KR20070077089A - Coating method, coating apparatus and memory medium - Google Patents

Abstract

A coating method, a coating apparatus, and a memory medium are provided to improve a film thickness control and coating quality by sucking back a treatment liquid on a substrate through a nozzle located at an injection termination position. A substrate supporter(76) supports a substrate(G) to be processed, horizontally. A long-shaped nozzle(78) injects a treatment liquid onto an upper surface of the substrate with a minute gap spaced away therefrom. A treatment liquid source supplies the treatment liquid to the nozzle. An injection unit moves the nozzle in a horizontal direction with respect to the substrate. An elevation unit elevates the nozzle in vertical direction with respect to the substrate. A controller controls the injection unit to position the nozzle at a preset injection termination position. The controller controls the nozzle positioned at the preset injection termination position to suck-back the treatment liquid residing on the substrate with a preset amount.

Description

Coating method, coating device and storage medium {COATING METHOD, COATING APPARATUS AND MEMORY MEDIUM}

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing the configuration of an applicable coating and developing treatment system of the present invention.

FIG. 2 is a flow chart showing the procedure of the process in the coating and developing processing system of FIG.

Fig. 3 is a schematic plan view showing the overall configuration of a resist coating unit and a reduced pressure drying unit in the first embodiment of the present invention mounted on the coating and developing processing system of Fig. 1;

Fig. 4 is a perspective view showing the overall configuration of a resist coating unit in the first embodiment of the present invention.

Fig. 5 is a schematic front view showing the overall configuration of a resist coating unit in the first embodiment of the present invention.

Fig. 6 is a plan view showing an example of an arrangement pattern of a jet port and a suction port in a stage application area in the resist coating unit.

FIG. 7 is a partial cross-sectional schematic side view showing the structure of a substrate transfer part in the resist coating unit. FIG.

Fig. 8 is an enlarged sectional view showing the configuration of the holding portion of the substrate transfer portion in the resist coating unit.

Fig. 9 is a perspective view showing the structure of a pad portion of the substrate transfer portion in the resist coating unit.

Fig. 10 is a perspective view showing one modification of the holding portion of the substrate transfer portion in the resist coating unit.

Fig. 11 is a diagram showing the configuration of a nozzle raising mechanism, a compressed air supply mechanism and a vacuum supply mechanism in the resist coating unit.

Fig. 12 is a diagram showing the configuration of a resist liquid supply mechanism in the resist coating unit.

Fig. 13 is a block diagram showing the main configuration of the control system in the resist coating unit.

Fig. 14 is a side view showing one step of coating injection in the first embodiment of the present invention.

Fig. 15 is a timing chart showing time characteristics (first example) of main parameters of the end of the coating scan in the first embodiment of the present invention.

Fig. 16 is a partial cross-sectional side view showing the action of one step of the application scanning end in the first embodiment of the present invention.

Fig. 17 is a partial sectional side view showing the action of one step of the application scanning end in the first embodiment of the present invention.

Fig. 18 is a partial sectional side view showing a state at the end of coating scan in the first embodiment of the present invention.

Fig. 19 is a partial sectional side view showing a state of a resist coating film at the time of completion of color back in the first embodiment of the present invention.

20 is a partial cross-sectional side view showing the action of one stage immediately before the end of the coating scan in the comparative example.

21 is a partial cross sectional side view showing a state at the end of coating scan in a comparative example.

Fig. 22 is a partial cross sectional side view showing a state of the resist coating film at the end of color back in a comparative example.

Fig. 23 is a timing chart showing the time characteristic (second example) of main parameters of the end of the coating scan in the first embodiment of the present invention.

Fig. 24 is a partial cross-sectional side view showing the action of one step of the application scanning end in the first embodiment of the present invention.

Fig. 25 is a partially enlarged cross-sectional view showing the action of one step of the application scanning end in the first embodiment of the present invention.

Fig. 26 is a partially enlarged plan view showing the action of one step immediately before the end of the coating scan in the first embodiment of the present invention.

Fig. 27 is a partially enlarged plan view showing a state immediately before the end of the coating scan in the first embodiment of the present invention.

Fig. 28 is a partially enlarged plan view showing a state immediately before completion of the coating scan in a comparative example.

Fig. 29 is a diagram showing a comparison of the film thickness profile of the resist coating film at the coating scanning end portion on the substrate with the example and the comparative example.

Fig. 30 is a timing chart showing the time characteristic (third example) of main parameters of the end of the coating scan in the first embodiment of the present invention.

Fig. 31 is a schematic plan view showing an entire structure of a resist coating unit and a reduced pressure drying unit in the coating and developing processing system of the second embodiment of the present invention.

32 is a perspective view showing an entire structure of a resist coating unit in the embodiment;

Fig. 33 is a schematic front view showing the overall configuration of a resist coating unit in the embodiment.

Fig. 34 is a partial sectional schematic side view showing the structure of a substrate transfer part in the resist coating unit.

Fig. 35 is a diagram showing the configuration of the nozzle raising mechanism, the compressed air supply mechanism and the vacuum supply mechanism in the resist coating unit.

Fig. 36 is a block diagram showing the main configuration of the control system in the resist coating unit.

Fig. 37 is a timing chart showing the time characteristic (first example) of main parameters of the end of the coating scan in the embodiment;

FIG. 38 is a partial cross-sectional side view showing the operation of one step of the application scanning end in the embodiment; FIG.

FIG. 39 is a partial cross-sectional side view showing the action of one step of the application scanning end in the embodiment; FIG.

40 is a partial cross-sectional side view showing a state at the end of coating scan in an embodiment.

Fig. 41 is a partial cross sectional side view showing a state of a resist coating film at the time of completion of color back in the embodiment.

Fig. 42 is a timing chart showing the time characteristic (second example) of main parameters of the end of coating scan in the embodiment.

Fig. 43 is a partial cross sectional side view showing the action of one step of the application scanning end in the embodiment;

Fig. 44 is a diagram showing a comparison of the film thickness profile of the resist coating film at the coating scan end portion on the substrate with the example and the comparative example.

45 is a flowchart showing the procedure of the main steps constituting one cycle of the sheet | leaf application process in embodiment.

Fig. 46 is a schematic diagram showing a procedure of main steps constituting one cycle of the sheet | leaf application process in embodiment.

Fig. 47 is a longitudinal sectional view showing a specific configuration example of a resist nozzle used in the embodiment.

Fig. 48 is a longitudinal cut showing the action of the nozzle air discharge operation in the embodiment;

Fig. 49 is a partial cross sectional side view showing the structure of a nozzle standby portion in the resist coating unit.

Fig. 50 is a partial cross sectional side view showing a priming treatment in the resist coating unit.

Fig. 51 is a sectional view showing a liquid film formed at a lower end portion of a resist nozzle by a priming process;

Fig. 52 is a perspective view showing the liquid state when the long resist nozzle is lowered to the application start position on the substrate after the priming treatment;

Fig. 53 is a partial cross sectional side view showing a film thickness state of a resist coating film formed at the coating scanning start portion in the embodiment.

Fig. 54 is a graph showing data obtained by measuring the film thickness of a resist coating film formed at the coating scanning start portion in the embodiment.

<Explanation of symbols for the main parts of the drawings>

40: resist coating unit (CT)

75: nozzle lifting mechanism

76: stage

78: resist nozzle

84 substrate transfer unit

88: spout

90: suction port

100: conveying drive unit

102: holding portion

104: adsorption pad

122: position sensor

138: electric motor

144: air cylinder

146: compressed air supply mechanism

148: vacuum supply mechanism

170: resist liquid supply mechanism

176: resist pump

196: resist liquid supply control unit

200: controller

246: Cavity

250: discharge passage

M ₁ : Import area

M ₃ : application area

M ₅ : export area

[Document 1] Japanese Unexamined Patent Publication No. 10-156255

The present invention relates to a coating method, a coating apparatus and a storage medium for forming a coating film of a processing liquid on a substrate to be processed using an elongated nozzle.

In the photolithography process in the manufacturing process of a flat panel display (FPD) such as an LCD, a spinless coating for applying a resist liquid onto a target substrate (such as a glass substrate) by scanning a long resist nozzle having a slit discharge port Law is often used.

Such a spinless coating method loads a substrate horizontally on a mounting table or a stage, for example, as disclosed in Japanese Patent Application Laid-open No. Hei 10-156255, between the substrate on this stage and the discharge port of the long resist nozzle. A fine gap of several hundred micrometers or less is set, and the resist liquid is discharged and coated on a substrate in a strip shape while moving the resist nozzle in the scanning direction (generally the horizontal direction orthogonal to the nozzle longitudinal direction) above the substrate. By only moving the long resist nozzle from one end of the substrate to the other end once, a resist coating film can be formed on the substrate at a desired film thickness without flowing the resist liquid out of the substrate.

The conventional spinless coating method has room for improvement in the film thickness control of a resist coating film, and especially the in-plane uniformity is a subject. Specifically, the resist liquid in the resist nozzle is discharged in a state where the resist liquid in the resist nozzle is connected to the resist liquid film on the substrate only by stopping the pump of the resist liquid supply source at the end of the coating scan and then retreating the resist nozzle to the outside or above the substrate. Since the liquid is subsequently broken off, there is a problem that the resist coating film is easily raised at the rear end of the substrate in the coating scanning direction.

In general, a margin area of a predetermined width is set at the periphery of the upper surface of the substrate (to-be-processed surface), and a device is formed in the product area inside the margin area. Therefore, in the resist coating process, the product region is a guarantee region which should guarantee the film thickness of the resist coating film, and the film thickness of the resist coating film may be suppressed within a predetermined allowable range in the entire region of the guarantee region, and within the margin margin area. Even if the bumps exceed the allowable range, the film thickness profile of the resist coating film does not become poor.

However, since the peripheral resist applied to the margin area may cause particles, the peripheral resist is removed in a later step using a peripheral exposure machine or the like. However, when the film thickness of a resist is large, it may not be able to remove it completely, In this respect, the rise of the resist coating film in the above-mentioned application | coating scan end part becomes a problem.

In order to suppress the rise of the resist coating film at such a coating scan end, the end position of the coating scan is set on the substrate, and the resist nozzle is stopped there once, and the pump of the resist liquid supply source is reversed under the nozzle stop or stop state. The so-called color-white method which absorbs a resist liquid from a board | substrate by doing so has conventionally been performed.

By the way, when the color white method is used under the prior art, the thinning of the resist coating film due to absorption of the resist liquid via the resist nozzle does not remain in the margin region but extends to the film thickness assurance region, and the resist film thickness in the film thickness assurance region is a set value. Or it might fall to below the allowable range.

Alternatively, the air (air) in the atmosphere is very small at the time of color back, but is sucked into the resist nozzle together with the resist liquid on the substrate, and this causes the resist film thickness of the coating scanning start portion to be repeated the number of times of treatment in the single-sheet continuous coating process. There was also a problem that significantly decreased during the process. That is, the long resist nozzle has a cavity which forms a buffer chamber for buffering or storing the resist liquid transferred from the resist liquid supply source once in the nozzle in order to equalize the discharge pressure in the slit-type discharge port, and discharge from the cavity. Until then, a slit discharge passage having the same gap size as the discharge port is provided. As described above, when the air sucked in the discharge port of the resist nozzle together with the resist liquid on the substrate at the time of color back enters the inner cavity through the discharge passage, it diffuses therein and mixes with the resist liquid in the room. If the number of times of continuous coating treatment, ie, the number of color whites, is repeated, the amount of air mixture also increases. Then, when the pump of the resist liquid supply source is started at the start of the coating scan, the discharge pressure from the pump is lowered by the mixed air in the cavity (air mixing occurs), whereby the sudden rise until the set pressure is reached. It becomes slow, and as a result, the resist coating film of an application | coating scanning start part becomes thin.

Accordingly, an object of the present invention is to provide a coating method and a coating apparatus for improving the coating quality by improving the film thickness controllability near the coating scanning end portion in the spinless coating method using an elongated nozzle.

Another object of the present invention is to provide a coating method and a coating apparatus for improving the coating quality by improving the film thickness controllability when the color white method is used in the spinless coating method using an elongated nozzle.

It is still another object of the present invention to provide a storage medium storing such a coating treatment program.

In order to achieve the above object, in the first coating method of the present invention, the discharge port of the substrate to be processed and the nozzle having an elongated shape is substantially horizontally opposed to each other with a small gap therebetween so that the processing liquid from the nozzle with respect to the substrate is removed. A coating method for forming a coating film of the processing liquid on the substrate by applying a coating scan to move the nozzle in a relatively horizontal direction while supplying the step, and setting a scanning end position for relatively stopping the nozzle on the substrate. And, at the end of the coating scan, raise the speed of the relative horizontal movement of the nozzle relative to the substrate once from the first horizontal movement speed to a second horizontal movement speed higher than that, and then substantially from the second horizontal movement speed. The nozzle is positioned at the scanning end position by decreasing it to a third horizontal movement speed equal to zero. A step of reducing the gap between the substrate and the nozzle from the first distance interval to a second distance interval smaller than that at the end of the coating scan, and from the nozzle after the end or the end of the coating scan. The process of stopping supply of the process liquid to the said board | substrate, and the process of absorbing the process liquid on a said board | substrate by a predetermined amount in the said nozzle located at the said scanning end position.

The first coating device of the present invention includes a substrate support for supporting a substrate to be processed substantially horizontally, an elongated nozzle for discharging the processing liquid through a small gap on the upper surface of the substrate during coating scanning, and coating A processing liquid supply source for feeding the processing liquid to the nozzle during scanning, a scanning portion for moving the nozzle in a horizontal direction relative to the substrate during the coating scan, and a nozzle in the vertical direction relative to the substrate A lifter for moving the tool, and the scanning part is controlled to raise the speed of the relative horizontal movement of the nozzle with respect to the substrate at the end of the coating scan once from the first horizontal movement speed to a second horizontal movement speed higher than that; Then a predetermined deceleration from the second horizontal moving speed to a third horizontal moving speed substantially equal to zero To reduce the rate to position the nozzle at a preset scanning end position, to control the elevation, and to close the gap between the substrate and the nozzle from the first distance interval to a second distance interval smaller than that at the end of the coating scan. To control the processing liquid supply source, to stop the feeding of the processing liquid to the nozzle after the end or the end of the coating scan, and to dispense a predetermined amount of the processing liquid on the substrate through the nozzle located at the scanning end position. It has a control unit to absorb as much.

The first storage medium of the present invention is relatively horizontal with the discharge port of the substrate to be processed and the elongated nozzle facing substantially horizontally with a small gap therebetween while supplying the processing liquid from the nozzle to the substrate. A storage medium for storing a coating processing program operating on a computer for performing a coating scan to move in a direction to form a coating film of the processing liquid on the substrate, wherein the program causes the nozzle to be relatively stopped on the substrate. Setting a scan end position, and raising the speed of relative horizontal movement of the nozzle relative to the substrate at the end of the application scan once from a first horizontal movement speed to a second horizontal movement speed higher than that, and subsequently Decreasing from the second horizontal movement speed to a third horizontal movement speed that is substantially equal to zero Positioning the nozzle at the scanning end position, and reducing the gap between the substrate and the nozzle at a predetermined vertical movement speed from the first distance interval to a smaller second distance interval at the end of the application scan. Stopping the supply of the processing liquid to the substrate from the nozzle after the end or the end of the coating scan, and absorbing the processing liquid on the substrate by a predetermined amount in the nozzle located at the scanning end position. The computer executes the steps.

In the first coating method, the coating apparatus, and the storage medium, the elongated nozzle moves relatively in the horizontal direction while discharging the processing liquid onto the substrate through a small gap in a strip shape, thereby moving the substrate from the front end side of the substrate in the scanning direction. The coating film of the processing liquid is formed toward the rear end side. During this coating scan, the treatment liquid discharged onto the substrate is attached to the lower back side of the nozzle in the scanning direction by the wet phenomenon and extends in the height direction (ridge) to form a meniscus extending in the nozzle longitudinal direction. Then, the area where the film thickness of the coating film should be ensured inside the boundary at the end of the coating scan at a predetermined scanning position or timing (preferably, a position offset by a predetermined distance from the outer peripheral edge of the substrate to the substrate center side). Treatment of the meniscus that has been attached or followed by the lower back of the nozzle until the scanning speed is increased (in a rapid acceleration) at a time when the nozzle passes near the boundary in the direction of coating scanning. The liquid ridge is separated from the nozzle and is removed behind the nozzle in the scanning direction. Immediately after the end of the scan, the nozzle is absorbed by the nozzle at the scanning end position on the substrate, i.e., the color is subjected to color back, thereby removing the extra processing liquid from the coated scan end part, and then removing the influence of the color back (absorption effect). The offset at the ridge prevents the film thickness in the film thickness assurance area on the substrate from outside the allowable range.

According to the second coating method of the present invention, the discharge port of the substrate to be processed and the elongated nozzle are substantially horizontally opposed to each other with a small gap therebetween, and the nozzle is supplied in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. A coating method of forming a coating film of the processing liquid on a substrate by performing a coating scan to be relatively moved, the step of setting a scanning end position for relatively stopping the nozzle on the substrate, and at the end of the coating scan. Reducing the speed of relative horizontal movement of the nozzle relative to the substrate from a first horizontal movement speed to a second horizontal movement speed substantially equal to zero, thereby positioning the nozzle at the scanning end position; In the end, the gap between the substrate and the nozzle is between the first distance and the second distance greater than that. Increasing once until then, and then decreasing from the second distance interval to a third distance interval smaller than the first distance interval, and supplying the processing liquid from the nozzle to the substrate after the end or the end of the coating scan. And a step of absorbing a predetermined amount of the processing liquid on the substrate by the nozzle located at the scanning end position.

The second coating device of the present invention includes a substrate support for supporting the substrate to be processed substantially horizontally, an elongated nozzle for discharging the processing liquid through a small gap on the upper surface of the substrate during the coating treatment, and the coating. A processing liquid supply source for feeding the processing liquid to the nozzle during the processing, a scanning portion for moving the nozzle in the horizontal direction relative to the substrate during the coating process, and the nozzle relative to the substrate in the vertical direction And a lifter for moving the tool, and controlling the scanning part to reduce the speed of the relative horizontal movement of the nozzle with respect to the substrate at the end of the coating scan from the first horizontal moving speed to a second horizontal moving speed that is substantially equal to zero. The nozzle is positioned at a preset scanning end position, and the lifting portion is controlled to end the coating scan. The gap between the substrate and the nozzle is once increased from a first distance interval to a second distance interval greater than that, and subsequently reduced from the second distance interval to a third distance interval less than the first distance interval, The processing liquid supply source is controlled to stop the feeding of the processing liquid to the nozzle after the end or the end of the coating scan, and to absorb a predetermined amount of the processing liquid on the substrate through the nozzle located at the scanning end position. Has a control unit.

Further, the second storage medium of the present invention horizontally faces the nozzle to be processed and the nozzle of the elongated nozzle to be substantially horizontally opposed to each other with a small gap therebetween while supplying the processing liquid from the nozzle to the substrate. Is a storage medium that stores a coating processing program operating on a computer for performing a coating scan that moves relatively in a direction to form a coating film of the processing liquid on the substrate, wherein the program is configured to relatively move the nozzle on the substrate. Setting a scanning end point position to stop, and reducing the speed of the relative horizontal movement of the nozzle relative to the substrate at the end of the application scan from the first horizontal movement speed to a second horizontal movement speed that is substantially equal to zero; Positioning a nozzle in the injection end position, and at the end of the application scan Once increasing the gap between the substrate and the nozzle from a first distance interval to a second distance interval greater than that, and subsequently decreasing from the second distance interval to a third distance interval less than the first distance interval, Stopping supply of the processing liquid to the substrate from the nozzle after the end or the end of the coating scan, and absorbing the processing liquid on the substrate by a predetermined amount into the nozzle located at the scanning end position. To run.

In the second coating method, the coating device, and the storage medium, an elongated nozzle moves relatively in the horizontal direction while discharging the processing liquid onto the substrate through a small gap in a band shape, whereby the front end side of the substrate in the scanning direction. The coating film of the processing liquid is formed from the side toward the rear end side. During this coating scan, the treatment liquid discharged onto the substrate is attached to the lower back side of the nozzle in the scanning direction by the wet phenomenon, and extends in the height direction (ridges), and a meniscus is formed extending in the nozzle length direction. Then, at the end of the coating scan, a region at which the film thickness of the coating film should be guaranteed inside the boundary at a predetermined scanning position or timing (preferably, a position offset by a predetermined distance from the outer peripheral edge of the substrate to the substrate center side). And the coating gap is instantaneously increased at the timing at which the nozzle passes near the boundary in the direction of the coating scan, whereby the side edges of the processing liquid are cut inward and the film thickness is increased accordingly. Thereby, even if it immediately reduces the scanning speed and reduces the coating gap between the nozzle and the substrate immediately afterwards, expansion of the side direction of the coating film near the boundary between the product region and the non-product region in the scanning direction on the substrate is achieved. Can be prevented or suppressed. Immediately after the end of the scan, the nozzle is absorbed by the nozzle at the scanning end position on the substrate, i.e. color whitening is performed to remove the excess treatment liquid of the coating scan end portion, and then the influence of the color back (absorption effect) is removed from the cutout portion. By canceling out, the film thickness of the process liquid in the film thickness assurance area | region on a board | substrate is prevented from becoming outside the permissible range.

According to the third coating method of the present invention, the nozzles are moved in the horizontal direction while the discharge port of the substrate to be processed and the nozzle having an elongated shape are opposed to each other substantially horizontally with a small gap therebetween while supplying the processing liquid from the nozzle to the substrate. A coating method of forming a coating film of the treatment liquid on the substrate by performing scanning to move relatively, the step of setting a scanning end position for relatively stopping the nozzle on the substrate, and at the end of the coating scan. The speed of the relative horizontal movement of the nozzle relative to the substrate is once raised from the first horizontal movement speed to a second horizontal movement speed higher than that, and then the third horizontal movement is substantially equal to zero from the second horizontal movement speed. Reducing the speed to position the nozzle at the scanning end position; and In half, the gap between the substrate and the nozzle is once enlarged from a first distance interval to a second distance interval greater than that and subsequently reduced from the second distance interval to a third distance interval less than the first distance interval. Stopping the supply of the processing liquid from the nozzle to the substrate after the end or the end of the coating scan, and absorbing the processing liquid on the substrate by a predetermined amount to the nozzle located at the scanning end position. Has a process.

The third coating device of the present invention includes a substrate support for supporting a substrate to be processed substantially horizontally, an elongated nozzle for discharging the processing liquid through a small gap on the upper surface of the substrate during coating scanning, and coating A processing liquid supply source for feeding the processing liquid to the nozzle during scanning, a scanning portion for moving the nozzle in a horizontal direction relative to the substrate during the coating scan, and a nozzle in the vertical direction relative to the substrate A lift section for moving the surface, and the scan section controls the scanning section to raise the speed of the relative horizontal movement of the nozzle with respect to the substrate at the end of the coating scan once from the first horizontal movement speed to a second horizontal movement speed higher than that; Continually decreasing from the second horizontal movement speed to a third horizontal movement speed that is substantially equal to zero, The nozzle is positioned at a preset scanning end position, and the lifting portion is controlled to increase the gap between the substrate and the nozzle once from the first distance interval to a second distance interval larger than that at the end of the coating scan. From the second distance interval to a third distance interval smaller than the first distance interval, to control the processing liquid supply source to stop the feeding of the processing liquid to the nozzle after the end or the end of the coating scan, and And a control unit for absorbing a predetermined amount of the processing liquid on the substrate through the nozzle located at the scanning end position.

Further, in the third storage medium of the present invention, the nozzles are horizontally opposed to the substrate to be processed and the ejection openings of the elongated nozzles are substantially horizontally faced with a small gap therebetween while supplying the processing liquid from the nozzles to the substrate. Is a storage medium in which a coating processing program operating on a computer is stored to form a coating film of the processing liquid on the substrate by performing scanning to move relatively in the direction, wherein the program relatively stops the nozzle on the substrate. Setting the scanning end point position to be made; once the speed of the relative horizontal movement of the nozzle with respect to the substrate at the end of the coating scan is raised from the first horizontal movement speed to a second horizontal movement speed higher than that, and then Decreasing from the second horizontal moving speed to a third horizontal moving speed that is substantially equal to zero Turning the nozzle into position at the scanning end position, and at the end of the coating scan, increase the gap between the substrate and the nozzle once from a first distance interval to a second distance interval greater than that, and subsequently Decreasing from a second distance interval to a third distance interval smaller than the first distance interval, stopping supply of the processing liquid from the nozzle to the substrate after the end or the end of the coating scan, and scanning The computer performs the step of absorbing a predetermined amount of the processing liquid on the substrate by the nozzle located at the end position.

In the third coating method, the coating device and the storage medium, a film thickness control method by acceleration and deceleration of the scanning speed in the first coating method, the coating device and the coating processing program, and the second coating method, the coating device and the storage medium. Since the film thickness control method by the increase and decrease of the application | coating gap of is used together, the film thickness uniformity in the product area | region on a board | substrate can be improved further by both synergistic effects.

In the first to third coating methods, in order to expand the processing liquid at the coating scanning end and to increase the stability and reproducibility of the film thickness, the processing liquid after a predetermined time has elapsed since the nozzle was positioned at the scanning end position. May be initiated.

In the said 1st thru | or 3rd coating apparatus, it can be comprised so that a board | substrate support part may have a stage which floats a board | substrate in air in an application | coating area | region. Moreover, in the said application | coating area | region, it can be set as the structure provided with the mixture of the blowing port which blows gas in and the suction port which inhales gas on the upper surface of a stage. Moreover, the said board | substrate conveyance part which arrange | positions in the fixed position in an application | coating area | region in the horizontal conveyance direction, and conveys the board | substrate of the state which the said scanning part floated on the stage to the predetermined conveyance direction corresponding to a horizontal movement, and passes underneath a nozzle It can be set as having a structure. The substrate conveyance part includes a guide rail disposed on one side or both sides of the stage so as to extend in parallel with the direction in which the substrate moves, a slider movable along the guide rail, a conveyance drive part that drives the slider to move along the guide rail; It can be set as the structure which has the holding part which extends toward the center part of a stage from a slider and detachably holds the side edge part of a board | substrate.

Further, in the first to the third coating device, the lifting unit is coupled to the nozzle support unit for integrally supporting the nozzle, and the nozzle support unit for moving the nozzle up and down from any first height position to any second height position. It can be set as the structure which has an electric actuator to which it is made, and the air cylinder couple | bonded with the said nozzle support part in order to cancel the gravity of a nozzle.

In the fourth coating method of the present invention, the discharge port of the substrate to be processed and the elongated nozzle are substantially horizontally opposed to each other with a small gap therebetween, so that the nozzle is relatively horizontal while discharging the processing liquid from the nozzle with respect to the substrate. A coating method for forming a coating film of the processing liquid on the substrate by performing a coating scan to move in a direction, the step of setting a scanning end position for relatively stopping the nozzle on the substrate, and at the end of the coating scan. Reducing the speed of relative horizontal movement of the nozzle relative to the substrate from a first horizontal movement speed to a second horizontal movement speed substantially equal to zero, thereby positioning the nozzle at the scanning end position; In the end, the gap between the substrate and the nozzle has a second distance smaller than that from the first distance interval. Reducing the distance to the interval; and increasing the rate of discharging the processing liquid from the nozzle at the end of the coating scan once from the first discharge rate to a second discharge rate larger than that, and then decreasing from the second discharge rate. And a step of stopping the supply of the processing liquid and absorbing the processing liquid on the substrate by a predetermined amount in the nozzle located at the scanning end position.

The fourth coating device of the present invention includes a substrate support for supporting the substrate to be processed substantially horizontally, an elongated nozzle for discharging the processing liquid through a small gap on the upper surface of the substrate during coating scanning, and coating A processing liquid supply source for feeding the processing liquid to the nozzle during scanning, a scanning portion for moving the nozzle in a horizontal direction relative to the substrate during the coating scan, and a nozzle in the vertical direction relative to the substrate And a lifter for moving the tool, and controlling the scanning part to reduce the speed of the relative horizontal movement of the nozzle with respect to the substrate at the end of the coating scan from the first horizontal moving speed to a second horizontal moving speed that is substantially equal to zero. The nozzle to be positioned at the scanning end position, and the lifting portion is controlled to terminate the coating scan. Reduces the gap between the substrate and the nozzle from the first distance interval to a second distance interval smaller than that, and controls the processing liquid supply source to reduce the ratio of discharging the processing liquid from the nozzle at the end of the coating scan. It is increased from one discharge ratio to a second discharge ratio larger than that, and subsequently decreased from the second discharge ratio to stop the supply of the processing liquid, and on the substrate via the nozzle located at the scanning end position. And a control unit for absorbing the processing liquid by a predetermined amount.

Further, the fourth storage medium of the present invention allows the nozzle to be discharged to the substrate and the nozzle of the elongated shape to be substantially horizontally opposed to each other with a small gap therebetween so as to supply the treatment liquid from the nozzle to the substrate. Is a storage medium storing a coating processing program operating on a computer for forming a coating film of the processing liquid on the substrate by carrying out a scanning scan to move in the horizontal direction. Setting the end point of the scanning end to be stopped; and reducing the speed of the relative horizontal movement of the nozzle relative to the substrate at the end of the application scan from the first horizontal movement speed to a second horizontal movement speed that is substantially equal to zero. Positioning the nozzle at the injection end position, and at the end of the application scan Reducing the gap between the substrate and the nozzle from a first distance interval to a second distance interval smaller than that, and the rate of discharging the processing liquid from the nozzle at the end of the coating scan is greater than that from the first discharge ratio. Stopping the supply of the processing liquid by once increasing to a second discharge ratio and subsequently decreasing from the second discharge ratio, and absorbing the processing liquid on the substrate by a predetermined amount by the nozzle located at the scanning end position. The computer executes the steps.

In the fourth coating method, the coating apparatus, and the storage medium, the elongated nozzle moves relatively in the horizontal direction while discharging the processing liquid onto the substrate through a small gap in a strip shape, thereby moving the substrate from the front end side of the substrate in the scanning direction. The coating film of the processing liquid is formed toward the rear end side. Then, by increasing the processing liquid discharge ratio of the nozzle at a predetermined scanning position or timing at the end of the coating scan, a ridge is formed in the coating film on the substrate, preferably near the boundary between the film thickness guaranteed region and the non-guaranteed region. Immediately after the end of scanning, the processing liquid is absorbed by the nozzle at the scanning end position on the substrate, that is, color whitening is performed to remove the excess processing liquid from the coating scan end portion, and the influence of color back (absorption action) is melted at that time. By offsetting at the base, the film thickness in the film thickness assurance area on the substrate is prevented from going outside the allowable range. In this case, it can be set as the structure which makes a process liquid discharge ratio reach | attain a 2nd discharge ratio in the vicinity which a nozzle passes in the vicinity of the boundary of a film thickness guarantee area | region and a non-guaranteed area | region in the direction of an application | coating scan.

In the fifth coating method of the present invention, the discharge port of the substrate to be processed and the elongated nozzle are substantially horizontally opposed to each other with a small gap therebetween, so that the nozzle is relatively horizontal while discharging the processing liquid from the nozzle to the substrate. A coating method for forming a coating film of the processing liquid on the substrate by performing a coating scan to move in a direction, the step of setting a scanning end position for relatively stopping the nozzle on the substrate, and at the end of the coating scan. Reducing the speed of relative horizontal movement of the nozzle relative to the substrate from a first horizontal movement speed to a second horizontal movement speed substantially equal to zero, thereby positioning the nozzle at the scanning end position; In the end, the gap between the substrate and the nozzle has a second distance greater than that from the first distance interval. A step of increasing once to the interval, and subsequently decreasing from the second distance interval to a third distance interval smaller than the first distance interval, and a ratio of discharging the processing liquid from the nozzle at the end of the coating scan; A step of once increasing from the ratio to a second discharge ratio larger than that, then decreasing from the second discharge ratio to stop the supply of the processing liquid, and the processing liquid on the substrate at the nozzle located at the scanning end position It has a process of absorbing a predetermined amount.

The fifth coating device of the present invention includes a substrate support for supporting a substrate to be processed substantially horizontally, an elongated nozzle for discharging the processing liquid with a small gap on the upper surface of the substrate during the coating process, and the coating. A processing liquid supply source for feeding the processing liquid to the nozzle during the processing, a scanning portion for moving the nozzle in the horizontal direction relative to the substrate during the coating process, and the nozzle relative to the substrate in the vertical direction And a lifter for moving the tool, and controlling the scanning part to reduce the speed of the relative horizontal movement of the nozzle with respect to the substrate at the end of the coating scan from the first horizontal moving speed to a second horizontal moving speed that is substantially equal to zero. The nozzle to be positioned at the scanning end position, and the lifting portion is controlled to terminate the coating scan. Increasing the gap between the substrate and the nozzle once from a first distance interval to a second distance interval greater than that, and subsequently decreasing from the second distance interval to a third distance interval less than the first distance interval. And controlling the processing liquid supply source to increase the rate of discharging the processing liquid from the nozzle at the end of the coating scan from the first discharge ratio to a second discharge ratio larger than that, and then from the second discharge ratio. A control unit for reducing the supply of the processing liquid and absorbing the processing liquid on the substrate by a predetermined amount through the nozzle located at the scanning end position.

In the fifth storage medium of the present invention, the discharge port of the substrate to be processed and the elongated nozzle are substantially horizontally opposed to each other with a small gap therebetween, and the nozzle is supplied in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. A storage medium for storing a coating processing program operating on a computer for performing a relatively scanning coating scan to form a coating film of the processing liquid on the substrate, wherein the program causes the nozzle to be relatively stopped on the substrate. Setting a scan endpoint position, and reducing the speed of relative horizontal movement of the nozzle relative to the substrate at the end of the application scan from a first horizontal movement speed to a second horizontal movement speed that is substantially equal to zero. Positioning at the end point of the injection and at the end of the application scan Increasing the gap between the nozzle and the nozzle once from a first distance interval to a second distance interval greater than that, and subsequently decreasing from the second distance interval to a third distance interval less than the first distance interval, At the end of the coating scan, the rate of discharging the processing liquid from the nozzle is once increased from the first discharging ratio to the second discharging ratio larger than that, and subsequently reduced from the second discharging ratio to stop the supply of the processing liquid. And causing the computer to absorb a predetermined amount of the processing liquid on the substrate by the nozzle located at the scanning end position.

In the fifth coating method, the coating device, and the storage medium, the elongated nozzle moves relatively in the horizontal direction while discharging the processing liquid onto the substrate through a minute gap in a strip shape, thereby moving the substrate from the front end side of the substrate in the scanning direction. The coating film of the processing liquid is formed toward the rear end side. Then, at the end of the coating scan, the treatment liquid discharge ratio of the nozzle is increased at a predetermined scanning position or timing by one step, and preferably, a ridge is formed in the coating film on the substrate near the boundary between the film thickness guaranteed region and the non-guaranteed region. In addition, by temporarily increasing the discharging ratio and increasing the coating gap instantaneously, the side edges of the coating film are cut inward to increase the film thickness of the ridge. In this way, immediately after the reduction of the scanning speed and reduction of the coating gap between the nozzle and the substrate at the same time, expansion of the side direction of the coating film near the boundary between the guaranteed and non-guaranteed regions in the scanning direction on the substrate. Can be prevented or suppressed. Immediately after the end of the scan, the nozzle is absorbed by the nozzle at the scanning end position on the substrate, i.e. color whitening is performed to remove the excess treatment liquid of the coating scan end portion, and then the influence of the color back (absorption effect) is removed from the cutout portion. Offset prevents the film thickness of the processing liquid in the film thickness assurance region on the substrate from outside the allowable range. In one suitable aspect of the present invention, the gap is reached to the second distance interval in the vicinity of the nozzle passing near the boundary between the film thickness guaranteed region and the non-guaranteed region in the direction of coating scanning.

In the fourth and fifth coating methods, in order to expand the processing liquid at the coating scanning end and to increase the stability and reproducibility of the film thickness, absorption of the processing liquid is started from the position of the nozzle at the scanning end position. Until a predetermined delay time can be set.

In the fourth and fifth coating apparatuses, the air is separated from the processing liquid on the substrate immediately after the control unit finishes the absorption of the processing liquid by the nozzle at the scanning end position, and the air is sucked together when the processing liquid is absorbed. It is possible to discharge the processing liquid to the nozzle to discharge the gas. Further, in order to prepare the coating process in advance, the discharge port at the lower end of the nozzle and the top of the cylindrical priming roller are faced with a desired gap therebetween at a predetermined priming position, and the priming roller is rotated so as to be processed from the nozzle. It can be set as the structure which further has a priming process part which discharges a liquid and forms the liquid film of the said process liquid at the lower end of the said nozzle after completion | finish of discharge.

Further, in the fourth and fifth coating apparatuses, the nozzle has a cavity for storing the processing liquid before discharge once and a slit discharge passage extending from the cavity to the discharge port, and the discharge amount of the processing liquid for air discharge is discharged. It can be configured to be set within the range of 1/2 to 1 times the volume of the passage.

Generally, air in the atmosphere is sucked into the nozzle together with the processing liquid on the substrate immediately before the end of absorption (color back) of the processing liquid, and the air immediately after being sucked into the nozzle is in the discharge passage and does not enter the cavity. However, if it is removed as it is, relatively little time later, the air in the discharge passage diffuses or moves upwards and mixes with the processing liquid in the cavity. In the present invention, immediately after the color back, the nozzle is retracted upwards from the application scanning end position by the required minimum distance to rapidly discharge the processing liquid, thereby rapidly injecting the air that has just been sucked in the discharge passage of the nozzle to the nozzle discharge port. Discharge out. At that time, by setting the treatment liquid discharge amount to an appropriate amount (preferably within a range of 1/2 to 1 times the volume of the discharge passage), the nozzles are treated by the surface tension of the treatment liquid discharged together with the air while completely discharging the air. It can stay around the discharge port, and can prevent it from flowing.

According to the present invention, the coating quality can be improved by improving the film thickness controllability near the coating scan end in the spinless coating method using the nozzle having an elongated shape by the above-described configuration and action. In addition, it is possible to improve the film thickness controllability near the coating scan end portion when the color white method is used, and to improve the film thickness controllability near the coating scan start portion, thereby further improving the coating quality. You can.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described with reference to an accompanying drawing.

Fig. 1 shows a coating development processing system as an example of the applicable configuration of the coating method, the coating apparatus, and the coating processing program of the present invention. This coating and developing system is installed in a clean room, for example, to perform cleaning, resist coating, prebaking, developing, and postbaking during a photolithography process in an LCD manufacturing process using an LCD substrate as a substrate to be processed. . An exposure process is performed in the external exposure apparatus (not shown) provided adjacent to this system.

This coating and developing processing system is roughly divided into a cassette station (C / S) 10, a process station (P / S) 12, and an interface unit (I / F) 14.

The cassette station (C / S) 10 provided at one end of the system includes a cassette stage 16 capable of stacking a predetermined number, for example, up to four cassettes C containing a plurality of substrates G, To the cassette C on the cassette stage 16, which is located on the cassette stage 16 and which is provided in parallel with the arrangement direction of the cassette C, and which is movable on the conveyor path 17. The conveyance mechanism 20 which carries out the board | substrate G in and out is provided. This conveyance mechanism 20 has a means which can hold | maintain the board | substrate G, for example, a conveyance arm, is operable in four axes of X, Y, Z, and (theta), and is the process station (P / S) mentioned later The transfer apparatus 38 and the board | substrate G on the side of the (12) are made to be able to be transmitted.

The process station (P / S) 12 relays the cleaning process unit 22, the application process unit 24, and the development process unit 26 from the cassette station (C / S) 10 side in turn. It is provided in a horizontal line via the part 23, the chemical | medical solution supply unit 25, and the space 27 (between).

The cleaning process unit 22 includes two scrubber cleaning units (SCRs) 28, two upper and lower ultraviolet irradiation / cooling units (UV / COL) 30, a heating unit (HP) 32, and cooling A unit (COL) 34 is included.

The coating process unit 24 includes a spinless resist coating unit (CT) 40, a reduced pressure drying unit (VD) 42, a top and bottom two-stage adhi- sion / cooling unit (AD / COL) 46, And a top and bottom two-stage heating / cooling unit (HP / COL) 48 and a heating unit (HP) 50.

The developing process unit 26 includes three developing units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 53, and heating units (HP) 55. .

The conveyance paths 36, 51, 58 are provided in the longitudinal direction in the center part of each process part 22, 24, 26, and the conveying apparatus 38, 54, 60 carries the conveyance paths 36, 51, 58, respectively. Therefore, it moves, accesses each unit in each process part, and carries in / out of a board | substrate G, or conveys it. Moreover, in this system, in each process part 22, 24, 26, the unit (SCR, CT, DEV, etc.) of a liquid processing system is arrange | positioned at one side of the conveyance paths 36, 51, 58, and the other side. The heat treatment system units (HP, COL, etc.) are arranged.

The interface unit (I / F) 14 disposed at the other end of the system is provided with an extension (substrate transfer unit) 56 and a buffer stage 57 on the side adjacent to the process station 12, and with an exposure apparatus. The conveyance mechanism 59 is provided in the adjacent side. The conveyance mechanism 59 is movable on the conveyance path 19 extending in the Y direction, and the extension (substrate transfer section) 56 and the substrate G are moved in and out of the buffer stage 57. The exposure apparatus and the board | substrate G of a neighbor are performed.

Fig. 2 shows the procedure of the processing in this coating and developing processing system. First, in the cassette station (C / S) 10, the conveyance mechanism 20 takes out one board | substrate G from among the predetermined | prescribed cassette C on the cassette stage 16, and the process station P / S) It transfers to the conveying apparatus 38 of the washing | cleaning process part 22 of 12 (step S1).

In the cleaning process part 22, the board | substrate G is first carried in to ultraviolet irradiation / cooling unit (UV / COL) 30 one by one, and dry cleaning by ultraviolet irradiation is performed by the first ultraviolet irradiation unit UV. It is implemented and cooled to a predetermined temperature in the next cooling unit COL (step S2). In this ultraviolet cleaning, the organic substance of the surface of a board | substrate is mainly removed.

Next, the substrate G is subjected to a scrubbing cleaning treatment in one of the scrubber cleaning units (SCRs) 28, and particulate contamination is removed from the substrate surface (step S3). After the scrubbing cleaning, the substrate G is subjected to a dehydration process by heating in the heating unit (HP) 32 (step S4), and then cooled to a constant substrate temperature in the cooling unit (COL) 34 (step S5). ). Preprocessing in the washing | cleaning process part 22 is complete | finished by this, and the board | substrate G is conveyed to the application | coating process part 24 via the board | substrate delivery part 23 by the conveying apparatus 38. FIG.

In the application | coating process part 24, the board | substrate G is first carried in to the adhigen / cooling unit (AD / COL) 46 one by one, and receives the hydrophobization process (HMDS) in the first adhigen unit AD. (Step S6), it cools to the constant substrate temperature in next cooling unit COL (step S7).

Then, the resist liquid is apply | coated by the spinless method in the resist coating unit (CT) 40, and the board | substrate G is then subjected to the drying process by pressure reduction in the pressure reduction drying unit (VD) 42 (step S8).

Next, the board | substrate G is carried in to the heating / cooling unit (HP / COL) 48 one by one, and baking (prebaking) after application | coating is performed in the first heating unit HP (step S9), and it cools next. The unit COL is cooled to a constant substrate temperature (step S10). Moreover, the heating unit (HP) 50 can also be used for baking after this application | coating.

After the said coating process, the board | substrate G is conveyed to the interface part (I / F) 14 by the conveyance apparatus 54 of the application | coating process part 24, and the conveyance apparatus 60 of the image development process part 26, From there, it is transmitted to the exposure apparatus (step S11). In the exposure apparatus, a predetermined circuit pattern is exposed to the resist on the substrate G. And the board | substrate G which finished pattern exposure returns to the interface part I / F 14 from an exposure apparatus. The conveyance mechanism 59 of the interface portion (I / F) 14 passes the substrate G received from the exposure apparatus via the extension 56 and the developing process portion 26 of the process station (P / S) 12. (Step S11).

In the developing process section 26, the substrate G is subjected to the developing treatment in any of the developing units DEV 52 (step S12), and subsequently in the heating / cooling unit (HP / COL) 53. It is carried in one by one, post-baking is performed in the first heating unit HP (step S13), and then cooled to a constant substrate temperature in the cooling unit COL (step S14). The heating unit (HP) 55 can also be used for this post baking.

The board | substrate G by which the series of process in the image development process part 26 was complete | finished is carried out by the cassette station (C / S) 10 by the conveying apparatus 60, 54, 38 in the process station (P / S) 12. ), And is accommodated in any one cassette C by the conveyance mechanism 20 there (step S1).

In this application | coating development system, this invention can be applied to the resist application | coating unit (CT) 40 of the application | coating process part 24, for example. Hereinafter, with reference to FIGS. 3-30, the 1st Embodiment which applied this invention to the resist coating unit (CT) 40 is demonstrated.

3 is a plan view showing the overall configuration of the resist coating unit (CT) 40 and the reduced pressure drying unit (VD) 42 in the present embodiment.

As shown in Fig. 3, a resist coating unit (CT) 40 and a reduced pressure drying unit (VD) 42 are arranged horizontally in the X direction on the support or the support 70. The new substrate G to be subjected to the coating treatment is carried into the resist coating unit CT 40 as indicated by the arrow F _A by the conveying apparatus 54 (FIG. 1) on the conveying path 51 side. The substrate G after the coating process is completed in the resist coating unit CT 40 is indicated by the arrow F _B by the transfer arm 74 which is movable in the X direction guided by the guide rail 72 on the support 70. As is, it is sent to the vacuum drying unit (VD) 42. Shut down the drying process in a vacuum drying unit (VD), (42) the substrate (G) are steps down as indicated by the arrow F _c by the conveying path 51, transfer device 54 (Figure 1) on the side.

The resist coating unit (CT) 40 has a stage 76 extending in the X direction, and is disposed above the stage 76 while conveying the substrate G in the same direction in the same direction on the stage 76. The resist liquid is supplied from the long resist nozzle 78 onto the substrate G, and a resist coating film having a predetermined thickness is formed on the upper surface of the substrate (to-be-processed surface) by the spinless method. The configuration and operation of each part in the unit (CT) 40 will be described later in detail.

The vacuum drying unit (VD) 42 is a lid-type lower chamber 80 having a tray or a shallow bottom, and a lid type configured to be hermetically adhered or fitted to the upper surface of the lower chamber 80. Has an upper chamber (not shown). The lower chamber 80 is substantially rectangular, and a stage 82 for horizontally loading and supporting the substrate G is disposed at the center, and an exhaust port 83 is provided at four corners of the bottom surface. Each exhaust port 83 communicates with a vacuum pump (not shown) via an exhaust pipe (not shown). In the state where the upper chamber is covered by the lower chamber 80, the closed processing spaces in both chambers can be decompressed to a predetermined degree of vacuum by the vacuum pump.

4 and 5 show a more detailed overall structure in the resist coating unit (CT) 40 in one embodiment of the present invention.

In the resist coating unit (CT) 40 of the present embodiment, the stage 76 does not function as a mounting table for holding and holding the substrate G as in the related art, and the substrate G is subjected to the force of air pressure. It serves as a substrate float for floating in the air. In addition, the linear movement board | substrate conveyance part 84 arrange | positioned at the both sides of the stage 76 hold | maintains both side edge parts of the board | substrate G floating on the stage 76, respectively, and detachably holds a stage longitudinal direction. The substrate G is conveyed in the (X direction).

In detail, the stage 76 is divided into five regions M ₁ , M ₂ , M ₃ , M ₄ , and M ₅ in the longitudinal direction (X direction) (FIG. 5). The area M ₁ at the left end is a loading area, and a new substrate G to be subjected to the coating process is loaded into the fixed position in this area M ₁ . In this carry-in area M ₁ , between the original position below the stage and the reciprocating position above the stage for receiving the substrate G from the transfer arm of the transfer device 54 (FIG. 1) and loading it onto the stage 76. A plurality of lift pins 86 capable of lifting and lowering are provided at predetermined intervals. These lift pins 86 are driven up and down by, for example, a lift pin lift unit 85 (FIG. 13) for carrying in using an air cylinder (not shown) as a drive source.

A transfer area (M ₁₎ is a unit knowledge substrate feed is also a start region, and the compression of the high-pressure or positive pressure to float the substrate (G) on the top surface stage in the area to carry flying height or flying height (H _a) for Many blower outlets 88 for blowing air are provided with a constant density. Here, the flying height of the substrate (G) in the imported area (M ₁₎ (H _a) is, when good without requiring a particularly high accuracy, for example, maintained in the range of 250 to 350 ㎛. Further, in the transport direction (X direction), the size of the fetch area (M ₁₎ is preferably that exceeds the size of the substrate (G). In addition, in the loading area M ₁ , a positioning unit (not shown) for positioning the substrate G on the stage 76 may be provided.

The region M ₃ set at the center of the stage 76 is a resist liquid supply region or an application region, and the substrate G is formed from the upper resist nozzle 78 when passing through the application region M ₃ . Receive the supply of R). Substrate floating amount H _{b in the} coating area M ₃ defines the coating gap S (for example, 240 μm) between the lower end portion (discharge port) of the nozzle 78 and the upper surface of the substrate (to-be-processed surface). do. This coating gap S is an important parameter influencing the film thickness and resist consumption of a resist coating film, and needs to be kept constant with high precision. From this, on the upper surface of the stage of the application region M ₃ , for example, an arrangement or distribution pattern as shown in FIG. 6 and compression of high pressure or static pressure to float the substrate G to a desired flotation amount H _b . A blowing port 88 for blowing air and a suction port 90 for sucking air at a negative pressure are provided in a mixture. Then, a vertical upward force by compressed air is applied from the jet port 88 to the portion passing through the coating area M ₃ of the substrate G, and vertical downward by negative pressure suction force from the suction port 90. By applying a force of, and controlling the balance of bidirectional forces against each other, the application floating amount H _b is kept at the set value H _s (for example, 50 μm). The size of the application area (M ₃₎ in the transport direction (X direction) may, if not afford enough to stably form the small coating gap (S), such as the right under the resist nozzle 78, Usually, it may be smaller than the size of the board | substrate G, for example about 1/3 to 1/4 may be sufficient.

As shown in Fig. 6, in the application region M ₃ , the jet port 88 and the suction port 90 are alternately arranged on a straight line C which forms a constant inclined angle with respect to the substrate conveyance direction (X direction). It arrange | positions and provides the suitable offset (alpha) in the pitch on the straight line C between each adjacent column. According to this arrangement pattern, the mixing density of the ejection opening 88 and the suction opening 90 can be made uniform so that not only the substrate floating force on the stage can be made uniform, but also when the substrate G moves in the conveying direction (X direction). It is also possible to equalize the ratio of time facing the ejection opening 88 and the suction opening 90 at each part of the substrate, whereby the ejection opening 88 or the suction opening 90 is formed on the coating film formed on the substrate G. It is possible to prevent the traces or traces of transfer from occurring. At the inlet of the coating area M ₃ , the ejection opening 88 arranged in the same direction (straight line J phase) so as to stably receive the uniform floating force in the direction (Y direction) orthogonal to the conveying direction and the tip end of the substrate G; It is preferable to make the density of the suction port 90 high. In addition, in the application area M ₃ , it is preferable to arrange only the ejection openings 88 in both side edge portions (linear K phase) of the stage 76 in order to prevent both side edge portions of the substrate G from flowing. Do.

In FIG. 5, the intermediate region M ₂ set between the carry-in region M ₁ and the application region M _{3 sets} the floating height position of the substrate G in the carry-in region M ₁ during conveyance. from the flying height (H _a) a transition area to change or switch to the flying height (H _b) of the application area (M _3). This was mixed an outlet transition region 88 and the suction port 90 to the upper surface of the stage 76, within the (M ₂₎ can be disposed. In that case, the density | concentration of the suction port 90 may increase gradually along a conveyance direction, and the floating amount of the board | substrate G may be gradually moved from H _a to H _b gradually during conveyance. Alternatively, the transition in the area (M _2), can also be configured to arrange only the air outlet 88 without including the suction port (90).

The region M ₄ of the neighboring side downstream of the coating region M ₃ is a floating amount H _c for carrying out the floating amount of the substrate G from the coating floating amount H _b during transportation. To 350 μm). In the transition region M ₄ , the ejection opening 88 and the suction opening 90 may be mixed on the upper surface of the stage 76, and in this case, the density of the suction opening 90 is gradually decreased along the conveyance direction. It is good. Alternatively, a configuration may be provided in which only the jet port 88 is provided without including the suction port 90. In addition, as shown in FIG. 6, in order to prevent a transfer trace from occurring in the resist coating film formed on the substrate G in the transition region M ₄ as in the application region M ₃ , the suction port 90 is provided. And (outlet 88) are arranged on a straight line E having a constant inclined angle with respect to the substrate conveyance direction (X direction), and providing an appropriate offset β in the arrangement pitch between adjacent rows. This is preferable.

The area M ₅ at the downstream end (right end) of the stage 76 is a carrying out area. The substrate G subjected to the coating treatment in the resist coating unit CT 40 has a reduced pressure on the downstream neighbor by the transfer arm 74 (FIG. 3) from a predetermined position or an ejecting position in the carrying region M ₅ . It is carried out to the drying unit VD 42 (FIG. 3). The ejection area M ₅ is provided with a plurality of ejection openings 88 for floating the substrate G to the floating amount H _c at a constant density on the stage upper surface, and the substrate G is placed on the stage 76. A plurality of lift pins 92 are provided at predetermined intervals to move up and down between the original position below the stage and the reciprocating movement position above the stage for unloading from the top to be transferred to the transfer arm 74 (Fig. 3). . These lift pins 92 are lifted and lowered by, for example, a lift pin lifter 91 (Fig. 13) for carrying out using an air cylinder (not shown) as a drive source.

The resist nozzle 78 has a length that can cover the substrate G on the stage 76 from one end to the other end to a lower end of an elongated nozzle body extending in a horizontal direction (Y direction) orthogonal to the conveying direction. The resist liquid supply pipe 94 (FIG. 4) which has a slit-type discharge port 78a, is provided so that the door-shaped nozzle support body 130 can be elevated, and is lifted from the resist liquid supply mechanism 170 (FIG. 12, FIG. 13). ) In Fig. 4, the rod body 136 extending in the vertical direction for supporting the resist nozzle 78 constitutes a part of the nozzle elevating mechanism 75 (Figs. 11 and 13).

As shown in Figs. 4, 7 and 8, the substrate transfer part 84 includes a pair of guide rails 96 arranged parallel to the left and right sides of the stage 76, and each guide rail 96. From the slider 98 provided to be movable in the axial direction (X direction) on the upper surface, the conveyance drive part 100 which moves the slider 98 straight on each guide rail 96, and the stage 76 from each slider 98. Each of the holding portions 102 extends toward the center of the center and detachably holds the left and right side edge portions of the substrate G.

Here, the conveyance drive part 100 is comprised with the linear drive mechanism, for example, a linear motor. In addition, the holding part 102 supports the suction pad 104 which couples to the lower surfaces of the left and right side edges of the substrate G with vacuum suction force, and supports the suction pad 104 at the distal end, and the proximal end of the slider 98 side. The pad support part 106 of the leaf-spring type which can be elastically deformed so that the height position of a front-end | tip part may change as a support point is respectively provided. The suction pads 104 are arranged in a row at a constant pitch, and the pad support portion 106 independently supports each suction pad 104. Thereby, the individual adsorption pad 104 and the pad support part 106 can hold | maintain the board | substrate G stably in independent height position (even if it is another height position).

As shown in FIG. 7 and FIG. 8, the pad support part 106 in this embodiment is provided in the plate-shaped pad lifting member 108 provided so that the inner side of the slider 98 can be elevated. The pad actuator 109 (Fig. 13), which is mounted on the slider 98, for example, made of an air cylinder, moves the pad elevating member 108 to the original position (retracted position) lower than the lift height position of the substrate G and the substrate. It moves up and down between the reciprocating position (coupling position) corresponding to the floating height position of (G).

As shown in FIG. 9, each suction pad 104 is provided with the some suction port 112 in the upper surface of the pad main body 110 made from synthetic rubber, for example, rectangular parallelepiped. These suction ports 112 are slit-shaped long holes, but may be circular or rectangular small holes. A strip-shaped vacuum tube 114 made of, for example, synthetic rubber is connected to the suction pad 104. The pipelines 116 of these vacuum tubes 114 communicate with the vacuum source of the pad adsorption control unit 115 (FIG. 13), respectively.

In the support section 102, as shown in Fig. 4, a separate or completely independent configuration in which one side of the vacuum suction pad 104 and the pad support section 106 are separated for each set is preferable. However, as shown in FIG. 10, the one-piece pad support portion 120 is formed of a single leaf spring provided with the cutout portion 118, and the one-side vacuum suction pad 104 is disposed thereon. Configuration is also possible.

As described above, the plurality of jet holes 88 formed on the upper surface of the stage 76 and the compressed air supply mechanism 146 (Fig. 11) for supplying the compressed air for generating the floating force to them, and also the application area of the stage 76 (M _3), a plurality of the suction port 90 is formed by a mixture with the air outlet 88 in and a vacuum supply for supplying a vacuum pressure mechanism 148 (FIG. 11) to these, fetch area (M ₁₎ or out In the region M ₅ , the substrate G is floated with a floating amount suitable for carrying in and out and high-speed transfer, and in the coating region M ₃ , the set floating amount H _s suitable for stable and accurate resist coating scanning is applied. The stage substrate floating part 145 (FIG. 13) is made to float.

11 shows the configuration of the nozzle elevating mechanism 75, the compressed air supply mechanism 146, and the vacuum supply mechanism 148. The nozzle elevating mechanism 75 is provided with a door-shaped support body 130 installed on the door-shaped support body 130, which is arranged to span the application region M _{3 in} a horizontal direction (Y direction) orthogonal to the conveying direction (X direction). The vertical linear motion mechanism 132 and the joint rod 136 which couple | attach the columnar horizontal support member 134 which is a moving body (elevation body) of this vertical linear motion mechanism 132, and the resist nozzle 78 are provided. Here, the drive part of the linear motion mechanism 132 has the electric motor 138, the ball screw 140, the guide member 142, and the air cylinder 144. As shown in FIG. The rotational force of the electric motor 138 is converted into linear motion in the vertical direction by the ball screw mechanisms 140, 142 and 134, and the nozzle 78 is elevated in the vertical direction integrally with the horizontal support member 134 of the lifting body. Move. The lifting amount and height position of the resist nozzle 78 can be arbitrarily controlled by the rotation amount and rotation stop position of the electric motor 138. The air cylinder 144 is for canceling the gravity of the resist nozzle 78 and the horizontal support member 134 when the resist nozzle 78 is moved upwards immediately before the end of the coating scan, which will be described later, and the piston rod 144a. Is pressed against both ends of the horizontal support portion 134 from below to assist the high speed rise. In addition, a configuration in which the resist nozzle 78 is directly coupled to the horizontal support member 134 may be omitted by omitting the joint bar 136.

The compressed air supply mechanism 146 uses, for example, factory power for the positive pressure manifold 150 connected to the spout 88 for each of the plurality of regions divided on the upper surface of the stage 76 and the positive pressure manifold 150. The compressed air supply pipe 154 which feeds the compressed air from the compressed air supply source 152, and the regulator 156 provided in the middle of this compressed air supply pipe 154 are provided. The vacuum supply mechanism 148 is connected to the negative pressure manifold 158 connected to the suction port 90 for each of the plurality of regions divided on the upper surface of the stage 76, and these negative pressure manifolds 158, for example, are used for factory power use. The vacuum tube 162 which feeds the vacuum from the vacuum source 160, and the throttling valve 164 provided in the middle of this vacuum tube 162 are provided.

12 shows the configuration of the resist liquid supply mechanism 170. As shown in FIG. The resist liquid supply mechanism 170 passes through the suction pipe 174 from the bottle 172 which stores the resist liquid R through the suction pipe 174 to at least one resist liquid R (for each substrate) of the resist pump 176. In advance, the resist liquid R is pushed from the resist pump 176 to the resist nozzle 78 at a predetermined pressure through the discharge tube or the resist liquid supply pipe 94 at the time of the coating process, and the resist nozzle 78 ), The resist liquid R is discharged onto the substrate G at a predetermined flow rate.

The bottle 172 is hermetically sealed, and the pressurized gas, for example, N ₂ gas, is supplied from the gas pipe 178 to the liquid surface in the bottle at a constant pressure. The gas pipe 178 is provided with an opening / closing valve 180 made of, for example, an air operated valve.

The filter 182, the degassing module 184, and the opening / closing valve 186 are provided in the middle of the suction pipe 174. The filter 182 removes foreign matter (trash) in the resist liquid R transferred from the bottle 172, and the degassing module 184 removes bubbles in the resist liquid. The opening / closing valve 186 consists of an air operated valve, for example, and turns ON (full open conduction) or OFF (blocks) the flow of the resist liquid R in the suction pipe 174. do.

An open / close valve 188 is provided in the middle of the resist liquid supply pipe 94. No filter or color back valve is installed. The on-off valve 188 consists of an air operated valve, for example, and turns on (fully open conduction) or off (blocks) the flow of the resist liquid R in the resist liquid supply pipe 94.

The resist pump 176 is made of, for example, a syringe pump, includes a pump main body 190 having a pump chamber, a piston 192 for arbitrarily changing the volume of the pump chamber, and a reciprocating motion of the piston 192. It has a pump drive part 194.

The resist liquid supply control unit 196 is a local controller, and in accordance with instructions from the main controller 200 (FIG. 13) described later, each part in the resist liquid supply mechanism 170, in particular, the pump drive unit 194 of the resist pump 176 ), Each open / close valve 180, 186, 188, or the like.

13 shows the main configuration of the control system in the resist coating unit (CT) 40 of the present embodiment. The controller 200 is made of a microcomputer, and each part in the unit, in particular, the resist liquid supply mechanism 170, the nozzle raising and lowering mechanism 75, the stage substrate floating portion 145, the substrate conveying portion 84 (the conveying driving portion ( 100), the pad adsorption control unit 115, the pad actuator 109], the lift pin lift unit 85 for carrying in, the lift pin lift unit 91 for carrying out, etc., and control of the whole operation (sequence). do.

Next, the coating process operation in the resist coating unit (CT) 40 of this embodiment is demonstrated.

The controller 200 takes in and executes a coating process program stored in a storage medium such as an optical disc into the main memory, for example, and controls a programmed series of coating process operations.

When an unprocessed new substrate G is brought into the carry-in area M ₁ of the stage 76 from the conveying device 54 (FIG. 1), the lift pin 86 receives the substrate G at the reciprocating position. do. Conveying device 54 after the withdrawal, the lift pin 86 for conveying the height position of the substrate (G) by the fall, that is down to the injured location (H _a) (Fig. 5). Subsequently, a positioning unit (not shown) is operated to press the pressing member (not shown) from all directions to the substrate G in the floating state, and position the substrate G on the stage 76. When the alignment operation is completed, immediately after that, the pad actuator 109 is operated in the substrate transfer section 84 to raise the suction pad 104 from its original position (retracted position) to the reciprocating position (coupling position). Let's do it. The suction pad 104 has been turned on by the vacuum, and as soon as the suction pad 104 comes into contact with the side edge portion of the substrate G in the floating state, the suction pad 104 is coupled with the vacuum suction force. Immediately after the adsorption pad 104 engages the side edge portion of the substrate G, the positioning portion retracts the pressing member to a predetermined position.

Next, the board | substrate conveyance part 84 holds the slider 98 in the conveyance direction (X direction) from a conveyance time position in the state which hold | maintained the side edge part of the board | substrate G in the holding part 102 at a relatively high speed. Move straight on. Thus, the board | substrate G moves straight to a conveyance direction (X direction) in the state which floated on the stage 76, and the front-end part of the board | substrate G is located in the set position just below the resist nozzle 78. Then, the board | substrate conveyance part 84 stops the board | substrate conveyance of a 1st step. At this time, the nozzle elevating mechanism 75 makes the resist nozzle 78 stand by at an upward retreat position.

When the substrate G is stopped, the nozzle elevating mechanism 75 is operated to lower the resist nozzle 78 vertically, and the initial distance (for example, 60) is applied to the distance or application gap between the discharge port of the nozzle and the substrate G. Μm). Subsequently, the resist liquid supply mechanism 170 starts discharging the resist liquid from the resist nozzle 78 toward the upper surface of the substrate G, and the substrate transfer portion 84 also starts the substrate transfer in the second step. On one side, the nozzle elevating mechanism 75 raises the resist nozzle 78 until the application gap reaches the set value S _A (for example, 240 µm) (for example, for 0.1 second), after which The substrate G is horizontally moved as it is. The relatively low first speed V _A (for example, 50 mm / s) is selected for this second step, that is, conveyance of the substrate during application.

In this way, the application area (M ₃₎ in the method, the substrate (G) a horizontal position at the same time long resist nozzle 78, the substrate under the right to go to a predetermined speed (V _A) in the transport direction (X direction) By discharging the resist liquid R in a band form at a constant pump pressure P _A toward (G), the coating film of the resist liquid is directed from the front end side to the rear end side of the substrate G as shown in FIG. RM) is formed. During this coating scan, the resist liquid R discharged onto the substrate G adheres to the lower side surface 78b on one side of the resist nozzle 78 due to the wet phenomenon and expands in the height direction (ridges), thereby extending the nozzle length. A meniscus RQ extending in the direction (Y direction) is formed.

In the present embodiment, the scanning speed (substrate conveyance speed), the coating gap, and the pressure of the resist pump 176 are controlled in time characteristics as shown in FIG. 15 under the control of the controller 200 from the end of the coating scan to immediately after the end. Is changed. More specifically, the substrate transfer part 84 under the control of the controller 200 from the time point t ₁ when the resist nozzle 78 has relatively passed the predetermined passing point X ₁ set on the substrate G. The predetermined acceleration from the first speed VA (50 mm / s) up to the second speed V _B (for example, 70 mm / s) higher than that to the scanning speed (substrate conveyance speed) (For example, 200 mm / s ² ) to raise once. Then, as shown in Fig. 16, the resist liquid ridge RQ of the meniscus, which has been attached or followed up to the lower side surface 78b of the resist nozzle 78 by one time, rises (acceleration) of the scanning speed. It separates from the resist nozzle 78 by this, and moves away from the resist nozzle 78 as it is.

Here, the passing point (X ₁ ) at which the sudden increase or acceleration of the scanning speed is started is appropriately determined depending on the characteristics of the resist liquid (viscosity, etc.), the coating conditions (film thickness, standard scanning speed, etc.), and the application specification (margin size, etc.). but it may be selected, usually bisecting the upper surface (features front and back surfaces) of the inside of the product area (thickness guaranteed area) (E _s) and the margin region (the film thickness non-guaranteed area) of the outer (E _M) of a substrate (G) It may be set near the boundary (hereinafter referred to as "guarantee area boundary") L _x .

When the scanning speed rises to the second speed V _B at the predetermined time point t ₂ by the rapid acceleration as described above, the substrate transfer part 84 next moves from the second speed, that is, the peak value V _B. The scanning speed is reduced to a predetermined deceleration rate (eg, 140 mm / s ² ) up to a third speed V _C taking a value of zero or around it. On the other hand, in conjunction with the reduction (deceleration) of the scanning speed, the nozzle elevating mechanism 75 moves the resist nozzle 78 in the vertical direction (Z direction) from the predetermined time point t ₃ under the control of the controller 200. (For example, 140 μm) is dropped at a predetermined moving speed (for example, 280 μm / s), and the application gap is smaller than that from the distance interval S _A (240 μm) up to then. Narrow down to S _C ) (100 μm).

FIG. 17 shows a mode where the application gap decreases as the scanning speed decreases between the resist nozzle 78 and the substrate G just before the end of the application scan. As shown in the figure, the resist liquid ridge RQ separated from the lower side surface 78b of the resist nozzle 78 immediately before the resist nozzle 78 in the scanning direction (-X direction) while maintaining the raised state. ) Is removed to the rear.

In this way, once the resist nozzle 78 is located at the preset scanning end position X _e on the substrate G and stops there once (Fig. 18), the resist liquid under the control of the controller 200 simultaneously or in succession thereof. The supply mechanism 170 terminates the discharge operation of the resist pump 176 (Fig. 15). Then, even after the pump pressure drops to the reference atmospheric pressure P _s near the atmospheric pressure, the state of the pump is kept as it is for a while. During this time, the resist liquid R extends from the discharge port 78a of the resist nozzle 78 to the periphery, especially around the horizontal direction (Y direction) orthogonal to the coating scan, so as to completely cover the corner portion of the rear end portion of the substrate.

Then, the resist liquid supply mechanism 170 causes the resist pump 176 to perform a suction operation after a predetermined time T _s has elapsed from the time point t ₅ at which the pump pressure is lowered to the reference atmospheric pressure P _s . That is, in the structural example of Fig. 12, the piston 192 is reciprocated by a predetermined stroke. The resist nozzle 78 absorbs the resist liquid R on the substrate G by this pump suction operation, whereby the film of the resist coating film RM toward the inside of the substrate G from the scanning end position X _e . The thickness decreases. The resist liquid supply mechanism 170 immediately returns to the reference atmospheric pressure P _s when the pump pressure is lowered to the predetermined suction pressure P _B. In this manner, the resist liquid R is absorbed by the resist nozzle 78 from the substrate G at the scanning end position X _e immediately after the end of the coating scan.

In the present embodiment, the ridge RQ is formed near the guarantee area boundary L _X in the course of the coating scan as described above, and the ridge RQ at the time of absorption (color back) immediately after the end of the scan as described above. When the resist liquid of is pulled closer to the scanning end position X _e , the resist coating film RM in the vicinity of the guaranteed area boundary L _X (particularly, in the guaranteed area E _S ), as shown in FIG. The film thickness is adjusted or held within the set value or tolerance.

After the color back is performed at the scanning end position X _e as described above, the nozzle elevating mechanism 75 moves (retreats) the resist nozzle 78 upward under the control of the controller 200, and simultaneously transfers the substrate. The part 84 restarts substrate conveyance toward the carrying out area M ₅ . Substrate conveyance of this final stage is performed at a conveyance speed larger than the case of application | coating scan. Then, the substrate (G) located in the conveying end position catch, the substrate feed section 84 is taken out in the area ₍₅ M) to stop the substrate carrying the third step. Immediately after this, the supply of vacuum to the adsorption pad 104 is stopped, and the adsorption pad 104 is lowered from the reciprocating position (combination position) to its original position (retraction position) and separated from both side ends of the substrate G. . Instead, the lift pin 92 ascends from the original position below the stage to the reciprocating position above the stage to unload the substrate G. As shown in FIG.

Thereafter, the ejector, that is, the transfer arm 74, is accessed to the transport region M ₅ , and the substrate G is received from the lift pin 92 and transported out of the stage 76. The board | substrate conveyance part 84 returns to the loading area M ₁ on the freeway immediately when the board | substrate G delivers the board | substrate G to the lift pin 92. FIG. When the substrate G, which has been processed as described above, is carried out in the carry-out area M ₅ , the carry-in area M ₁ is loaded, positioned or conveyed to a new substrate G to be subjected to the coating process next time. Initiation is made.

As mentioned above, in this embodiment, the resist liquid melt | dissolution of the meniscus which adhered to or followed by the lower side surface 78b of the one side (back side in a scanning direction) of the resist nozzle 78 from the end of application | coating scan to then. The base RQ is separated from the resist nozzle 78 by an instantaneous increase (rapid acceleration) of the scanning speed (substrate conveyance speed), and preferably behind the resist nozzle 78 in the scanning direction, preferably in the guaranteed area. Move away from the boundary (L _X ). Then, the resist nozzle 78 is color-backed at the scanning end position X _e on the substrate G immediately after the end of scanning, thereby removing excess resist liquid from the coating scan end portion, and the effect of color back at that time (absorption action). By canceling out in the removed resist liquid ridge RQ, it is possible to prevent the resist film thickness in the guaranteed area E _S from being within the set value and outside the allowable range.

20 to 22 show the operation in the case of omitting the step of rapidly raising (rapid acceleration) the scanning speed (substrate conveyance speed) as described above at the end of the coating scan as a comparative example. In this case, as shown in Figs. 20 and 21, up to the scanning end position X _e in the state where the meniscus resist liquid ridge RQ is attached to the lower side surface 78b of the resist nozzle 78, as shown in Figs. It moves, and no ridge is formed in the resist coating liquid near the guarantee region boundary L _X. Then, when the resist nozzle 78 is stopped at the scanning end position X _e and color-backed, the resist coating liquid near the guaranteed area boundary L _X is also pulled closer to the scanning end position X _e , and FIG. 22. As shown in the figure, the film thickness of the resist coating film RM in the guaranteed area E _S becomes thinner than the set value.

In the coating treatment method (FIG. 15) in the first embodiment described above, the film thickness of the resist coating film was controlled in the scanning direction (-X direction) at the end of the coating scan. Therefore, in the case of using the color white method, it may be necessary to control film thickness from different angles in the horizontal direction (Y direction) orthogonal to the scanning direction. That is, in the color back method, the scanning speed and the coating gap are reduced between the resist nozzle 78 and the substrate G just before the end of the coating scanning as described above, so that the boundary of the guaranteed area in the scanning direction as shown in FIG. From the vicinity of L _X , the resist coating film RM broadly extends to the vicinity of the substrate edge in the side direction (Y direction). Due to the expansion of the side direction of the resist coating film RM, the thickness of the resist film in the guaranteed area E _S close to the guaranteed area boundary L _Y in the same direction becomes thin, and depending on the type of the resist, before the start of color whitening. After the color finish, the color may become thinner than the set value or the set range. In such a case, only the film thickness control of the scanning direction in the said embodiment may not fully respond.

In order to cope with this problem, a film thickness control method effective in the horizontal direction or the side direction (Y direction) perpendicular to the scanning direction will be described. Here, the scanning speed (substrate conveyance speed), the coating gap, and the pressure of the resist pump 178 are changed to the time characteristics as shown in FIG. 23 under the control of the controller 200 at the end of the coating scan. Among these characteristics, what differs from the control in Fig. 15 is the time characteristic of the coating gap. That is, the application gap is moved up and down by the nozzle elevating mechanism 75 at the end of the coating scan by the nozzle elevating mechanism 75, so that the application gap is the first distance interval S _A (for example). For example, it is once increased to a predetermined vertical movement speed (eg 600 μm / s) from a second distance interval S _B (eg 300 μm) larger than that to 240 μm, and then the color Reduce to a predetermined vertical movement speed (eg 400 μm / s) up to the minimum distance spacing S _C (eg 100 μm) for the bag.

Characteristics of the viscosity of the resist liquid (viscosity, etc.), application conditions (film thickness, scanning speed, etc.) at which the increase from the first distance interval S _A to the second distance interval S _B of the coating gap as described above starts. applying specifications well when (margin size, or the like) to thus properly selected, it is usually may be set in the vicinity of the boundary region assurance _(X L) of the scanning direction.

24 to 27 show the operation in the case where each part is controlled by the above time characteristic (Fig. 23). First, at the end of the coating scan, the application gap is instantaneously increased along with the instantaneous increase (rapid acceleration) of the scanning speed (substrate conveyance speed) near the guaranteed area boundary L _X , so that the resist nozzle is as shown in FIG. 24. While the resist liquid ridge RQ of the meniscus is separated from the lower side 78b of the 78 in a further raised state, the side edges of the resist coating liquid RM as shown in Figs. The portion (edge in the Y direction) is pushed inwardly (to be cut off), whereby the film thickness also increases. Thereby, the guaranteed area of the scanning direction, between the resist nozzle 78 and the substrate (G) in that immediately after the deceleration and the reduction of the coating gap of the scanning speed is also carried out simultaneously, as shown in Figure 27 the boundary (L _X ), The expansion of the side direction (Y direction) of the resist coating film RM can be prevented or suppressed. However, to stabilize the film thickness from the applied scanning terminal end to put between the predetermined time (T _s) before the start saekbaek, a scan end position the resist coating in the vicinity (X _e) as shown in Figure 27, film is formed on the side direction in the substrate but extend to the edge, assurance area boundary (L _X) is from a remote location, also not so much liquid volume being expanded.

As can be understood in comparison with the comparative example (FIG. 28), in the present embodiment (FIG. 27), the side edges of the resist coating film RM are cut inward near the guarantee region boundary L _{X in the} scanning direction. As a result, the resist film thickness in the guaranteed region E _S increases in the vicinity of the guaranteed region boundary L _{Y in the} side direction (Y direction). As a result, it is possible to prevent the thickness of the resist film in the guaranteed region E _S from outside the permissible range at the end in the side direction (Y direction) when color back is performed at the scanning end position X _e .

Fig. 29 is a straight line X _s passing through the inside of the guaranteed area E _S slightly inward from the guaranteed area boundary L _Y in the side direction (Y direction) at the rear end of the substrate G in the scanning direction (X direction). The film thickness profile on the () is shown by comparison with Example (Fig. 27) and Comparative Example (Fig. 28). As shown in Fig. 29, in the scanning direction, the film thickness of the resist coating film RM decreases exponentially toward the scanning end position X _e , and in the comparative example (Fig. 28), the margin area EM is shown. In addition, although the thickness becomes thinner than the set value D _S even in the guaranteed area E _S , in the embodiment (Fig. 27), the set value D _S can be held in the guaranteed area E _S.

As described above, in the first embodiment, by using the film thickness control method by increasing and decreasing the coating gap together with the film thickness control method by acceleration and deceleration of the scanning speed, the film thickness uniformity can be further improved by the synergistic effect of both. . However, depending on the application, it is also possible to use only the film thickness control method by increasing or decreasing the coating gap as shown in FIG. 15, 23, and 30, the timing at which each parameter is changed and the timing relationship with each other are one example, and various modifications and changes can be made according to the type, application conditions, application specifications, and the like of the resist liquid as described above. . For example, in the characteristic of FIG. 23, although the timing which increases and decreases a scanning speed and an application | coating gap is made to correspond, it is also possible to shift the timing of both suitably.

Next, with reference to FIGS. 31-58, the 2nd Embodiment which applied this invention to the resist coating unit (CT) 40 is demonstrated. In addition, in 2nd Embodiment, the same code | symbol is attached | subjected to the same thing as 1st Embodiment, and it demonstrates.

FIG. 31 is a plan view showing the overall configuration of the resist coating unit (CT) 40 and the reduced pressure drying unit (VD) 42 in the present embodiment.

As shown in FIG. 31, the resist coating unit (CT) 40 and the reduced pressure drying unit (VD) 42 basically have the same structure as FIG. 3 of 1st Embodiment, and the description of a basic structure is abbreviate | omitted. do.

32 and 33 show a more detailed overall structure in the resist coating unit (CT) 40 in the second embodiment of the present invention.

In the resist coating unit (CT) 40 of this embodiment, the stage 76 blows compressed air from the many jet port 88 similarly to 1st Embodiment, and makes the board | substrate G into the air by the force of air pressure. It serves as a substrate float for floating. And similarly to 1st Embodiment, the board | substrate conveyance part 84 of the linear motion type arrange | positioned at the both sides of the stage 76 is removable so that both side edge parts of the board | substrate G which float on the stage 76 are each removable. It is holding and conveying the board | substrate G in a stage longitudinal direction (X direction). The stage 76 is also divided into five regions M ₁ , M ₂ , M ₃ , M ₄ , and M _{5 in} the longitudinal direction (X direction) similarly to the first embodiment (FIG. 33). Since the functions of these regions M ₁ , M ₂ , M ₃ , M ₄ , and M ₅ are the same as those in the first embodiment, description thereof is omitted.

The resist nozzle 78 is a length which can cover the board | substrate G on the stage 76 from one end to the other end like the 1st Embodiment, and is extended in the horizontal direction (Y direction) orthogonal to a conveyance direction. It has a slit-shaped discharge port 78a at the lower end of the nozzle body of the shape, is attached to the door-shaped nozzle support 130 so that it can be elevated, and is connected to the resist liquid supply pipe 94 from the resist liquid supply mechanism 170. .

As shown in FIG. 32 and FIG. 34, the board | substrate conveyance part 84 is a pair of guide rail 96 arrange | positioned parallel to the left and right sides of the stage 76 similarly to 1st Embodiment, and each guide rail. From the slider 98 provided so that it can move to the axial direction (X direction) on 96, the conveyance drive part 100 which moves the slider 98 straight on each guide rail 96, and each slider 98, It has the support part 102 which extends toward the center part of the stage 76, and detachably holds the left and right side edge parts of the board | substrate G, respectively.

As shown in FIG. 34, also in this embodiment, the pad support part 106 is provided in the plate-shaped pad lifting member 108 provided so that the inner side of the slider 98 can be elevated. The lifting movement between the original position (retracted position) lower than the floating height position of the board | substrate G of the pad lifting member 108 and the reciprocating position (coupling position) corresponding to the floating height position of the board | substrate G is 1st Embodiment. And pad actuator 109 (FIG. 37).

As described above, the plurality of jet holes 88 formed on the upper surface of the stage 76 and the compressed air supply mechanism 146 (Fig. 35) for supplying the compressed air for generating the floating force to them, and also the application area of the stage 76 Loading area M ₁ and carrying out area by a plurality of suction ports 90 formed in a mixture with the jet port 88 in M ₃ and a vacuum supply mechanism 148 (FIG. 35) for supplying a vacuum pressure thereto. In the M ₅ , the substrate G is floated at an appropriate floating level for carrying in and out, and in the application region M ₃ , the set floating amount H _S suitable for stable and accurate resist coating scanning in the application region M ₃ . The stage substrate floating part 145 (FIG. 36) for floating is comprised.

35 shows the configuration of the nozzle elevating mechanism 75, the nozzle horizontal moving mechanism 77, the compressed air supply mechanism 146, and the vacuum supply mechanism 148. As shown in FIG. The nozzle elevating mechanism 75 is provided with a door-shaped frame 130 that is arranged to span the application region M _{3 in} a horizontal direction (Y direction) orthogonal to the conveying direction (X direction), and is provided in the door-shaped frame 130. It has a pair of left and right vertical movement mechanisms 132, and the nozzle support body 134 of the movable body (elevating body) extended between these vertical movement mechanisms 132. As shown in FIG. The drive part of each vertical motion mechanism 132 has the electric motor 138 which consists of a pulse motor, the ball screw 140, and the guide member 142, for example. The rotational force of the pulse motor 138 is converted to linear motion in the vertical direction by the ball screw mechanisms 140 and 142, and the resist nozzle 78 moves up and down in a vertical direction integrally with the nozzle support 134 of the lifting body. . The lifting amount and height positions of the left and right sides of the resist nozzle 78 can be arbitrarily controlled by the rotation amount and rotation stop position of the pulse motor 138. The nozzle support 134 is made of, for example, a rigid body, and the resist nozzle 78 is detachably provided on the lower surface or side surface of the nozzle support 134 via a flange, a bolt, or the like.

The nozzle horizontal moving mechanism 77 includes a pair of left and right guide rails (not shown) for guiding the door-shaped frame 130 in the horizontal direction (X direction) orthogonal to the nozzle length direction, and the door-shaped frame 130 on these guide rails. ) Has a left and right pair of horizontal motion mechanisms, for example, a pulse motor driven ball screw mechanism 135, and is configured to position the door frame 130 at an arbitrary position on the guide rail. .

In addition, the compressed air supply mechanism 146 and the vacuum supply mechanism 148 are comprised similarly to 1st Embodiment. Moreover, the resist liquid supply mechanism 170 is also comprised similarly to 1st Embodiment (refer FIG. 12).

As shown in Fig. 33, the resist coating unit (CT) 40 is provided with a nozzle standby section 210 slightly above the stage 76 in the substrate conveyance direction (X direction). The priming process part is provided in the nozzle standby part 210.

49 shows the configuration in the nozzle standby section 210. As shown in FIG. As shown, the nozzle standby part 210 arrange | positions the priming process part 212, the solvent atmosphere chamber 214, and the washing | cleaning part 216 in a horizontal line in the X direction. Among these, the priming process part 212 is provided in the place closest to a coating process position. The straight drive unit 135 of the nozzle horizontal moving mechanism 77 (FIG. 49) extends to the nozzle standby unit 210 (FIG. 31), and the resist nozzle 78 is placed in each of the units 212 in the nozzle standby unit 210. FIG. , 214, 216).

The cleaning part 216 has the nozzle cleaning head 218 which moves or scans the lower part of the resist nozzle 78 located in the predetermined position in the longitudinal direction (Y direction). The nozzle cleaning head 218 has a cleaning nozzle 220 which blows out a cleaning liquid (for example, thinner) and a drying gas (for example, N ₂ gas) toward the lower end of the resist nozzle 78 and the discharge port 78a. ) And a gas nozzle 222 are mounted, and a drain portion 224 is provided for collecting and recovering the cleaning liquid dropped on the resist nozzle 78 with a vacuum force.

The solvent atmosphere chamber 214 extends in parallel with the nozzle longitudinal direction (Y direction) in the length which covers the full length of the resist nozzle 78, and a solvent, for example, thinner is contained in the room. On the upper surface of the solvent atmosphere chamber 214, a cover V-shaped cross section 226 having a slit-shaped opening 226a extending in the longitudinal direction (Y direction) is provided. When the nozzle part of the resist nozzle 78 is matched with the cover 226 from above, only the discharge port 78a and the tapered nozzle lower end part are exposed to the vapor | steam of the solvent which spreads inside through the opening 226a. While the application | coating process is not performed on the stage 76 temporarily, the resist nozzle 78 wash | cleans the discharge port 78a and the nozzle part by the washing | cleaning part 216, and waits in the solvent atmosphere chamber 214 after that.

The priming processing part 212 arrange | positions the cylindrical priming roller 228 extending in the horizontal direction (Y direction) in the solvent bath 230 in the length which covers the full length of the resist nozzle 78. As shown in FIG. The solvent bath 230 contains a solvent or cleaning liquid, such as thinner, at a liquid surface level such that the lower portion of the priming roller 228 is locked. The rotation support mechanism 232 arrange | positioned outside the solvent bathroom 230 supports the rotating shaft of the priming roller 228, and drives the priming roller 228 to rotate. In addition, in the solvent bath 230, the wiper 236 which frictionally contacts the outer circumferential surface of the solvent nozzle 234 and the priming roller 228 which flushes out the solvent of the fresh liquid to the outer circumferential surface of the priming roller 228 at a position above the washing liquid pool. Is installed. The operation of the priming processing unit 212 will be described later.

36 shows the main configuration of the control system in the resist coating unit (CT) 40 of the present embodiment. Similarly to the first embodiment, the controller 200 includes a microcomputer. In the present embodiment, the controller 200 includes the resist liquid supply mechanism 170, the nozzle raising and lowering mechanism 75, the stage substrate floating portion 145, the substrate conveying portion 84 (the conveyance driving portion 100, the pad adsorption control portion ( 115), pad actuator 109], lift pin lift unit 85 for carrying in, lift pin lift unit 91 for carry out, individual priming roller rotation support mechanism 232, nozzle cleaning head 218, and the like. Control the operation and the overall operation (sequence).

Next, the coating process operation in the resist coating unit (CT) 40 of this embodiment is demonstrated.

The controller 200 takes in and executes a coating process program stored in a storage medium such as an optical disk into the main memory, for example, and controls a programmed series of coating process operations.

When an unprocessed new substrate G is brought into the carry-in area M ₁ of the stage 76 from the conveying device 54 (FIG. 1), the lift pin 86 receives the substrate G at the reciprocating position. do. After the conveying device 54 withdrawn, the lift pin 86 is lowered down to the transport height positions for the substrate (G), i.e., flying height (H _a) (Fig. 33). Subsequently, a positioning unit (not shown) is operated to press the pressing member (not shown) from the four sides to the substrate G in the floating state to position the substrate G on the stage 76. When the positioning operation is completed, immediately after that, the pad actuator 109 is operated in the substrate transfer section 84, and the suction pad 104 is raised from the original position (retracted position) to the reciprocating position (coupling position) (UP). ) The suction pad 104 has been turned on by the vacuum, and as soon as it comes into contact with the side edge portion of the substrate G in the floating state, the suction pad 104 is coupled with the vacuum suction force. Immediately after the adsorption pad 104 engages the side edge portion of the substrate G, the positioning portion retracts the pressing member to a predetermined position.

Next, the board | substrate conveyance part 84 carries out the slider 98 in the conveyance direction (X direction) from a conveyance time position in the state which hold | maintained the side edge part of the board | substrate G in the holding part 102 at a relatively high speed. Move straight on. Thus, the board | substrate G moves straight to a conveyance direction (X direction) in the state which floated on the stage 76, and the front-end part of the board | substrate G is located in the set position just below the resist nozzle 78. Then, the board | substrate conveyance part 84 stops the board | substrate conveyance of a 1st step. At this time, the nozzle elevating mechanism 75 makes the resist nozzle 78 stand by at an upward retreat position.

When the substrate G is stopped, the nozzle elevating mechanism 75 is operated to lower the resist nozzle 78 vertically, and the initial distance (for example, 60) is applied to the distance or application gap between the discharge port of the nozzle and the substrate G. Μm). Subsequently, the resist liquid supply mechanism 170 starts discharging the resist liquid from the resist nozzle 78 toward the upper surface of the substrate G, and the substrate transfer unit 84 also starts the substrate transfer in the second step. On one side, the nozzle elevating mechanism 75 raises the resist nozzle 78 until the coating gap becomes the set value S _A (for example, 240 µm) (for example, for 0.1 second), and then Moves the substrate G horizontally. The relatively low first speed V _A (for example, 50 mm / s) is selected for this second step, that is, conveyance of the substrate during application.

In this way, the application area (M ₃₎ in the method, the substrate (G) a horizontal position at the same time long resist nozzle 78, the substrate under the right to go to a predetermined speed (V _A) in the transport direction (X direction) By discharging the resist liquid R toward (G) at a constant first pump pressure P _A in a band form, as in the first embodiment, as shown in FIG. 14, the rear end portion from the front end side of the substrate G is shown in FIG. The coating film RM of the resist liquid is formed toward the side. During the coating scan, the resist liquid R discharged onto the substrate G adheres to one side of the resist nozzle 78, i.e., the side surface 78b on the back side in the coating scanning direction, in the height direction by the wet phenomenon. A meniscus RQ that extends and extends in the nozzle longitudinal direction (Y direction) is formed.

In this embodiment, the scanning speed (substrate conveyance speed), the coating gap and the pump pressure (output side pressure of the resist pump 176) are shown in FIG. 37 under the control of the controller 200 from the end of the coating scan to immediately after the end. Each changes with a time characteristic. More specifically, from the time point t ₁ at which the resist nozzle 78 has relatively passed the predetermined passing point X ₁ set on the substrate G, the resist liquid supply mechanism (under the control of the controller 200) 170, the discharge pressure of the resist pump 176, that is, the pump pressure from the first pump pressure P _A up to then the second pump pressure (P _B ) higher than that (for example, P _B = 1.3 P _A ) up to. The rate or flow rate at which the resist liquid is discharged from the resist nozzle 78 in the resist liquid supply mechanism 170 is proportional to the pump pressure. Therefore, the flow rate of the resist liquid R supplied from the resist nozzle 78 to the board | substrate G increases immediately by the increase of the pump pressure P _A → P _B by one order. . In this manner, when the second pump pressure P _B of the peak value is reached at a predetermined time point t ₂ , the pump pressure is subsequently lowered at once or stepwise to the reference atmospheric pressure P _c set to a value near atmospheric pressure. .

On the other hand, in conjunction with the decrease in the pump pressure (P _B → P _C ), under the control of the controller 200, the substrate conveying unit 84 sets the scanning speed (substrate conveying speed) to the first speed V _A (until then) ( The nozzle elevating mechanism 75 reduces the predetermined deceleration rate (for example, -100 mm / s ² ) from 50 mm / s to the second speed V _C taking a value of 0 or its vicinity. The resist nozzle 78 is dropped in the vertical direction (Z direction) by a predetermined distance (for example, 140 µm) at a predetermined moving speed (for example, 280 µm / s), and the coating gap is the distance up to that point. The distance S _A (240 μm) is narrowed to a distance distance S _C (100 μm) smaller than that.

Here, the passing point X ₁ (or timing t ₁ ) at which the instantaneous increase in the pump pressure is started is characterized by the characteristics of the resist liquid (viscosity, etc.), application conditions (film thickness, standard scanning speed, etc.), application specifications ( What is necessary is just to select suitably according to margin size etc.). Preferably, the upper surface (the surface to be treated) of the substrate G so that the pump pressure reaches the peak second pump pressure P _B in the vicinity where the resist nozzle 78 passes through the guarantee region boundary L _X. ) Is a boundary that divides the product into an inner product area (film thickness guarantee area) E _S and an outer margin area (film thickness non-guaranteed area) E _M (hereinafter referred to as a "guaranteed area boundary") (L _x The passage point X ₁ may be set slightly inside (in the guaranteed area E _S ). Similarly, a passing point or timing for starting the reduction of the scanning speed (substrate conveyance speed) and the coating gap, respectively, is also appropriately selected.

Fig. 39 shows a mode where the application gap decreases while the scanning speed decreases between the resist nozzle 78 and the substrate G immediately before the end of the application scan. As shown in the figure, a local ridge RK of the resist coating film is formed near the guaranteed area boundary L _{X in} which the discharge ratio of the resist nozzle 78 has risen by one point.

In this way, once the resist nozzle 78 is located at the predetermined scanning end point position X _e on the substrate G at a predetermined time point t ₃ and once stopped there (FIG. 40), the pump is simultaneously or one after another. The pressure reaches the reference atmospheric pressure P _C near the atmospheric pressure at the predetermined time point t ₄ , and the resist liquid discharge operation is completed (FIG. 37). Then, the pump pressure went down to the standard atmospheric pressure (P _C) even after a short time as it maintains a stopped state. During this time, the resist liquid R extends from the discharge port 78a of the resist nozzle 78 to the periphery, particularly around the horizontal direction (Y direction) orthogonal to the coating scan, so as to completely cover the corner portion of the rear end portion of the substrate.

Subsequently, the resist liquid supply mechanism 170 causes the resist pump 176 to perform a suction operation after the predetermined time T _s has elapsed at the time point t ₄ at which the pump pressure is lowered to the reference atmospheric pressure P _C. That is, in the structural example of Fig. 12, the piston 192 is reciprocated by a predetermined stroke. By the pump suction operation, the resist nozzle 78 absorbs the resist liquid R on the substrate G, so that the film thickness of the resist coating film RM toward the inside of the substrate G from the scanning end position X _e . Decreases. The resist liquid supply mechanism 170 immediately returns to the reference atmospheric pressure P _C when the pump pressure is lowered to the predetermined suction pressure P _D. In this manner, the resist liquid R is absorbed by the resist nozzle 78 from the upper portion of the substrate G at the scanning end position X _e immediately after the application of the scanning.

In the present embodiment, the ridge RK is formed near the guarantee area boundary L _X in the course of the coating scan as described above, and the ridge RK at the time of absorption (color back) immediately after the end of the above-described injection. When the resist liquid of is pulled closer to the scanning end position X _e , the resist coating film RM in the vicinity of the guaranteed area boundary L _X (particularly, in the guaranteed area E _S ), as shown in FIG. The film thickness is adjusted or held within the set value or tolerance.

After the color back is performed at the scanning end point position X _e as described above, the nozzle elevating mechanism 75 moves (retreats) the resist nozzle 78 upward under the control of the controller 200, and the resist liquid is supplied there. The mechanism 170 sequentially raises the pump pressure to the positive pressure side for air discharge (ejection) of the resist nozzle 78 and discharges a predetermined amount of the resist liquid R to the resist nozzle 78. The function and action of this nozzle air discharge will be described later in detail.

On the other hand, the substrate feed section 84 under the control of the controller 200 resumes conveying the substrate toward the out zone ₍₅ M). Substrate conveyance of this final stage is performed at a conveyance speed larger than that at the time of application | coating scan. Then, the substrate (G) located in the conveying end position catch, the substrate feed section 84 is taken out in the area ₍₅ M) to stop the substrate carrying the third step. Immediately after this, the supply of vacuum to the adsorption pad 104 is stopped, and the adsorption pad 104 is lowered from the reciprocating position (combination position) to its original position (retraction position) and separated from both ends of the substrate G. . Instead, the lift pin 92 ascends from the original position below the stage to the reciprocating position above the stage to unload the substrate G. As shown in FIG.

Thereafter, the ejector, that is, the transfer arm 74, is accessed to the carrying out region M ₅ , and the substrate G is received from the lift pin 92 and taken out of the stage 76. When the board | substrate conveyance part 84 cut | disconnects the board | substrate G with the lift pin 92, it returns immediately to the loading area M ₁ by the highway. Out area when brought region to be the substrate (G) the processing is ended as described above, taken out from the (M ₅₎ (M ₁₎ in the start of fetch, position adjustment to transfer the new substrate (G) to obtain a coating in the following Is performed.

As described above, in the present embodiment, the pump pressure of the resist liquid supply mechanism 170, that is, the resist liquid discharge rate is raised in a single step at the end of the coating scan, thereby raising the RK of the resist coating film near the guarantee area boundary L _X. ). Then, the resist nozzle 78 is color-backed at the scanning end position X _e on the substrate G immediately after the end of scanning, thereby removing excess resist liquid from the coating scan end portion, and the effect of color back at that time (absorption action). By canceling out at the ridge RK of the resist liquid film, it is possible to prevent the resist film thickness in the guaranteed area E _{s from} falling below the set value and the allowable range.

In the case of the comparative example in which the step of raising the pump pressure (resist liquid discharge ratio) as described above is omitted at the end of the coating scan, the substrate G is the same as that described with reference to FIGS. 20 to 22 in the first embodiment. On the other hand, the resist liquid film maintains a substantially constant film thickness up to the scanning end position X _e , and no ridge is formed in the resist coating film near the guarantee area boundary L _X. Then, when the resist nozzle 78 is stopped at the scanning end position X _e and color-backed, the resist coating liquid near the guarantee region boundary L _X is also pulled closer to the scanning end position X _e , resulting in a guaranteed region. The film thickness of the resist coating film RM in (E _s ) becomes thin below a set value.

In the coating treatment method (FIG. 37) in the second embodiment described above, the film thickness of the resist coating film was controlled in the scanning direction (-X direction) at the end of the coating scan. However, when the color white method is used, film thickness control from another angle in the horizontal direction (Y direction) perpendicular to the scanning direction is required. That is, in the color back method, as described above, the scanning speed and the coating gap are simultaneously reduced between the resist nozzle 78 and the substrate G immediately before the end of the coating scanning. Thus, as shown in FIG. As described above, the resist coating film RM extends from the vicinity of the guaranteed region boundary L _X in the scanning direction to the vicinity of the substrate edge in the side direction (Y direction). By the expansion of the side direction of the resist coating film RM, the thickness of the resist film in the guaranteed area E _s close to the guaranteed area boundary L _{Y in the} same direction becomes thin, and color back starts depending on the type of resist. It may become thin before the setting value or the setting range before or after completion of color whitening. In such a case, only the film thickness control of the scanning direction in the said embodiment may not fully correspond.

In order to cope with this problem, effective film thickness control in the horizontal direction or the side direction (Y direction) perpendicular to the scanning direction will be described. Here, the scanning speed (substrate conveyance speed), the coating gap, and the pump pressure are changed to the time characteristics as shown in FIG. 42 under the control of the controller 200 at the end of the coating scan. Among these characteristics, the difference from the control in Fig. 37 is the time characteristic of the coating gap. That is, in the first embodiment, the same operations as those described in FIG. 28 are added to the operations in FIG. That is, at the end of the coating scan, the nozzle lifting mechanism 75 lifts and lowers the resist nozzle 78 under the control of the controller 200 to increase the coating gap once, and thereafter, the color distance minimum distance interval S _C. Decreases to).

When each part is controlled by the time characteristic as shown in Fig. 42, first, the application gap is instantaneously increased along with the increase in the pump pressure, that is, the resist liquid discharge ratio, at the end of the coating scan, thereby applying the resist coating as shown in Fig. 43. The ridge portion RK of the membrane extends upwards (raises), and at the same time, as shown in FIGS. 25 and 26 described in the first embodiment, the side edge portions of the resist coating liquid RM (end portions in the Y-direction). ) Is pushed inwardly (they are narrowed), and the thickness thereof increases. As a result, even if the reduction of the scanning speed and the reduction of the coating gap are simultaneously performed between the resist nozzle 78 and the substrate G immediately after that, as shown in FIG. 27 described above, the guaranteed area boundary L in the scanning direction. _{In the} vicinity of _X ), expansion of the side direction (Y direction) of the resist coating film RM can be prevented or suppressed.

As can be understood from comparison with the comparative example (FIG. 28), in the present embodiment, the side edges of the resist coating film RM are cut off to the inside in the vicinity of the guaranteed area boundary L _X in the scanning direction. The thickness of the resist film in the guaranteed area E _s increases near the guaranteed area boundary L _{Y in the} direction (Y direction). As a result, it is possible to prevent the resist film thickness in the guaranteed area E _s from thinning below the permissible range at the end in the side direction (Y direction) when color back is performed at the scanning end position X _e .

The film on the straight line X _s which passes through the scanning direction (X direction) in the inside of the guaranteed area E _s slightly inside the guarantee area boundary L _Y in the side direction (Y direction) at the rear end of the substrate G. As a result of comparing the thickness profile with the example and the comparative example (FIG. 28), as shown in FIG. 44, the same result as in FIG. 29 of the first embodiment was obtained.

As described above, in the second embodiment, by using the film thickness control method by increasing or decreasing the coating gap in combination with the film thickness control method by an increase in the treatment liquid discharge ratio, the film thickness uniformity is further enhanced by the synergistic effect of both. Can be improved. However, depending on the application, it is also possible to use only the film thickness control method by increasing or decreasing the coating gap. 37 and 42, the timing at which each parameter is changed and the timing relationship between them are one example, and various modifications and changes are possible as described above depending on the type of resist liquid, application conditions, application specifications, and the like. For example, in the characteristic of Fig. 42, the timing for increasing or decreasing the pump pressure (process liquid discharge ratio) and the application gap is coincident with each other, but it is also possible to appropriately shift the timing of both.

45 and 46 show the procedure of the main steps constituting one cycle of the sheet-coating process in the resist coating unit (CT) 40 in the second embodiment. As shown, application scan (step A ₁ ), color back (step A ₂ ), nozzle air discharge (step A ₃ ) and priming process (step A ₄ ) are executed in sequence, and after the priming process (step A ₄ ) The coating scan of the cycle (step A ₁ ) is executed. Among these, the contents of each process of the coating scan (step A ₁ ) and the color bag (step A ₃ ) are as described above. Hereinafter, the contents of each process of nozzle air discharge (step A ₃ ) and priming process (step A ₄ ) will be described.

The nozzle air discharge (step A ₃ ) is a step of raising the pump pressure to the pure positive pressure side immediately after the color back (step A ₂ ) and discharging a predetermined amount of the resist liquid R to the resist nozzle 78. 2 features. Specifically, in Figs. 37 and 42, saekbaek immediately after the end (t ₆ to t _7), nozzle elevating mechanism 75 is applied to a gap (S _D) is completely separated from the resist nozzle 78 from the substrate (G) in (For example, several millimeters) to move upwards, and immediately afterwards (t ₈ to t ₉ ), the resist liquid supply mechanism 170 sets the pump pressure (output side pressure of the resist pump 176) until then. Is raised from the reference atmospheric pressure (P _C ) to the predetermined pressure (P _E ) of the positive pressure (for example, P _E = 0.5 to 0.8P _A ) in one step and immediately returned to the reference atmospheric pressure (P _C ). As a result, in the resist nozzle 78, a predetermined amount of the resist liquid R is discharged from the discharge port 78a, and air sucked together with the resist liquid on the substrate G is discharged at the time of color back immediately before.

The rate of increase and the peak value P _E of the pump pressure in the nozzle air discharge operation are such that the air is completely discharged from the resist nozzle 78 and the resist liquid R out of the nozzle discharge port 78a is lowered. It is set to satisfy two conditions of not flowing at the same time. As will be described later, the volume of the discharge passage 250 (FIG. 47) in the resist nozzle 78 is only about 1.5 ml (milliliters), for example, so that the discharge amount corresponding to the volume of the discharge passage 250 is set. That is, even if all of the resist liquid in the discharge passage 250 (FIG. 47) is discharged, it can be prevented from flowing by the holding force of surface tension. Therefore, the resist liquid discharge amount in the nozzle air discharge operation may preferably be set within a range of 1/2 to 1 times the volume of the discharge passage. In addition, the shorter the elapsed time from the end of color bag, the better the timing t ₈ of the discharge start may be set within 2 seconds, more preferably within 1 second. In addition, in the resist liquid supply mechanism 170, the opening / closing valve 188 of the resist liquid supply pipe 94 is kept open even after completion of color back, and is closed immediately after the nozzle air discharge operation is completed.

47 shows a specific configuration example of the resist nozzle 78. As shown in FIG. The nozzle structure shown is very general and is comprised between two divided nozzle parts 242 and 244 from the left and right with the shim 240 interposed. A buffer cavity 246 extending in the nozzle longitudinal direction is formed on an inner wall of one split nozzle portion 242, and an external resist liquid supply pipe 94 and a buffer chamber 246 inside the split nozzle portion 244. ), An inlet passage 248 is formed. A slit discharge passage 250 is formed between the cavity 246 and the nozzle discharge port 78a at the lower end, and the gap (slit gap) J of the discharge passage 250 and the nozzle discharge port 78a is It is defined as the thickness of the shim 240. When the size (land length) in the vertical direction of the discharge passage 250 is L and the size (discharge width) in the horizontal direction is W, the volume (slit volume) U in the discharge passage 250 is U = J × L It is represented by x W. As an example, U = 1.494 ml (milliliters) when J = 60 micrometers, L = 25 mm, and W = 996 mm.

As described above, air is also sucked into the resist nozzle 78 together with the resist liquid on the substrate G at the time of color back, but most of the air is drawn in immediately before the end of color back. That is, when the resist coating film on the substrate G becomes thin due to color back, and the liquid film level is lower than the discharge port 78a of the resist nozzle 78, the surrounding air is mixed with the resist liquid on the substrate G to discharge the discharge port 78a. Is inhaled. Therefore, the air AR immediately after being sucked into the resist nozzle 78 is in the discharge passage 250 and does not enter the cavity 246.

However, with the passage of time, the air AR in the discharge passage 250 diffuses or moves upwards and enters the cavity 246 after a relatively short time (usually after 4 to 5 seconds from the end of color back). If the nozzle air discharge (step A ₃ ) of the present embodiment is omitted, at least 4 to 5 seconds or more is required from the end of the color back (step A ₂ ) to the start of the priming process (step A ₄ ), for example, to move or set up. Usually, air AR is introduced into the cavity 246 from the discharge passage 250 within this time. Once the air AR enters the cavity 246, it is mixed into the resist liquid R therein, and a dummy dispense is applied to the resist nozzle 78 at the cleaning portion 216 (FIG. 34) of the wafer standby portion 210. Unless it is done, air AR is standing in the cavity 246. In the single coating type continuous coating treatment, in order to increase the production efficiency, since only priming treatment (step A ₄ ) is performed in the atmosphere within one cycle of the coating treatment, as shown in FIG. 30, the number of continuous coating treatments is repeated. The more the air AR mixed in the resist liquid in the cavity 246 increases cumulatively. Then, as described above as a problem of the prior art, the pump pressure is lowered by the entrained air in the cavity 246 (air bite occurs) at the start of the application scan, thereby setting the application pressure P _A for application. The sudden rise until reaching is delayed, and as a result, the resist coating film of the coating scanning start portion becomes thinner.

In this regard, in the present embodiment, after the color back is finished, the resist nozzle 78 is retracted upward from the application scanning end position by the required minimum distance, and the nozzle air discharge operation as described above is promptly performed to thereby discharge the resist nozzle 78. The air AR which has just been sucked in 250 is discharged out of the discharge port 78a. At this time, as shown in Fig. 48, the resist liquid discharged together with the air AR forms a convex liquid film RB around the discharge port 78a by surface tension and stays there without flowing. In this way, the nozzle air discharge operation is performed as the post-processing each time the coating scan and color back are performed, so that the cavity 246 of the resist nozzle 78 can be normally maintained without air mixing. As a result, air bite can be prevented from occurring in the resist nozzle 78 immediately after the start of coating scanning, and further, the film thickness of the resist coating film can be prevented from decreasing at the coating scanning starting section.

The priming process (step A ₄ ) performed after the nozzle air discharge operation (step A ₃ ) is performed at the lower portion of the discharge port 78a to the rear surface 78 of the resist nozzle 78 for the next application scan (step A ₁ ). It is a preliminary process of priming a resist liquid. Under the control of the controller 200, the nozzle elevating mechanism 75 and the nozzle horizontal moving mechanism 77 (FIG. 35) and the like cooperate to move the resist nozzle 78 to the priming processor 212 of the nozzle standby section 210, The resist liquid supply mechanism 170 (FIG. 12), the priming roller rotation support mechanism 232 (FIG. 49), and the like interlock to perform the priming process.

In this priming process, as shown in FIG. 50, the resist nozzle 78a is discharged to the position where the discharge port 78a of the resist nozzle 78 opposes in parallel with the top part of the priming roller 228 and the gap Q of a set interval. 78 is close to the priming roller 228. In this proximity state, the resist liquid R is discharged to the resist nozzle 78, and the priming roller 228 is rotated in a fixed direction (clockwise in FIG. 35) simultaneously with or immediately after this. In this case, as shown in an enlarged view in FIG. 50, the resist liquid R from the discharge port 78a of the resist nozzle 78 returns to the nozzle back surface 78b and is then wound on the outer circumferential surface of the priming roller 228. The outer peripheral surface of the priming roller 228 which wound the resist liquid immediately enters the bath of a solvent, and washes off the resist liquid R. As shown in FIG. And the outer peripheral surface of the priming roller 228 raised from the solvent bath is wash | cleaned of finishing with the solvent of the fresh liquid sprayed from the solvent nozzle 234, and immediately after that, the wiper 236 wipes off a liquid and recovers the clean surface. After that, it passes under the discharge port 78a of the resist nozzle 78 again and receives the resist liquid there. The amount of rotation of the priming roller 228 for a priming process may be arbitrary, for example, may be half rotation. In addition, the gap Q formed between the ejection opening of the resist nozzle 78 and the priming roller 228 is an application formed between the ejection opening of the resist nozzle 78 and the substrate G on the stage 76 during the coating process. It may be set to a size equal to or close to the gap S (eg, 240 µm).

In this priming process, it is preferable to start the rotation operation of the priming roller 228 for a predetermined delay time (for example, 1 second) after the resist nozzle 78 starts the resist liquid discharge operation. By the method, the resist liquid R can be completely and uniformly returned to the tapered back surface 78b side of the resist nozzle 78. In this way, even after the completion of the priming process, the resist is uniformly extended straight in the nozzle length direction (Y direction) in the lower portion of the discharge port 78a to the back surface 78b of the resist nozzle 78 as shown in FIG. The liquid film RF remains.

In the priming treatment as described above, the liquid film RB adhered to the discharge port 78a of the resist nozzle 78 as a result of the nozzle air discharge operation in the previous step is subjected to the resist nozzle 78 at the pump pressure immediately after the priming treatment starts. It escapes from and is recovered by the priming roller 228.

The resist nozzle 78 which has been subjected to the above priming treatment is controlled by the nozzle elevating mechanism 75 and the nozzle horizontal moving mechanism 77 (FIG. 35) under the control of the controller 200 in order to perform the coating process of the next cycle. It is moved to the application position on the stage 76 at a predetermined timing. That is, as described above, when the untreated substrate G is conveyed from the loading portion M ₁ to the coating area M ₃ , the resist nozzle 78 forms a predetermined initial coating gap with the substrate G. To the height position. Then, as shown in FIG. 52, the liquid film RF of the resist liquid attached to the discharge port of the resist nozzle 78 and the lower end part of the back surface prevents the application gap of the setting size d to bead-shaped, and the board | substrate G ) (Attach). And the resist liquid supply mechanism 170 starts discharge of the resist liquid R, and the board | substrate conveyance part 84 starts conveyance of the board | substrate of a 2nd step, and apply | coating scan to the said board | substrate G (step A _l ) is executed.

In this case, since the discharge operation of the resist pump 176 is started in the resist liquid supply mechanism 170 in the state in which air AR is not mixed in the resist nozzle 78 (particularly in the cavity 246), The pump pressure is not lowered in the resist nozzle 78 (no air bite occurs), so that the pump pressure rises stably and quickly to the set point P _A. As a result, as shown in Fig. 53, the film thickness TH of the resist coating film RM can be controlled within a set value or an allowable range at the coating scanning start portion.

Fig. 54 compares the data obtained by measuring the film thickness of the resist coating film formed on the coating scan start portion when the nozzle air discharge operation is performed in the priming process as compared with the case where the nozzle air discharge operation is omitted (comparative example). Illustrated. In addition, the film thickness measurement position is selected at a position near the guarantee area boundary L _X (for example, a position 10 mm inward from the start end of the substrate). In the Example, even if it performed 100 times of continuous application | coating processes, it was confirmed that the film thickness of the application | coating scanning start part was stabilized in the vicinity of set value (1600 nm). On the other hand, in the comparative example, as the number of continuous coating processes is repeated, the film thickness of the coating scanning start portion decreases exponentially, and if the film thickness allowable range is, for example, ± 5%, only the allowable range is 5 times. It was confirmed to divide the lower limit of (1520 nm).

The film thickness control of the coating scan start section by the nozzle air discharge operation of the present invention can also be applied independently to the coating process of the color white method independently of the film thickness control of the coating scan end section.

As mentioned above, although preferred embodiment was described, this invention is not limited to the said embodiment, A various deformation | transformation is possible within the scope of the technical idea. For example, in the second embodiment, when the tube pump pump is used for the resist pump 176 of the resist liquid supply mechanism 170, the pump pressure suddenly rise / fall speed is low, and the pump is at the end of the coating scan. Residual pressure tends to occur when the pressure is lowered from the peak value P _B to the reference atmospheric pressure P _C. In that case, the tube fram pump may be lowered to the reference atmospheric pressure P _C and then pulled toward the negative pressure side to release the residual pressure.

In addition, this invention is not limited to the spinless coating method of the floating conveyance system like the said embodiment. Spinless coating method in which a substrate is fixedly mounted on a stacking stage horizontally, and a resist liquid is discharged in a strip shape onto the substrate while the long resist nozzle is moved in a horizontal direction perpendicular to the nozzle length direction above the substrate. The present invention can also be applied.

Although the above-mentioned embodiment relates to the resist coating apparatus in the coating-development processing system of LCD manufacture, this invention is applicable to the arbitrary coating methods which apply | coat a process liquid on a to-be-processed board | substrate. Therefore, as the processing liquid in the present invention, in addition to the resist liquid, for example, a coating liquid such as an interlayer insulating material, a dielectric material, a wiring material, or the like can be used, and a developing solution, a rinse liquid, or the like can also be used. The to-be-processed board | substrate in this invention is not limited to an LCD board | substrate, Another flat panel display board | substrate, a semiconductor wafer, a CD board | substrate, a photomask, a printed board, etc. are also possible.

According to the present invention, in the spinless coating method using an elongated nozzle, it is possible to provide a coating method and a coating apparatus which improve the coating quality by improving the film thickness controllability near the coating scanning end portion.

Further, in the spinless coating method using an elongated nozzle, it is possible to provide a coating method and a coating apparatus that improve the coating quality by improving the film thickness controllability when using the color white method.

Moreover, the storage medium which stored such an application | coating process program can be provided.

Claims (36)

A coating scan is performed in which the ejection openings of the substrate to be processed and the elongated nozzle face each other substantially horizontally with a small gap therebetween and move the nozzle in a relatively horizontal direction while supplying a processing liquid from the nozzle to the substrate. It is a coating method which forms the coating film of the said processing liquid on the said board | substrate, Setting a scanning end position for relatively stopping the nozzle on the substrate; At the end of the coating scan, the speed of the relative horizontal movement of the nozzle relative to the substrate is once raised from the first horizontal movement speed to a second horizontal movement speed higher than that, and subsequently substantially zero from the second horizontal movement speed. Reducing the nozzle to the scanning end position by reducing it to a third horizontal moving speed equal to; Reducing the gap between the substrate and the nozzle from a first distance interval to a second distance interval smaller than that at the end of the coating scan, Stopping supply of the processing liquid to the substrate from the nozzle after the end or the end of the coating scan; And a step of absorbing the processing liquid on the substrate by a predetermined amount into the nozzle located at the scanning end position. A coating scan is performed in which the ejection openings of the substrate to be processed and the elongated nozzle face each other substantially horizontally with a small gap therebetween and relatively move the nozzle in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. It is a coating method which forms the coating film of the said processing liquid on the said board | substrate, Setting a scanning end position for relatively stopping the nozzle on the substrate; Reducing the speed of the relative horizontal movement of the nozzle relative to the substrate at the end of the application scan from the first horizontal movement speed to a second horizontal movement speed that is substantially equal to zero, thereby positioning the nozzle at the scanning end position. and, At the end of the coating scan, the gap between the substrate and the nozzle is once enlarged from a first distance interval to a second distance interval larger than that, and then a third distance smaller than the first distance interval from the second distance interval. Reducing process to intervals, Stopping supply of the processing liquid to the substrate from the nozzle after the end or the end of the coating scan; And a step of absorbing the processing liquid on the substrate by a predetermined amount into the nozzle located at the scanning end position. The area | region which should ensure the film thickness of the said coating film is set inward from the boundary through the position which offset by the predetermined distance from the outer peripheral edge of the said board | substrate to the board | substrate center side, The direction of the said coating scan And an increase in the gap at a timing at which the nozzle passes near the boundary. The discharge openings of the substrate to be processed and the nozzle having an elongated shape are opposed to each other substantially horizontally with a small gap therebetween, and scanning is performed to relatively move the nozzle in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. It is a coating method of forming the coating film of the said processing liquid on a board | substrate, Setting a scanning end position for relatively stopping the nozzle on the substrate; At the end of the coating scan, the speed of the relative horizontal movement of the nozzle relative to the substrate is once raised from the first horizontal movement speed to a second horizontal movement speed higher than that, and subsequently substantially zero from the second horizontal movement speed. Reducing the nozzle to the scanning end position by reducing it to a third horizontal moving speed equal to; At the end of the coating scan, the gap between the substrate and the nozzle is once enlarged from a first distance interval to a second distance interval larger than that, and then a third distance smaller than the first distance interval from the second distance interval. Reducing process to intervals, Stopping supply of the processing liquid to the substrate from the nozzle after the end or the end of the coating scan; And a step of absorbing the processing liquid on the substrate by a predetermined amount into the nozzle located at the scanning end position. The area | region in which the film thickness of the said coating film should be ensured inside the boundary through the position which offset by the predetermined distance from the outer peripheral edge of the said board | substrate to the board | substrate center side, The area | region which should ensure the film thickness of Claim 1 or 4, The coating method which starts acceleration of the said horizontal movement speed at the timing which the said nozzle passes near the boundary in the direction. 6. The coating method according to claim 5, wherein the gap is started to increase at a timing at which the nozzle passes near the boundary in the direction of the coating scan. The coating method according to any one of claims 1 to 4, wherein absorption of the treatment liquid is started after a predetermined time has elapsed since the nozzle is positioned at the scanning end position. A substrate support for supporting the substrate to be processed substantially horizontally; An elongated nozzle for discharging the processing liquid with a small gap on the upper surface of the substrate during coating scanning; A processing liquid supply source for feeding the processing liquid to the nozzle during the coating scan; A scanning portion for moving the nozzle in a horizontal direction relative to the substrate during coating scanning; A lifting part for moving the nozzle in a direction perpendicular to the substrate; The scanning unit is controlled to raise the speed of the relative horizontal movement of the nozzle with respect to the substrate at the end of the coating scan once from the first horizontal movement speed to the second horizontal movement speed higher than that, and then the second horizontal movement speed. To a third horizontal movement speed that is substantially equal to zero so as to set the nozzle at a preset scanning end position, and control the lifting portion to control the elevation between the substrate and the nozzle at the end of the coating scan. Reducing the gap from the first distance interval to a second distance interval smaller than that, controlling the source of the treatment liquid to stop the feeding of the treatment liquid to the nozzle after the end or the end of the coating scan, and also at the injection end position Absorbs a predetermined amount of the processing liquid on the substrate through the nozzle located at Applying device having a fisherman. A substrate support for supporting the substrate to be processed substantially horizontally; An elongated nozzle for discharging the processing liquid with a small gap on the upper surface of the substrate during the coating process; A processing liquid supply source for feeding the processing liquid to the nozzle during the coating process; A scanning part for moving the nozzle in a horizontal direction relative to the substrate during the coating process; A lifting part for moving the nozzle in a direction perpendicular to the substrate; A scanning end point which presets the nozzle by controlling the scanning unit to reduce the speed of the relative horizontal movement of the nozzle with respect to the substrate at the end of the coating scan from the first horizontal movement speed to a second horizontal movement speed that is substantially equal to zero Position and control the lift to increase the gap between the substrate and the nozzle once from the first distance interval to a larger second distance interval at the end of the application scan, and then from the second distance interval. The process liquid supply source is controlled to a third distance interval smaller than the first distance interval, and the feeding of the processing liquid to the nozzle is stopped after the end or the end of the coating scan, and is further positioned at the scanning end position. It has a control unit for absorbing a predetermined amount of the processing liquid on the substrate through the nozzle Application device. A substrate support for supporting the substrate to be processed substantially horizontally; An elongated nozzle for discharging the processing liquid with a small gap on the upper surface of the substrate during coating scanning; A processing liquid supply source for feeding the processing liquid to the nozzle during the coating scan; A scanning portion for moving the nozzle in a horizontal direction relative to the substrate during coating scanning; A lifting part for moving the nozzle in a direction perpendicular to the substrate; The scanning unit is controlled to raise the speed of the relative horizontal movement of the nozzle with respect to the substrate at the end of the coating scan once from the first horizontal movement speed to a second horizontal movement speed higher than that, and then continue with the second horizontal movement speed. To reduce the third horizontal moving speed to substantially equal to 0 to position the nozzle at a preset scanning end position, and to control the lifting portion to close the gap between the substrate and the nozzle at the end of the coating scan by a first distance. Increase from the interval to the second distance interval larger than that, then decrease from the second distance interval to the third distance interval smaller than the first distance interval, control the processing liquid supply source to end or terminate the coating scan After that, the feeding of the processing liquid to the nozzle is stopped, and the scanning end point Applying device having a control section for absorption by a predetermined amount of the treatment liquid on the substrate through the nozzles situated in the device. The application apparatus according to any one of claims 8 to 10, wherein the substrate support has a stage to float the substrate in the air in the application area. The coating device according to claim 11, wherein a plurality of blowing holes for blowing gas and a suction hole for sucking gas are provided in the upper surface of the stage in the coating area. The method of claim 11, wherein the nozzle is disposed at a predetermined position fixed in the horizontal direction in the application area, And a substrate conveying unit for conveying the substrate in a state where the scanning unit floats on the stage in a predetermined conveying direction corresponding to the horizontal movement, and allowing the substrate to pass directly under the nozzle. The method of claim 13, wherein the substrate transfer unit, A guide rail disposed on one side or both sides of the stage to extend in parallel with the moving direction of the substrate; A slider movable along the guide rail, A conveying drive unit which drives the slider to move along the guide rail; And a holding part extending from the slider toward the center of the stage and detachably holding the side edges of the substrate. The method of claim 11, wherein the lifting unit, A nozzle support unit which integrally supports the nozzle, An electric actuator coupled with the nozzle support to move the nozzle up and down from any first height position to any second height position; And an air cylinder engaged with the nozzle support to offset gravity of the nozzle. A coating scan is performed in which the ejection openings of the substrate to be processed and the elongated nozzle face each other substantially horizontally with a small gap therebetween and move the nozzle in a relatively horizontal direction while supplying a processing liquid from the nozzle to the substrate. A storage medium storing a coating processing program operating on a computer for forming a coating film of the processing liquid on the substrate, The program, Setting a scanning end position for relatively stopping the nozzle on the substrate; At the end of the coating scan, the speed of the relative horizontal movement of the nozzle relative to the substrate is once raised from the first horizontal movement speed to a second horizontal movement speed higher than that, and subsequently substantially zero from the second horizontal movement speed. Reducing the nozzle to the scanning end position by reducing it to a third horizontal moving speed equal to; Reducing the gap between the substrate and the nozzle at a predetermined vertical movement speed at the end of the application scan from a first distance interval to a second distance interval less than that; Stopping supply of the processing liquid to the substrate from the nozzle after the end or the end of the coating scan; And causing the computer to absorb a predetermined amount of the processing liquid on the substrate by the nozzle located at the scanning end position. A coating scan is performed in which the ejection openings of the substrate to be processed and the elongated nozzle face each other substantially horizontally with a small gap therebetween and relatively move the nozzle in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. A storage medium storing a coating processing program operating on a computer for forming a coating film of the processing liquid on the substrate, The program, Setting a scanning end position for relatively stopping the nozzle on the substrate; Reducing the speed of relative horizontal movement of the nozzle relative to the substrate at the end of the application scan from the first horizontal movement speed to a second horizontal movement speed that is substantially equal to zero to position the nozzle at the scanning endpoint position. Wow, At the end of the coating scan, the gap between the substrate and the nozzle is once enlarged from a first distance interval to a second distance interval larger than that, and then a third distance smaller than the first distance interval from the second distance interval. Reducing the interval, Stopping supply of the processing liquid to the substrate from the nozzle after the end or the end of the coating scan; And causing the computer to absorb a predetermined amount of the processing liquid on the substrate by the nozzle located at the scanning end position. The discharge openings of the substrate to be processed and the nozzle having an elongated shape are opposed to each other substantially horizontally with a small gap therebetween, and scanning is performed to relatively move the nozzle in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. A storage medium storing a coating processing program operating on a computer for forming a coating film of the processing liquid on a substrate, The program, Setting a scanning end position for relatively stopping the nozzle on the substrate; At the end of the application scan the speed of relative horizontal movement of the nozzle relative to the substrate is once raised from a first horizontal movement speed to a second horizontal movement speed higher than that, and subsequently substantially zero from the second horizontal movement speed. Reducing the nozzle to the scanning end position by reducing it to a third horizontal moving speed equal to; At the end of the coating scan, the gap between the substrate and the nozzle is once enlarged from a first distance interval to a second distance interval larger than that, and then a third distance smaller than the first distance interval from the second distance interval. Reducing the interval, Stopping supply of the processing liquid to the substrate from the nozzle after the end or the end of the coating scan; And causing the computer to absorb a predetermined amount of the processing liquid on the substrate by the nozzle located at the scanning end position. A coating scan is performed in which the ejection openings of the substrate to be processed and the elongated nozzle face each other substantially horizontally with a small gap therebetween and move the nozzle in a relatively horizontal direction while discharging the processing liquid from the nozzle with respect to the substrate. It is a coating method which forms the coating film of the said processing liquid on the said board | substrate, Setting a scanning end position for relatively stopping the nozzle on the substrate; Reducing the speed of the relative horizontal movement of the nozzle relative to the substrate at the end of the application scan from the first horizontal movement speed to a second horizontal movement speed that is substantially equal to zero, thereby positioning the nozzle at the scanning end position. and, Reducing the gap between the substrate and the nozzle from a first distance interval to a second distance interval smaller than that at the end of the coating scan, At the end of the coating scan, the rate of discharging the processing liquid from the nozzle is once increased from the first discharging ratio to a second discharging ratio larger than that, and subsequently reduced from the second discharging ratio to stop the supply of the processing liquid. Process to do, And a step of absorbing the processing liquid on the substrate by a predetermined amount into the nozzle located at the scanning end position. A coating scan is performed in which the ejection openings of the substrate to be processed and the elongated nozzle face each other substantially horizontally with a small gap therebetween and move the nozzle in a relatively horizontal direction while discharging the processing liquid from the nozzle with respect to the substrate. It is a coating method which forms the coating film of the said processing liquid on the said board | substrate, Setting a scanning end position for relatively stopping the nozzle on the substrate; Reducing the speed of the relative horizontal movement of the nozzle relative to the substrate at the end of the application scan from the first horizontal movement speed to a second horizontal movement speed that is substantially equal to zero, thereby positioning the nozzle at the scanning end position. and, At the end of the coating scan, the gap between the substrate and the nozzle is once enlarged from a first distance interval to a second distance interval larger than that, and then a third distance smaller than the first distance interval from the second distance interval. Reducing process to intervals, At the end of the coating scan, the rate of discharging the processing liquid from the nozzle is once increased from the first discharging ratio to a second discharging ratio larger than that, and subsequently reduced from the second discharging ratio to stop the supply of the processing liquid. Process to do, And a step of absorbing the processing liquid on the substrate by a predetermined amount into the nozzle located at the scanning end position. 21. The method according to claim 20, wherein a region in which the film thickness of said coating film is to be ensured is set inside a boundary through a position offset from the outer edge of said substrate by a predetermined distance from the outer peripheral edge of said substrate, and in the direction of said coating scan, And the gap reaches the second distance interval in the vicinity of the nozzle passing near the boundary. The area | region which should ensure the film thickness of the said coating film is set inward from the boundary through the position which offset by the predetermined distance from the outer peripheral edge of the said board | substrate to the board | substrate center side, A coating method in which the treatment liquid discharge rate reaches the second discharge rate in the vicinity where the nozzle passes near the boundary in the direction of the coating scan. The coating method according to any one of claims 19 to 21, wherein absorption of the treatment liquid is started after a predetermined time has elapsed since the nozzle is positioned at the scanning end position. 22. The method according to any one of claims 19 to 21, wherein the nozzle is spaced apart from the processing liquid on the substrate immediately after the absorption of the processing liquid by the nozzle at the scanning end position is completed. A coating method for discharging the processing liquid to the nozzle to discharge the air sucked together. The coating method according to claim 24, wherein the discharge amount is set so that the processing liquid exiting the discharge port of the nozzle does not flow when discharging the processing liquid for discharging the air. 27. The top of the discharge port of the lower end of the nozzle and the top of the cylindrical priming roller at the predetermined priming position after performing the process liquid discharge for the air discharge, in order to prepare for the next coating process in advance. And forming a liquid film of the processing liquid at the lower end of the nozzle by discharging the processing liquid from the nozzle and rotating the priming roller while facing the gap therebetween. A substrate support for supporting the substrate to be processed substantially horizontally; An elongated nozzle for discharging the processing liquid with a small gap on the upper surface of the substrate during coating scanning; A processing liquid supply source for feeding the processing liquid to the nozzle during the coating scan; A scanning portion for moving the nozzle in a horizontal direction relative to the substrate during coating scanning; A lifting part for moving the nozzle in a direction perpendicular to the substrate; Controlling the scanning portion to reduce the rate of relative horizontal movement of the nozzle relative to the substrate at the end of the coating scan from a first horizontal movement speed to a second horizontal movement speed that is substantially equal to zero, and the nozzle is terminated at the scanning end point In position, controlling the elevation to reduce the gap between the substrate and the nozzle from the first distance interval to a second distance interval less than that at the end of the application scan, and controlling the processing liquid supply source to At the end of the coating scan, the rate of discharging the processing liquid from the nozzle is once increased from the first discharging ratio to a second discharging ratio larger than that, and subsequently reduced from the second discharging ratio to stop the supply of the processing liquid. And processing liquid on the substrate through the nozzle located at the scanning end position. Applying device having a control section for absorbing predetermined amount. A substrate support for supporting the substrate to be processed substantially horizontally; An elongated nozzle for discharging the processing liquid with a small gap on the upper surface of the substrate during the coating process; A processing liquid supply source for feeding the processing liquid to the nozzle during the coating process; A scanning portion for moving the nozzle in a horizontal direction relative to the substrate during the coating process; A lifting part for moving the nozzle in a direction perpendicular to the substrate; Controlling the scanning portion to reduce the rate of relative horizontal movement of the nozzle relative to the substrate at the end of the coating scan from a first horizontal movement speed to a second horizontal movement speed that is substantially equal to zero, and the nozzle is terminated at the scanning end point In position, and controlling the lifting portion to increase the gap between the substrate and the nozzle once from the first distance interval to a second distance interval larger than that at the end of the coating scan, and subsequently to the second distance interval. A process of reducing the process liquid supply source from the nozzle at the end of the coating scan by controlling the process liquid supply source from the first ejection ratio; Increase once at a second discharge rate, and subsequently decrease from the second discharge rate to And a control unit which stops the supply of the processing liquid and absorbs the processing liquid on the substrate by a predetermined amount through the nozzle located at the scanning end position. 29. The method according to claim 27 or 28, wherein the control part controls at least one of the scanning part and the lifting part immediately after the absorption of the processing liquid by the nozzle is completed at the scanning end position to control the nozzle on the substrate. A coating device spaced apart from the processing liquid and configured to discharge the processing liquid to the nozzle by controlling the processing liquid supply source to discharge the air sucked together when the processing liquid is absorbed. The coating device according to claim 29, wherein the discharge amount is set so that the processing liquid exiting the discharge port of the nozzle does not flow downward when the air is discharged. The nozzle according to claim 29, wherein the nozzle has a cavity for storing the processing liquid before discharge once and a slit discharge passage extending from the cavity to the discharge port, And a coating liquid discharge amount for discharging the air within a range of 1/2 to 1 times the volume of the discharge passage. 29. The priming according to claim 27 or 28, wherein the discharge port of the lower end of the nozzle and the top of the cylindrical priming roller face each other with a desired gap at a predetermined priming position for preliminary preparation of the coating treatment. And a priming treatment portion for discharging the treatment liquid from the nozzle while rotating the roller, and forming a liquid film of the treatment liquid at the lower end of the nozzle after the discharge is finished. A coating scan is performed in which the ejection openings of the substrate to be processed and the elongated nozzle face each other substantially horizontally with a small gap therebetween and move the nozzle in a relatively horizontal direction while supplying a processing liquid from the nozzle to the substrate. A storage medium storing a coating processing program operating on a computer for forming a coating film of the processing liquid on the substrate, The program, Setting a scanning end position for relatively stopping the nozzle on the substrate; Reducing the speed of relative horizontal movement of the nozzle relative to the substrate at the end of the application scan from the first horizontal movement speed to a second horizontal movement speed that is substantially equal to zero to position the nozzle at the scanning endpoint position. Wow, Reducing the gap between the substrate and the nozzle at the end of the application scan from a first distance interval to a second distance interval less than that; At the end of the coating scan, the rate of discharging the processing liquid from the nozzle is once increased from the first discharging ratio to a second discharging ratio larger than that, and subsequently reduced from the second discharging ratio to stop the supply of the processing liquid. Making a step, And causing the computer to absorb a predetermined amount of the processing liquid on the substrate by the nozzle located at the scanning end position. A coating scan is performed in which the ejection openings of the substrate to be processed and the elongated nozzle face each other substantially horizontally with a small gap therebetween and relatively move the nozzle in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. A storage medium storing a coating processing program operating on a computer for forming a coating film of the processing liquid on the substrate, The program, Setting a scanning end position for relatively stopping the nozzle on the substrate; Reducing the relative horizontal displacement of the nozzle relative to the substrate at the end of the application scan from the first horizontal movement speed to a second horizontal movement speed that is substantially equal to zero to position the nozzle at the scanning endpoint position. Wow, At the end of the coating scan, the gap between the substrate and the nozzle is once enlarged from a first distance interval to a second distance interval larger than that, and then a third distance smaller than the first distance interval from the second distance interval. Reducing the interval, At the end of the coating scan, the rate of discharging the processing liquid from the nozzle is once increased from the first discharging ratio to a second discharging ratio larger than that, and subsequently reduced from the second discharging ratio to stop the supply of the processing liquid. Making a step, And causing the computer to absorb a predetermined amount of the processing liquid on the substrate by the nozzle located at the scanning end position. 35. The program according to claim 33 or 34, wherein the program is spaced apart from the processing liquid on the substrate immediately after the absorption of the processing liquid by the nozzle at the scanning end position, and upon absorption of the processing liquid. And causing the computer to perform a step of discharging the processing liquid to the nozzle to discharge the air sucked together. 36. The top of a cylindrical priming roller according to claim 35, wherein the program is configured to discharge the processing liquid for the air discharge for preliminary preparation of the next coating process, and then, at a predetermined priming position, a discharge port of the lower end of the nozzle and a cylindrical priming roller. To cause the computer to face each other with a desired gap therebetween, discharging the processing liquid from the nozzle while rotating the priming roller, and forming a liquid film of the processing liquid at the lower end of the nozzle after discharging ends. media.

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