KR20080013586A - Photosensitive composition of positive type and manufacturing method of plasma display panel using it - Google Patents

Abstract

A positive photosensitive composition, and a method for preparing a plasma display panel by using the composition are provided to reduce the step of manufacturing process for lowering a manufacturing cost and to improve the stability of a partition wall. A positive photosensitive composition comprises 50-90 wt% of diazonaphthoquinone and 10-50 wt% of a novolac resin. A method for preparing a plasma display panel comprises the steps of (S410) forming a partition wall layer on an underplate by using an underlayer material comprising the composition; (S420) patterning the partition wall layer by using a photomask; (S430) developing the patterned partition wall layer; and (S440) sintering the developed partition wall layer to form a partition wall.

Description

Positive type photosensitive composition and manufacturing method of plasma display panel using same {PHOTOSENSITIVE COMPOSITION OF POSITIVE TYPE AND MANUFACTURING METHOD OF PLASMA DISPLAY PANEL USING IT}

1 is a perspective view illustrating an example of a general plasma display panel.

2 is a schematic block diagram showing a step of forming a partition wall using a general photosensitive method.

3 is a schematic block diagram illustrating a step of forming a partition wall using a general DFR.

4 is a schematic block diagram illustrating a method of manufacturing a plasma display panel according to an exemplary embodiment of the present invention.

5 is a schematic block diagram illustrating a method of manufacturing a plasma display panel according to an embodiment of the present invention.

6A through 6E are schematic cross-sectional views illustrating steps of forming a partition wall according to an exemplary embodiment of the present invention.

7A to 7D are schematic cross-sectional views illustrating steps of forming a partition wall according to an exemplary embodiment of the present invention.

<Brief description of the main parts of the drawing>

110, 210: Bottom 111: Rear glass

115, 130, 230: dielectric layers 113, 120, 220: address electrode

140, 240: partition wall layer 141, 241: fired partition wall layer

142, 242: bulkhead before firing 150, 250: photoresist

112a, 160, 260: bulkhead

The present invention relates to a positive photosensitive partition wall material and a method of manufacturing a plasma display panel using the same.

Plasma Display Panel (PDP) is a type of light emitting device that displays an image by using a discharge phenomenon, and there is no need to mount an active device for each cell, so the manufacturing process is simple and the screen is easily enlarged. As a result, the response speed is fast becoming a display element of an image display device having a large screen.

As shown in FIG. 1, the plasma display panel has a structure in which the upper panel 10 and the lower panel 20 face each other and overlap each other. The upper panel 10 has a pair of sustain electrodes arranged on an inner surface of the transparent substrate 11, and usually the sustain electrodes comprise a transparent electrode 12 and a bus electrode 13, respectively.

The sustain electrode is covered with a dielectric layer 14 for AC driving, and a protective film 15 is formed on the surface of the dielectric layer 14.

On the other hand, the inner surface of the lower panel 20, the address electrode 22 is arranged on the lower plate 21, the dielectric layer 23 is formed thereon, and the dielectric layer 23 is formed on the dielectric layer 23 for partitioning the address electrode 22 A stripe or well type partition wall 24 is formed, and red, blue, and green phosphor layers 26 for color display are applied to the cells partitioned by the partition wall 24 to form subpixels.

The discharge cell 25 is divided into subpixels by the partition wall 24, and discharge gas is enclosed in the discharge cell 25, and one pixel includes the three subpixels.

As the method for forming the partition wall 24, a printing method, a sand blasting method, an etching method, and a photolithography method using a photosensitive material are mainly applied.

The printing method is a method of forming a partition of a desired degree by printing a glass paste having a high thixotropy several times, sandblasting method after applying a dry film resist (DFR) on the partition material before firing, After exposure and development using a photo mask, the patterned DFR is used as a mask to form a barrier rib pattern by sand blasting and then fire.

In addition, the etching method is similar to the sandblasting process, but instead of the sandblasting, an etching solution is used to form partition walls.

However, two methods are currently applied to the etching method, and there are two cases of DFR placed on the partition material, that is, a film form and a liquid photoresist (PR). Therefore, there is a difference in the method according to this material.

2 shows a process of the photosensitive method currently applied. After forming the electrode layer on the lower glass, a dielectric is coated and the partition material is coated on the substrate through printing, sheeting, or die coating (S10) and dried.

The bulkhead material used here is not a material used in the conventional sanding or printing method, but is a paste or sheet made of a paste containing a powder suitable for photosensitivity and a photocurable vehicle that can be cured by being exposed to UV light. It is a material of form.

This photosensitive partition material is used on a substrate in the form of a paste, or the sheet is printed or coated to dry. Next, after the UV exposure (S20) as a photomask, the non-exposed part is developed using a developing solution such as aqueous alkali solution or H ₂ O (S30), and after obtaining a desired partition wall pattern, it is fired (S40) to form a final partition wall. Form.

3 is a method of forming a barrier rib for etching using a DFR. After coating the partition wall material (S10) with a powder that can be easily etched in an acid in the general partition wall material (S10), it is fired and coated with an organic DFR (S11), followed by UV exposure (S20), and this development ( S30) to obtain a primary pattern in the DFR, and then selectively remove the unexposed part. The unexposed portion is patterned into a barrier rib shape using an acid solution, and the pattern is used as a resist to etch (S50) an acid such as nitric acid to finally form a barrier rib.

However, the negative type photosensitive barrier material used in the conventional barrier rib formation method as described above cannot obtain a high-patterned patterned partition wall, and it is difficult to control the upper and lower widths of the partition wall even in the thick film process, thereby expanding the discharge space. There was a problem that can not be done.

The present invention has been made to solve the above problems, and to provide a positive photosensitive partition wall composition that can form a high-definition partition wall and a method of manufacturing a plasma display panel using the same.

In order to achieve the object of the present invention as described above, the positive photosensitive composition according to the embodiment of the present invention is 50 to 90% by weight of diazonaphthoquinone (DNQ: diazonaphthoquinone) and 10 to 50% by weight of novolac resin ( NR: Novolak Resist).

Here, the positive photosensitive composition has a pattern resolution of 1 μm or less by G-ray exposure such as mercury, and has a pattern resolution of 0.5 nm or less by 200 μm or less by I-ray exposure.

In addition, the positive photosensitive composition may be dissolved in a 2.38% tetramethylammonium hydroxide (TMAH) alkaline developer together with an NR resin to obtain a positive fine pattern.

A method of manufacturing a plasma display panel according to an embodiment of the present invention includes the steps of forming a partition layer on a lower plate using a partition material including a positive photosensitive composition, patterning the partition layer using a photomask; Developing the patterned partition wall layer, and baking the developed partition wall layer to form a partition wall.

In addition, the method of manufacturing a plasma display panel according to an embodiment of the present invention comprises the steps of forming a partition layer on a lower plate using a partition material comprising a positive photosensitive composition, patterning the partition layer using a laser, the Developing the patterned partition wall layer, and baking the developed partition wall layer to form a partition wall.

The patterning may be performed using KrF having a wavelength of 248 nm or an ArF high power excimer laser having a wavelength of 193 nm, and the barrier ribs may be formed to have different heights in the horizontal direction and the vertical direction by adjusting the wavelength of the laser light. do.

Here, the partition material is a positive photosensitive partition wall including the 50 to 90% by weight of diazonaphthoquinone (DNQ: diazonaphthoquinone), 10 to 50% by weight of novolac resin, conductive powder, inorganic binder and photosensitive vehicle It is a paste, the photosensitive vehicle comprising an organic binder, a photoacid generator, a solvent and an additive, and is applied on the lower dielectric layer in the form of a slurry.

In addition, the barrier material has a pattern resolution of 1 μm or less by G-ray exposure such as mercury, and a 200 nm-class pattern resolution of 0.5 μm or less by I-ray exposure, and NR resin in a 2.38% TMAH (tetramethylammonium hydroxide) alkaline developer. It melt | dissolves and the positive fine pattern is obtained.

Hereinafter, the configuration and operation of the embodiments of the present invention with reference to the accompanying drawings, the configuration and operation of the invention shown in the drawings and described by it will be described as at least one embodiment, which By the technical spirit of the present invention described above and its core configuration and operation is not limited.

4 is a schematic block diagram illustrating a method of manufacturing a plasma display panel according to an exemplary embodiment of the present invention.

First, a barrier rib layer is formed by coating or coating a lower plate using a barrier material including a positive photosensitive composition according to the present invention (S410). Next, through the UV (ultraviolet) exposure, the barrier layer is patterned as a photomask (S420), and then the patterned barrier layer is developed (S430), and then the developed barrier layer is fired to form a barrier rib. (S440).

A more detailed description will be made later, but the positive photosensitive composition comprises 50 to 90% by weight of diazonaphthoquinone (DNQ) and 10 to 50% by weight of novolac resin (NR: Novolak Resist). And mercury and the like have a pattern resolution of 1 m or less under G-ray exposure, and I-ray exposure have a 0.5 nm or less 200 nm pattern resolution. In addition, it is dissolved in a 2.38% tetramethylammonium hydroxide (TMAH) alkaline developer together with an NR resin to obtain a positive fine pattern.

The partition material including the photosensitive composition has a positive type including 50 to 90% by weight of diazonaphthoquinone (DNQ: diazonaphthoquinone), 10 to 50% by weight of a novolak resin, conductive powder, an inorganic binder, and a photosensitive vehicle. It is a photosensitive partition wall paste. Although the composition of DNQ / NR is used as a kind of photoresist material, it is important in many aspects in the micromachining process, so the chemical structure and molecular weight size / distribution of NR resin are controlled, the chemical structure of DNQ, G-ray and I-ray. Research on the improvement of the actual fine pattern by adjusting the photoreactivity correlation at the wavelength is continuously pursued.

Here, the photosensitive vehicle includes an organic binder, a photoacid generator, a solvent, and an additive. Moreover, it is preferable that baking temperature is 500-600 degreeC, More preferably, it is preferable that it is 540-580 degreeC.

5 is a schematic block diagram illustrating a method of manufacturing a plasma display panel according to an embodiment of the present invention.

First, a barrier rib layer is formed by coating or coating a lower plate using a barrier material including a positive photosensitive composition according to the present invention (S510). Next, the barrier rib layer is directly patterned through laser imaging (S520), and then the barrier rib layer patterned by the laser imaging is developed (S530). Next, the developed barrier rib layer is fired to form a barrier rib ( S540).

The laser used in the step S520 uses a KrF of 248 nm or an ArF high-power excimer laser of 193 nm, and adjusts the wavelength of the laser light so that the heights of the horizontal and vertical bulkheads are different from each other. Can be formed. Moreover, it is preferable that baking temperature is 500-600 degreeC, More preferably, it is preferable that it is 540-580 degreeC.

6A to 6E are schematic cross-sectional views illustrating steps of forming the partition wall described in FIG. 4.

First, as shown in FIG. 6A, an address electrode 120 is formed on a lower plate 110, and a dielectric layer 130 covering the address electrode 120 is formed, and then the present invention is formed on the dielectric layer 130. The partition layer 140 is coated using a partition material including the positive photosensitive composition.

Next, as shown in FIG. 6B, the barrier rib layer 140 is fired, and a liquid photoresist (PR) 150 having excellent sensitivity is applied onto the fired barrier rib layer 141.

Next, as illustrated in FIG. 6C, the photoresist 150 is exposed to ultraviolet rays (UV) using a photo mask, and as illustrated in FIG. 6D, portions exposed to ultraviolet rays according to the photomask pattern cause photolysis reactions to decompose the photoresist. Then, as shown in Figure 6e, when developed in pure water (H ₂ O) or alkaline aqueous solution is a light-dispersed portion is developed, and the portion not exposed to ultraviolet rays to form the partition wall (160).

7A to 7D are schematic cross-sectional views illustrating the step of forming the partition described with reference to FIG. 5. The step of forming the partition by mixing the advantages of the photosensitive method and the advantages of laser imaging is shown.

First, as shown in FIG. 7A, an address electrode 220 is formed on the lower substrate 210, a dielectric layer 230 covering the address electrode 220 is formed, and then a laser is applied on the dielectric layer 230. The barrier layer 240 is coated and coated using a barrier material including a positive photosensitive composition that can be patterned.

As described above, the photosensitive partition wall material includes a photoinitiator having a photosensitive property and a vehicle containing a photomonomer, and a material causing a reaction to laser light.

Thereafter, as shown in FIG. 7B, imaging is performed according to the pattern of the partition wall to be formed on the partition layer 240 using a laser light source without firing the partition layer 240.

The partition layer 240 on which the imaging is performed is formed in a pattern of the partition wall 242 as illustrated in FIG. 7C.

Thereafter, when the barrier rib 242 having the pattern is fired, the barrier rib 160 is formed as shown in FIG. 7D.

As shown in FIGS. 7a to 7d, when the partition wall is obtained by laser imaging using a partition material including a highly sensitive positive photosensitive composition without using a photomask, process shortening, material cost reduction, and process cost reduction may be achieved. High-definition bulkheads can be obtained.

In the above-described step, when the partition wall is formed by using a laser light source, a horizontal partition wall and a vertical direction are controlled by using a KrF having a wavelength of 248 nm or an ArF high output excimer laser having a wavelength of 193 nm and adjusting the wavelength of the laser light. Different heights of the bulkheads may be formed.

The above embodiment is an example for explaining the technical idea of the present invention in detail, and the present invention is not limited to the above embodiment, various modifications are possible, and various embodiments of the technical idea are all protected by the present invention. It belongs to the scope.

According to the positive photosensitive composition and the method of manufacturing the plasma display panel using the same, the partition wall can be manufactured by reducing the number of manufacturing steps, thereby reducing the manufacturing cost.

Furthermore, since a high-definition partition can be formed by a simple process, there is an effect of increasing the stability of the partition.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit of the present invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims.

Claims (14)

50 to 90% by weight of diazonaphthoquinone (DNQ) A positive photosensitive composition comprising 10 to 50% by weight of a novolak resin (NR: Novolak Resist). The method of claim 1, wherein the positive photosensitive composition, Positive type photosensitive composition characterized by having a pattern resolution of 1 micrometer or less by G-ray exposure, such as mercury. The method of claim 1, wherein the positive photosensitive partition wall composition, A positive photosensitive composition, characterized by I-ray exposure, having a pattern resolution of 0.5 nm or less and 200 nm class. The method of claim 1, wherein the positive photosensitive composition, A positive photosensitive composition, wherein a positive fine pattern is obtained by dissolving in a 2.38% TMAH (tetramethylammonium hydroxide) alkaline developer in the same manner as an NR resin. Forming a barrier layer on the bottom plate using a barrier material comprising a positive photosensitive composition; Patterning the barrier rib layer as a photomask; Developing the patterned partition wall layer; And Firing the developed barrier rib layer to form a barrier rib. Forming a partition layer on the lower plate using a partition material including a positive photosensitive composition; Patterning the barrier layer with a laser; Developing the patterned partition wall layer; And Firing the developed barrier rib layer to form a barrier rib. The method of claim 6, wherein the patterning step, A method of manufacturing a plasma display panel using KrF having a wavelength of 248 nm or an ArF high power excimer laser having a wavelength of 193 nm. The method of claim 6, wherein the partition wall, A method of manufacturing a plasma display panel characterized in that the height of the horizontal barrier ribs and the vertical barrier ribs are formed differently by adjusting the wavelength of the laser light. 7. The barrier material of claim 5 or 6 wherein the partition material is It is a positive type photosensitive partition paste containing 50-90 weight% of diazonaphthoquinone (DNQ: diazonaphthoquinone), 10-50 weight% of novolak resin, an electroconductive powder, an inorganic binder, and a photosensitive vehicle, It is characterized by the above-mentioned. Method of manufacturing a plasma display panel. The method of claim 5 or 6, wherein the photosensitive vehicle, A method of manufacturing a plasma display panel comprising an organic binder, a photoacid generator, a solvent, and an additive. The barrier rib material of claim 5 or 6, The method of manufacturing a plasma display panel, characterized in that applied to the dielectric layer of the lower plate in the form of a slurry.  The method of claim 5 or 6, wherein the partition material, A method of manufacturing a plasma display panel, characterized by having a pattern resolution of 1 µm or less by G-ray exposure of mercury or the like.  The method of claim 5 or 6, wherein the partition material, A plasma display panel manufacturing method characterized by having a pattern resolution of 0.5 nm or less and 200 nm class by I-ray exposure. The method of claim 1, wherein the partition material, A method of manufacturing a plasma display panel, characterized by dissolving in a 2.38% TMAH (tetramethylammonium hydroxide) alkaline developer together with an NR resin to obtain a positive fine pattern.

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