption of the connecting substrate 220 inserted into the upper and lower widths are smaller than the upper and lower widths of both ends of the connecting substrate 220. Therefore, the role of the connecting substrate 220 to be fixed in the inserted state in the substrate insertion hole 212 and the gap between the substrate insertion hole 212 and the interruption of the connecting substrate 220 to fill the substrate insertion hole An auxiliary member 230 is provided to serve to block heat exchange between the test chamber TC and the test head TH through 212.

<1st application example>

FIG. 5A is a cross-sectional view of a major portion of the electrical signal connection system according to the first application of the first embodiment, and FIG. 5B is a perspective view of a major portion of the electrical signal connection system according to the present application.

In the first embodiment, the auxiliary member 230 that can be separated into the upper plate 231 and the lower plate 232 is configured. However, in this application example, the upper and lower widths equal to the upper and lower widths H1 ′ of the substrate insertion hole 212 are defined. Has a substrate insertion groove 230'b through which the connecting substrate 220 can be completely inserted into the upper surface of the auxiliary member 230 ', and the upper and lower widths H ₁ ' of the auxiliary member 230 'are N The first pogo pin group 221 is larger than the upper and lower widths (H ₃ ') of the connecting substrate 220 of the site. Although the upper and lower widths H ₁ ′ of the relief member 230 ′ may be equal to the upper and lower widths H ₃ ′ of the connecting substrate 220 at the portion where the N first pogo pin groups 221 are installed, this case may be the same. Since the first pogo pin group 221 may be damaged during the assembly work, there is a difficulty that a sophisticated assembly work must be made.

Of course, the case where the first pogo pin group is installed to protrude upward may also be considered. In this case, it may be preferable that the substrate insertion groove is formed on the lower surface of the auxiliary plate.

Similarly, according to the present application, the upper and lower widths of the connecting substrate 220 of the portion where the second pogo pin group 222 is installed so as to replace the portion where the first pogo pin group 221 is installed are equal to that of the auxiliary member 230 '. It may be implemented to be less than or equal to the upper and lower widths, the assembly work in this case will have to take a way to pass the portion of the second pogo pin group 222 is installed through the substrate insertion hole (212).

<2nd application example>

Fig. 6 is a sectional view of principal portions of the electric signal connection system according to the second application of the first embodiment.

In the first embodiment, the second pogo pin group 222 is installed in the other region of the connecting substrate 220, but in this application, the system board SB is integrally coupled to the other side of the connecting substrate 220 '. It takes the structure that was made.

In the above examples, a configuration may be added to maintain sealing by sealing between the connecting substrate and the auxiliary member and between the auxiliary member and the heat insulating material, between the auxiliary member and the wall of the test chamber or the wall of the test head.

In addition, a coupling means such as a bolt may be further added to couple the connecting substrate to the auxiliary member and to insert the connecting substrate having the auxiliary member inserted into the substrate insertion hole and to more firmly maintain the coupling state.

In the above-described embodiment, although the air through hole is formed in the auxiliary member, the air through hole may not be formed as long as air in the heat insulating space of the heat insulator can circulate well in the vertical direction. The insulation space may not be formed.

Of course, in the above-described embodiment, the interruption portion of the wiring board has a concave configuration, but the wiring board may have a constant width at both sides and the interruption portion.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings. However, since the above-described embodiments have only been described with reference to preferred examples of the present invention, the present invention is limited to the above embodiments. It should not be understood that the scope of the present invention is to be understood by the claims and equivalent concepts described below.

1 is a cross-sectional view of an electrical signal connection system considered until the time of creation of the present invention.

2 is a cross-sectional view of main parts of an electric signal connection system according to a first embodiment of the present invention.

3 is an exploded perspective view of a major portion of the electrical signal connection system of FIG.

4 is a cross-sectional view of a main portion of the electrical signal connection system according to the application of the electrical signal connection system of FIG.

Fig. 5A is a sectional view of principal parts of an electric signal connection system according to a first application of the first embodiment.

FIG. 5B is a perspective view of a major portion of the electrical signal connection system of FIG. 5B. FIG.

Fig. 6 is a sectional view of principal portions of the electric signal connection system according to the second application of the first embodiment.

<Description of Symbols for Main Parts of Drawings>

210: insulation

212: substrate insertion hole

220: connecting board

221: first pogo pin group 222: second pogo pin group

223: wiring board

223d: positioning groove

230: auxiliary member

230a: Air passage

230b: substrate bonding hole

230e: expansion stage

231: top plate

231b: substrate coupling groove 231c: fitting groove

232: bottom plate

232b: substrate coupling groove 232c: fitting protrusion

232d: Positioning protrusion

Claims (10)

An insulating material provided between the test chamber of the test handler and the test head of the tester and having a substrate insertion hole having a vertical width 'H ₁ '; Inserted into the substrate insertion hole formed in the heat insulating material mediates electrical contact between the test board located in the test chamber and the system board located in the test head, the upper and lower widths of the portion inserted into the substrate insertion hole is' H ₂ (H ₁ > H ₂ ) 'connecting substrate; An auxiliary member configured to assist the connecting substrate to be fixed while being inserted into the substrate insertion hole; Characterized in that it comprises Electrical signal connection system between tester and test handler. The method of claim 1, The connecting substrate, N pogo pin groups electrically contacting or releasing contact with the N terminal groups in a one-to-one correspondence with the N terminal groups of the test board; And  A wiring board provided with the N pogo pin groups in one region of the test chamber, the wiring board for electrically connecting the N pogo pin groups to the system board; Characterized in that it comprises Electrical signal connection system between tester and test handler. The method of claim 2, The N pogo pin groups are installed to protrude upward or downward of the wiring board, The connecting substrate is characterized in that the upper and lower width of the site where the N pogo pin groups are installed 'H ₃ (H ₁ ?? H ₃ > H ₂ )' Electrical signal connection system between tester and test handler. The method of claim 1, The auxiliary member is formed with a substrate coupling hole into which the connecting substrate is inserted and coupled, The connecting substrate is inserted into the substrate insertion hole of the auxiliary member in the state that the auxiliary member is inserted into the substrate insertion hole, the connecting substrate is ultimately inserted into the substrate insertion hole, characterized in that Electrical signal connection system between tester and test handler. The method of claim 4, wherein The auxiliary member, An upper plate covering an upper surface of the connecting substrate; And A lower plate covering a lower side of the connecting substrate and coupled to the upper plate; Including; The substrate coupling hole is formed over the bottom surface of the upper plate and the upper surface of the lower plate Electrical signal connection system between tester and test handler. The method of claim 4, wherein The auxiliary member is provided with an insertion positioning means for determining a position to be inserted into the substrate insertion hole Electrical signal connection system between tester and test handler. The method of claim 4, wherein The auxiliary member is provided with a coupling positioning means for determining a position to which the connecting substrate is coupled Electrical signal connection system between tester and test handler. The method of claim 4, wherein The auxiliary member is characterized in that the air passing hole is formed through which air can pass in the vertical direction Electrical signal connection system between tester and test handler. The method of claim 1, The connecting substrate, N first pogo pin groups electrically contacting or releasing contact with the N first terminal groups in a one-to-one correspondence with the N first terminal groups of the test board; N second pogo pin groups electrically contacting or releasing contact with the N second terminal groups in a one-to-one correspondence with the N second terminal groups of the system board; And The N first pogo pin groups are installed in one region located in the test chamber, and the N second pogo pin groups are installed in the other region located in the test head. A wiring board having wiring for electrically connecting a pin group and the N second pogo pin groups; Characterized in that it comprises Electrical signal connection system between tester and test handler. The method of claim 1, The system board is integrally coupled to the connecting substrate Electrical signal connection system between tester and test handler.

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