KR20080091986A - Chemical vapor deposition apparatus for flat display - Google Patents

Abstract

A chemical vapor deposition apparatus for a flat display is provided to ground a susceptor to various grounding points of a chamber by using a plurality of strip clamps. A chemical vapor deposition apparatus for a flat display comprises a susceptor(70) installed in a process chamber including upper and lower chambers(10,20), a plurality of strips(45) fixed to the susceptor, and a plurality of strip clamps(50) for grounding the susceptor to the process chamber. The flat display is loaded on the susceptor installed in the lower chamber. The strip clamps are inserted into through holes formed in a bottom wall of the lower chamber. The other ends of the strips are coupled to the strip clamps to ground the susceptor to the process chamber.

Description

Chemical Vapor Deposition Apparatus for Flat Displays {Chemical Vapor Deposition Apparatus for Flat Display}

1 is a schematic structural diagram of a chemical vapor deposition apparatus for a planar display according to a first embodiment of the present invention.

2 is an enlarged view illustrating main parts of FIG. 1.

3 is a schematic plan view of the susceptor for showing the position of the plurality of strips provided in the susceptor shown in FIG.

4 is an enlarged view illustrating main parts of a chemical vapor deposition apparatus for a planar display according to a second exemplary embodiment of the present invention.

FIG. 5 is a perspective view of the strip clamp shown in FIG. 4. FIG.

6 is a cross-sectional view of FIG. 5.

7 is a cross-sectional view illustrating an operating state of FIG. 6.

8 and 9 are perspective views showing modified embodiments of the strip clamp, respectively.

* Explanation of symbols for the main parts of the drawings

10: upper chamber 20: lower chamber

20a: substrate entry part 30: electrode

31: gas distribution plate 32: rear plate

35: suspension support member 37: gas supply unit

38: high frequency power supply 40: reinforcement wall

45: strip 50: strip clamp

51: clamp body 51a: shaft portion

51b: head 52: clamping part

70: susceptor 72: lift pin

74: column 76: susceptor support

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical vapor deposition apparatus for planar displays, and more particularly, by allowing the susceptor to be grounded to the chamber at more points than conventionally, including the central region of the rear surface of the susceptor in a simple and convenient manner. The present invention relates to a chemical vapor deposition apparatus for a flat panel display which can induce sufficient grounding of the acceptor to increase the quality of the deposited film for the flat panel display.

Flat panel displays are widely used in personal handheld terminals, as well as in TVs and computers.

Such flat displays include liquid crystal displays (LCDs), plasma display panels (PDPs), and organic light emitting diodes (OLEDs).

Among them, LCD (Liquid Crystal Display) injects a liquid crystal, which is an intermediate between solid and liquid, between two thin upper and lower glass substrates, and generates contrast by changing the arrangement of liquid crystal molecules by the electrode voltage difference between the upper and lower glass substrates. It is a device using a kind of optical switch phenomenon to display an image.

LCDs are now widely used in electronic clocks, electronic calculators, TVs, notebook PCs, electronic products, automobiles, aircraft speed displays and driving systems.

Previously, LCD TVs have a size of about 20 to 30 inches, and monitors have a mainstream size of 17 inches or less. In recent years, however, the preference for large TVs of 40 inches or larger and large monitors of 20 inches or larger has increased.

Therefore, manufacturers of LCDs have come to produce wider glass substrates. Currently, there is a mass production of so-called 8th generation glass substrates that are about 2 meters (m) wide.

LCD is a TFT process in which processes such as deposition, photo lithography, etching, chemical vapor deposition, etc. are repeatedly performed, a cell process for bonding upper and lower glass substrates, and an apparatus It is released as a product through the completed module process.

On the other hand, the chemical vapor deposition process, which is one of numerous processes, is plasma-formed by an external high frequency power source, and silicon-based compound ions having high energy are ejected from the gas distribution plate through the electrodes. It is a process to be deposited on a glass substrate. This process takes place in a chamber that performs a chemical vapor deposition process.

As will be described later in detail, the chamber for performing the chemical vapor deposition process is composed of an upper chamber and a lower chamber. An upper chamber is provided with an electrode, and a lower chamber is provided with a susceptor for loading a glass substrate to be deposited.

Thus, when the glass substrate is loaded on the upper surface of the susceptor, the susceptor is heated to a temperature of about 280 ~ 380 ℃. Subsequently, the susceptor is raised to place the glass substrate adjacent to the gas distribution plate, which is the lower electrode.

Then, power is applied through an electrode insulated from the chamber by Teflon, which is an insulator. Subsequently, silicon-based compound ions are ejected through the gas distribution plate in which a large number of orifices are formed, and the deposition process of the glass substrate is performed.

On the other hand, in order to increase the quality of the deposited film on the glass substrate during the deposition process as described above, a more stable and uniform plasma must be obtained, and for this purpose, the susceptor needs to be grounded to the chamber.

Therefore, in a conventional chemical vapor deposition apparatus, a ground line called a strip is provided on the susceptor, and a plurality of strip clamps are mounted on the bottom surface of the chamber to couple the strips to the strip clamps. The receptor has been grounded. Since the space between the susceptor, a large structure mounted inside the chamber, and the inner wall of the chamber is narrow, the susceptor is inevitably grounded to the chamber only for the circumferential region of the susceptor to which access is permitted. Although it has been described by the applicant of the Patent Application No. 2006-0047495 et al.

As described above, however, as the glass substrate becomes larger, sufficient grounding of the susceptor is known to be more advantageous for improving the quality of the deposited film on the glass substrate. And strip clamps need to be provided and connected respectively.

However, after the susceptor is mounted in the chamber, it should be considered that a countermeasure should be taken into account because it is practically impossible to access the area between the bottom of the chamber and the back of the susceptor except for the circumferential region of the susceptor. . In other words, separating the susceptor from the chamber for grounding is a large loss in the process, and it is necessary to implement sufficient grounding for the susceptor in a simple and convenient manner.

It is an object of the present invention to induce a sufficient grounding of the susceptor by inducing a simple grounding of the susceptor to the chamber at more points than in the prior art, including the center region of the backside of the susceptor in a simple and convenient manner, thereby ensuring the quality of the deposited film for the flat display. It is to provide a chemical vapor deposition apparatus for a flat panel display to increase the.

According to the present invention, a susceptor is provided in the chamber in which the deposition process for the flat display is carried out and the flat display is loaded on the upper surface (Loading); A plurality of strips coupled to the susceptor so that one end is fixed to the susceptor; And a plurality of strip clamps detachably coupled to a through hole formed in one wall of the chamber, and a plurality of strip clamps coupled to other free ends of the plurality of strips to ground the susceptor to the chamber. It is achieved by a chemical vapor deposition apparatus for a planar display.

Here, the strip may be provided in plurality along the circumferential direction of the rear outer circumferential region and the central region of the susceptor.

The strip clamp may be coupled to the lower chamber bottom wall at a position corresponding to the strip so as to correspond to the plurality of strips one by one.

Each of the plurality of strip clamps includes: a clamp body made of a metal material coupled to the through hole and electrically connected to the lower chamber; And a clamping part coupled to one end of the clamp main body toward the inside of the lower chamber and having the other free end of the strip substantially coupled thereto.

The clamp body may include a shaft portion that is substantially fitted with the through hole; And a head portion formed at one end of the shaft portion and exposed to the rear surface of the lower chamber.

On the other hand, according to the present invention, a susceptor is provided in the chamber in which the deposition process for the planar display is in progress and the planar display is loaded on the upper surface (Loading); A plurality of strips coupled to the susceptor such that one end thereof is fixed to the susceptor in the circumferential direction of the rear outer circumferential region and the central region of the susceptor; And a plurality of free ends coupled to the other end of the susceptor to ground the susceptor to the chamber, provided at the bottom surface of the chamber between an inner wall of the chamber and an outer surface of the susceptor to which an operator is allowed to access. It is also achieved by a chemical vapor deposition apparatus characterized by including a strip clamp.

Here, the strip clamp, the fixed body coupled to the fixed side wall of the chamber; A movable body disposed on one side of the fixed body so as to be accessible and spaced from the fixed body, and chucking and fixing a strip extending from the susceptor together with the fixed body when the fixed body is approached; A rotating shaft portion coupled to the fixed and movable bodies, respectively, for approaching and spaced apart from the fixed body by the rotation in the forward and reverse directions; And a rotation manipulation unit provided in an exposed end region of the rotation shaft to rotate the rotation shaft in the forward and reverse directions.

The rotating shaft portion may be screwed to the fixed and movable body, respectively, in the central region of the fixed and movable body, the direction of the screw thread formed between the rotary shaft portion and the fixed body, and formed between the rotary shaft portion and the movable body The direction of the threads can be machined in opposite directions.

The fixed and movable body may further be provided with a guide for guiding the approach and separation of the movable body to the fixed body.

The guide portion, the fixing groove portion formed in one side of the fixed body; A movable groove recessed in one side of the movable body facing one side of the fixed body in which the fixing groove is formed; And both ends may include a guide rod coupled to each of the fixed and movable groove.

The flat panel display may be a large glass substrate for a liquid crystal display (LCD).

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 is a schematic structural diagram of a chemical vapor deposition apparatus for a planar display according to a first embodiment of the present invention, FIG. 2 is an enlarged view of a main part of FIG. 1, and FIG. 3 is provided in a plurality of susceptors shown in FIG. Is a schematic plan view of the susceptor for showing the location of the strips.

As described above, the flat display G may be any of liquid crystal display (LCD), plasma display panel (PDP), and organic light emitting diodes (OLED) as described above.

However, in the present embodiment, a large glass substrate G for a liquid crystal display (LCD) will be regarded as a flat display (G). In addition, as mentioned above, large size refers to the magnitude | size of the level applied to 8 generations. Hereinafter, the flat display G will be described as a glass substrate G.

As shown in FIG. 1, the planar display chemical vapor deposition apparatus according to the present embodiment is provided in the upper and lower chambers 10 and 20 and the upper chamber 10 toward the glass substrate G to be deposited. An electrode 30 that emits a deposition material that is a predetermined silicon-based ion, a susceptor 70 provided in the lower chamber 20, and loaded with a glass substrate G, and the susceptor 70. A plurality of strips (50, strips) extending from the plurality of strips 50, the strips 50 are detachably coupled so that the susceptor 70 can be grounded to the lower chamber 20. Strip Clamp).

As shown in FIG. 1, the upper and lower chambers 10 and 20 are coupled to each other as the deposition process proceeds. That is, the upper chamber 10 is coupled to the upper portion of the lower chamber 20 by separate cranes so that the upper and lower chambers 10 and 20 form a body.

As described above, the upper and lower chambers 10 and 20 form a body, and when the deposition process is performed in the deposition space S therein, the deposition space S may be maintained in the vacuum atmosphere. Shielded.

Looking at the upper chamber 10, the inside of the upper chamber 10 is provided with an electrode 30 in the transverse direction. The electrode 30 is behind the gas distribution plate 31 with the gas distribution plate 31 disposed on the front surface facing the lower chamber 20 and the buffer space B between the gas distribution plate 31 interposed therebetween. It has a rear plate 32 disposed in the.

The gas distribution plate 31 is provided with a number of finely processed orifices (not shown). Therefore, when the susceptor 70 is raised and disposed close to the gas distribution plate 31 at about several tens of millimeters (mm), the deposition material is discharged through numerous orifices and deposited on the upper surface of the glass substrate G. .

An insulator 34 is provided between the rear plate 32 and the upper chamber 10 so that the rear plate 32 is not in direct contact with the outer wall of the upper chamber 10 and is not energized. The insulator 34 may be made of Teflon or the like. In the periphery of the rear plate 32 is further provided with a plate support 33 for supporting the rear plate 32 with respect to the upper chamber (10).

A suspension support member 35 is provided between the gas distribution plate 31 and the rear plate 32. The suspension supporting member 35 not only prevents the deposition material in the buffer space B from leaking to the outside, but also suspends the gas distribution plate 31 having a heavy weight of about 400 kg to the rear plate 32. In addition, the suspension supporting member 35 also serves to compensate for the thermal expansion of the gas distribution plate 31 heated to about 200 ° C. in at least one of X, Y, and Z directions during the deposition process.

An upper plate 36 is provided at the upper end of the upper chamber 10. In addition, a gas supply part 37 for supplying a reaction gas, a cleaning gas, or another gas into the deposition space S is provided above the upper plate 36. In the vicinity of the gas supply unit 37, a high frequency power supply unit 38 is provided. The high frequency power supply 38 is electrically connected to the rear plate 32 of the electrode 30 by the connection line 39. On the other hand, one side of the outer wall of the upper chamber 10 is further provided with a reinforcing wall portion 40 for reinforcing the difference between the side wall thickness of the lower chamber 20 and the side wall thickness of the upper chamber 10.

The lower chamber 20 is a portion where the deposition process on the glass substrate G is substantially performed. Therefore, the deposition space S is substantially formed in the lower chamber 20. The outer wall of the lower chamber 20 is formed with a substrate access part 20a which is a passage through which a glass substrate G flows into and out of the deposition space S by a predetermined working robot. The substrate access portion 20a is selectively opened and closed by a gate valve 24 coupled to the periphery thereof.

Although not shown, a gas diffusion plate (not shown) is provided in the bottom region of the lower chamber 20 to diffuse the gas present in the deposition space S back into the deposition space S.

The susceptor 70 supports the glass substrate G which is disposed in the transverse direction in the deposition space S in the lower chamber 20 and loaded. Usually, it is formed of a structure larger than the area of the glass substrate G to be deposited. The upper surface of the susceptor 70 is manufactured almost in a plate so that the glass substrate G can be loaded in a precise horizontal state. A heater (not shown) is mounted inside the susceptor 70 to heat the susceptor 70 to a predetermined deposition temperature of approximately 280 to 380 ° C.

The plurality of lift pins 72 stably supporting the lower surface of the glass substrate G loaded or taken out on the susceptor 70 to be loaded or taken out while the glass substrate G is placed on the upper surface of the susceptor 70. It is further provided. The lift pins 72 are installed to penetrate the susceptor 70.

When the susceptor 70 is lowered, the lift pins 72 are pressed at the bottom of the lower chamber 20 so that the top thereof protrudes to the top of the susceptor 70. Thus, the glass substrate G is spaced apart from the susceptor 70. On the contrary, when the susceptor 70 floats, the susceptor 70 moves downward to bring the glass substrate G into close contact with the upper surface of the substrate loading part 31. These lift pins 72 serve to form a space between the glass substrate G and the susceptor 70 so that the robot arm (not shown) can grip the glass substrate G loaded on the susceptor 70. do.

The susceptor 70 has a column 74 having an upper end fixed to a rear center region of the susceptor 70 and a lower end exposed downward through the lower chamber 20 to support the susceptor 70 in a liftable manner. Is more coupled.

As described above, the susceptor 70 under the eighth generation may have a large weight and a relatively large size, which may cause sag. In this case, the susceptor 70 may also sag in the glass substrate G. Thus, as shown in the upper region of the column 74, a susceptor support 76 is provided to stably support the susceptor 70.

The susceptor 70 moves up and down in the deposition space S in the lower chamber 20. That is, when the glass substrate G is loaded, the glass substrate G is disposed in the bottom region of the lower chamber 20, and when the glass substrate G is loaded and the deposition process is performed, the glass substrate G is the gas distribution plate 31. Injury to be adjacent to. To this end, the elevating module 60 for elevating the susceptor 70 is further provided in the column 74 coupled to the susceptor 70.

In the process of elevating the susceptor 70 by the elevating module 60, the space between the column 74 and the lower chamber 20 should not be generated. Therefore, a bellows pipe 78 is provided in the region of the lower chamber 20 through which the column 74 passes to surround the outside of the column 74. The bellows tube 78 expands when the susceptor 70 descends and is compressed when the susceptor 70 rises.

On the other hand, as described above, as the glass substrate G becomes larger, sufficient grounding of the susceptor 70 is known to be more advantageous for improving the quality of the deposited film on the glass substrate G. Therefore, it is necessary to provide a greater number of strips 45 and strip clamps 50 in the susceptor 70 and the lower chamber 20, respectively, and connect them.

For example, as shown in FIG. 3, the number of the susceptors 70 is greater than the circumferential direction of the rear outer region 45a of the susceptor 70 as well as the circumferential direction of the rear center region of the susceptor 70. After being connected in a large portion, the strip clamp 50 may be connected thereto.

However, although it is narrow between the susceptor 70 and the lower chamber 20, a separate space (A, see FIG. 4) is further provided, and this space (A) is allowed because the worker is allowed to access the space (A). The strip 45a disposed at the rear outer region of the susceptor 70 may be coupled to the strip clamp 50 by the reference numeral.

However, in the case of the strips 45 located in the central region of the rear surface of the susceptor 70, a separate structure for coupling the strips 45 to the strip clamp 50 is required because no operator's access is allowed. It can be implemented in the following way.

In other words, since the susceptor 70 has a structure of elevating up and down, the strip 45 must be continuously connected to the strip clamp 50 even during the up and down movement of the susceptor 70. Thus, as shown, the strip 45 is provided in the form of an arch having a sufficient length, and is selected of a soft material so as not to break even in frequent movement.

In addition, since the inside of the lower chamber 20 is filled with an inert gas, a cleaning gas, etc., in addition to the process gas, the strip 45 and the strip clamp 50 are selected as materials having corrosion resistance thereto.

The strip clamp 50 of the present embodiment is coupled to the bottom wall in the lower chamber 20 and individually connected to the plurality of strips 45 extending from the susceptor 70 to connect the susceptor 70 to the lower chamber 20. ) To ground. Therefore, the strip clamp 50 including the strip 45 is formed of a metal material.

The strip clamp 50 is detachably coupled to the through hole 20b to be inserted into the through hole 20b formed in the bottom wall of the lower chamber 20.

Therefore, even in the case of the strips 45 located in the rear center region of the susceptor 70 can be easily coupled to the strip clamp 50. For reference, referring to FIG. 2, the coupling structure is not illustrated for the strips 45a positioned in the rear circumferential region of the susceptor 70. However, the structure of the strip clamp 150 (FIGS. 4 to 7), which will be the same as the coupling structure of the strips 45 located at the rear center region of the susceptor 70, will be described. There will be.

In this embodiment, the strip clamp 50 is coupled to the bottom wall of the lower chamber 20 at a position corresponding to the strip 45 so as to correspond to the plurality of strips 45 one by one. However, since the scope of the present invention is not limited thereto, two or more strips 45 may be coupled to one strip clamp 50 together.

Each of the plurality of strip clamps 50 is coupled to the through-hole 20b and coupled to the lower chamber 20 to electrically connect the lower chamber 20, and the clamp body toward the inside of the lower chamber 20. And a clamping portion 52 coupled to one end of the 51 to substantially engage the other free end of the strip 45.

At this time, the clamp body 51 has a shaft portion 51a which is substantially forcibly fitted into the through hole 20b, and a head portion formed at one end of the shaft portion 51a and exposed to the rear surface of the lower chamber 20 ( 51b). Thus, after holding the head portion 51b to allow the shaft portion 51a to be pulled out of the through hole 20b, the other end free end of the strip 45 is coupled to the clamping portion 52, and the shaft portion 51a penetrates again. The strip 45 and the strip clamp 50 can be easily connected by fitting the ball 20b.

For reference, in the present embodiment, the clamping portion 52 coupled to the free end of the other end of the strip 45 is not shown and described in detail. However, the clamping portion 52 may be a simple structure for simply coupling the strips 45 by a bolt coupling method or the like, or the strip clamp 150 to be described in the second embodiment to be described later with reference to FIGS. 4 to 7. May be applied.

Referring to the operation of the chemical vapor deposition apparatus for planar display having such a configuration as follows.

First, the susceptor 70 is mounted in the lower chamber 20. The plurality of strips 45 coupled to the back of the susceptor 70 then hang down to the bottom of the lower chamber 20. In this state, the plurality of strip clamps 50 are separated from the bottom of the lower chamber 20. Then, the other end of the strip 45 is coupled to the clamping portion 52 formed in the plurality of strip clamps 50, and then the plurality of strip clamps 50 are easily inserted into the through holes 20b at the corresponding positions. The susceptor 70 is grounded to the lower chamber 20. As such, when the assembly of the strip 45 and the strip clamp 50 is completed, the deposition process is performed.

That is, the glass substrate G to be deposited is transferred by the robot arm (not shown) while the susceptor 70 is lowered to the lower region of the lower chamber 20 by the elevating module 60. It is introduced through the 20a and disposed on the susceptor 70.

At this time, since the upper end of the lift pin 72 is protruded a predetermined height to the upper surface of the susceptor 70, the robot arm is taken out after placing the glass substrate on the lift pins (72). When the robot arm is taken out, the substrate entry portion 20a is closed, and the interior of the upper and lower chambers 10 and 20 is maintained in a vacuum atmosphere and filled with process gases (SiH4, NH3, etc.) required for deposition.

Next, in order to proceed with the deposition process, the elevating module 60 is operated to float the susceptor 70. Then, the lift pin 72 is lowered, and the glass substrate G is loaded while being in close contact with the upper surface of the susceptor 70. When the susceptor 70 rises by a predetermined distance, the operation of the elevating module 60 is stopped and the glass substrate G is located directly below the gas distribution plate 31. At this time, the susceptor 70 is heated to about 280 ° C to 380 ° C.

Then, power is applied through the electrode 30 insulated by the insulator 34. Subsequently, as the deposition material, which is a silicon-based compound ion, is ejected through the gas distribution plate 31 in which a large number of orifices are formed, the deposition is performed on the glass substrate G by reaching the glass substrate G.

At this time, in the present embodiment, the susceptor 70 is grounded to the lower chamber 20 at more points than in the prior art, including the rear center region of the susceptor 70 in a simpler and simpler manner than in the prior art. A sufficient grounding of 70) can be induced, thus improving the quality of the deposited film on the glass substrate (G).

On the other hand, Figure 4 is an enlarged view of the main portion of the chemical vapor deposition apparatus for a planar display according to a second embodiment of the present invention, Figure 5 is a perspective view of the strip clamp shown in Figure 4, Figure 6 is a sectional view of Figure 5, 7 is a cross-sectional view illustrating an operating state of FIG. 6.

If, unlike the first embodiment described above, the strip clamp 50 (see Fig. 2) is not provided on the bottom wall in the lower chamber 20, as shown in Figure 4, the strip clamp 150 is It may be provided on the bottom surface of the lower chamber 20 in the area between the lower chamber 20 and the outer periphery of the susceptor 70. This space A (refer to FIG. 4) is a space where the worker is allowed to access.

However, even if there is a space A to which the worker is allowed to access, since the space A is substantially very narrow, the task of coupling the strip 140 to the strip clamp 150 is not cumbersome or inconvenient. do. Therefore, when the worker puts his hand through this space (A) and wants to couple the strip 140 to the strip clamp 150, there is a structure that can easily and easily fix the strip 145 to the strip clamp 150 Required. This can be easily solved by the following structure. However, in the present embodiment, the strip 145 having a longer length than that of the strip 45 (see FIG. 2) of the first embodiment will be used.

As shown in FIGS. 4 to 7, the strip clamp 150 includes a fixed body 151, a movable body 153 accessible and spaced apart from the fixed body 151, and fixed and movable bodies 151 and 153. It is provided with a rotating shaft portion 155 coupled to, and a rotating operation portion 157 for rotating the rotating shaft portion 155.

The fixed body 151 is fixed to the bottom wall of the lower chamber 20 is coupled. To this end, a plurality of coupling grooves 152 are formed on the plate surface of the fixed body 151. The coupling groove 152 is utilized as a portion into which a coupling member (not shown) such as a screw and rivet is inserted.

The movable body 153 is coupled to the upper portion of the stationary body 151. It forms a separate structure from the fixed body 151, and is approached and spaced apart from the fixed body 151. When the movable body 153 approaches the fixed body 151 by the rotation of the rotary shaft 155, the strip 145 is chucked between the fixed body 151 and the movable body 153 to be fixed. do.

At this time, the strip 145 may be fixed anywhere between the fixed body 151 and the movable body 153. For example, the fixing body 151 and the movable body 153 in a state in which the grooves 145a (see FIG. 4) formed in the strip 145 are fitted to the rotation shaft portion 155 or the guide rods 159c to be described later, respectively. It may be fixed in between. Of course, the shape of the groove 145a may be formed long along the lengthwise direction of the strip 145, unlike the illustrated one.

The rotating shaft portion 155 serves to approach and space the movable body 153 with respect to the fixed body 151. For this operation, the rotary shaft portion 155 is integrally screwed to the fixed and movable bodies 151 and 153 in the central region of the fixed and movable bodies 151 and 153, respectively.

At this time, the direction of the screw thread 155a formed between the rotary shaft portion 155 and the fixed body 151 and the direction of the screw thread 155b formed between the rotary shaft portion 155 and the movable body 153 are opposite to each other. It is processed.

For example, if the direction of the screw thread 155a formed between the rotary shaft portion 155 and the fixed body 151 is in the right screw direction, the screw thread 155b formed between the rotary shaft portion 155 and the movable body 153 may be formed. Can be direction. Of course, the opposite is also possible.

Accordingly, when the rotation shaft 155 rotates in the forward direction (for example, clockwise direction), the movable body 153 may approach the fixed body 151 due to the structure of the threads 155a and 155b in opposite directions. When the rotary shaft 155 rotates in the reverse direction (for example, counterclockwise direction), the movable body 153 may be spaced apart from the fixed body 151. Of course, even if the rotation shaft 155 is slightly rotated due to the screw 155a and 155b structures, the movable body 153 may move a lot of distances with respect to the stationary body 151 to be quickly approached and spaced apart.

The rotary manipulation unit 157 is coupled to the rotary shaft unit 155 at the upper end of the rotary shaft unit 155. The rotary manipulator 157 may be directly coupled to the upper end of the rotary shaft 155, or may be coupled to the rotary shaft 155 through a separate member. In the figure, a separate member is shown to connect the rotating shaft portion 155 and the rotating operation portion 157.

The rotary operation unit 157 serves as a handle for rotating the rotary shaft unit 155 in the forward and reverse directions. In this case, there is an advantage that can easily rotate the rotating shaft portion 155 in the forward and reverse directions without a separate tool. Therefore, even if the free space A between the lower chamber 20 and the susceptor 70 is narrow, the strip 145 can be easily attached and detached to the strip clamp 150.

On the other hand, when the movable body 153 is shaken or skewed while the movable body 153 approaches and is spaced with respect to the fixed body 151, the strips 145 are not completely engaged because the fixed and movable bodies 151 and 153 do not completely engage with each other. It may not be fixed.

Thus, the fixing and movable bodies 151 and 153 in the strip clamp 150 of the present embodiment are further provided with a guide 159 for guiding the approach and separation of the movable body 153 to the fixed body 151.

The guide part 159 is formed on the fixing groove 159a recessed in the upper surface 151a of the fixing body 151 and on the lower surface 153a of the movable body 153 facing the upper surface 151a of the fixing body 151. A recessed movable groove portion 159b and guide rods 159c coupled to the fixed and movable groove portions 159a and 159b, respectively, are included. Due to this structure, when the operation as shown in Figure 6 to 7, the movable body 153 is able to stably approach and spaced apart from the fixed body 151 without being shaken or skewed.

Referring to the process of fixing the strip 145 to the strip clamp 150 by this configuration as follows.

First, as shown in FIG. 6, in a state where the movable body 153 is spaced apart from the fixed body 151, the strip 145 is disposed in a space between the fixed and movable bodies 151 and 153. At this time, as described above, each of the two grooves 145a formed in the strip 145 may be fitted to the guide rods 159c.

Next, the rotation manipulation unit 157 is turned in the forward direction while the rotation manipulation unit 157 is held. Then, the rotating shaft portion 155 coupled to the rotating operation portion 157 rotates in the same direction, and thus the movable body 153 approaches the fixed body 151 due to the structure of the threads 155a and 155b in opposite directions. Can be. While approaching, the strip 145 interposed in the space between the stationary and movable bodies 151 and 153 may be chucked to the stationary and movable bodies 151 and 153 and fixed at the position as shown in FIG. 7. This makes the fixing of the strip 145 easy to complete.

8 and 9 are perspective views showing modified embodiments of the strip clamp, respectively.

Referring to FIG. 7, the upper end of the rotary shaft unit 155 is coupled to the rotary shaft unit 155, and the upper end of the rotary shaft unit 157 passes through the rotary operating unit 157 to expose the outer side of the rotary operating unit 157 to the rotating rod ( 162 is further coupled.

Wrench rotating rod 162 has a hexagonal shape, but in the case of FIG. 8, a separate hexagon wrench (not shown) may be inserted into the wrench rotating rod 162 to rotate the rotating shaft part 155 in the forward and reverse directions.

9, a plurality of tool insertion grooves 164 are further formed on the plate surface of the rotation manipulation unit 157. In the case of FIG. 9, a separate tool (not shown) may be inserted into the tool insertion groove 164 to rotate the rotation shaft 155 in the forward and reverse directions.

Even in the case of Figures 8 and 9, there is an advantage that can be fixed to the strip 145 much easier and more convenient than the prior art.

In the above-described embodiments, the rotating operation unit coupled to the axis of the rotating shaft portion in the exposed end region of the rotating shaft portion has been described above, but the rotating operation portion is a tool which is directly formed on the rotating shaft portion to rotate the rotating shaft portion in the forward and reverse directions. It may be an insertion groove (not shown).

In addition, since the rotation operation portion serves as a handle for rotating the rotation shaft portion in the forward and reverse directions, the rotation operation portion may be the exposed end region itself of the rotation shaft portion exposed to the upper portion of the movable body.

Although the description is omitted in the first embodiment described above, the clamping portion 52 described in the first embodiment may be the strip clamp 150 described in the second embodiment.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

As described above, according to the present invention, the susceptor can be grounded to the chamber at more points than the conventional one, including the rear center area of the susceptor in a simple and convenient manner, thereby inducing sufficient grounding of the susceptor to the flat display. The quality of the deposited film can be improved.

Claims (11)

A susceptor provided in a chamber in which a deposition process for a flat panel display is performed and the flat panel display is loaded on an upper surface thereof; A plurality of strips coupled to the susceptor so that one end is fixed to the susceptor; And A plurality of strip clamps detachably coupled to a through hole formed in one wall of the chamber, and a plurality of strip clamps coupled to the other free ends of the plurality of strips to ground the susceptor to the chamber. Chemical vapor deposition apparatus for a flat panel display. The method of claim 1, And a plurality of strips along the circumferential direction of the rear outer circumferential region and the central region of the susceptor. The method of claim 2, And the strip clamp is coupled to the lower chamber bottom wall at a position corresponding to the strip so as to correspond to the plurality of strips one by one. The method of claim 3, Each of the plurality of strip clamps, A clamp body made of a metallic material coupled to the through hole and electrically connected to the lower chamber; And And a clamping portion coupled to one end of the clamp main body toward the inside of the lower chamber and having a free end coupled to the other free end of the strip. The method of claim 4, wherein The clamp body, A shaft portion forcibly fitted to the through hole; And And a head portion formed at one end of the shaft portion and exposed to the rear surface of the lower chamber. A susceptor provided in a chamber in which a deposition process for a flat panel display is performed and the flat panel display is loaded on an upper surface thereof; A plurality of strips coupled to the susceptor such that one end thereof is fixed to the susceptor in the circumferential direction of the rear outer circumferential region and the central region of the susceptor; And A plurality of free ends coupled to the other end of the susceptor to ground the susceptor to the chamber are provided on the bottom surface of the chamber in the area between the inner wall of the chamber and the outside of the susceptor to allow the worker access Chemical vapor deposition apparatus comprising a strip clamp. The method of claim 6, The strip clamp, A fixed body fixedly coupled to one side wall of the chamber; A movable body disposed on one side of the fixed body so as to be accessible and spaced from the fixed body, and chucking and fixing a strip extending from the susceptor together with the fixed body when the fixed body is approached; A rotating shaft portion coupled to the fixed and movable bodies, respectively, for approaching and spaced apart from the fixed body by the rotation in the forward and reverse directions; And And a rotation manipulation portion provided in an exposed end region of the rotation shaft portion to rotate the rotation shaft portion in a forward and backward direction. The method of claim 7, wherein The rotating shaft portion is screwed to the fixed and movable body in the central region of the fixed and movable body, And a direction of the screw thread formed between the rotary shaft portion and the fixed body and a direction of the screw thread formed between the rotary shaft portion and the movable body are processed in opposite directions. The method of claim 8, The fixed and movable body, the chemical vapor deposition apparatus characterized in that the guide portion for guiding the approach and the separation of the movable body to the fixed body is further provided. The method of claim 9, The guide portion, A fixed groove formed in one side of the fixed body; A movable groove recessed in one side of the movable body facing one side of the fixed body in which the fixing groove is formed; And Chemical vapor deposition apparatus, characterized in that both ends include a guide rod coupled to each of the fixed and movable groove. The method according to claim 1 or 6, The planar display is a chemical vapor deposition apparatus for a flat panel display, characterized in that the large glass substrate for liquid crystal display (LCD).

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