KR20070115640A - Exposure device and exposure method - Google Patents

Abstract

An exposing apparatus and an exposure method are provided to reduce a tact time and to precisely expose a mask pattern on a substrate by using a first substrate stage, a second substrate stage, and a vibration absorber. A mask stage(10) maintains a mask. A main bed(19) is located on a lower portion of the mask stage. A first sub-bed(21) and a second sub-bed(22) are arranged on a side of the main bed. A first substrate stage(11) is movable between the main bed and the first sub-bed. A second substrate stage(12) is movable between the main bed and the second sub-bed. An irradiating apparatus irradiates light for use in a pattern exposure through the mask to a substrate supported on the first and the second substrate stages located on the main bed. A vibration absorber prevents vibration generated in the first and the second sub-beds from being transmitted to the main bed.

Description

Exposure apparatus and exposure method {EXPOSURE DEVICE AND EXPOSURE METHOD}

FIG. 1: is a top view which shows roughly the whole structure of the exposure apparatus which is 1st Embodiment of this invention.

2 is an essential part front view illustrating a state in which the first substrate stage is movable from the first standby position to the exposure position.

3 is an essential part front view illustrating a state in which the first substrate stage is positioned at the exposure position and the second substrate stage is positioned at the second standby position.

It is a principal part enlarged front view which shows the modification of the dustproof mechanism of the exposure apparatus of 1st Embodiment.

Fig. 5 is a plan view schematically showing the overall configuration of an exposure apparatus which is a second embodiment of the present invention.

6 is a front view of an essential part showing a state in which the first substrate stage is movable from the first standby position to the exposure position.

FIG. 7: is a principal part front view which shows the state in which the 1st board | substrate stage is located in an exposure position, and the 2nd board | substrate stage is located in a 2nd standby position.

8 is a plan view schematically showing the entire configuration of an exposure apparatus as a third embodiment of the present invention.

9 is a front view of an essential part of the exposure apparatus of FIG. 8.

FIG. 10 is a plan view schematically showing the overall configuration of an exposure apparatus as a fourth embodiment of the present invention. FIG.

FIG. 11 is a front view of an essential part of the exposure apparatus of FIG. 10.

12 is a side view of the first and second substrate loaders.

It is a top view which shows roughly the whole structure of the exposure apparatus which is 5th Embodiment of this invention.

FIG. 14 is a front view of the exposure apparatus of FIG. 13.

Explanation of the sign

10 mask stage

11 first substrate stage

12 second substrate stage

13 counting device

18 Dustproof Material (Dustproof Mechanism)

19 main bed

21 first subbed

22 2nd subbed

50, 51 Dustproof Mechanism

52 first bed member

53 second bed member

54, 55, 70 actuator

92 pins

46 Air Spring (Vibration Isolation)

47 Electromagnet (Lock Mechanism)

95, 59 vibration detector

96, 56

93, 94, 57, 58 Active Vibration Control Unit

90 vibration damper

M mask

PE exposure device

W board

EP exposure position

WP1 first standby position

WP2 second standby position

[Patent Document 1] Japanese Patent Application Laid-Open No. 63-87725

[Patent Document 2] Japanese Unexamined Patent Publication No. 2005-183876

TECHNICAL FIELD The present invention relates to an exposure apparatus and an exposure method, and more particularly, to an exposure apparatus and an exposure method used when manufacturing a large flat panel display such as a semiconductor, a liquid crystal display panel or a plasma display.

As a conventional exposure apparatus, the apparatus which irradiates light (electron beam) for pattern exposure through a mask in the state which approached the mask (reticle) and the board | substrate (wafer), and by this, the apparatus which exposes and transfers a mask pattern to a board | substrate is known (example See, for example, patent documents 1 and 2).

The exposure apparatus described in Patent Literature 1 includes two frames on which a mask is disposed, two substrate stages on which substrates are mounted corresponding to each of the two frames, and two alignment mechanisms respectively disposed on two substrate stages. And a stage moving mechanism that alternately moves to an exposure position and performs exposure transfer in a state where each frame and substrate stage are combined. Thereby, the stage movement mechanism implements alignment and exposure simultaneously in two substrate stages, and aims at shortening a tact time.

Moreover, the exposure apparatus described in patent document 2 arrange | positions a vibration control actuator and a vibration control mass to the slider of a biaxial stage, reduces the vibration of a stage, thereby shortens the settling time of a stage, and improves positioning accuracy. To promote

By the way, in the exposure apparatus described in Patent Document 1, by using two substrate stages, the transfer transfer of the substrate and the loading and unloading of the substrate to the substrate stage are simultaneously performed to shorten the tact time. It is not considered about the vibration which generate | occur | produces, and this vibration may affect exposure precision, and there existed room for further improvement.

Moreover, although the exposure apparatus of patent document 2 reduces the residual vibration in one board | substrate stage, and aims at shortening the stage settling time, it does not consider about the vibration which arises at the time of carrying in and out of a board | substrate, The use of two substrate stages is also not described.

This invention is made | formed in view of the above-mentioned subject, The objective is simultaneously carrying out the exposure transfer of a board | substrate, carrying in and taking out a board | substrate to a board | substrate stage, and shortening a tact time, It is to provide an exposure apparatus and an exposure method which can remove exposure of vibration to exposure accuracy and can perform exposure-transfer with high precision.

Means to solve the problem

The above object of the present invention is achieved by the following configuration. (1) a mask stage for holding a mask, a main bed positioned below the mask stage, a first subbed and a second subbed disposed on the side of the main bed, and a movement between the main bed and the first subbed Through the mask, light for pattern exposure is applied to the first substrate stage, the second substrate stage movable between the main bed and the second subbed, and the substrate held on the first and second substrate stages positioned on the main bed. And an anti-vibration mechanism for preventing the vibration generated in the first sub-bed and the second sub-bed from being transmitted to the main bed.

(2) The anti-vibration mechanisms are respectively formed so as to be able to fit in the wedge space formed between the main bed and the first and second sub-beds or the wedge spaces formed in the first and second sub-beds, respectively, having first and second inclined surfaces. An exposure apparatus according to (1), comprising a two-bed member and an actuator for driving the first and second bed members in the vertical direction.

(3) The exposure apparatus according to (1), wherein the vibration isolator includes an actuator for driving the main bed in an up and down direction, with each opposing surface between the main bed and the first and second sub-beds as an inclined surface.

(4) The exposure apparatus according to any one of (1) to (3), wherein the vibration isolator is disposed below the main bed, and has a dustproof material capable of supporting the main bed.

(5) a mask stage holding a mask, a main bed positioned below the mask stage, a first subbed and a second subbed disposed on the side of the main bed, and a movement between the main bed and the first subbed; A pattern exposure light is applied to the first substrate stage, the second substrate stage movable between the main bed and the second subbed, and the substrate held on the first and second substrate stages positioned on the main bed. An exposure method using an exposure apparatus including an irradiation apparatus for irradiating through and an anti-vibration mechanism for preventing the vibration generated in the first sub-bed and the second sub-bed from being transmitted to the main bed, comprising: a first substrate positioned on the main bed; The first exposure step of exposing and transferring the mask pattern of the mask to the substrate held on the stage, and on the second subbed during the first exposure step. A first import / export process of carrying in and carrying out a substrate with respect to a second substrate stage to be placed; a first moving process of moving the first substrate stage on a first subbed and the second substrate stage on a main bed, respectively; And a first driving step of driving the dustproof mechanism after the first moving step, a second exposure step of exposing and transferring a mask pattern of a mask to a substrate held on a second substrate stage positioned on the main bed, and a second exposure step. During the process, a second import / export process of importing and unloading a substrate with respect to the first substrate stage positioned on the first subbed, the first substrate stage on the main bed, and the second substrate stage on the second subbed And a second driving step for driving the dustproof mechanism after the second moving step, and the first driving step is performed by the second carry-out step in the second exposure step. The vibration generated in the first sub-bed is prevented from being transmitted to the main bed, and the second driving process prevents the vibration generated in the second sub-bed from being transmitted to the main bed by the first import / export process during the first exposure process. An exposure method characterized by the above-mentioned.

Implement the invention  Best form for

EMBODIMENT OF THE INVENTION Hereinafter, each embodiment of the exposure apparatus and exposure method which concern on this invention is described in detail based on drawing.

(First Embodiment) Fig. 1 is a plan view schematically showing the overall configuration of an exposure apparatus which is a first embodiment of the present invention, and Fig. 2 is an essential part showing a state in which a first substrate stage can be moved from a first standby position to an exposure position. Front view, FIG. 3 is a principal part front view which shows the state in which the 1st board | substrate stage is located in an exposure position, and the 2nd board | substrate stage is in a 2nd standby position.

As shown to FIG. 1 and FIG. 2, the exposure apparatus PE of 1st Embodiment is the mask stage 10, the 1st board | substrate stage 11, the 2nd board | substrate stage 12, the irradiation apparatus 13, The 1st board | substrate loader 14, the 2nd board | substrate loader 15, and the mask loader 16 are provided, and are mounted on the base 17, respectively. Moreover, on the base 17, it is arrange | positioned facing each other with respect to the main bed 19 in the side of this main bed 19 and the main bed 19 mounted by the anti-vibration material 18, such as anti-vibration rubber | gum, and level First and second sub-beds 21 and 22 are mounted via the block 20. The first substrate stage 11 moves between the main bed 19 and the first subbed 21, and the second substrate stage 12 moves between the main bed 19 and the second subbed 22, respectively. .

The mask stage 10 is supported by the some support pillar 23 provided in the main bed 19, and is arrange | positioned above the main bed 19. As shown in FIG. The plurality of support pillars 23 include the main bed 19 so that the first and second substrate stages 11 and 12 can move in the Y direction (left and right directions in FIG. 1) to advance downward of the mask stage 10. Space is formed above.

The mask stage 10 has a rectangular opening 25a in the center, and has a mask holding part 25 that is supported to be adjustable in the X, Y, and θ directions with respect to the mask stage 10, and should be exposed. The mask M which has a pattern to do is hold | maintained in the mask holding part 25 so that it may face this opening 25a. Moreover, the mask stage 10 detects the mask alignment camera (not shown) which detects the position of the mask M with respect to the mask holding part 25, and detects the gap between the mask M and the board | substrate W. FIG. A gap sensor (not shown) is provided.

As shown in FIG. 2, the 1st and 2nd board | substrate stage 11, 12 has the board | substrate holding part 31a, 31b which hold | maintains the board | substrate W as an to-be-exposed material, respectively, on an upper surface. Moreover, below the 1st and 2nd board | substrate stage 11, 12, the Y-axis table 33, the Y-axis feed mechanism 34, the X-axis table 35, the X-axis feed mechanism 36, and Z -The substrate stage movement mechanisms 32 and 32 provided with the tilt adjustment mechanism 37 are provided, respectively.

The Y-axis feed mechanism 34 is provided with the linear guide 38 and the feed drive mechanism 39, and the slider 40 attached to the back surface of the Y-axis table 33 has a rolling element (not shown). Linear with a stator 42 and a mover 43, while being installed over two guide rails 41 extending through the main bed 19 and the first and second side beds 21, 22 through The Y-axis table 33 is driven along the guide rail 41 by a motor.

Moreover, the X-axis feed mechanism 36 also has the same structure as the Y-axis feed mechanism 34, and the Z-tilt adjustment mechanism 37 is comprised by the movable wedge mechanism which combines the wedge-shaped moving body and a feed drive mechanism. do. The feed drive mechanism may be a linear motor having a stator and a mover, or a combination of a motor and a ball screw device.

Thereby, each board | substrate stage movement mechanism 32, 32 transfers and drives the 1st and 2nd board | substrate stage 11, 12 to an X direction and a Y direction, and between the mask M and the board | substrate W To finely adjust the gap, the first and second substrate stages 11 and 12 are finely moved and tilted in the Z axis direction.

Moreover, the bar mirrors 61 and 62 are attached to the 1st and 2nd board | substrate stage 11 and 12 in the X direction side part and the Y direction side part of each board | substrate holding part 31a, 31b, respectively. In addition, three laser interferometers 63, 64, 65 are provided at both side ends of the first subbed 21 and the second subbed 22 in the Y-axis direction and on one side of the main bed 19 in the X-axis direction. Is installed. Thereby, the laser beam is irradiated to the bar mirrors 61 and 62 from the laser interferometers 63, 64 and 65, receives the laser beam reflected by the bar mirror 62, and the laser beam and the bar mirrors 61 and 62. ), The interference of the laser light reflected by () is measured to detect the positions of the first and second stages (11, 12).

As shown in FIG. 2, the illuminating device 13 is arrange | positioned above the opening 25a of the mask holding part 25, and is a light source for ultraviolet irradiation, for example, a high pressure mercury lamp, a concave mirror, an optical integrator, And a planar mirror, a spherical mirror, a shutter for exposure control, and the like. The lighting device 13 includes a substrate held in the exposure positions EP, that is, the substrate holding portions 31a and 31b of the first and second substrate stages 11 and 12 moved on the main bed 19 ( W) is irradiated with the light for pattern exposure through the mask M. FIG. Thereby, the mask pattern P of the mask M is exposed and transferred to the board | substrate W. As shown in FIG.

In addition, the 1st board | substrate loader 14 and the 2nd board | substrate loader 15 are the board | substrate cassette which is not shown in figure, and the 1st board | substrate located on the 1st subbed 21 which is 1st standby position WP1. Loading and unloading of the substrate W is performed between the stage 11 and the second substrate stage 12 positioned on the second subbed 22, which is the second standby position WP2, and the mask loader ( 16 carries in and out the mask M between the mask cassette and mask stage 10 which are not shown in figure.

In addition, between the main bed 19 and the first and second sub-beds 21, 22, vibrations generated in the first sub-bed 21 and the second sub-bed 22 are transmitted to the main bed 19. The dustproof mechanisms 50 and 51 which prevent a thing are arrange | positioned.

As shown in FIG. 2, the vibration isolator 50, 51 is disposed between the Y-direction end surface 19a of the main bed 19 and the Y-direction end surface 21a of the first sub-bed 21 facing the same. Disposed in a wedge space formed between the Y-direction other end surface 19b of the main bed 19 and the Y-direction end surface 22a of the second sub-bed 22 opposite thereto, and in the Y-direction amount so as to correspond to this wedge space. First and second bed members 52, 53 whose end faces 52a, 52b, 53a, 53b form an inclined surface, and piston rods 54a, which are mounted below the first and second bed members 52, 53, 55a) and actuators 54, 55 made of hydraulic or pneumatic cylinders for driving the first and second bed members 52, 53 in the vertical direction.

The first and second bed members 52, 53 have the same height as the main bed 19 and the first and second subbeds 21, 22, and the first and second bed members 52, 53. ) In the lowered position, the Y-direction both end surfaces 52a, 52b, 53a, 53b of these bed members 52, 53 are the main bed 19 and the first and second sub-beds 21, 22. Are in contact with the Y-direction end faces 19a, 21a, 19b, and 22a, respectively, and these upper surfaces become approximately the same height as the main bed 19 and the first and second sub-beds 21 and 22, respectively. Moreover, when the 1st and 2nd bed members 52 and 53 are in the raised position, the Y-direction both end surfaces 52a, 52b, 53a, 53b of the 1st and 2nd bed members 52, 53, and main A predetermined gap is formed between the bed 19 and the Y-direction end surfaces 19a, 21a, 19b, 22a of the first and second sub-beds 21, 22. The actuators 54 and 55 are driven while detecting the positions of the first and second bed members 52 and 53 by a sensor (not shown).

In addition, the guide rail 41 extending over the main bed 19 and the first and second beds 21 and 22 is, respectively, the main bed 19, the first and second sub-beds 21 and 22, It is comprised by the five rail pieces 41a-41e provided on the 1st and 2nd bed member 52, 53, When these 1st and 2nd bed member 52, 53 falls, these rails The pieces 41a to 41e substantially form one guide rail 41. In addition, the stator 42 of the feed drive mechanism 39 is also disposed on the main bed 19, the first and second sub-beds 21, 22, and the first and second bed members 52, 53, respectively. have.

Next, operation | movement of the dustproof mechanisms 50 and 51 at the time of exposure by the exposure apparatus PE of 1st Embodiment is demonstrated.

As shown in FIG. 2, the first substrate stage 11 holding the substrate W is moved from the first waiting position WP1 on the first subbed 21 to the exposure position EP on the main bed 19. In the case of moving, the first bed member 52 is located below, fits without a gap in the wedge space between the main bed 19 and the first subbed 21, and the first bed member 52. The upper rail piece 41d is continuous with the rail pieces 41a and 41b of the main bed 19 and the first subbed 21. In this state, the first substrate stage 11 moves from the first standby position WP1 to the exposure position EP by the feed drive mechanism 39 of the Y-axis feed mechanism 34.

And as shown in FIG. 3, after moving the 1st board | substrate stage 11 to exposure position EP, the actuator 55 of the 2nd bed member 53 side is driven (2nd drive process), The second bed member 53 is positioned upward, and the Y-direction both end surfaces 53a and 53b of the second bed member 53 and the respective Y-direction end faces of the main bed 19 and the second subbed 22 are positioned. A gap is formed between 19b and 22a.

Thereafter, while adjusting the gap and alignment between the mask M and the substrate W, while moving the first substrate stage 11 stepwise, the mask pattern P of the mask M is moved to the substrate ( Exposure transfer to W) (1st exposure process).

Here, in the exposure transfer, on the second substrate stage 12 located at the second standby position WP2, the replacement operation of the substrate W, that is, the substrate after exposure (using the second substrate loader 15) The main bed 19 and the second sub-bed 22 are carrying out the carrying out of the W to the substrate cassette and the loading of the substrate W from the substrate cassette to the substrate holding part 31b (the first carrying out process). ) Is discontinuous by the second bed member 53, and the vibration generated in the second subbed 22 by the replacement operation is prevented from being transmitted to the main bed 19, so that the first substrate stage 11 is prevented. The influence of the vibration on the exposure accuracy at the time of the exposure operation at can be eliminated, and the mask pattern P can be exposed to the substrate W with high accuracy.

And when the exposure transfer in the 1st board | substrate stage 11 and the replacement operation in the 2nd board | substrate stage 12 are complete | finished, the actuator 55 of the 2nd bed member 53 side is driven, and a 2nd bed member The 53 is positioned below, and the Y-direction both end surfaces 53a and 53b of the second bed member 53 and the respective Y-direction end surfaces 19b and 22a of the main bed 19 and the second subbed 22 are positioned. ).

Thereby, the main bed 19, the 1st and 2nd sub-beds 21 and 22, and the rail pieces 41a-41e on the 1st and 2nd bed members 52 and 53 are continuous, and one guide The rail 41 is comprised, the 1st board | substrate stage 11 moves to the 1st standby position WP1, and the 2nd board | substrate stage 12 moves to the exposure position EP (1st movement process), respectively. Thereafter, the actuator 54 on the first bed member 52 side is driven (first drive step), the first bed member 52 is positioned upward, the first bed member 52 and the main bed A gap is formed between the 19 and the first subbed 21.

In this state, the mask pattern of the mask M is exposed and transferred to the substrate W held by the second substrate stage 12 at the exposure position EP (second exposure step). In addition, during the exposure transfer, the first substrate stage 11 replaces the substrate W in the first substrate stage 11, that is, the substrate W after exposure to the substrate cassette and from the substrate cassette. The main bed 19 and the first subbed 21 are discontinuous by the first bed member 52 in which the substrate W is loaded into the substrate holding part 31a (second loading and unloading step). Therefore, the vibration generated in the first sub-bed when the substrate W is replaced is prevented from being transmitted to the main bed 19, so that the vibration that affects the exposure accuracy in the exposure operation in the second substrate stage 12 is prevented. The influence can be eliminated, and the mask pattern P can be exposed to the substrate W with high accuracy.

And similarly, the actuator 54 of the 1st bed member 52 side is driven, the 1st bed member 52 is located below, it is set as one guide rail 41, and the 1st board | substrate stage 11 is carried out. ) Is moved to the exposure position EP, and the second substrate stage is moved to the second standby position WP2 (second moving step), and then the above-described second driving step is performed to carry out the main bed 19 and The second subbed 22 is made discontinuous by the first bed member 52, and the above-described first exposure process and first import / export process are repeated.

In addition, in 1st Embodiment, also the vibration damper 18 arrange | positioned under the main bed 19 transmits the vibration generate | occur | produced in the 1st subbed 21 and the 2nd subbed 22 to the main bed 19. In addition, in FIG. It acts as a dustproof mechanism that prevents it from becoming. In other words, the dustproof material 18 is provided with the first and second subbeds 21, 22, the first and second substrate loaders 14, which are transmitted through the base 21 during the exposure transfer in the main bed 19. 15) The vibration from the apparatus on the base 17, such as the mask loader 16, can be absorbed.

As described above, according to the exposure apparatus PE of the first embodiment, the mask stage 10 holding the mask M, the main bed 19 positioned below the mask stage 10, and the main The first sub-bed 21 and the second sub-bed 22 disposed on the side of the bed 19 and the first substrate stage 11 movable between the main bed 19 and the first sub-bed 21. And a second substrate stage 12 that is movable between the main bed 19 and the second subbed 22, and to the first and second substrate stages 21, 22 positioned on the main bed 19. The vibration generated in the irradiation apparatus 13 and the first subbed 21 and the second subbed 22 that irradiate the held substrate W with the light for pattern exposure through the mask M is applied to the main bed 19. In the first and second sub-beds (21, 22), it is provided with a dustproof mechanism (50, 51) to prevent transmission to It is possible to prevent the vibration generated when replacing the substrate W in the first and second substrate stages 11 and 12 from being transmitted to the main bed 19 during exposure, thereby eliminating the influence of vibration on the exposure accuracy. Can be. Thereby, the mask pattern P of the mask M can be exposed-transferred to the board | substrate W with high precision.

In addition, the dustproof mechanisms 50 and 51 are respectively provided so that they may fit in the wedge space formed between the main bed 19 and the 1st and 2nd sub-beds 21 and 22, and the 1st and 1st which have an inclined surface, respectively. Since the two bed members 52 and 53 and the actuators 54 and 55 which drive the first and second bed members 52 and 53 in the vertical direction are provided, the bed members 52 and 53 which are relatively lightweight What is necessary is just to drive, and the dustproof of the main bed 19 is attained with the few actuators 54 and 55.

Moreover, since the dustproof mechanism is arrange | positioned under the main bed 19, and has the dustproof material 18 which can support the mainbed 19, it is transmitted through the base 21 during the exposure transfer in the mainbed 19. The vibration from the device on the base 21 to be absorbed can be absorbed. In this way, the influence of vibration on the exposure accuracy can be eliminated, and the mask pattern P of the mask M can be exposed and transferred to the substrate W with high accuracy.

In addition, the first and second bed members 52 and 53 are disposed between the main bed 19 and the first and second sub-beds 21 and 22 when these bed members 52 and 53 are positioned upward. What is necessary is just to form a clearance gap between at least one Y direction cross section 19a, 21a, 19b, 22a of the, and, for example, as shown to FIG. 4 (a), the Y direction cross section of the 1st bed member 52 ( One of 52a and 52b may be an inclined surface, and the other may be a vertical surface. In addition, the 1st and 2nd bed members 52 and 53 may be arrange | positioned in the wedge space formed in the 1st and 2nd subbeds 21 and 22 near the main bed 19, for example, FIG. As shown in (b), even when the first bed member 52 is disposed in the first subbed 21 near the main bed 19, the vibration generated in the first subbed 21 is maintained in the main bed ( 19) can be prevented.

(2nd Embodiment) Next, the exposure apparatus and exposure method of 2nd Embodiment of this invention are demonstrated with reference to FIGS. Fig. 5 is a plan view schematically showing the overall configuration of an exposure apparatus according to a second embodiment of the present invention. Fig. 6 is a front view of the principal parts showing a state in which the first substrate stage can be moved from the first standby position to the exposure position. It is a principal part front view which shows the state in which the 1st board | substrate stage is located in an exposure position, and the 2nd board | substrate stage is located in a 2nd standby position. In addition, the exposure apparatus of 2nd Embodiment differs from the thing of 1st Embodiment in the structure of a dustproof mechanism, and attaches | subjects the same code | symbol about the part equivalent to 1st Embodiment, and abbreviate | omits or simplifies description.

As shown in FIG. 6, in the exposure apparatus PE according to the second embodiment, the main bed 19 is gradually widened in the Y-direction width as the Y-direction both end surfaces 19a and 19b face upward. It is formed in the shape of a wedge with an inclined surface. In addition, the 1st and 2nd sub-beds 21 and 22 have Y-direction end surfaces 21a and 22a which oppose the Y-direction end surfaces 19a and 19b of the main bed 19, and these Y-direction end surfaces 21a. And 22a form an inclined surface having an angle equivalent to the Y-direction end surfaces 19a and 19b.

In addition, as shown in FIG. 5 and FIG. 6, between the main bed 19 and the base 17, a plurality of dustproof materials 18 such as dustproof rubber are disposed with a predetermined gap between the main bed 19. In addition, a plurality of actuators 70 including a piston rod 70a mounted on the lower surface of the main bed 19 and configured to drive the main bed 19 in the vertical direction are arranged. That is, the antivibration mechanism of the first embodiment uses an opposing surface between the main bed 19 and the first and second sub-beds 21 and 22 as an inclined surface, and the actuator for driving the main bed 19 in the vertical direction. The structure provided with 70 and the dustproof material 18 arrange | positioned under the main bed 19 are provided.

In addition, the guide rails 41 extending over the main bed 19 and the first and second beds 21 and 22 are on the main bed 19 and the first and second sub-beds 21 and 22, respectively. It is comprised by the three rail pieces 41a-41c provided in the inside, and when the main bed 19 is located upward, these rail pieces 41a-41c form substantially one guide rail 41. As shown in FIG. do. In addition, the stator 42 of the feed drive mechanism 39 is also disposed on the main bed 19, the first and second sub-beds 21, 22, respectively.

In 2nd Embodiment, as shown in FIG. 6, the 1st board | substrate stage 11 which hold | maintained the board | substrate W was carried out on the main bed 19 from the 1st standby position WP1 on the 1st subbed 21. When moving to the exposure position EP, the main bed 19 is positioned upward by the actuator 70, and the Y-direction both end surfaces 19a, 19b of the main bed 19 are 1st and 2nd sub. The main pieces 19 and the rail pieces 41a to 41c of the first and second sub-beds 21 and 22 are continuously brought into contact with the respective Y-direction end surfaces 21a and 22a of the beds 21 and 22. do. In this state, the first substrate stage 11 moves from the first standby position WP1 to the exposure position EP by the feed drive mechanism 39 of the Y-axis feed mechanism 34.

And as shown in FIG. 7, after moving the 1st board | substrate stage 11 to exposure position EP, the actuator 70 is driven, the main bed 19 is moved below, and the main bed 19 is moved. ) Is supported on the dustproof material 18, and the Y-direction both end surfaces 19a and 19b of the main bed 19 and the respective Y-direction end faces 21a and 22a of the first and second sub-beds 21 and 22. To form a gap between them.

In this state, similarly to the first embodiment, the exposure transfer is performed on the substrate W held by the first substrate stage 11, and on the second substrate stage 12 positioned at the second standby position WP2. Although the work of replacing the substrate W is performed, the main bed 19 and the second subbed 22 become discontinuous, and vibration generated in the second subbed 22 by the replacement operation is caused by the main bed ( 19 can be prevented from being transmitted, and the influence of vibration on the exposure accuracy during the exposure operation on the first substrate stage 11 can be eliminated, so that the mask pattern P can be exposed to the substrate W with high accuracy. Can be.

In addition, the movement from the exposure position EP of the first substrate stage 11 to the first standby position WP1, the movement between the exposure position EP and the second standby position WP2 of the second substrate stage 12. 6, the main bed 19 is implemented in the state located upwards, and the exposure operation | movement in the exposure position EP of the 2nd board | substrate stage 12 is also shown in FIG. It is implemented in a state where the bed 19 is located below and mounted on the dustproof material 18.

According to the exposure apparatus PE of 2nd Embodiment, similarly to 1st Embodiment, the board | substrate W is attached to the 1st and 2nd board | substrate stages 11 and 12 in the 1st and 2nd subbeds 21 and 22. FIG. Can be prevented from being transmitted to the main bed 19 at the time of exposure, and the influence of the vibration on the exposure accuracy can be eliminated. In particular, the vibration isolator includes the main bed 19 and the first bed. Since each opposing surface 19a, 19b, 21a, 22a between the 1st and 2nd sub-beds 21 and 22 is made into the inclined surface, and the actuator 70 which drives the main bed 19 to an up-down direction is provided, The dustproofing of the main bed 19 becomes possible only by moving the main bed 19 relatively.

(3rd Embodiment) Next, the exposure apparatus of 3rd Embodiment of this invention is demonstrated with reference to FIGS. In addition, in the exposure apparatus of 3rd Embodiment, the same code | symbol is attached | subjected about the part equivalent to embodiment mentioned above, and description is abbreviate | omitted or simplified.

FIG. 8 is a plan view schematically illustrating the entire configuration of an exposure apparatus according to a third embodiment of the present invention, and FIG. 9 is a front view of a main part of the exposure apparatus of FIG. 8.

As shown in FIG. 9, the 1st and 2nd board | substrate stages 11 and 12 are the board | substrate holding parts 31a and 31b in which the board | substrate W as an to-be-exposed material is mounted on the upper surface, and this board | substrate holding part 31 is shown. Each of the plurality of pins 92 is disposed so as to be able to freely advance and retreat from the upper surface of the substrate and supports the substrate W. Moreover, below the 1st and 2nd board | substrate stage 11, 12, the Y-axis table 33, the Y-axis feed mechanism 34, the X-axis table 35, the X-axis feed mechanism 36, and Z- The board | substrate stage movement mechanisms 32 and 32 provided with the tilt adjustment mechanism 37 and the Z-axis table 30 are provided, respectively.

Moreover, between the board | substrate holding parts 31a and 31b and the Z-axis table 30 of the board | substrate stage movement mechanism 32 which moves the 1st and 2nd board | substrate stage 11, 12, the board | substrate stage movement mechanism 32 ) An electromagnet which is an air spring 46 which is an anti-vibration mechanism capable of elastically supporting the substrate holding portions 31a and 31b, and a locking mechanism capable of fixing the substrate holding portions 31a and 31b to the substrate stage moving mechanism 32. A plurality of (47; 47a, 47b) are arranged. These air springs 46 and the electromagnets 47 are arranged so as not to interfere with the position where the plurality of fins 92 are arranged, and are provided on a pillar portion (not shown) which is formed on the Z-axis table 30. You may be.

The air spring 46 is a spring using the elasticity of air by sealing compressed air in a rubber film, and a bellows type, a diaphragm type, a rolling seal type, etc. are known. The air spring 46 is flexible in structure and can insulate not only the axial direction but also the vibrations in the transverse direction and the rotation direction.

And in the state in which the electromagnet 47 does not operate, the board | substrate holding parts 31a and 31b are elastically supported by the Z-axis table 30 by the air spring 46, and the board | substrate holding parts 31a and 31b are supported. Vibration on the phase is prevented from being transmitted to the Z axis table 30. On the other hand, in the state in which the electromagnet 47 was operated, the board | substrate holding parts 31a and 31b are fixedly supported by the electromagnet 47 to the Z-axis table 30 firmly.

Here, in the exposure apparatus PE of 3rd Embodiment, the 1st board | substrate stage 11 is exposure position EP by the board | substrate stage movement mechanism 32 of the 1st and 2nd board | substrate stage 11, 12. Between the first standby position WP1 and the second substrate stage 12 interlock with each other between the exposure position EP and the second standby position WP2. And when the 1st board | substrate stage 11 is located in exposure position EP (broken line position of FIG. 9), and the 2nd board | substrate stage 12 is located in 2nd waiting position WP2 (solid line position of FIG. 9), The mask pattern P of the mask M is exposed and transferred to the substrate W held by the first substrate stage 11, and in the second substrate stage 12, the substrate by the second substrate loader 15 ( The replacement operation of W), that is, the carrying out of the substrate W after exposure to the substrate cassette and the loading of the substrate W from the substrate cassette to the substrate holding part 31b are simultaneously performed.

Replacement operation on the second substrate stage 12, first, the plurality of fins 92 are raised to raise the pins protruding from the upper surface of the substrate holding part 31b after the exposure of the substrate W on the substrate holding part 31b. It supports at the front-end | tip of 92, and receives the board | substrate W by the conveyance part (not shown) of the 2nd board | substrate loader 15. FIG. Moreover, also when carrying in the new board | substrate W, several pin 92 is raised, the conveyance part of the 2nd board | substrate loader 15 mounts the board | substrate W at the front-end | tip of the pin 92, and pin ( 92 is lowered and the board | substrate W is mounted on the upper surface of the board | substrate holding part 31b.

During this replacement operation, the substrate holding portion 31b is elastically supported by the air spring 46, and the vibration of the second substrate stage 12 generated during the operation causes the Z of the substrate stage moving mechanism 32 to move. It is not transmitted to the axis table 30, nor to the first substrate stage 11 under exposure.

On the other hand, in the first substrate stage 11 under exposure, since the substrate holding part 31a is fixedly supported by the substrate stage moving mechanism 32 by the operation of the electromagnet 47, the substrate holding part 31a is supported. Is not shifted, the mask pattern P of the mask M is exposed-transferred to the board | substrate W with high precision.

Moreover, when the 2nd board | substrate stage 12 is located in exposure position EP (dashed line position of FIG. 9), and the 1st board | substrate stage 11 is located in 1st waiting position WP1 (solid line position of FIG. 9), The mask pattern P of the mask M is exposed and transferred to the substrate W held by the second substrate stage 12, and in the first substrate stage 11, the substrate by the first substrate loader 14 ( The replacement operation of W), that is, the carrying out of the substrate W after exposure to the substrate cassette and the loading of the substrate W from the substrate cassette to the substrate holding part 31a are simultaneously performed.

Also in this case, in the 1st board | substrate stage 11 which is in a replacement operation | work, the board | substrate holding part 31a makes elastic support to Z-axis table 30 by the air spring 46 by making electromagnet 47 non-operational. In the second substrate stage 12 under exposure, the substrate holding part 31b is fixedly supported on the Z-axis table 30 by operating the electromagnet 47. Thereby, the vibration of the 1st board | substrate stage 11 which generate | occur | produces during a replacement operation is not transmitted to the 2nd board | substrate stage 12 under exposure, and in the 2nd board | substrate stage 12, the mask pattern of the mask M (P) is exposed-transferred to the board | substrate W with high precision.

In addition, the electromagnet 47 is operated during the movement between the exposure positions EP of the first and second substrate stages 11 and 12 and the first and second standby positions WP1 and WP2, and the substrate holding portion 31a is operated. And 31b are fixedly supported by the Z-axis table 30, the substrate holding portions 31a and 31b are shaken and position shift does not occur in the substrate W. FIG.

As described above, the exposure apparatus PE of the third embodiment includes (1) a mask stage 10 holding a mask, an exposure position EP positioned below the mask stage, and a first standby position WP1. The first substrate stage 11 which is movable between), the 2nd substrate stage 12 which is movable between exposure position EP, and 2nd standby position WP2, and the 1st which moved to exposure position EP And an irradiation apparatus 13 for irradiating light for pattern exposure through the mask M to the substrate W held by the second substrate stages 11 and 12, wherein the first and second substrate stages 11, The plurality of pins 12 are arranged to freely advance and retreat from the upper surfaces of the substrate holding portions 31a and 31b and the substrate holding portions 31a and 31b on which the substrate W is mounted. The board | substrate which has 92 and moves the board | substrate holding parts 31a and 31b and the 1st and 2nd board | substrate stage 11 and 12. Between the stage movement mechanisms 32 and 32, the dustproof mechanism which can elastically support the board | substrate holding parts 31a and 31b with respect to the board | substrate stage movement mechanisms 32 and 32, and the board | substrate with respect to the board | substrate stage movement mechanisms 32 and 32 A lock mechanism capable of fixing and holding the holding portions 31a and 31b is characterized in that it is arranged.

Moreover, according to the exposure apparatus PE of 3rd Embodiment, (2) the dustproof mechanism is comprised by the air spring 46, and the lock mechanism hold | maintains a board | substrate with respect to the board | substrate stage movement mechanisms 32 and 32 by an electromagnetic force. It is an electromagnet 47 which fixes and supports the parts 31a and 31b.

According to the exposure apparatus PE of 3rd Embodiment, the 1st board | substrate stage 11 which can move between exposure position EP and 1st standby position EP1 located below the mask stage, and exposure position EP ) And the second substrate stage 12 that is movable between the second standby position WP2, thereby exposing the transfer of the substrate W and the substrate W to the first and second substrate stages 11, 12. Import and export can be performed simultaneously, and the tact time can be shortened.

Moreover, between the board | substrate holding parts 31a and 31b of the 1st and 2nd board | substrate stages 11 and 12, and the board | substrate stage moving mechanisms 32 and 32 which move the 1st and 2nd board | substrate stages 11 and 12. FIG. The air support 46 which can elastically support the board | substrate holding parts 31a and 31b with respect to the board | substrate stage moving mechanism 32, and the board | substrate holding parts 31a and 31b are fixedly supported with respect to the board | substrate stage moving mechanism 32 in the Since the electromagnet 47 which is possible is arrange | positioned, the vibration which generate | occur | produces in the board | substrate stage on the side which carries in / out the board | substrate W can be prevented from being transmitted to the board | substrate stage under exposure by the air spring 46. Thereby, the mask pattern P of the mask M can be exposed-transferred to the board | substrate W with high precision, excluding the influence of the vibration on exposure precision.

In addition, when exposing the board | substrate W hold | maintained by the 1st and 2nd board | substrate stage 11, 12, the board | substrate holding part 31a, 31b with the electromagnet 47 with respect to the board | substrate stage movement mechanism 32 is also exposed. Since it is fixedly supported, the board | substrate holding parts 31a and 31b do not shift | deviate and can perform exposure transfer with high precision.

Moreover, since the air spring 46 and the electromagnet 47 are arrange | positioned between the board | substrate holding parts 31a and 31b and the Z-axis table 30, the mass supported by the air spring 46 and the electromagnet 47 is supported. It is possible to reduce the weight and to improve the responsiveness, and the air spring 46 and the electromagnet 47 can be miniaturized.

In addition, the vibration isolator of 3rd Embodiment should just be able to elastically support a board | substrate holding part with respect to a board | substrate stage movement mechanism, and a structure other than an air spring may be sufficient as it. Moreover, the lock mechanism should just be able to switch elastic support by a dustproof mechanism, and can hold | maintain a board | substrate holding part with respect to a board | substrate stage movement mechanism, and structures other than an electromagnet may be sufficient.

(4th Embodiment) Next, the exposure apparatus of 4th Embodiment of this invention is demonstrated with reference to FIGS. In addition, in the exposure apparatus of 4th Embodiment, the same code | symbol is attached | subjected about the part equivalent to embodiment mentioned above, and description is abbreviate | omitted or simplified.

FIG. 10 is a plan view schematically showing the overall configuration of an exposure apparatus as a fourth embodiment of the present invention, FIG. 11 is a front view of a main part of the exposure apparatus of FIG. 10, and FIG. 12 is a side view of the first and second substrate loaders.

As shown in FIG. 12, as for the 1st and 2nd board | substrate loader 14 and 15, the some conveyance part 82 and 83 is free to the column 81 formed in the column support 80 on the base 17 on the base 17. It is a loader robot arranged to swing. The plurality of conveying units 82 and 83 move up and down along the column 81 by a lifting mechanism (not shown), and servo motors are arranged and driven independently of each other. Each conveyance part 82 and 83 is equipped with the board | substrate mounting base 87 in which the several rod-shaped member 86 was planted in parallel at the front-end | tip of the 1st and 2nd arms 84 and 85 and the 1st arm 84. FIG. And by controlling and operating each servomotor, the board | substrate mounting board 87 is raised, rotated, and moved, and the board | substrate W on the board | substrate mounting board 87 is conveyed. ) Also has the same configuration as the first and second substrate loaders 14 and 15.

Here, the 1st and 2nd subbeds 21 and 22 are the vibration detector 95 which detects a vibration, and the exciter 96 which oscillates the vibration detected by the vibration detector 95, and an antiphase vibration. Active vibration control devices 93 and 94, respectively. The active vibration control devices 93 and 94 are provided at positions near the main bed 19 in the first and second sub-beds 21 and 22, and the detection signal detected by the vibration detector 95 is shown. And the exciter 96 oscillates the detected vibration and the antiphase vibration on the basis of the instruction from the control apparatus. As a result, the vibration generated in the first and second sub-beds 21 and 22 is canceled by the vibration generated by the exciter 96, and the main bed 19 is separated from the first and second sub-beds 21 and 22. The vibration transmitted to) is reduced.

In addition, the first and second substrate loaders 14 and 15 also have a vibration detector 59 for detecting vibrations, and an excitation device 56 for oscillating the vibrations detected by the vibration detector 59 and vibrations out of phase. Active vibration control apparatuses 57 and 58, respectively. The active vibration control devices 57 and 58 are provided in the column support 80 that supports the column 81 on the base 17, and a control device in which the detection signal detected by the vibration detector 59 is not shown. And the exciter 56 oscillates the detected vibration and the antiphase vibration on the basis of the instruction from the control device. As a result, the vibration generated in the first and second substrate loaders 14 and 15 is canceled by the vibration generated by the exciter 56, and the base 17 is lifted from the first and second substrate loaders 14 and 15. The vibration transmitted to the main bed 19 is reduced.

In the exposure apparatus PE of 4th Embodiment, the 1st board | substrate stage 11 is exposed with the exposure position EP by the board | substrate stage movement mechanism 32 of the 1st and 2nd board | substrate stages 11 and 12. FIG. Between the 1st waiting position WP1, the 2nd board | substrate stage 12 mutually cooperates between the exposure position EP and the 2nd waiting position WP2. And when the 1st board | substrate stage 11 is located in exposure position EP (broken line position of FIG. 11), and the 2nd board | substrate stage 12 is located in 2nd waiting position WP2 (solid line position of FIG. 11), The mask pattern P of the mask M is exposed and transferred to the substrate W held by the first substrate stage 11, and in the second substrate stage 12, the substrate by the second substrate loader 15 is provided. The replacement operation of W, that is, the carrying out of the substrate W after exposure to the substrate cassette and the loading of the substrate W from the substrate cassette to the substrate holder 31b are simultaneously performed.

Here, in the second substrate stage 12 during the replacement operation, when vibration occurs in the second subbed 22, the vibration detector 95 of the active vibration control device 94 is generated in the second subbed 22. The vibration is detected and a detection signal is sent to the control device. And the exciter 96 produces | generates the vibration detected by the vibration detector 95 based on the instruction | command from a control apparatus, and the reverse phase vibration, and cancels the vibration of the 2nd subbed 22. As shown in FIG. As a result, the vibration of the second subbed 22 is damped so that the vibration generated in the second subbed 22 is not transmitted to the main bed 19, and the substrate W being exposed on the first substrate stage 11 is exposed. Does not affect).

In addition, when a vibration generate | occur | produces in the 2nd board | substrate loader 15 by the drive of the 2nd board | substrate loader 15 during a replacement | work operation, the vibration detector 59 of the active vibration control apparatus 58 will perform the 2nd board | substrate loader 15. Detects the vibration generated in the control panel) and transmits the detection signal to the control device, and the exciter 56 generates the vibration detected by the vibration detector 59 and the reverse phase vibration based on the command from the control device, The vibration of the second substrate loader 15 is canceled out. As a result, the vibration of the second substrate loader 15 is damped so that the vibration generated in the second substrate loader 15 is not transmitted to the main bed 19 through the base 21, and the first substrate stage 11 is provided. It does not affect the board | substrate W under exposure on a phase.

Moreover, when the 2nd board | substrate stage 12 is located in exposure position EP (broken line position of FIG. 11), and the 1st board | substrate stage 11 is located in 1st waiting position WP1 (solid line position of FIG. 11), The mask pattern P of the mask M is exposed and transferred to the substrate W held by the second substrate stage 12, and in the first substrate stage 11, the substrate by the first substrate loader 14 ( The replacement operation of W), that is, the carrying out of the substrate cassette of the substrate W after exposure and the loading of the substrate W from the substrate cassette to the substrate holding part 31a are simultaneously performed.

Also in this case, in the 1st board | substrate stage 11 which is in operation of replacement | exchange, the active vibration control apparatus 93 damps the vibration of the 1st subbed 21 similarly to the active vibration control apparatus 94 mentioned above, Moreover, the active vibration control apparatus 57 arrange | positioned in the 1st board | substrate loader 14 also damps the vibration generate | occur | produced by the 1st board | substrate loader 14 driving similarly to the active vibration control apparatus 58 mentioned above. As a result, vibration generated in the first sub-bed 21 or the first substrate loader 14 is not transmitted to the main bed 19, and does not affect the substrate W being exposed on the second substrate stage 12. Do not.

As described above, the exposure apparatus PE of the fourth embodiment includes (1) a mask stage 10 holding a mask, a main bed 19 positioned below the mask stage 10, and a main bed. A first sub-bed 21 and a second sub-bed 22 arranged on the side of the first substrate stage 11, which are movable between the main bed 19 and the first sub-bed 21, and a main bed. A second substrate stage 12 movable between the 19 and second sub-beds 22 and a substrate held on the first and second substrate stages 11, 12 located on the main bed 19. The irradiation apparatus 13 which irradiates the light for pattern exposure through the mask M is provided to (W), The 1st and 2nd sub-beds 21 and 22 are the vibration detector 95 which detects a vibration, and And an active vibration control device 9 having an exciter 96 for oscillating the vibration detected by the vibration detector 95 and the antiphase vibration. 3 and 94, respectively.

Moreover, the exposure apparatus PE of 4th Embodiment is (2) the mask stage 10 holding a mask, the exposure position EP located under the mask stage 10, and the 1st standby position WP1. The first substrate stage 11 which is movable between), the 2nd substrate stage 12 which is movable between exposure position EP, and 2nd standby position WP2, and the 1st which moved to exposure position EP And an irradiation apparatus 13 for irradiating the substrate W held on the second substrate stages 11 and 12 with the light for pattern exposure through the mask M, and the first position positioned at the first standby position WP1. The board | substrate W is carried in with respect to the 1st board | substrate loader 14 which carries in and unloads the board | substrate W with respect to the board | substrate stage 11, and the 2nd board | substrate stage 12 located in the 2nd standby position WP2. And a second substrate loader 15 to be carried out, wherein the first and second substrate loaders 14 and 15 are vibrations for detecting vibrations. The chulgi 59, a vibration detector 59, an active vibration control device (57, 58) having a group (56) with which oscillates the vibration of the vibration and the phase opposite to the phase detected by the characterized in that it comprises respectively.

According to the exposure apparatus PE of 4th Embodiment, the main bed 19 (exposure position EP) located under the mask stage 10, and the 1st subbed 21 arrange | positioned at the side (the 1st The first substrate stage 11 movable between the first standby position WP1 and the main bed 19 (exposure position) and the second subbed 22 (second standby position WP2) disposed on the side thereof. By providing the second substrate stage 12 that is movable between), the exposure transfer of the substrate W and the loading and unloading of the substrate W to the first and second substrate stages 11 and 12 are simultaneously performed. The tack time can be shortened.

In addition, the first and second sub-beds 21 and 22 include a vibration detector 95 for detecting vibration, and an exciter 96 for oscillating the vibration detected by the vibration detector 95 and the vibration in the reverse phase. Since it is provided with the active vibration control apparatus 93 and 94 which respectively have the 1st and 2nd sub-beds 21 and 22 when carrying in and carrying out the board | substrate W to the 1st and 2nd board | substrate stage 11 and 12, it is carried out. Vibration generated in the phase can be prevented from being transmitted to the main bed 19 during exposure. Thereby, the mask pattern P of the mask M can be exposed-transferred to the board | substrate W with high precision, excluding the influence of the vibration on exposure precision.

In addition, the first and second substrate loaders 14 and 15 also have a vibration detector 59 for detecting vibration, and an exciter 56 for oscillating the vibration detected by the vibration detector 59 and the antiphase vibration. Since it is provided with the active vibration control apparatus 57 and 58 which respectively have the 1st and 2nd board | substrate loader 14 and 15 when carrying in / out the board | substrate W to the 1st and 2nd board | substrate stage 11 and 12, it is carried out. It is possible to prevent the vibration generated in the transfer from the first and second substrate stages 11 and 12 at the time of exposure through the main bed 19. Thereby, the mask pattern P of the mask M can be exposed-transferred to the board | substrate W with high precision, excluding the influence of the vibration on exposure precision.

Although the vibration detector 95 of the active vibration control apparatuses 93 and 94 of 4th Embodiment is arrange | positioned adjacent to the exciter 96, arbitrary positions of the 1st and 2nd subbeds 21 and 22 are provided. It may be arranged in, and may not be built-in type. Moreover, what is necessary is just to arrange | position the exciter 96 also in the position which can excite efficiently inside the 1st and 2nd sub-beds 21 and 22. FIG.

In addition, the vibration detector 59 of the active vibration control apparatus 57, 58 may also be arrange | positioned in arbitrary positions of the 1st and 2nd board | substrate loader 14, 15, and does not need to be a built-in type. What is necessary is just to arrange | position the exciter 56 also in the position which can efficiently excite inside the 1st and 2nd board | substrate loader 14,15.

(5th Embodiment) Next, the exposure apparatus which is 5th Embodiment of this invention is demonstrated with reference to FIG. In addition, the fifth embodiment is characterized in that the vibration damping device 90 is disposed between the base 17 and the bottom surface FL. For this reason, about the part similar to embodiment mentioned above, the same code | symbol is attached | subjected and description is abbreviate | omitted or simplified. In addition, although not shown about the active vibration control apparatus 57, 58, 93, 94 of 4th Embodiment, it is applicable even if it combines with 5th Embodiment.

As shown in FIG. 14, the base 17 is formed of the concrete surface plate, and supports the component parts of the above-mentioned exposure apparatus PE containing the board | substrate cassette and mask cassette which are not shown in figure.

And as shown to FIG. 13 and FIG. 14, the air spring system which is the damping apparatus 90 is arranged in multiple numbers between this base 17 and the floor surface FL, and the base 17 has a bottom surface ( It is arrange | positioned at substantially the same height as the slab bottom 91 located above FL).

Moreover, the air spring system is a spring which used the elasticity of air by enclosing compressed air in a rubber film, and a bellows type, a diaphragm type, a rolling seal type, etc. are known. The air spring is flexible in structure and can insulate not only the axial direction but also the vibration of a horizontal direction and a rotation direction.

As described above, the exposure apparatus PE of the fifth embodiment includes the mask stage 10 holding the mask, the exposure position EP positioned below the mask stage 10, and the standby positions WP1, WP2. Irradiating light for pattern exposure through the mask M to the substrate stages 11 and 12 movable between the substrate stages 11 and 12 and the substrate W held by the substrate stages 11 and 12 moved to the exposure position EP. The irradiating apparatus 13 and the board | substrate loader 14 and 15 which carry in and carry out the board | substrate W with respect to the board | substrate stage 11, 12 located in the standby position WP1, WP2 are provided, and the mask stage 10 ), The substrate stages 11 and 12, and the substrate loaders 14 and 15 are supported by the base 17, and the base 17 is on the bottom surface FL through the vibration suppression apparatus 90. It is characterized by being arranged.

Therefore, according to 5th Embodiment, since the damping apparatus 90 is arrange | positioned between the base 17 which supports the component parts of exposure apparatus PE, and the bottom surface FL, exposure apparatus PE and The base 17 formed of the concrete base can be lifted from the floor surface FL to suppress various vibrations generated from the surroundings. For example, the substrate W may be disposed on the first and second substrate stages 11 and 12. ), The vibration generated in various components, such as the first and second sub-beds 21 and 22 and the first and second substrate loaders 14 and 15, is exposed from the bottom surface FL. It can be prevented from being transferred to the first and second substrate stages 11, 12. Thereby, the mask pattern P of the mask M can be exposed-transferred to the board | substrate W with high precision, excluding the influence of the vibration on exposure precision. The structure and action other than that are the same as that of 1st Embodiment. Moreover, the vibration damping apparatus 90 of this embodiment is equipped with two board | substrate stages, and in addition to the exposure apparatus which can perform an exposure operation and a replacement operation simultaneously, an exposure operation and a replacement operation are alternately performed in one board | substrate stage. It is applicable to an exposure apparatus.

In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably.

According to the exposure apparatus and exposure method of this invention, the 1st board | substrate stage which is movable between the main bed located under the mask stage, and the 1st subbed arrange | positioned at the side, and the main bed and the 2nd arrange | positioned at the side By providing a second substrate stage movable between the sub-beds, the exposure transfer of the substrate and the loading and unloading of the substrate to the first and second substrate stages can be simultaneously performed to shorten the tact time. Since a vibration isolating mechanism is provided to prevent the vibration generated in the first sub bed and the second sub bed from being transmitted to the main bed, the vibration generated when the substrate is brought in and out of the first and second substrate stages is the main part during exposure. It can be prevented from being delivered to the bed. Thereby, the mask pattern can be exposed-transferred to a board | substrate with high precision, eliminating the influence of the vibration on exposure precision.

Claims (5)

A mask stage to hold the mask, A main bed positioned below the mask stage, A first sub bed and a second sub bed disposed on the side of the main bed; A first substrate stage movable between the main bed and the first subbed; A second substrate stage movable between the main bed and the second subbed; An irradiation apparatus for irradiating light for pattern exposure through the mask to substrates held on the first and second substrate stages positioned on the main bed; And an anti-vibration mechanism for preventing vibration generated in the first sub bed and the second sub bed from being transmitted to the main bed. The method of claim 1, The dustproof mechanism, First and second bed members each having an inclined surface, the first wedge spaces formed between the main bed and the first and second sub-beds or the wedge spaces formed on the first and second sub-beds, respectively; And an actuator for driving the first and second bed members in the vertical direction. The method of claim 1, The said dustproof mechanism is comprised by providing the actuator which drives each said main bed to an up-down direction, making each opposing surface between the said main bed and the said 1st and 2nd subbed into an inclined surface, The exposure apparatus characterized by the above-mentioned. The method according to any one of claims 1 to 3, The dustproof mechanism is disposed below the main bed and has a dustproof material capable of supporting the main bed. A mask stage holding a mask, a main bed positioned below the mask stage, a first subbed and a second subbed disposed on the side of the main bed, and between the main bed and the first subbed. For pattern exposure to a substrate held by a movable first substrate stage, a second substrate stage movable between the main bed and the second subbed, and the first and second substrate stages positioned on the main bed An exposure method using an exposure apparatus including an irradiation device for irradiating light through the mask and a dustproof mechanism for preventing vibration generated in the first subbed and the second subbed from being transmitted to the main bed, A first exposure process of exposing and transferring the mask pattern of the mask to the substrate held on the first substrate stage positioned on the main bed; A first import / export step of carrying in and carrying out the substrate with respect to the second substrate stage positioned on the second subbed during the first exposure process; A first moving step of moving the first substrate stage on the first subbed and the second substrate stage on the main bed, respectively; A first driving step of driving the dustproof mechanism after the first moving step, A second exposure process of exposing and transferring the mask pattern of the mask to the substrate held on the second substrate stage positioned on the main bed; A second import / export step of carrying in and carrying out the substrate with respect to the first substrate stage positioned on the first subbed during the second exposure process; A second moving step of moving the first substrate stage on the main bed and the second substrate stage on the second subbed, respectively; And a second driving step of driving the dustproof mechanism after the second moving step, The first driving process prevents the vibration generated in the first subbed from being transmitted to the main bed by the second loading / unloading step during the second exposure process, The said 2nd drive process prevents the vibration generate | occur | produced in the said 2nd subbed by the said 1st carry-in / out process in the said 1st exposure process, It is characterized by the above-mentioned.

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