KR20080102074A - Apparatus of transferring test tray, test handler having the same, and method of manufacturing semiconductor device using the same - Google Patents

Abstract

A test tray transfer apparatus is provided to improve production efficiency by transferring two test trays at the same time. A first transfer unit(100) includes a first barrier groove connecting with a barrier jaw of a first test tray. A second transfer unit(200) includes a second barrier groove connecting with a barrier jaw of a second test tray. The first transfer unit and the second transfer unit move at the same time. The first test tray and the second test tray move at the same time. The first transfer unit and the second transfer unit are combined in an elevating rod(300). The first transfer unit and the second transfer unit get on/off at the same time by an elevation of the elevating rod.

Description

Apparatus of transferring Test Tray, Test Handler having the same, and method of manufacturing semiconductor device using the same

1 is a conceptual diagram schematically showing a conventional test handler.

2 is a perspective view of a test tray feeder according to an embodiment of the present invention.

3 is a front view of a first or second test tray according to an embodiment of the present invention.

4A and 4B are perspective views of a test tray feeder according to another embodiment of the present invention.

5 is a schematic side view of a test handler according to an embodiment of the present invention.

<Description of main parts of drawing>

100: first transfer mechanism 200: second transfer mechanism

110: first locking groove 210: second locking groove

300: lifting bar 310: connecting member

320: belt 330: rotating bar

340: support frame 345: LM guide

350: rotating rod 355: groove

The present invention relates to a test handler, and more particularly, to a conveying apparatus for conveying a test tray containing a semiconductor device.

In general, a memory or non-memory semiconductor device is shipped after various test procedures after production, such a device used to test the semiconductor device is a test handler.

The test handler not only tests the performance of the semiconductor device at room temperature but also tests whether the semiconductor device can perform normal functions even in extreme conditions of high or low temperatures.

Accordingly, the test handler is connected to the first chamber, the test chamber connected to the first chamber and performing a performance test of the semiconductor device, and the test chamber connected to the first chamber to form the semiconductor device in an extreme state of high temperature or low temperature. It comprises a second chamber for returning to a room temperature state.

In addition, the test handler includes a test tray for accommodating a semiconductor device to be tested and transferring the accommodated semiconductor device to the first chamber, the test chamber, and the second chamber.

Hereinafter, a conventional test handler will be described with reference to the drawings.

1 is a conceptual diagram schematically showing a conventional test handler.

As can be seen in Figure 1, the conventional test handler comprises a rotating part 10, the first chamber 20, the test chamber 30 and the second chamber 40, the rotating part 10, the first The test tray 1 moves between the chamber 20, the test chamber 30, and the second chamber 40. The semiconductor device is accommodated in the test tray 1.

Referring to the operation of the conventional test handler as follows.

First, the test tray 1 in a horizontal state is rotated 90 degrees in the rotating unit 10 to position the test tray in a vertical state.

Next, the test tray 1 in the vertical state is transferred to the upper first chamber 20 and sequentially moved in the first chamber 20 to be heated or cooled to a temperature that meets the test conditions.

Next, the test tray 1 in the vertical state is moved to the lower test chamber 30, and then a test is performed on the semiconductor device.

Next, the test tray 1 in the vertical state is transferred to the lower second chamber 40 and then returned to room temperature while sequentially moving in the second chamber 40.

Next, the test tray 1 in a vertical state is transferred to the upper rotating part 10, and then rotated 90 degrees in the rotating part 10 to position the test tray in a horizontal state.

Next, the semiconductor devices are classified and unloaded according to the test results.

On the other hand, in order to improve the productivity in testing the semiconductor device in this manner, after completing the process of one test tray after the process of the other test tray is not repeated, but a plurality of methods It is preferable to sequentially input the plurality of test trays and to sequentially process the plurality of test trays.

However, even if the process is sequentially performed for a plurality of test trays, a more efficient method for transferring the test trays between the respective process steps should be considered.

In more detail, when the plurality of test trays are inserted and the processes are sequentially performed on the plurality of test trays, the first test trays that have completed the test in the test chamber 30 are the second chambers 40. The second test tray, which is waiting for the transfer to) and heated or cooled in the first chamber 20, is waiting for the transfer to the test chamber 30.

In this situation, in the conventional case, a method of transferring the first test tray to the second chamber 40 and then transferring the second test tray to the test chamber 30 was used.

Therefore, the waiting time before the second test tray is transferred to the test chamber 30 is long, and thus, there is a disadvantage in that the production efficiency is lowered.

The present invention is designed to solve the above disadvantages,

An object of the present invention is to provide a test tray transfer apparatus, a test handler having the same, and a method of manufacturing a semiconductor device using the same, which can further improve production efficiency by simultaneously transferring two test trays.

In order to achieve the above object, the present invention includes a first transfer mechanism having a first locking groove coupled to a locking jaw of a first test tray, and a second locking groove coupled to a locking jaw of a second test tray. And a second transfer mechanism, wherein the first transfer mechanism and the second transfer mechanism simultaneously move the first test tray and the second test tray, thereby providing a test tray transfer device. .

The present invention also provides a semiconductor device comprising: a first chamber for forming a semiconductor device in an extreme state of high temperature or low temperature; A test chamber connected to the first chamber and configured to test a semiconductor device in an extreme state of high temperature or low temperature; A second chamber connected to the test chamber and for returning the tested semiconductor device to a room temperature state; And a first transfer mechanism for transferring the first test tray, which has been tested in the test chamber, to the second chamber and simultaneously transferring a second test tray heated or cooled in the first chamber to the test chamber. It provides a test handler comprising a test tray transfer device comprising a second transfer mechanism.

In addition, the present invention comprises the steps of preparing a semiconductor device; Loading the prepared semiconductor device in a test tray and rotating the test tray in a vertical state in a rotating part; Transferring the test tray from the rotating unit to the first chamber and then applying an extreme state of high temperature or low temperature to the test tray in the first chamber; Transferring the test tray from the first chamber to the test chamber; Performing a test on a semiconductor device loaded in the test tray in the test chamber; Transferring the test tray from the test chamber to a second chamber; Returning the test tray to a room temperature state in the second chamber; And rotating the test tray in a vertical state after transferring the test tray from the second chamber to the rotating unit, wherein the test tray is transferred from the first chamber to the test chamber. The step of transferring the test tray from the test chamber to the second chamber provides a method for manufacturing a semiconductor device, characterized in that performed at the same time using the test tray transfer device including the first transfer mechanism and the second transfer mechanism described above. do.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

<Test Tray Feeder>

2 is a perspective view of a test tray feeder according to an embodiment of the present invention, Figure 3 is a front view of the first or second test tray according to an embodiment of the present invention, Figures 4a and 4b is a view of the present invention A perspective view of a test tray feeder according to another embodiment.

As can be seen in Figure 2, the test tray transfer apparatus according to an embodiment of the present invention comprises a first transfer mechanism 100 and a second transfer mechanism 200 connected to the first transfer mechanism 100.

The first transfer mechanism 100 includes a first locking groove 110 coupled with a locking step (see reference numeral 150a of FIG. 3) of the first test tray T, and the second transfer mechanism 200. The second test groove (T) is provided with a second locking groove 210 coupled with the locking step (reference numeral 150b of FIG. 3).

The first locking groove 110 of the first transfer mechanism 100 is coupled to the locking jaw 150a formed on the upper side of the first test tray T, and the second locking mechanism of the second transfer mechanism 200 is coupled. The groove 210 is coupled to the engaging jaw 150b formed below the second test tray T, so that the first test tray T is connected to the first transfer mechanism 100 and the second transfer mechanism 200. ) And the second test tray T are combined at the same time.

The first transfer mechanism 100 and the second transfer mechanism 200 are coupled to the lifting bar 300. Therefore, when the lifting rod 300 is raised and lowered, the first transfer mechanism 100 and the second transfer mechanism 200 are lifted at the same time, accordingly, the first test tray T and the second test tray T. Will be transported at the same time.

FIG. 2 illustrates a test tray transfer device including a first transfer mechanism 100, a second transfer mechanism 200, and a lifting rod 300, but the test tray transfer apparatus according to FIG. The first test tray T and the second test tray T are transferred.

In addition, the first transfer mechanism 100 and the second transfer mechanism 200 should not be disturbed when the first test tray and the second test tray enter the transfer space. More specifically, the first transfer mechanism 100 and the second transfer mechanism 200 when the first test tray (T) enters the transfer space for the transfer to the second chamber from the test chamber of the test handler The second test tray T should not be prevented from entering the first test tray T, and when the second test tray T enters the transfer space for being transferred from the first chamber of the test handler to the test chamber, It should not interfere with the entry of T).

Therefore, the lifting bar 300 is rotatably configured so that the first test tray T and the second test tray T do not interfere when entering the transfer space. When the lifting bar 300 rotates as described above, the first transfer mechanism 100 and the second transfer mechanism 200 coupled to the lifting rod 300 rotate together to form the first test tray T and the first transfer mechanism. 2 When the test tray (T) enters the transfer space, the entry space is given. In addition, when the first and second test trays (T) has completed the entry into the transport space, the lifting bar 300 is rotated in reverse. As such, when the lifting bar 300 rotates in the opposite direction, the first transfer mechanism 100 and the second transfer mechanism 200 also rotate together to be coupled to the first and second test trays T.

As described above, the first transfer mechanism 100 and the second transfer mechanism 200 are moved up and down by lifting up and down the lifting rod 300 to simultaneously move the first test tray T and the second test tray T up and down simultaneously. When the first test tray (T) and the second test tray (T) enters the transfer position by rotating by the lifting rod 300, the entry space is provided and the first and the first When the second test tray T completes the entry, the test tray T is coupled to the first and second test trays T.

Hereinafter, a configuration for lifting the lifting bar 300 and a configuration for rotating the lifting rod 300 will be described in detail with reference to FIGS. 4A and 4B.

First, the configuration for the lifting bar 300 to move up and down will be described.

Figure 4a shows the lifting rod is lowered and Figure 4b shows the lifting rod is raised.

As can be seen in Figures 4a and 4b, the lifting bar 300 is connected to the belt 320 through the connecting member 310. One end of the belt 320 is wound around the rotation bar 330, and the other end of the belt 320 is wound around a predetermined support frame 340. The support frame 340 is provided with an LM guide 345, the connection member 310 is connected to the LM guide 345 of the support frame 340.

Accordingly, when the rotation bar 330 is rotated by a motor (not shown), the belt 320 wound around the rotation bar 330 is rotated, and when the belt 320 is rotated, the belt ( The connecting member 310 connected to the 320 is elevated along the LM guide 335 of the support frame 330. As such, when the connection member 310 is elevated, the lifting rod 300 connected to the connection member 310 is elevated.

On the other hand, when the elevating bar 300 is raised, the elevating bar 300 is raised through the interior of the rotating rod 350 formed to surround the circumference. In this case, a groove 355 is formed in the rotary rod 350 in the longitudinal direction, and the first transfer mechanism 100 coupled to the elevating rod 300 through the groove 355 formed in the rotary rod 350. The second transfer mechanism 200 is exposed to the outside of the rotating rod (350). Therefore, when the lifting bar 300 rises through the inside of the rotary bar 350, the first transfer mechanism 100 and the second transfer mechanism 200 along the groove 355 of the rotary rod 350 Will rise. Even when the lifting bar 300 descends, the first transfer mechanism 100 and the second transfer mechanism 200 descend through the groove 355 of the rotary rod 350.

As such, the first and second transfer mechanisms 100 and 200 connected to the lifting rods 300 are lifted by the lifting and lowering of the lifting rods 300, and eventually, the first transfer mechanisms 100 and The first test tray and the second test tray respectively coupled to the second transfer mechanism 200 are transferred simultaneously.

Next, a configuration for the lifting bar 300 to rotate will be described.

As can be seen in Figures 4a and 4b, the lifting bar 300 is surrounded by a rotating rod 350, the rotating rod 350 is connected to the link structure 360. In addition, the rotating rod 350 has a groove 355 in the longitudinal direction, the first transfer mechanism 100 coupled to the lifting bar 300 through the groove 355 formed in the rotating rod 350 and The second transfer mechanism 200 is exposed to the outside of the rotating rod (350).

Therefore, when the rotating rod 350 is rotated by the link structure 360, the lifting bar 300 is rotated together with the rotating rod 350.

At this time, one end of the elevating rod 300 is connected to the connecting member 310 via a bearing, so that the elevating rod 300 on the connecting member 310 when the rotating rod 350 is rotated It becomes rotatable.

In other words, when the first test tray and the second test tray enter the transfer space, the rotating rod 350 rotates clockwise (or counterclockwise) so that the first transfer mechanism 100 and the second transfer tray rotate. The mechanism 200 rotates together to a position outside the entrances of the first test tray and the second test tray so that it does not interfere with the entry of the first test tray and the second test tray. In addition, when the first test tray and the second test tray has completed the entry into the transfer space, the rotating rod 350 is rotated counterclockwise (or clockwise) to the first transfer mechanism 100 and the first transfer tray. When the two transfer mechanisms 200 return to their original states, the two transfer mechanisms 200 are coupled to the first test tray and the second test tray, thereby preparing the transfer of the first test tray and the second test tray.

A process of simultaneously transferring the first test tray and the second test tray using the test tray transfer apparatus as described above is as follows.

First, the rotary bar 350 and the lifting bar 300 are rotated using the link structure 360, and then the first test tray and the second test tray are moved to a transfer position.

Next, by using the link structure 360 to rotate the rotary bar 350 and the lifting bar 300 to the original state, the first locking groove 110 and the first test tray upper side of the first transfer mechanism (100). The engaging jaw of the, and the second engaging groove 210 of the second transfer mechanism 200 and the engaging jaw of the lower side of the second test tray.

Next, the lifting bar 300 coupled with the first transfer mechanism 100 and the second transfer mechanism 200 is lowered to simultaneously lower the first test tray and the second test tray. In the step of lowering the lifting bar 300, as described above, the rotation bar 330 is rotated by a motor (not shown), the belt 320 is rotated by the rotation of the rotation bar 300, The connection member 310 is lowered by the rotation of the belt 320.

Next, when the lowering of the first test tray and the second test tray is completed, by using the link structure 360 to rotate the rotating rod 350 and the lifting bar 300 by the first transfer mechanism 100 and the first The coupling between the first test tray and the coupling between the second transfer mechanism 200 and the second test tray is released.

Next, the lifting bar 300 coupled with the first transfer mechanism 100 and the second transfer mechanism 200 is raised to return the first transfer mechanism 100 and the second transfer mechanism 200 to their original positions. Then, the transfer of the next third test tray and the fourth test tray is prepared.

<Test handler>

5 is a schematic side view of a test handler according to an embodiment of the present invention.

As can be seen in Figure 5, the test handler according to an embodiment of the present invention comprises a rotating part 400, the first chamber 500, the test chamber 600 and the second chamber 700.

The rotating unit 400 serves to rotate the test tray to be transferred to the first chamber 500 from a horizontal state to a vertical state, and also to horizontally rotate the test tray transferred from the second chamber 700 in a vertical state. It serves to rotate. Although not shown, the loading unit for loading the semiconductor device to be tested into the test tray and the unloading unit for classifying and unloading the tested semiconductor device from the test tray are installed in the vicinity of the rotating unit 400.

The first chamber 500 is a space for forming a semiconductor device in an extreme state of high temperature or low temperature. The first chamber 500 moves the test tray T for accommodating the semiconductor device in the first chamber 500 step by step. The semiconductor element is heated or cooled to a temperature condition corresponding to the condition.

The test chamber 600 is formed below the first chamber 500 and is a space for testing a semiconductor device in an extreme state of high temperature or low temperature, and the test tray T transferred from the first chamber 500 is The semiconductor device is positioned between the push unit 610 and the tester 620, and the push unit 610 pushes the semiconductor device accommodated in the test tray T to connect the tester 620 to test the semiconductor device. .

The second chamber 700 is formed in the lower part of the test chamber 600 and is a space for returning the tested semiconductor device to a room temperature state. The test tray accommodates the semiconductor device in the second chamber 700 ( The semiconductor element is returned to room temperature while moving T) step by step.

On the other hand, a plurality of test trays are sequentially transferred through the rotating part 400, the first chamber 500, the test chamber 600 and the second chamber 700, and the process proceeds, although not specifically illustrated. In addition, a transfer device may be formed to simultaneously transfer a plurality of test trays over the first chamber 500, the test chamber 600, and the second chamber 700.

The test tray transfer apparatus transfers the first test tray tested in the test chamber 600 to the second chamber 700 and simultaneously transfers the second test tray heated or cooled in the first chamber 500. As the transfer to the test chamber 600, the specific configuration is the same as described above will be omitted.

The first test tray and the second test tray simultaneously transported by the test tray feeder are configured by combining a plurality of carrier modules in a predetermined frame, and the catching jaw coupled to the catching groove of the test tray feeder in the predetermined frame. (See 150a and 150b in Fig. 3).

<Semiconductor Device Manufacturing Method>

Hereinafter, a method of manufacturing a semiconductor device according to an embodiment of the present invention will be described.

First, a semiconductor element is prepared. The semiconductor device includes a memory semiconductor device and a non-memory semiconductor device.

Next, after loading the prepared semiconductor device in the test tray, the test tray is rotated in a vertical state in the rotating unit.

As shown in FIG. 5, the semiconductor device is loaded in a test tray in a horizontal state in a loading unit near the rotating unit 400, and then the horizontal test tray is rotated in a vertical state in the rotating unit 400. Can be done.

Next, the test tray is transferred from the rotating unit to the first chamber, and the extreme state of high temperature or low temperature is given to the test tray in the first chamber.

As shown in FIG. 5, the process may be performed by heating or cooling the semiconductor device while moving the test tray accommodating the semiconductor device by one step in the first chamber 500.

Next, the test tray is transferred from the first chamber to the test chamber.

This process is performed using the test tray feeder according to FIGS. 2, 4A and 4B described above.

Next, a test is performed on the semiconductor device loaded in the test tray in the test chamber.

As can be seen in FIG. 5, the semiconductor device accommodated in the test tray may be connected to the tester 620 by the push unit 610 to perform a test on the semiconductor device.

Next, the test tray is transferred from the test chamber to the second chamber.

This process is performed using the test tray feeder according to FIGS. 2, 4A and 4B described above.

Next, the test tray is returned to a room temperature state in the second chamber.

As shown in FIG. 5, the process may be performed to return the semiconductor device to a room temperature while moving the test tray accommodating the semiconductor device in the second chamber 700 by one step.

Next, the test tray is transferred from the second chamber to the rotating unit, and the test tray in the vertical state is rotated in the horizontal state.

As can be seen in Figure 5, the rotating unit 400 may be a process of rotating the test tray in a vertical state in a horizontal state. As described above, after the test tray is rotated in a horizontal state, the unloading unit near the rotating unit 400 undergoes a process of classifying the semiconductor device from the test tray according to the test result, thereby completing the manufacture of the semiconductor device.

Meanwhile, the process is performed while the plurality of test trays are continuously transferred, in which case, the process of transferring the test tray from the first chamber to the test chamber and the process of transferring the test tray from the test chamber to the second chamber Is performed using the test tray feeder according to FIGS. 2, 4A and 4B.

As described above, according to the present invention, the production efficiency can be further improved by simultaneously transferring two test trays.

Claims (13)

It includes a first transfer mechanism having a first locking groove coupled to the locking jaw of the first test tray and a second transfer mechanism having a second locking groove coupled to the locking jaw of the second test tray, And the first transfer mechanism and the second transfer mechanism simultaneously move the first test tray and the second test tray. The method of claim 1, The first transfer mechanism and the second transfer mechanism is coupled to the lifting rod, the test tray transfer apparatus, characterized in that the first transfer mechanism and the second transfer mechanism is raised and lowered at the same time by lifting the lifting rod. The method of claim 2, The elevating rod is connected to the belt through a connecting member so that the elevating rod is lifted according to the rotation of the belt. The method of claim 3, One end of the belt is wound on a rotation bar, the other end of the belt is wound on a predetermined support frame, and the connecting member is connected to the LM guide of the support frame, The belt is rotated by the rotation of the rotary bar, and the lifting rod connected to the connection member is lifted by the lifting member connected to the elevating guide of the support frame by the rotation of the belt. . The method of claim 1, The first transfer mechanism and the second transfer mechanism provide an entry space when the first and second test trays enter the transfer position, and the first transfer mechanism and the second transfer mechanism when the first and second test trays complete the entry. A test tray feeder, characterized in that for moving to engage with the first and second test trays. The method of claim 5, The first transfer mechanism and the second transfer mechanism are coupled to the lifting rod, and the first transfer mechanism and the second transfer mechanism rotate by the rotation of the lifting rod, thereby opening the entrance spaces of the first and second test trays. And a test tray conveying apparatus which is attached to the first and second test trays. The method of claim 6, One end of the elevating rod is rotatable and is connected to the connecting member, and the connecting member is connected to the belt, and the elevating rod is rotatable and the test tray transport apparatus, characterized in that the elevating according to the rotation of the belt. The method of claim 6, The lifting rod is surrounded by a rotating rod, the rotating rod is formed with a groove in the longitudinal direction, the first transfer mechanism and the second transfer mechanism coupled to the lifting rod is exposed to the outside of the rotating rod through the groove formed in the rotating rod , The elevating rod rotates by the rotation of the rotary rod, and the first transfer mechanism and the second transfer mechanism coupled to the elevating rod along the groove of the rotary rod is lifted. The method of claim 8, The rotary rod is connected to the link structure, characterized in that the rotary rod rotates by the link structure. A first chamber for forming a semiconductor device in an extreme state of high temperature or low temperature; A test chamber connected to the first chamber and configured to test the semiconductor device in an extreme state of high temperature or low temperature; A second chamber connected to the test chamber and for returning the tested semiconductor device to a room temperature state; And The apparatus of claim 1, wherein the first test tray tested in the test chamber is transferred to the second chamber and the second test tray heated or cooled in the first chamber is transferred to the test chamber. A test handler comprising a test tray feeder according to any one of claims. The method of claim 10, And the first test tray and the second test tray have a locking step coupled to a locking groove of the first transfer mechanism and the second transfer mechanism. The method of claim 10, And the first chamber is formed above the test chamber, and the second chamber is formed below the test chamber. Preparing a semiconductor device; Loading the prepared semiconductor device in a test tray and rotating the test tray in a vertical state in a rotating part; Transferring the test tray from the rotating unit to the first chamber and then giving an extreme state of high temperature or low temperature to the test tray in the first chamber; Transferring the test tray from the first chamber to the test chamber; Performing a test on a semiconductor device loaded in the test tray in the test chamber; Transferring the test tray from the test chamber to a second chamber; Returning the test tray to a room temperature state in the second chamber; And And rotating the test tray in a vertical state after transferring the test tray from the second chamber to the rotating unit. At this time, the step of transferring the test tray from the first chamber to the test chamber and the step of transferring the test tray from the test chamber to the second chamber, transfer of the test tray according to any one of claims 1 to 9. A method for manufacturing a semiconductor device, characterized in that performed simultaneously using the device.

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