KR20070080820A - Low reflective film and manufacturing method thereof - Google Patents

Abstract

A low-reflection film and a manufacturing method thereof are provided to secure excellent anti-reflection property by keeping surface reflection below 2% and to control the reflectivity easily by freely controlling refractivity according to the input amount of soluble materials. A low-reflection film is composed of a hard coating layer(2) formed on a transparent base film(1) and a porous layer(3) formed on the hard coating layer. The porous layer has a void ratio of 10~50%, refractivity of 1.25~1.45 lower than that of the hard coating layer, and reflectivity below 2%. A void of the porous layer is 10~70 nanometers. The hard coating layer has surface hardness over 2H. The low-reflection film manufacturing method comprises the steps of: forming the hard coating layer on at least one surface of the transparent base film; forming a coating layer for the porous layer by applying coating solution including soluble materials, on the hard coating layer; and forming the porous layer by dissolving some or all of the soluble materials.

Description

Low Reflective Film And Manufacturing Method Thereof}

1 is a cross-sectional view of a low reflection film according to an embodiment of the present invention,

2 is a flowchart illustrating a method of manufacturing a low reflection film according to another embodiment of the present invention.

** Description of the major symbols in the drawings **

1: transparent substrate film

2: hard coating layer

3: porous layer

The present invention relates to a low reflection film and a method for manufacturing the same, and more particularly, to the porous layer coating layer by dissolving and extracting a soluble material using a solvent after forming a coating layer for a porous layer containing a soluble material. The present invention relates to a low reflection film and a method of manufacturing the same, in which pores are introduced to form a porous layer.

With the rapid change in display technology, image display devices such as LCDs, CRTs, PDPs, or OLEDs typically have the outermost surface of the display device to prevent contrast from being reduced due to external light reflections and image reflections. Place an antireflection film on the. The antireflection film provided with such a function is coated with a material for anti-reflection (AR) or low reflection (LR).

Existing antireflective films have been made by stacking transparent layers of one or more metal oxides. The transparent layer made of a metal oxide is formed by CVD (chemical vapor deposition), PVD (physical vapor deposition), or the like. In particular, the PVD method is mainly used. This metal oxide layer had excellent performance as an antireflection film, but the deposition method had a disadvantage in that it was not suitable for mass production because productivity decreased and production cost was high.

Since then, instead of the deposition process, a method of manufacturing an antireflection film by coating the film using a coating liquid containing an inorganic fine particle and a low refractive compound such as a fluorine-based compound has been developed.

As an example, a method of manufacturing an antireflection film by laminating a high refractive index layer on a support, a low refractive index layer using inorganic fine particles thereon, and using two or more kinds of fine particles such as MgF ₂ or SiO ₂ to mix according to the thickness. There is a method of manufacturing an antireflection film by changing the refractive index by changing the ratio.

In addition, a method of manufacturing an antireflection film by forming a low refractive index layer using hollow particles has been developed. That is, there is a method of manufacturing an antireflection film using an inorganic powder and a binder made of hollow silica.

However, in the case of inorganic fine particles, the above-described problems have a high manufacturing cost in coating, and fluorine compounds have a low surface hardness and thus have low scratch resistance, and thus are easily damaged when applied to a display device. have.

The present invention is to solve the above problems, by introducing a hard coating layer and forming a coating layer for a porous layer containing a soluble material thereon to form a void by dissolving and extracting the soluble material using a solvent to form a porous layer It is an object of the present invention to provide a low reflection film having a surface reflection of 2% or less, excellent scratch resistance and low manufacturing cost, and a method for producing the same.

The present invention for achieving the above object,

It provides a low reflection film comprising a hard coating layer formed on the transparent base film and a porous layer formed on the hard coating layer.

In addition, the porous layer provides a low reflection film, characterized in that the porosity is in the range of 10 to 50%.

In addition, the porous layer has a lower refractive index than the hard coating layer, the refractive index provides a low reflection film, characterized in that within the range of 1.25 ~ 1.45 and reflectance is 2% or less.

In addition, the hard coating layer provides a low reflection film, characterized in that the surface hardness is 2H or more.

In addition, the pores of the porous layer provides a low reflection film, characterized in that the nano-size of 10 ~ 70 nm.

In still another aspect of the present invention, there is provided a method for forming a hard coating layer on at least one side of a transparent substrate film; Forming a coating layer for the porous layer by applying a coating solution including a soluble material on the hard coating layer; And dissolving all or part of the soluble material with a solvent to form a porous layer. It provides a method for producing a low reflection film comprising a.

In addition, the soluble material provides a method for producing a low reflection film, characterized in that at least one selected from organic or inorganic materials dissolved in at least one of water, alcohol-based, ketone-based solvents.

In addition, the solvent provides a method for producing a low reflection film, characterized in that at least one selected from the group consisting of water, alcohol and ketone solvents.

In addition, the content of the soluble material provides a method for producing a low reflection film, characterized in that 10 to 50 parts by weight based on 100 parts by weight of the coating liquid containing the soluble material.

Hereinafter, the present invention will be described in more detail with reference to the drawings and embodiments.

1 is a view showing a cross-sectional view of a low reflection film according to an embodiment of the present invention. As shown, it characterized in that it comprises a hard coating layer 2 formed on the transparent base film 1 and a porous layer 3 formed on the hard coating layer and having a lower refractive index than the hard coating layer.

As the transparent base film 1, any film can be used as long as it is a film having transparency. Cellulose derivatives, for example diacetyl cellulose, triacetyl cellulose, propionyl cellulose, butyryl cellulose, acetyl propionyl cellulose and also polyesters, polyamides, polyimides, polyethersulfones, polysulfones, polypropylenes, polys Unstretched, uniaxial or biaxially oriented films of thermoplastic polymers such as methylpentene, polyvinyl chloride, polyvinyl acetal, polyether ketone, polymethyl methacrylate, polyethylene terephthalate, polycarbonate, polyurethane and epoxy Etc. Among them, preferably, a uniaxial or biaxially stretched polyester film having excellent transparency and heat resistance, and a triacetyl cellulose film can be preferably used in view of transparency and optical anisotropy. Although the thickness of a transparent base film is not restrict | limited, It is about 8-1000 micrometers, Preferably 40-100 micrometers can be used.

The hard coat layer 2 can be used without limitation as long as the material is excellent in scratch resistance. Herein, the hard coating layer means a coating layer having a hardness of H or more in a pencil hardness test. The surface hardness of the hard coat layer is preferably a coating liquid capable of providing physical properties of surface hardness of 2H or more, more preferably 4H or more. Reactive cured resins or reactive organosilicon compounds that are cured by UV or heat may be preferably selected.

In one example, UV-curable resins of organic-inorganic hybrid type (reactive silica particles) can be used, which can be prepared by chemical bonding by mixing the silica particles with a hydrolyzable silane having a polymeric unsaturated group. The amount of hydrolyzable silane having a polymeric unsaturated group bonded to the reactive silica particles is about 0.05 to 99% by weight, preferably 5 to 85% by weight. Less than 0.05% by weight affects the transparency and wear resistance of the cured film, and more than 99% by weight only slightly improves the wear resistance. Hydrolyzable silyl groups can be carboxylate silyl groups such as acetoxy silyl groups, alkoxy silyl groups such as methoxy or ethoxy silyl groups, halogen silyl groups such as chloro silyl groups, amino and hydride silyl groups and the like, preferably alkoxy Silyl is best to use. The polymerizable unsaturated group may be a carboxy, hydroxy, acryloxy, methacryloxy, vinyl, propenyl, butadienyl, styryl, cinnamoyl, maleate, acrylamide group and the like. Among these, unsaturated aliphatic carboxylic acid and methacrylate compound containing a hydroxy group are preferable. The average particle diameter of the reactive silica particles is preferably 0.0001 to 1 µm and is preferably 0.001 to 0.01 µm when used for the cured transparent film. The specific surface area of the silica particles is preferably 0.001 to 2 m ² / g, more preferably 0.001 to 0.1 m ² / g, and most preferably 0.001 to 0.01 m ² / g. The silica particles may be a colloidal silica dispersed in an organic solvent such as a dry powder or a silica sol of methanol. The production of the reactive silica particles is carried out at 20 to 150 ° C, and is performed in a range of 5 minutes to 24 hours.

A photoinitiator may be added to the hard coating layer 2 for UV curing, and photoinitiators used in the art may be used. As an example, diphenyl ketone benzyl dimethyl ketal, 2-hydroxy-2-methyl-1-phenyl-1-one, 4-hydroxycyclophenyl ketone, dimethoxy-2-phenylatetophenone, anthraquinone, fluorene 0.1-10% by weight of triphenylamine, carbazole, 3-methylacetophenone, 4-knoloacetophenone, 4,4-dimethoxyacetophenone, 4,4-diaminobenzophenone, or the like alone or in combination. Can be used. If less than 0.1% by weight, the curing speed is slow and more than 10% by weight is uneconomical. Photostimulants can be used with photoinitiators, for example triethylamine, diethylamine, methyldiethanolamine, ethanolamine, 4-dimethylamino-benzoic acid, isoamyl-4-dimethylaminobenzoate and the like can be used. have. In addition to the above materials, antioxidants, UV absorbers, light stabilizers, thermal polymerisation inhibitors, leveling agents, surfactants, lubricants and the like can be formed.

The porous layer 3 has pores on its surface and inside and its porosity is not limited, but 10 to 50%, preferably 18 to 40% is appropriate. If the porosity is 10% or less, there is a problem that the low refractive effect and the surface reflection prevention effect is lowered. If the porosity is 50% or more, there is a problem that the scratch resistance and the transmittance are reduced by the formation of the micro voids. The pore size of the porous layer is a nano size of 10 ~ 70 nm, preferably a nano size of 20 ~ 50 nm.

It is preferable that the refractive index of the porous layer 3 is smaller than the hard coating layer, and the refractive index is not limited, but is within the range of 1.25 to 1.45 and the reflectance is 2% or less. The refractive index of the porous layer can be adjusted by adjusting the porosity.

Although the material of the porous layer 3 is not limited, a reactive cured resin or a reactive organosilicon compound that is cured by UV or heat may be preferably selected. In addition, it is possible to use a material having excellent surface strength, such as the UV cured resin and the hard coating layer.

The method of forming the porous layer may use a method known in the art, and more preferably, it is formed by a manufacturing method to be described later.

The low reflection film according to the present invention may, in addition to the above-described constitution, laminate special layers between or outside the above-described layers as necessary, which is also included in the present invention. In addition, the low reflection film according to the present invention can be produced by a low reflection film manufacturing method to be described later.

2 is a flowchart illustrating a method of manufacturing a low reflection film according to another embodiment of the present invention. As shown, forming a hard coating layer on at least one side of the transparent substrate film (S10), applying a coating solution containing a soluble material on the hard coating layer to form a coating layer for the porous layer (S20), and the Dissolving all or part of the soluble material with a solvent to form a porous layer, characterized in that the method for producing a low reflection film comprising the step (S30). In addition to the above steps, other steps may be added as necessary, and are also included in the present invention.

First, a hard coating layer is formed on at least one surface of the transparent base film (S10). The coating solution of the hard coating layer may include the above-mentioned curable resin and photoinitiator, and may also include a solvent for the viscosity required during coating. The hard coating layer may be formed by a method used in the art, and may be coated in a suitable manner such as die coating, casting, gravure, and spin coating. The coating thickness is usually about 0.1 to 400 mu m, preferably about 1 to 200 mu m. After coating, it is dried by evaporation of volatiles at a temperature of 10-100 ° C. for 1 second to 24 hours, preferably 5 seconds to 2 hours. After that, UV light is cured by irradiation. The irradiation amount of UV light is about 0.01-10 J / cm <^2> , Preferably it is 0.1-2 J / cm <^2> . It is preferable that the refractive index of the hard coat layer formed therefrom is at least higher than the refractive index of the porous layer laminated | stacked on this hard coating layer, and its surface strength is 2H or more, It is preferable that it is 4H or more more preferably.

Next, to form a coating layer for a porous layer by applying a coating solution containing a soluble material on the hard coating layer (S20). The coating method can be the same as the method of the hard coating layer, but is not limited. Coating can be carried out in a suitable manner such as gravure and spin coating. The coating thickness is not limited but is usually about 50-200 nm, preferably about 80-120 nm. After application, the composition is dried by evaporation of the volatiles at a temperature of 10-100 ° C. for 1 second to 24 hours, preferably 5 seconds to 2 hours. After that, UV light is cured by irradiation. The irradiation amount of UV light is about 0.01-10 J / cm <^2> , Preferably it is 0.1-2 J / cm <^2> .

Hardening of the hard coat layer and the coating layer for the porous layer in the above may be carried out, respectively, but may be cured at once after forming each layer, which is also included in the present invention.

The coating solution including the soluble material may include the above-described binder and photoinitiator. That is, the coating solution for the porous layer for forming the porous layer may be used without limitation as long as it includes a binder and is insoluble in the solvent used to dissolve the soluble material, and the material of the porous layer is cured by UV or heat. Reactive cured resins or reactive organosilicon compounds may be preferably selected. In addition, it is possible to use a material having excellent surface strength by using the same UV curing resin as the hard coating layer.

The soluble material is for forming the pores of the porous layer, water, alcohol-based (methanol, ethanol, isopropanol, butanol, etc.), ketone-based (methyl ethyl ketone, methyl butyl ketone, methyl isobutyl ketone, diethyl ketone, di If it is a substance such as an organic substance or an inorganic substance that is dissolved in a solvent such as propyl ketone, etc., one or more may be selected. As an example, the following monomers and polymer materials thereof are included. As monomers, styrene, p-methylstyrene, m-methylstyrene, p-ethylstyrene, m-ethylstyrene, p-chlorostyrene, m-chlorostyrene, p-chloromethylstyrene, m-chloromethylstyrene, pt-part Aromatic vinyl compounds such as oxy styrene, mt-butoxy styrene, fluoro styrene, alpha methyl styrene, vinyl toluene, and chloro styrene; Methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, octyl acrylate, octyl methacrylate, stearyl acrylate, stearyl methacrylate, benzyl acrylate , Benzyl methacrylate, glycidyl acrylate, glycidyl methacrylate, fluoroethyl acrylate, ethyl methacrylate, hexafluorobutyl methacrylate, hexafluoroisopropyl methacrylate, perfluoro Acrylic and fluoroacrylic compounds such as alkyl acrylate and octafluorophenyl methacrylate; Unsaturated carboxylic acid compounds such as (meth) acrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid and vinylsulfonic acid; Unsaturated sulfonic acid compounds such as vinylsulfonic acid, arylsulfonic acid, and P-styrene sulfonic acid; Acrylic ester compounds such as methyl acrylate, ethyl acrylate, butyl acrylate, octyl acrylate, methoxyethyl acrylate, phenyl acrylate and cyclohexyl acrylate; Vinyl cyanide compounds such as (meth) acrylonitrile and methacrylonitrile; And amide compounds such as 2- (meth) acrylamido-2-methylpropanesulfonic acid, (meth) acrylamide, N-isopropyl (meth) acrylamide, and N-vinylacetamide. Further, inorganic compounds include zirconium oxynitrate hydrate _{[ZrO (NO 3) 2]} · H 2 O, zirconium oxychloride hydrate _{(ZrOCl 2 · H 2 O)} , lithium nitrate (LiNO _3), lithium acetate (CH ₃ COOLi) , Tin chloride hydrate (SnCl ₄ nH ₂ O), indium nitrate hydrate (In (NO ₃ ) ₃ nH ₂ O), indium chloride hydrate (InCl ₂ nH ₂ O), 12- tungstoic acid (H ₃ PW ₁₂ O ₄₀ ), 12-tungstosilonic acid (H ₄ SiW ₁₂ O ₄₀ ), and the like. These can be used in one or in combination of two or more.

The content of the soluble substance added to the hard coating solution is 10 to 50 parts by weight, preferably 18 to 40 parts by weight, based on 100 parts by weight of the coating liquid. When the soluble material is added in an amount of 10 parts by weight or less, there is a problem in that the nano-porous layer is not sufficiently formed so that the low refractive effect and the surface reflection prevention effect are lowered. In addition, if the content is 50 parts by weight or more, there is a problem that scratch resistance and transmittance are lowered due to the remaining of the coating surface of the soluble material and the formation of micro voids. It is preferable that the refractive index of the porous layer is smaller than the refractive index of the hard coating layer, but is not limited, but is within the range of 1.25 to 1.45 and the reflectance is 2% or less. The refractive index of the porous layer can be adjusted by adjusting the porosity.

Next, by dissolving all or part of the soluble material with a solvent to form a pore in the coating layer for the porous layer to form a porous layer (S30). The film prepared above is not limited but immersed for 1 to 60 minutes, preferably 5 to 15 minutes at a solvent temperature of 25 to 80 ° C. to dissolve and extract the soluble material, and then 1 to 10 minutes at 60 to 150 ° C. Drying to prepare a low reflection film according to an embodiment of the present invention.

In the group consisting of solvents such as water, alcohols (methanol, ethanol, isopropanol, butanol, etc.), ketones (methyl ethyl ketone, methyl butyl ketone, methyl isobutyl ketone, diethyl ketone, dipropyl ketone, etc.) One or more may be selected.

Hereinafter, the present invention will be described in detail through examples. Embodiments of the present invention are only specific examples, and are not intended to limit or limit the protection scope of the present invention.

<Example 1>

The hard coating solution (Product Name: DN-0080, product company: DSM) is coated on a triacetyl cellulose film (hereinafter referred to as TAC film), heat-dried at 70 ° C. for 1 minute, and then UV light of 700 mJ / cm 2 using a high pressure mercury lamp. Irradiation cured. As the coating liquid for the porous layer, a polyacrylic acid content of 20 wt% was mixed with a hard coating liquid (product name: DN-0080, product company: DSM). The coating solution for the mixed porous layer was coated with a thickness of 110 nm on the TAC film on which the hard coating layer was formed, followed by heat drying at 70 ° C. for 1 minute, and curing by irradiating 700 mJ / cm 2 UV light using a high pressure mercury lamp. The prepared film was left to stand at a temperature of 50 ° C. for 10 minutes using water as a solvent, and the polyacrylic acid was removed and dried at 80 ° C. for 5 minutes to form a porous layer to prepare a low reflection film. The size of the formed pores was about 50 nm.

<Example 2>

The coating solution for the porous layer was prepared in the same manner as in Example 1 except that the polyacrylic acid content was 25% by weight and mixed with a hard coating solution (product name: DN-0080, manufactured by DSM).

<Example 3>

The coating solution for the porous layer was prepared in the same manner as in Example 1, except that the polyacrylic acid content was mixed with a hard coating solution (product name: DN-0080, product company: DSM).

<Example 4>

The coating solution for the porous layer was prepared in the same manner as in Example 1 except that the polyacrylic acid content was 35% by weight and mixed with a hard coating solution (product name: DN-0080, manufactured by DSM).

Example 5

A hard coating solution (product name: DN-0080, product company: DSM) was coated on a triacetyl cellulose film (hereinafter referred to as TAC film), heat-dried at 70 ° C. for 1 minute, and then UV cured. The coating liquid for the porous layer was mixed with a hard coating liquid (product name: DN-0080, manufactured by DSM) in an amount of 20 wt% of 12- tungstophosphoric acid. The mixed coating solution for the porous layer was coated with a thickness of 110 nm on the TAC film on which the hard coating layer was formed, followed by heat drying at 70 ° C. for 1 minute, followed by ultraviolet curing. The prepared film was left for 10 minutes at 50 ° C. using ethanol as a solvent, 12-tungstoic acid was removed, dried at 80 ° C. for 5 minutes, and a porous layer was formed to prepare a low reflection film. The size of the formed voids was about 40 nm.

Comparative Example 1

The hard coating solution (product name: DN-0080, product company: DSM) was coated on the TAC film, heat dried at 70 ° C. for 1 minute, and then UV cured, and the porous layer was excluded.

Comparative Example 2

The coating solution for the porous layer was prepared in the same manner as in Example 1 except that the polyacrylic acid content was 7 wt% and mixed with the hard coating solution (product name: DN-0080, product company: DSM).

Experimental Example

The low reflection film prepared in Examples and Comparative Examples was measured for physical properties as follows, the results are shown in Table 1 below.

(1) refractive index and porosity

Using a spectroscopic ellipsometer (Elli-SE, Korea Ellipso Technology Co., Ltd.) to measure the reflected light in the incident angle of 60 degrees, photon energy 1.20 ~ 4.80eV region to determine the refractive index and porosity of the porous layer prepared in Examples and Comparative Examples Measure

(2) transmittance and haze

The total light transmittance and haze of the low reflection films prepared in Examples and Comparative Examples were measured using a spectrophotometer (HZ-1, Japanese SUGA).

Total light transmittance (%)

5: 95% or more

4: 93% or more

3: 90% or more

2: more than 85%

1: 80% or more

(3) reflectance

The reflectance of the low reflection film prepared in the above Examples and Comparative Examples was measured using a UV spectrometer (UV-Spectrophotometer, SHIMADZU, Japan). The wavelength region measures the visible light region of 380 ~ 780nm. The minimum reflectance (%) of the low reflection film was obtained from the obtained reflectance spectrum.

(4) pencil hardness

Using a pencil hardness tester (PHT, Korea Stone Science) is applied to 500g load and measure the pencil hardness of the low reflection film prepared in Examples and Comparative Examples.

Pencils are made from Mitsubishi products and are used five times per pencil hardness.

If there are more than one, exclude them from the specification.

Kiss: 0 OK

Kiss: 1 OK

Ges: 2 or more NG

(5) scratch resistance

The scratch resistance of the low-reflection films prepared in Examples and Comparative Examples was tested by reciprocating 10 times under 1 kg / (2 cm × 2 cm) using a steel wool tester (WT-LCM100, PROTECH Korea).

Steel wool uses # 0000.

A: 0 scratches

A ': 1 to 10 scratches

B: 11 to 20 scratches

C: 21 to 30 scratches

D: 31 or more scratches

(6) adhesion

After drawing 11 straight lines each 1 vertically and horizontally on the surface of the low reflection film prepared in Examples and Comparative Examples to make 100 squares, three peel tests were performed using a tape (CT-24, NICHIBAN, Japan) Proceed. Test three 100 squares and record the average.

The adhesion is recorded as follows.

Adhesion = n / 100

n: number of rectangles that do not peel out of the entire rectangle

100: total number of squares

Therefore, if none were peeled off, record 100/100.

(7) pore size

The pore size is measured by FE-SEM (S4300, Hitachi, Japan).

TABLE 1

Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Soluble content (% by weight) 20 25 30 35 20 - 7 Low refractive index layer refractive index (%) 1.41 1.38 1.36 1.32 1.40 - 1.48 Low Refractive Index Porosity (%) 19 23 29 37 18 - 4 Total light transmittance (%) 4 4 4 5 4 3 3 Haze (%) 0.4 0.3 0.4 0.4 0.3 0.3 0.4 reflectivity(%) 1.9 1.6 1.1 0.6 1.9 4.1 3.9 Pencil hardness 5H 4H 4H 4H 5H 5H 5H Scratch resistance A A A A A A A Adhesion 100/100 100/100 100/100 100/100 100/100 100/100 100/100 Low refractive index pore size (nm) 30-50 30-50 30-50 30-50 30-50 - 30-50

As described above, the low reflection film and the method for manufacturing the same according to the present invention form a coating layer by adding a soluble material, and then dissolved and extracted in a solvent to prepare a porous layer, the surface hardness is very excellent, the surface reflection is 2 Excellent antireflection performance of less than%. In addition, by controlling the refractive index freely in accordance with the amount of the soluble substance, it is easy to control the reflectance, and a low-reflection film having a low manufacturing cost can be manufactured using a low-cost material.

Claims (9)

A low reflection film comprising a hard coating layer formed on the transparent base film and a porous layer formed on the hard coating layer. According to claim 1, wherein the porous layer is a low reflection film, characterized in that the porosity is in the range of 10 to 50%. The low reflection film of claim 1, wherein the porous layer has a lower refractive index than the hard coating layer, and has a refractive index within a range of 1.25 to 1.45 and a reflectance of 2% or less. The low reflection film of claim 1, wherein the hard coating layer has a surface hardness of 2H or more. According to claim 1, wherein the pores of the porous layer is a low reflection film, characterized in that the nano-size of 10 ~ 70 nm. Forming a hard coating layer on at least one side of the transparent substrate film; Forming a coating layer for the porous layer by applying a coating solution including a soluble material on the hard coating layer; And Dissolving all or part of the soluble material with a solvent to form a porous layer. The method of claim 6, wherein the soluble material is selected from at least one of an organic material and an inorganic material dissolved in at least one of water, an alcohol, and a ketone solvent. The method of manufacturing a low reflection film according to claim 7, wherein the optical property is controlled according to a change in the content of the soluble material. The method of claim 6, wherein the content of the soluble material is 10 to 50 parts by weight based on 100 parts by weight of the coating liquid containing the soluble material.

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