KR20080089982A - 실란 커플링제, 이를 포함하는 동박 및 그 표면처리방법 - Google Patents
실란 커플링제, 이를 포함하는 동박 및 그 표면처리방법 Download PDFInfo
- Publication number
- KR20080089982A KR20080089982A KR1020070032869A KR20070032869A KR20080089982A KR 20080089982 A KR20080089982 A KR 20080089982A KR 1020070032869 A KR1020070032869 A KR 1020070032869A KR 20070032869 A KR20070032869 A KR 20070032869A KR 20080089982 A KR20080089982 A KR 20080089982A
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- silane coupling
- coupling agent
- formula
- integer
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 90
- 239000011889 copper foil Substances 0.000 title claims abstract description 85
- 239000006087 Silane Coupling Agent Substances 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 20
- 230000004888 barrier function Effects 0.000 claims abstract description 18
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 150000001923 cyclic compounds Chemical class 0.000 claims abstract description 5
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 5
- 150000002367 halogens Chemical class 0.000 claims abstract description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 5
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 5
- 238000004532 chromating Methods 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims description 15
- 239000007864 aqueous solution Substances 0.000 claims description 14
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 abstract description 12
- 239000011810 insulating material Substances 0.000 abstract 3
- 125000000143 2-carboxyethyl group Chemical group [H]OC(=O)C([H])([H])C([H])([H])* 0.000 abstract 1
- 238000009413 insulation Methods 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 9
- 125000000524 functional group Chemical group 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000003792 electrolyte Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- -1 spraying Substances 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- SYYDEXILBJXXIA-UHFFFAOYSA-N trimethoxy(pent-4-enyl)silane Chemical compound CO[Si](OC)(OC)CCCC=C SYYDEXILBJXXIA-UHFFFAOYSA-N 0.000 description 2
- SHCOHQFMRILWFT-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)pent-4-enyl]silane Chemical compound CO[Si](OC)(OC)CCC(C=C)OCC1CO1 SHCOHQFMRILWFT-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- IRRIJWFQIJUELE-UHFFFAOYSA-N 1-ethoxy-3-trimethoxysilylpropan-1-amine Chemical compound NC(CC[Si](OC)(OC)OC)OCC.NC(CC[Si](OC)(OC)OC)OCC IRRIJWFQIJUELE-UHFFFAOYSA-N 0.000 description 1
- HBBBMMMSWKEHKC-UHFFFAOYSA-N 3-ethoxypropyl(trimethoxy)silane Chemical compound CCOCCC[Si](OC)(OC)OC HBBBMMMSWKEHKC-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- QATKVEHFRZAWJF-UHFFFAOYSA-N NC(CC[Si](OC)(OC)OC)OCC Chemical compound NC(CC[Si](OC)(OC)OC)OCC QATKVEHFRZAWJF-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
구분 | 접착강도 (kgf/㎝) | HCl 처리 후 박리강도 저하율 (%) |
실시예 1 | 1.45 | 3 |
실시예 2 | 1.35 | 3 |
실시예 3 | 1.39 | 5 |
비교예 1 | 1.15 | 7 |
비교예 2 | 1.27 | 9 |
비교예 3 | 1.21 | 9 |
Claims (5)
- 모듈이 형성된 동박, 상기 모듈이 형성된 동박 상에 위치하는 베리어층 및 상기 베리어층이 형성된 동박 상에 위치하는 실란 커플링제층을 포함하여 이루어지는 동박에 있어서,상기 실란 커플링제층은 제1항에 따르는 실란 커플링제가 적용된 것을 특징으로 하는 동박.
- (S1) 동박을 거침도금처리하는 단계;(S2) 상기 거침도금처리된 동박에 베리어 표면처리하는 단계;(S3) 상기 베리어 표면처리된 동박에 크로메이팅 방청처리하는 단계; 및(S4) 상기 크리메이팅 방청처리한 동박에 실란 커플링제를 도포하는 단계;를 포함하여 진행되는 것을 특징으로 하는 동박의 표면처리방법.
- 제3항에 있어서,상기 (S4)의 실란 커플링제의 도포 단계는, 0.05 내지 5 중량%의 농도의 수 용액인 실란 커플링제를 이용하여 진행되는 것을 특징으로 하는 동박의 표면처리방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070032869A KR100892189B1 (ko) | 2007-04-03 | 2007-04-03 | 실란 커플링제, 이를 포함하는 동박 및 그 표면처리방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070032869A KR100892189B1 (ko) | 2007-04-03 | 2007-04-03 | 실란 커플링제, 이를 포함하는 동박 및 그 표면처리방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080089982A true KR20080089982A (ko) | 2008-10-08 |
KR100892189B1 KR100892189B1 (ko) | 2009-04-07 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020070032869A KR100892189B1 (ko) | 2007-04-03 | 2007-04-03 | 실란 커플링제, 이를 포함하는 동박 및 그 표면처리방법 |
Country Status (1)
Country | Link |
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KR (1) | KR100892189B1 (ko) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4202694C1 (en) * | 1992-01-31 | 1993-07-01 | Degussa Ag, 6000 Frankfurt, De | Silane surface-modified pyrogenic alumina, for use in toner - to increase charge stability, produced by spraying with silane mixt. free from solvent |
JP2000131871A (ja) * | 1998-10-26 | 2000-05-12 | Canon Inc | トナー |
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- 2007-04-03 KR KR1020070032869A patent/KR100892189B1/ko active IP Right Grant
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Publication number | Publication date |
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KR100892189B1 (ko) | 2009-04-07 |
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