CN100576077C - Coating process and apparatus for coating - Google Patents
Coating process and apparatus for coating Download PDFInfo
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- CN100576077C CN100576077C CN200610085007A CN200610085007A CN100576077C CN 100576077 C CN100576077 C CN 100576077C CN 200610085007 A CN200610085007 A CN 200610085007A CN 200610085007 A CN200610085007 A CN 200610085007A CN 100576077 C CN100576077 C CN 100576077C
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Abstract
The present invention relates to the particularly coating process that carries out easily of the uniform film thicknessization of circumference of a kind of film thickness monitoring that can make coated film.In planar coater unit (ACT) (40), go up mounting substrate (G) at objective table (80), make the work of resist liquid feed mechanism (86) and nozzle moving mechanism (88), by the coating scanning of long nozzle (82), go up the planar coated film (100) that forms resist liquid from an end of substrate to the other end at substrate (G).Planar resist-coating film this moment (100) is contacting with wire coated film (76) in the process of the outside of substrate (G) expansion and even integrated, the position of planar resist-coating film (100) outer rim is by wire coated film (76) defined, and thickness is also controlled simultaneously.
Description
Technical field
The present invention relates to a kind of on processed substrate the technology of coating liquid, particularly a kind of coating process and apparatus for coating that on substrate, forms coated film in mode without spin.
Background technology
Recently, in lithoprinting (photolithography) operation of flat-panel monitor (FPD) manufacture process, as helping resist (resist) rubbing method that processed substrate (as glass substrate) maximizes, popularizing has: make elongated resist nozzle be banded ejection resist liquid from its slit-shaped ejiction opening on one side, one side relatively moves for substrate or scans, do not need to rotatablely move, painting erosion resistant agent liquid forms the mode without spin (for example with reference to patent documentation 1) of desired thickness on substrate.
Even in adopting the resist technology of mode (claiming slit again) without spin, also carry out cleaning treatment and adhesion process as pre-treatment, in cleaning treatment, pollutants such as the particle of substrate surface, organism are removed.In adhesion process, in order to improve the adaptation of substrate and resist film, the HMDS of coating vaporous on substrate.In addition, the resist-coating processing is what the patternless substrate after the adhesion process was carried out.
The flat 10-156255 of [patent documentation 1] Jap.P. Te Open
But, existing mode without spin, the film thickness monitoring aspect for being formed on the resist-coating film on the substrate leaves room for improvement, particularly improves inner evenness and becomes problem.Concrete, exist the thickness of the coated film that is coated with beginning portion to cave in, the thickness that is coated with the coated film of pars intermedia on the other hand can not be controlled at both ends, the left and right sides, the problem that the coated film of coating terminal part is significantly swelled easily.
Concrete, according to existing mode without spin, plan view case as shown in figure 22, the coated film 200 of formation resist liquid on substrate G.Here, at the coating beginning A of portion, shown in Figure 23 (A), dwindle the clearance D of elongated resist nozzle 202 and substrate G
A, carry out resist liquid preposition ejection or liquid, but from the resist liquid of the slit-shaped ejiction opening 202a of resist nozzle 202 ejection, (the particularly nozzle length direction outside) hyper expanded easily laterally on substrate G.As a result, as shown in figure 24, at the coating beginning A of portion (particularly its left and right sides corner portion), the thickness of resist-coating film 200 is sagging laterally and cave in.
In the coating scanning, shown in Figure 23 (B), make the clearance D of resist nozzle 202 and substrate G
BBecome big during than the coating beginning, form meniscus in its bottom, back side, above substrate G, move simultaneously, because the resist liquid that just has been sprayed onto on the substrate G is pulled by nozzle 202, as shown in figure 25, resist liquid is assembled to the inside at the both ends, the left and right sides of coating pars intermedia B easily and is formed protuberance 204.Sweep velocity is fast more, perhaps clearance D
BBig more, this protuberance 204 just just like dotted line 204 ' shown in the big tendency of change.
And, when resist nozzle 202 finishes ejection resist liquid, owing to be moved upward, keep out of the way, begin the liquid cutting of resist liquid from the two ends of its slit-shaped ejiction opening 202a, so more serious in coating terminal part C (particularly its left and right sides corner portion) resist liquid gathering to the inside, the protuberance that easier formation is big.
About the Thickness Variation or the unevenness of above-mentioned resist-coating film, corresponding with situation, the condition of resist technology, make the ejection structure of resist nozzle 202 more suitable, can be reduced to a certain degree., this method does not have ubiquity, each changing condition (as thickness), condition (as the kind of resist), all necessary hardware of changing the resist nozzle, the deficiency on the very big practicality of aspects such as cost, use existence.
And, existing mode without spin, as shown in figure 26, when the preposition ejection of coating starting position A, the gap between resist nozzle 202 and substrate G can't be filled up by resist liquid fully, often produces gap (the bad place of liquid) 206.Begin coating scanning under this certain state of the bad place 206 of liquid existing, as shown in figure 27, top line (the wet line: wet line), on the position of the resist-coating film 200 corresponding, produce easily and be coated with irregular 208 of the meniscus that forms in resist nozzle 202 lower backside along the strip of direction of scanning with its position in the bad place of liquid 206 depressions.
Summary of the invention
The present invention is in view of the prior art problems point, and its purpose provides the coating process and the apparatus for coating of the mode without spin that a kind of uniform film thicknessization that makes the film thickness monitoring of coated film, particularly circumference carries out easily.
Another object of the present invention provides in the coating starting position, in the gap between nozzle and processed substrate, fills up treating fluid really tight, prevents to be coated with the coating process and the apparatus for coating of irregular mode without spin.
In order to reach above-mentioned purpose, coating process of the present invention comprises: be set in part or all of dispensing area circumference on the processed substrate, the coating treating fluid forms the wire painting process of wire coated film; With the above-mentioned dispensing area on aforesaid substrate, the coating treating fluid forms the planar painting process of planar coated film.
Apparatus for coating of the present invention has: be set in part or all of dispensing area circumference on the processed substrate, the coating treating fluid forms the wire coating handling part of wire coated film; With the above-mentioned dispensing area on aforesaid substrate, the coating treating fluid forms the planar coating handling part of planar coated film.
According to the present invention, before the planar painting process of coating treating fluid on the one side of the dispensing area on the substrate carried out, by the wire painting process, part or all the coating treating fluid at this dispensing area circumference formed the wire coated film.In planar painting process, the treating fluid that is planar coating on substrate contacts with the wire coated film and even integrated at the dispensing area circumference, is subjected to the control with the corresponding thickness of profile (profile) of wire coated film.
Among the present invention, according to a suitable embodiment, the profile of selected wire coated film makes the expansion that is coated on the treating fluid on the substrate in planar painting process be stoped by the wire coated film.According to another suitable embodiment, the profile of selected wire coated film, make in planar painting process, be coated on the substrate treating fluid since with the adhesion gravitation of wire coated film, to the perimeter sides expansion of dispensing area.Coating process of the present invention preferably heated the wire coated film before planar painting process, made its drying.So, in the apparatus for coating of the present invention, preferably be provided with before the planar painting process wire coated film heated and make its dry drying equipment.
In addition, according to a suitable embodiment, wire coating handling part has: to the substrate of approximate horizontal state, from first nozzle of top ejection wire treating fluid; Relatively move the feasible first coating scanner section that is sprayed onto the treating fluid formation wire coated film on the substrate from this first nozzle for substrate with first nozzle.This first nozzle can suitably be selected for use by the response electric drive signal treating fluid in the nozzle is pressurizeed, the nozzle of the ink jet type that sprays with the drop form.
According to a suitable embodiment, planar coating handling part has: to the substrate of approximate horizontal state, spray second nozzle of banded treating fluid from the top; Relatively move for substrate with second nozzle, make to be sprayed onto the second coating scanner section that the treating fluid on the substrate is coated with to the one side of dispensing area from this second nozzle.This second nozzle suitably uses has the elongated nozzle of length for the slit-shaped ejiction opening of the end to end of covering dispensing area on a direction.In the planar painting process, can make this elongated nozzle parallel with substrate and with the direction of nozzle length direction approximate vertical on relatively move.
According to a suitable embodiment, the profile of selected wire coated film makes treating fluid and the wire coated film of utilizing above-mentioned second nozzle to be coated on the substrate when planar painting process begins adhere to, and fills up the gap.
In the present invention, the wire coating is handled with planar coating and is handled and can carry out in different base plate supports portions (change location), also can carry out in identical support portion (same position).
The coating process of other viewpoints of the present invention is the ejiction openings of instigating processed substrate and elongated nozzle, across minim gap approximate horizontal ground subtend, carry out one side and spray treating fluid to aforesaid substrate from said nozzle, the coating scanning that said nozzle is being moved on horizontal direction, on aforesaid substrate, form the coating process of the planar coated film of above-mentioned treating fluid, near the position that the above-mentioned coating scanning on the aforesaid substrate stops, before carrying out above-mentioned coating scanning, make the coated film of implementing earlier that forms by above-mentioned treating fluid become desired pattern, the terminal that is formed on the planar coated film on the aforesaid substrate by above-mentioned coating scanning engages with the above-mentioned coated film of implementing earlier, and the above-mentioned coated film of enforcement earlier becomes the expansion of above-mentioned planar coated film.
In addition, the apparatus for coating of another viewpoint of the present invention has: the ejiction opening that makes processed substrate and elongated nozzle, across minim gap approximate horizontal ground subtend, carry out one side and spray treating fluid to aforesaid substrate from said nozzle, make said nozzle in the coating scanning of on horizontal direction, moving on one side, on aforesaid substrate, form the planar coating handling part of the planar coated film of above-mentioned treating fluid; And near the above-mentioned coating scan end position on the aforesaid substrate, before the above-mentioned coating scanning of carrying out above-mentioned planar coating handling part, the coated film of implementing earlier that makes the coated film of enforcement earlier that is formed by above-mentioned treating fluid become desired pattern forms portion, the terminal that is formed on the planar coated film on the aforesaid substrate by the coating of above-mentioned planar coating handling part scanning engages with the above-mentioned coated film of implementing earlier, and the above-mentioned coated film of enforcement earlier becomes the expansion of above-mentioned planar coated film.
In the preferred mode of the present invention, substrate is a rectangle, implements the corner portion that coated film is formed on coating end of scan side on the substrate earlier.
According to aforesaid way, near the coating scan end position, planar coated film engaged (integrated) with implementing coated film earlier when planar coating was handled, and implemented the expansion that coated film becomes planar coated film earlier, therefore, the profile of the planar coated film of coating terminal part can be adjusted arbitrarily.
According to coating process of the present invention or apparatus for coating, utilize above-mentioned formation and effect, during the coating of mode is handled without spin, the uniform film thicknessization of the film thickness monitoring of coated film, particularly circumference is carried out easily.And, in the coating starting position, in the gap between nozzle and processed substrate, fill up treating fluid really tight, can prevent to be coated with irregular.
Description of drawings
The planimetric map that Fig. 1 constitutes for the present invention's coating developing system applicatory.
Fig. 2 is the process flow diagram of the processing sequence of the coating developing system of expression embodiment.
The oblique view that Fig. 3 constitutes for major part in the wire coater unit in the coating developing system of expression embodiment.
Fig. 4 is the planimetric map of the plan view case of the wire resist-coating film that forms in the pattern ground expression embodiment on substrate.
Fig. 5 is the coating position of the wire resist-coating film that forms in the pattern ground expression embodiment and the sectional view of cross sectional shape on substrate.
The oblique view that Fig. 6 constitutes for major part in the planar coater unit in the coating developing system of expression embodiment.
Fig. 7 is the oblique view of the effect in the planar coater unit of expression embodiment.
Fig. 8 is the planimetric map of the plan view case of the planar resist-coating film that forms in the pattern ground expression embodiment on substrate.
Fig. 9 is the partial cross section figure of a kind of effect of wire resist-coating film in the pattern ground expression embodiment.
Figure 10 is the partial cross section figure of a kind of effect of wire resist-coating film in the pattern ground expression embodiment.
Figure 11 is the partial cross section figure of a kind of effect of wire resist-coating film in the pattern ground expression embodiment.
Figure 12 is the partial cross section figure of a kind of effect of wire resist-coating film in the pattern ground expression embodiment.
Figure 13 is the partial cross section figure of a kind of effect of wire resist-coating film in the pattern ground expression embodiment.
The oblique view that Figure 14 constitutes for a kind of variation that makes up wire coating treating apparatus in the expression embodiment on planar coating treating apparatus.
Figure 15 is the planimetric map of the coating processing effect of pattern ground presentation graphs 14 configuration examples.
Figure 16 is the summary outboard profile that is illustrated in the configuration example of combined heated drying device in Figure 14 configuration example.
Figure 17 is the planimetric map of implementing an example of resist-coating film figure earlier of expression embodiment.
Figure 18 is the planimetric map of the effect of coated film of implementing earlier of expression embodiment.
Figure 19 is the planimetric map of implementing other figure cases of coated film earlier of expression embodiment.
Figure 20 is the planimetric map of implementing other figure cases of coated film earlier of expression embodiment.
Figure 21 is the planimetric map of implementing other figure cases of coated film earlier of expression embodiment.
Figure 22 handles the planimetric map of the resist-coating membrane plane view case that obtains on substrate according to the coating without spin of prior art for the expression of pattern ground.
Figure 23 is the front view (FV) that is coated with the processing effect without spin of pattern ground expression prior art.
Figure 24 is the partial cross section figure of pattern ground expression prior art problem points.
Figure 25 is the partial cross section figure of pattern ground expression prior art problem points.
Figure 26 is the front view (FV) of pattern ground expression prior art problem points.
Figure 27 is the oblique view of pattern ground expression prior art problem points.
Symbol description
40 planar coater units (ACT)
44 wire coater units (LCT)
62 objective tables
64 ink jet type resist nozzles (ink jet type nozzle)
68 Y guide rails
70 X guide rails
72 Y direction drive divisions
74 stands
76 wire resist-coating films
80 objective tables
82 elongated resist nozzles (long nozzle)
84 coating handling parts
86 resist liquid feed mechanisms
88 nozzle moving mechanism
100 planar resist-coating films
102 warm-air driers
110 implement the resist-coating film earlier
112 planar resist-coating films
114 synthetic resist-coating films
G glass substrate (processed substrate)
The RE dispensing area
Embodiment
Below, with reference to Fig. 1～Figure 21, the preferred embodiment for the present invention is described.
Among Fig. 1, as coating process of the present invention and apparatus for coating configuration example applicatory, expression coating developing system.This coating developing system is arranged in the decontamination chamber, for example with LCD with glass substrate as processed substrate, in the LCD manufacture process, carry out in the lithoprinting operation cleaning, resist-coating, prebake, development and after cure each and handle.Exposure-processed with the outside exposure device (not shown) of this adjacent setting of system in carry out.
This is coated with developing system, substantially by cassette station (cassette station) (C/S) 10, process platform (process station) (P/S) 12 be connected (interface) portion (I/F) 14 and constitute.
The cassette station (C/S) 10 that is provided with in an end of system has: can the mounting stated number boxlike objective table 16 of 4 the box C that holds a plurality of substrate G at the most for example; Side on this boxlike objective table 16, the conveyance path 17 that be arranged in parallel with the orientation of box C; With on this carrying channel 17, move freely, for the box C on the objective table 16, carry out the transport mechanism 20 that sending into of substrate G sent.This carrying mechanism 20 has equipment such as the carrying arm that keeps substrate G, can move on 4 axles of X, Y, Z, θ, carries out the exchange of substrate G with the carrying device 38 of aftermentioned process platform (P/S) 12 sides.
Process platform (P/S) 12 from above-mentioned cassette station (C/S) 10 sides, in turn with cleaning process portion 22, coating process portion 24, developing process portion 26, is arranged as horizontal row across (clamping) substrate relay 23, soup feed unit 25 and space 27.
Developing process portion 26 has 52,2 of 3 developing cells (DEV) 2 segment type heating/cooling unit (HP/COL) 53 and heating unit (HP) 55 up and down.
Central portion in each process portion 22,24,26 is provided with conveyance path 36,47,58 along its length, carrying device 38,54,60 36,47,58 moves along the conveyance path respectively, each unit in each process portion is arrived in access (access), carries out moving into/take out of or conveyance of substrate G.And in this system, to each process portion 22,24,26, a side in conveyance path 36,47,58 disposes liquid processing system unit (SCR, CT, DEV etc.), and opposite side disposes heat treatment system unit (HP, COL etc.).
Be arranged on the connecting portion (I/F) 14 of system the other end, be provided with extension (extension) (substrate exchange portion) 56 and buffer stage (buffer stage) 57, be provided with transport mechanism 59 with the exposure device sides adjacent in a side adjacent with process platform 12.This transport mechanism 59 is along moving freely on the conveyance path 19 of Y direction, except carrying out with respect to buffer stage 57 moving into of substrate G take out of, also carries out the exchange of substrate G with extension (substrate exchange portion) 56 and adjacent exposure device.
Fig. 2 represents the processing sequence of this coating developing system.At first in cassette station (C/S) 10, transport mechanism 20 takes out 1 substrate G from the box C of boxlike objective table 16 regulations, is transported in the carrying device 38 of cleaning process portion 22 of process platform (P/S) 12 (step S1).
In cleaning process portion 22, substrate G is at first moved in the ultraviolet ray irradiation/cooling unit (UV/COL) 30 in turn, in initial ultraviolet irradiation unit (UV), implement to clean by the dry type that the ultraviolet ray irradiation is carried out, in following cooling unit (COL), be cooled to set point of temperature (step S2).Clean the organism of mainly removing substrate surface by this ultraviolet ray.
Then, substrate G shampoos cleaning treatment in a shampooing (scrub) cleaning unit (SCR) 28, and particle shape pollutant is removed (step S3) from substrate surface.After shampooing was cleaned, substrate G heated in heating unit (HP) 32, dewaters and cures processing (step S4), and next step is cooled to certain substrate temperature (step S5) in cooling unit (COL) 34.So far, the pre-treatment of cleaning process portion 22 finishes, and substrate G is by carrying device 38, by 23 conveyances of substrate exchange portion to coating process portion 24.
In coating process portion 24, substrate G is at first moved in the wire coater unit (LCT) 44, dispensing area periphery of setting on substrate G as described later there or circumference wire painting erosion resistant agent liquid (step S6).Substrate G goes up the wire resist-coating film that forms like this, and then in heating unit (HP) 50, carries out drying (step S7) by heat treated.Then, substrate G is moved in adhesion/cooling unit (AD/COL) 46 in turn, carries out hydrophobization in initial coherent unit (AD) and handles (HMDS) (step S8), at following cooling unit (COL), is cooled to certain substrate temperature (step S9).Between heat drying operation (HP) and hydrophobization operation (HMDS), also can carry out cooling processing (COL).
Next, substrate G utilizes method without spin in planar coater unit (ACT) 40, and painting erosion resistant agent liquid on the dispensing area one side utilizes decompression to carry out dried (step S10) then in drying under reduced pressure unit (VD) 42.
Below, substrate G is moved in heating/cooling unit (HP/COL) 48 in turn, heat baking (prebake) (step S11) after being coated with in initial heating unit (HP) is cooled to certain substrate temperature (step S12) in following cooling unit (COL).Also can use heating unit (HP) 50 in the heat baking after coating.
After above-mentioned coating was handled, substrate G was arrived connecting portion (I/F) 14 by the carrying device 54 of coating process portion 24 and the carrying device 60 of developing process portion 26 by conveyance, is moved to therefrom (step S13) in the exposure device.Resist in exposure device on the substrate G is exposed into the circuit design of regulation.Then, the substrate G after pattern exposure finishes turns back to the connecting portion (I/F) 14 from exposure device.The transport mechanism 59 of connecting portion (I/F) 14 will be transported to the developing process portion 26 (step S13) of process platform (P/S) 12 from the substrate G that exposure device is fetched by extension 56.
In developing process portion 26, substrate G accepts development treatment (step S14) in any of developing cell (DEV) 52, then moved in turn among of heating/cooling unit (HP/COL) 53, in initial heating unit (HP), carry out after heat baking (step S15), in cooling unit (COL), be cooled to certain substrate temperature (step S16) then.In this after heat baking, also can use heating unit (HP) 55.
The substrate G that carries out in developing process portion 26 after a series of processing turns back to cassette station (C/S) 10 by the carrying device 60,54,38 of process platform (P/S) 12, is received among any box C (step S1) by transport mechanism 20 there.
In this coating developing system, coating process portion 24, particularly wire coater unit (LCT) 44 and planar coater unit (ACT) 40 are suitable for the present invention.Below, utilize Fig. 3～Figure 14, the wire coater unit (LCT) 44 of one embodiment of the present invention and the formation and the effect of planar coater unit (ACT) 40 are elaborated.
Fig. 3 represents that wire coater unit (LCT) the 44 interior major parts of this embodiment constitute.This wire coater unit (LCT) 44 has: for keeping the objective table 62 of the horizontal mounting of substrate G; Substrate G on relative this objective table 62 is the resist nozzle (hereinafter to be referred as " ink jet type nozzle ") 64 of the ink jet type of point-like or wire ejection resist liquid, along the nozzle scan mechanism 66 that the XY direction moves; Controller (not shown) with the control each several part.
In nozzle scan mechanism 66, be configured in the left and right sides of objective table 62, transversal objective table 62 tops along a pair of Y guide rail 68,68 of Y direction, an X guide rail 70 along directions X, under the effect of the Y direction drive division 72 of for example being furnished with motor, can on Y guide rail 68,68, move along the Y direction.And, at X guide rail 70 upper edge directions Xs the removable stand (carriage) (conveyance body) 74 of self-propelled for example or external drive formula is installed, ink jet type nozzle 64 is installed on this stand 74.Because can move in the Y direction by Y direction drive division 72, can move at directions X by stand 74, with both combinations, ink jet type nozzle 64 is moved between any 2 on the XY face above the objective table 62 or along arbitrary line or curvilinear path.
Ink jet type nozzle 64 constitutes: in its ejiction opening inside, as jetting system, for example be built-in with piezoelectric element, because the electric drive signal of above-mentioned controller transmission, make this piezoelectric element contracts action, the resist liquid in the nozzle is pressurizeed, from ejiction opening ejection drop by this systolic pressure.In addition, resist liquid supply unit (not shown) directly or by the pipe arrangement (not shown) is connected with resist nozzle 64 as container.
This wire coater unit (LCT) 44, because above-mentioned structure, can be on part or all of predefined dispensing area circumference on the substrate G, the coating treating fluid forms the resist-coating film of wire.For example, as shown in Figure 4, make ink jet type nozzle 64 by nozzle scan mechanism 66,4 limits at substrate G, track with (1) → (2) → (3) → (4) moves, owing to the resist drop of the aequum each point to this track, on dispensing area RE circumference, can form rectangular wire resist-coating film 76 from ink jet type nozzle 64.The dispensing area RE here be meant in planar coater unit described later (ACT) 40 resist liquid with method without spin by the zone on the substrate G of planar coating.Usually, the outer fringe position of dispensing area RE is set in end a few minutes (as the 10mm) inboard apart from substrate G.
The shape of the plan view case of wire resist-coating film 76 is a standard with the shape (quadrangle) that meets with substrate G, but also can select and planar resist-coating (ACT) claimed condition of back operation, any variation that treatment conditions adapt.For example, Thickness Variation or unevenness for the edge part of the resist-coating film 200 of the prior art of more effective minimizing such as Figure 22～shown in Figure 27, in the planar resist-coating (ACT) of subsequent handling, become substrate one end side of the directions X of coating starting position A, make that part enlarged drawing LA is depicted as circle in the circle of the bight 76A of wire resist-coating film 76 such as Fig. 8, the pattern of Ju Jiing to the inside, or in the substrate the other end side that becomes the directions X that is coated with final position C, the bight 76C of wire resist-coating film 76 is fined away be acute angle shown in part enlarged drawing LC in the circle of Fig. 8, Kuo Zhan pattern etc. all suits laterally.
In addition, as shown in Figure 5, the cross sectional shape of wire resist-coating film 76, size (particularly thickness W and height H etc.) also can be selected arbitrarily within the specific limits.Dotted line J among the figure represents the goods zone on the substrate G and the boundary in non-goods zone.Usually because the circumferential position of dispensing area RE is set in the outside of boundary J, so wire resist-coating film 76 also can be formed on the outside of boundary J.
As mentioned above, in wire coater unit (LCT) 44, be formed on the wire resist-coating film 76 on the substrate G, and then in heating unit (HP) 50, carry out heat treated, make its drying (step S7).This heat drying is in order to make residual solvent evaporation in the wire resist-coating film 76, improves the adaptation with substrate G, but there is no need drying as prebake (step S11), and can be half-dried.
Fig. 6 represents that the major part in the planar coater unit (ACT) 40 constitutes.This planar coater unit (ACT) 40 has: for keeping the objective table 80 of the horizontal mounting of substrate G; With above the substrate G for mounting on this objective table 80 (correctly being dispensing area RE), utilize elongated resist nozzle (hereinafter referred to as " long nozzle ") 82, use method without spin, the coating handling part 84 of planar painting erosion resistant agent liquid.
Coating handling part 84 has: the resist liquid feed mechanism 86 that has long nozzle 82; With the nozzle moving mechanism 88 that when coating is handled, long nozzle 82 is moved horizontally above objective table 80 along directions X.In resist liquid feed mechanism 86, long nozzle 82 has the length with the end to end that covers objective table 80 upper substrate G, the slit-shaped ejiction opening that extends in the Y direction, and be connected with the resist liquid supply pipe 90 of resist liquid supply source (not shown).Nozzle moving mechanism 88 has: support anti-" コ " font of long nozzle 82 levels or the nozzle support body 92 of door shape; With make this nozzle support body 92 on directions X, the craspedodrome drive division 94 that twocouese keep straight on to move.This craspedodrome drive division 94 can be made of for example tape guide straight line electric machine mechanism or ball screw mechanism.In addition, be used to change or the tape guide elevating mechanism 96 of regulating the height and position of long nozzle 82 is arranged on the connecting portion 98 that for example connects nozzle support body 92 and long nozzle 82.Because the height and position of long nozzle 82 can be regulated or change to elevating mechanism 96, so can regulate or change the lower end of long nozzle 82 arbitrarily or the distance interval between (processed face), the i.e. size in gap above the substrate G on ejiction opening and the objective table 80.
In this planar coater unit (ACT) 40, mounting substrate G on the objective table 80, under the control of controller (not shown), resist liquid feed mechanism 86 and nozzle moving mechanism 88 etc. are operated with the order of regulation, thus, as shown in Figure 8, the dispensing area RE on substrate G, be in the rectangular frame or zone of wire resist-coating film 76, can make planar resist-coating film 100 form desirable thickness with dyke one-tenth.
In more detail, as shown in Figure 6, on one side long nozzle 82 is moved with certain speed by nozzle moving mechanism 88, make that the height with regulation cuts or scanning along directions X is vertical above objective table 80, on one side in resist liquid feed mechanism 86, supply to the dispensing area RE of the substrate G on the objective table 80 with the banded discharging jet of expanding along the Y direction from the resist liquid of the slit-shaped ejiction opening ejection of long nozzle 82.By the coating scanning of this long nozzle 82, as shown in Figure 7, on substrate G,, form the planar coated film 100 of resist liquid to the other end from an end of substrate as catching up with in long nozzle 82 back.At this moment, in the process of planar resist-coating film 100 (outside particularly) expansion outside substrate G, contact with wire coated film 76 and even integrated, the marginal position of planar resist-coating film 100 is by wire resist-coating film 76 defineds, and thickness is also controlled simultaneously.
Promptly at coating starting position A, because dwindle the gap of long nozzle 82 and substrate G, carry out resist liquid preposition ejection or liquid, so from the resist liquid of the slit-shaped ejiction opening of long nozzle 82 ejection (particularly outside the long hand direction of nozzle) hyper expanded laterally on substrate G easily.But under this embodiment, the edge part of dispensing area RE has formed wire resist-coating film 76.Thus, as shown in Figure 9,, can't expand (embankment effect) thus laterally because the outer rim of planar resist-coating film 100 is limited by the dyke of wire resist-coating film 76, as imaginary line 100 ' shown in attenuate (depression) of thickness hindered.Particularly, shown in part enlarged drawing LA in the circle among Fig. 8,, the bight of wire resist-coating film 76 is become in the circular pattern, can further improve above-mentioned embankment effect and even prevent the effect that thickness caves in coating starting position A side.
On the other hand, in the coating scanning, as shown in Figure 7, form the state of meniscus in its bottom, back side with long nozzle 82, above substrate G, move along directions X, because the resist liquid that has just sprayed on substrate G is by long nozzle 82 towings, so the power that is subjected to assembling to the inside at both ends, the left and right sides resist liquid that is coated with pars intermedia B.Under this embodiment, because the outer edge of dispensing area RE has formed wire coated film 76, as shown in figure 10, rest on the circumferential position of regulation because of the adhesion gravitation of the outer edge of planar resist-coating film 100 and wire resist-coating film 76, assemble to the inside, prevented imaginary line 100 ' shown in the protuberance of thickness.
In addition, at the coating termination C of portion, though just be sprayed onto the bigger inside power of ratio coating pars intermedia B that resist liquid on the substrate G is subjected to long nozzle 82 sides, but still owing to rest on the circumferential position of regulation with adhesion (wetting) gravitation of wire resist-coating film 76, do not assemble to the inside, prevented the protuberance of thickness.Particularly shown in part enlarged drawing LC in the circle among Fig. 8, in coating final position C side, in the pattern that the bight 76C formation acute angle of wire resist-coating film 76 is expanded laterally, when finishing, coating will transfer to its zone broadening part from the excessive resist liquid of long nozzle 82 ejections, because wetting adhesion with wire resist-coating film 76, it is kept better, therefore can improve the effect that prevents above-mentioned thickness protuberance more.
And, this embodiment, before coating scanning beginning or during beginning, on coating starting position A, be used between long nozzle 82 and substrate G gap filling resist liquid liquid can repeatability carry out well.Promptly as shown in figure 12, because near coating starting position A or its directions X outside, formed wire resist-coating film 76, so by the slit-shaped ejiction opening 82a of long nozzle 82 ejection liquid with resist liquid R, on the wire resist-coating film 76 from above overlap, adhesion and even integrated, to the long hand direction of nozzle (Y direction) expansion, can be in the gap complete filling resist liquid R, making it does not have the space.
Like this, by scanning will be long beginning coating under the state that fills up fully with resist liquid of nozzle 82 and the gap of substrate G, as shown in Figure 7, (wet line: wet line) WL remains on the same horizontal line top line of the meniscus that forms in the lower backside of long nozzle 82, can form the resist-coating film 100 that is not coated with irregular tabular surface on substrate G.
Under this embodiment, various states, condition for resist technology, do not need to change or exchange the hardware of long nozzle 82, suitably select the profile (coating position, height H, width W etc.) of wire resist-coating film 76, can realize the film thickness monitoring of above-mentioned homogenising easily.
For example, do not change coating conditions such as sweep velocity, resist characteristic, with the thickness setting value of planar resist-coating film 100 by T
aChange into for example about 2 times T
b, in coating scanning pars intermedia B, compare with the power of assembling to the inside of long nozzle 82, because bigger with the wetting quantitative power of expanding laterally of resist liquid of substrate, the thickness at both ends, the left and right sides not only swells, and outwards hang down easily (depression).
At this moment, as shown in figure 11,, can possess prevention on wire resist-coating film 76, the embankment effect function of the outer edge of planar resist-coating film 100 expansion because assemble to substrate inboard (goods area side) the coating position of wire resist-coating film 76.Thus, can eliminate as imaginary line (dot-and-dash line) 100 ' shown in the thickness of planar resist-coating film 100 hang down or cave in, keep the homogenising of thickness.
As mentioned above, according to this embodiment, for the resist-coating of mode without spin, because the periphery of the dispensing area RE that sets on substrate G has formed wire resist-coating film 76, in regular coating was without spin handled, the film thickness monitoring that the makes planar resist-coating film 100 particularly uniform film thickness chemical control system of circumference was carried out easily.And, when beginning coating or before the work that surges, to fill resist liquid well be possible to repeatability in the gap between long nozzle 82 and substrate G, thus, the irregular generation of coating of strip can be in coating scanning, prevented, the resist film of tabular surface high-quality can be obtained.
In the above-described embodiment, constitute and utilize special-purpose wire coater unit (LCT) 44, carry out on substrate G, forming the processing of wire resist-coating film 76.But, also can be to carry out the device of wire coating processing and to be located in the planar coater unit (ACT) 40 or the formation of combination.
For example shown in Figure 14, in planar coater unit (ACT) 40, can be on the nozzle support body 92 of nozzle moving mechanism 88, by with above-mentioned wire coater unit (LCT) 41 in wire coating treating apparatus (Fig. 3) in X guide rail 70, the stand 74 of same configuration, carry ink jet type nozzle 64.At this moment, make by nozzle moving mechanism 88 long nozzle 82 above objective table 80 along prescribed direction (directions X) in the mobile coating scanning, ink jet type nozzle 64 can be in the anterior position of long nozzle 82, above objective table 80, move, can before the planar coating scanning of long nozzle 82, carry out the wire coating scanning of ink jet type nozzle 64 earlier.
Like this, when wire coating treating apparatus was installed in planar coater unit (ACT) 40, preferably installation was used for the dry equipment that just has been formed on the wire resist-coating film 76 on the substrate G in unit (ACT) 40.For example, as shown in figure 16, can the equipment that warm-air drier 102 is scanned be installed in the back of ink jet type nozzle 64.This warm-air drier 102 has the heat generating part 104 that for example is made of resistance heating equipment, introduces air or nitrogen by gas line 106, blows desiccant warm braw by the wire resist-coating film 76 of warm-air drier 102 on substrate G.Perhaps,, can after the wire coating, not do special dried yet, directly carry out planar coating and handle if the action effect of wire resist-coating film 76 is reduced to a certain degree.
In the above-mentioned embodiment, with around the substrate G mode in one week, all form wire resist-coating film 76 in the outer rim of dispensing area RE.But also can be only in the part of dispensing area RE periphery, as only near the coating starting position or, form local wire resist-coating film 76 only at coating scanning pars intermedia or only at the coating terminal part or only in the bight.In addition, as a variation of the coated pattern shown in the enlarged drawing LC of Fig. 8, also can vacate formation with gap not in conjunction with the wire resist-coating film 76 in bight, this formation also can obtain effect same as described above.
The coating of above-mentioned embodiment scanning is to adopt fixing base G on objective table 80, the mode that ink jet type nozzle 64 or long nozzle 82 are moved along prescribed direction or track.But, fixed nozzle 64,82, the mode that substrate G is moved on prescribed direction, or the mode that nozzle 64,82 and substrate G are moved simultaneously is also passable.In coating scanning, the come-up conveyance formula that substrate G is floated over move in the air is also passable.
In the above-described embodiment, coating beginning during liquid, by long nozzle 82 to the slit of substrate G in the micro-resist liquid of ejection, but, also can adopt primary coat (priming) facture carrying out liquid as additive method.According to the primary coat facture, primary coat handling part by near setting objective table 80, near the primary coat resist liquid ejiction opening of long nozzle 82, long nozzle 82 is moved to objective table 80 tops, reduce to and substrate G between form the height of the close gap of regulation, make the coating starting position of the liquid film of the accompanying resist liquid in the lower end of substrate G near substrate G.According to the present invention because the coating starting position near, formed wire resist-coating film, utilize the primary coat facture liquid also can reappearance carry out well.
From the resist liquid of long nozzle 82 ejections in beginning with before wire resist-coating film 76 contacts, preferably make long nozzle 82 static or stop to move.In case resist contacts with wire resist-coating film 76, even long nozzle 82 is moved, also can be by wire resist-coating film 76 absorption, can to and wire resist-coating film 76 between resist seamlessly is provided.The ejection resist was preferably tried to achieve by trial test etc. to time that long nozzle 82 begins to move.
In addition, for making long nozzle 82 ejection resists and contacting with wire resist-coating film 76 as early as possible, can spray resist than ormal weight in the incipient stage, the resist of ejection is with after wire resist-coating film 76 contacts with Duoing, and the resist of surplus can be drawn in the long nozzle 82.The time that begins to attract from being ejected into of resist preferably also obtains by trial test.
In addition, omit among the figure,, can constitute a plurality of (as the 4) nozzle 64 on each limit, form the device of wire resist-coating film 76 along each limit of substrate simultaneously with difference counterpart substrate about wire coater unit (LCT) 44.Like this, can the enough shorter time on substrate, form desirable wire resist-coating film 76.
Wire resist film coating of the present invention also can have various deformation with the formation that nozzle and planar resist film are coated with nozzle.For example, can use the solenoid valve ON/OFF formula nozzle that has the minute aperture ejiction opening to replace ink jet type nozzle 64.The ejiction opening of long in addition nozzle 82 also is not limited only to slit-type, also a plurality of minute aperture assortments can be become row.
In addition, in the wire painting process, be that arbitrary graphic pattern beyond the wire also is fine with the warpage of wire resist-coating film 76.Particularly in the planar coating of method without spin, as the coating terminal part (particularly left and right sides corner portion) of above-mentioned resist liquid film on substrate G, (on the direction vertical with the coating direction of scanning, substrate center's side) assembles a lot easily to the inside.The present invention is (particularly left and right sides corner portion) near the terminal of the planar resist-coating film on the substrate G, and in advance (for example with same the implementing in the painting process earlier of above-mentioned wire painting process) the resist-coating film of implementing earlier that will be used to expand the profile of the profile of planar resist-coating film, particularly left and right sides corner portion becomes desirable pattern.
As described in Figure 17, the left and right sides corner portion of the planar coating rear end side on substrate G, with right angle slightly
Shape or " " " pattern of shape constitutes and to implement coated film 110 earlier.At this moment, in planar painting process, the planar resist-coating film 112 that is formed on the substrate G is assembled to the inside in coating end of scan portion, (particularly shown in part expanded view LD in the circle) as shown in figure 18, left and right sides corner portion on substrate G, planar resist-coating film 112 is overlapped and is formerly implemented on the resist-coating film 110, engage (integrated), implement the shape (rectangular shaped) that resist-coating film 110 expansions as planar resist-coating film 112 are defined as the bight earlier, so obtain synthetic resist-coating film 114.
Other, among the present invention, pattern or the profile of implementing resist-coating film 110 earlier can be out of shape arbitrarily.For example, circular pattern as shown in figure 19, the thin rectangle that extends to planar coating direction of scanning shown in Figure 20 or the pattern of rectangle, as shown in figure 21 extend to the thin rectangle of the perpendicular direction in planar coating direction of scanning or pattern of rectangle etc. can.In these cases, remain terminal in planar coating scanning, planar resist-coating film 112 is implemented resist-coating film 110 with elder generation and is engaged (integrated), implement the shape that resist-coating film 110 prolongations as planar resist-coating film 112 are defined as the bight earlier, so obtain synthetic resist-coating film 114.
In addition, the coated film of implementing earlier of the present invention can be utilized for example thinning agent (thinner) replacement resist liquid of solvent, form and above-mentioned same pattern or profile.This situation, diagram is omitted, the planar resist-coating film of planar painting process is implemented the thinning agent coated film with elder generation and is engaged, the resist liquid of planar resist-coating film is formerly implemented wetting expansion on the thinning agent coated film, its result, the profile of planar resist-coating film is expanded or is extended on the profile of implementing the thinning agent coated film earlier.Thus, planar resist-coating film is assembled to the inside in coating end of scan portion, and the coated film profile in bight, the left and right sides can become desirable shape (for example rectangular shaped).
Resist-coating device in the coating toning system that above-mentioned embodiment is with LCD makes is relevant, but the present invention also is applicable to any treating apparatus and the application of supplying with treating fluid on processed substrate.Therefore, as treating fluid of the present invention, except resist liquid, can be the coating fluid of interlayer dielectic, dielectric substance, wiring material etc., also can be developer solution, washing lotion etc.Processed substrate of the present invention is not limited only to the LCD substrate, and the flat-panel monitor that also can be other is with substrate, semiconductor wafer, CD substrate, glass substrate, photomask, printed base plate etc.
Claims (17)
1. a coating process is characterized in that, comprising:
Be set in dispensing area circumference on the processed substrate part or all on, the coating treating fluid is pre-formed the wire painting process of wire coated film; With
Described dispensing area on described substrate, the coating treating fluid forms the planar painting process of planar coated film.
2. coating process as claimed in claim 1 is characterized in that:
The profile of wire coated film makes the expansion that is coated on the treating fluid on the described substrate in described planar painting process be stoped by described wire coated film described in the selected described wire painting process.
3. coating process as claimed in claim 1 is characterized in that:
The profile of wire coated film described in the selected described wire painting process, make in described planar painting process, be coated on the described substrate treating fluid by with the perimeter sides expansion of the adhesion gravitation of described wire coated film to described dispensing area.
4. as each described coating process in the claim 1～3, it is characterized in that:
Described wire painting process comprises that first nozzle that makes treating fluid wire ejection makes the operation that relatively moves for described substrate.
5. as each described coating process in the claim 1～3, it is characterized in that:
Described planar painting process comprises making banded second nozzle that sprays for the treatment of fluid make the operation that relatively moves for described substrate.
6. coating process as claimed in claim 5 is characterized in that:
Described second nozzle is the elongated nozzle that has the slit-shaped ejiction opening, in described planar painting process, makes described elongated nozzle parallel with described substrate, and relatively moves along the direction with nozzle length direction approximate vertical.
7. coating process as claimed in claim 6 is characterized in that:
The profile of selected described wire coated film makes treating fluid and the described wire coated film of utilizing described second nozzle to be coated on the described substrate when described planar painting process begins adhere to, and fills up described gap.
8. as claim 2 or 3 described coating processes, it is characterized in that:
The profile of described wire coated film comprises at least one in thickness, live width and the position on substrate of this coated film.
9. as each described coating process in the claim 1～3, it is characterized in that:
Before described planar painting process, the wire coated film that is formed by described wire painting process is heated, make its drying.
10. apparatus for coating is characterized in that having:
Be set in part or all of dispensing area circumference on the processed substrate, the coating treating fluid forms the wire coating handling part of wire coated film; With
Described dispensing area on described substrate, the coating treating fluid forms the planar coating handling part of planar coated film.
11. apparatus for coating as claimed in claim 10 is characterized in that,
Described wire coating handling part has:
To the described substrate of approximate horizontal state, from first nozzle of top ejection wire treating fluid; With
Described first nozzle is relatively moved for described substrate, make to be sprayed onto the first coating scanner section that treating fluid on the described substrate forms described wire coated film from first nozzle.
12. apparatus for coating as claimed in claim 11 is characterized in that:
Described first nozzle is pressurizeed to the treating fluid in the nozzle by the response electric drive signal, and the Jetspray nozzle that sprays with the drop form constitutes.
13. as each described apparatus for coating in the claim 10～12, it is characterized in that,
Described planar coating handling part has:
To the described substrate of approximate horizontal state, spray second nozzle of banded treating fluid from the top; With
Described second nozzle is relatively moved for described substrate, make to be sprayed onto the second coating scanner section on the one side that treating fluid on the described substrate is applied to described dispensing area from described second nozzle.
14. apparatus for coating as claimed in claim 13 is characterized in that:
Described second nozzle constitutes by having the elongated nozzle of length for the slit-shaped ejiction opening of the end to end of the described dispensing area of covering on a direction.
15. apparatus for coating as claimed in claim 13 is characterized in that:
Described wire coating handling part and described planar coating handling part have for keeping described substrate to be in the support portion independently separately of horizontality.
16. apparatus for coating as claimed in claim 13 is characterized in that:
Described wire coating handling part and described planar coating handling part have for keeping described substrate to be in the shared support portion of horizontality.
17., it is characterized in that as each described apparatus for coating in the claim 10～12:
The described wire coated film that has being formed on the described substrate by described wire coating handling part heats, and makes its dry drying equipment.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP2005156895 | 2005-05-30 | ||
| JP2005156895 | 2005-05-30 | ||
| JP2006121556 | 2006-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009102093194A Division CN101685257B (en) | 2005-05-30 | 2006-05-30 | Coating method and coating apparatus |
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| CN1873535A CN1873535A (en) | 2006-12-06 |
| CN100576077C true CN100576077C (en) | 2009-12-30 |
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| CN200610085007A Expired - Fee Related CN100576077C (en) | 2005-05-30 | 2006-05-30 | Coating process and apparatus for coating |
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| JP (1) | JP5430697B2 (en) |
| CN (1) | CN100576077C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103796819A (en) * | 2011-09-09 | 2014-05-14 | Lg伊诺特有限公司 | Method of fabricating thick film of large area substrate, thick film, backlihgt unit and liquid crystal display using the same |
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| JP2010287686A (en) * | 2009-06-10 | 2010-12-24 | Tokyo Electron Ltd | Coating/developing device, and method for cleaning back of substrate |
| JP5628768B2 (en) * | 2011-09-07 | 2014-11-19 | 富士フイルム株式会社 | Manufacturing method of string filler-containing coating |
| CN103246165B (en) * | 2013-04-25 | 2015-03-25 | 深圳市华星光电技术有限公司 | Photoresist coating device and coating method thereof |
| KR101503402B1 (en) * | 2013-07-12 | 2015-03-17 | 삼성디스플레이 주식회사 | Slit nozzle and method of manufacturing display device using the same |
| CN105492962B (en) * | 2013-08-30 | 2019-07-26 | 武藏工业株式会社 | The manufacturing method and device of plate laminated body |
| JP6002115B2 (en) * | 2013-11-18 | 2016-10-05 | 東京エレクトロン株式会社 | Coating processing method, program, computer storage medium, and coating processing apparatus |
| JP6030078B2 (en) * | 2014-01-23 | 2016-11-24 | 富士フイルム株式会社 | Method for producing coated film |
| JP6271289B2 (en) * | 2014-02-20 | 2018-01-31 | 芝浦メカトロニクス株式会社 | Adhesive coating apparatus, display device member manufacturing apparatus, and display device member manufacturing method |
| JP5781659B1 (en) * | 2014-04-14 | 2015-09-24 | 株式会社石井表記 | Coating film forming and drying device |
| JP6231956B2 (en) * | 2014-08-11 | 2017-11-15 | 東京エレクトロン株式会社 | Substrate processing equipment |
| US10457115B2 (en) * | 2015-08-10 | 2019-10-29 | Hanon Systems | Air conditioning system for vehicle |
| JP6761860B2 (en) * | 2016-06-30 | 2020-09-30 | 東京エレクトロン株式会社 | Coating processing equipment, coating processing method and computer storage medium |
| CN108435000B (en) * | 2017-02-16 | 2023-12-08 | 上海硅苑膜科技有限公司 | Automatic film coating device for flat ceramic film and preparation method of flat ceramic film |
| WO2020066229A1 (en) * | 2018-09-27 | 2020-04-02 | 富士フイルム株式会社 | Film manufacturing method and film roll |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09164357A (en) * | 1995-12-18 | 1997-06-24 | Dainippon Screen Mfg Co Ltd | Liquid coater |
| JP4539938B2 (en) * | 2000-08-16 | 2010-09-08 | 東京エレクトロン株式会社 | Coating device |
| JP3967631B2 (en) * | 2001-06-07 | 2007-08-29 | 東京エレクトロン株式会社 | Film forming method and film forming apparatus |
| JP4192456B2 (en) * | 2001-10-22 | 2008-12-10 | セイコーエプソン株式会社 | Thin film forming method, thin film structure manufacturing apparatus, semiconductor device manufacturing method, and electro-optical device manufacturing method using the same |
| JP3808792B2 (en) * | 2002-03-28 | 2006-08-16 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and slit nozzle |
| JP2004098012A (en) * | 2002-09-12 | 2004-04-02 | Seiko Epson Corp | Thin film formation method, thin film formation device, optical device, organic electroluminescent device, semiconductor device, and electronic apparatus |
| JP2005217282A (en) * | 2004-01-30 | 2005-08-11 | Tokyo Electron Ltd | Method and apparatus for forming coating film |
-
2006
- 2006-05-30 CN CN200610085007A patent/CN100576077C/en not_active Expired - Fee Related
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2012
- 2012-03-07 JP JP2012050567A patent/JP5430697B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103796819A (en) * | 2011-09-09 | 2014-05-14 | Lg伊诺特有限公司 | Method of fabricating thick film of large area substrate, thick film, backlihgt unit and liquid crystal display using the same |
| US9857502B2 (en) | 2011-09-09 | 2018-01-02 | Lg Innotek Co., Ltd. | Method of fabricating film of substrate and film, backlight unit and liquid crystal display using the same |
| CN103796819B (en) * | 2011-09-09 | 2018-05-29 | Lg伊诺特有限公司 | For manufacturing the method for the film of substrate and film, the back light unit and liquid crystal display using back light unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1873535A (en) | 2006-12-06 |
| JP5430697B2 (en) | 2014-03-05 |
| JP2012160735A (en) | 2012-08-23 |
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