JPH1131654A - Treatment apparatus for end edge of substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a treatment apparatus, for the end edge of a substrate by which the end edge of the substrate can be treated properly, even when substrates in different thicknesses are treated. SOLUTION: A treatment apparatus for the end edge of a substrate is provided with a vacuum chuck 51, by which a glass substrate 5 whose surface is coated with a resist is supported from its rear surface, with four resist- removal heads 61 which comprise respective treatment-liquid supply hozzles at their inside and with a resist-removal-head movement mechanism 81, by which the respective resist-removal heads 61 are moved back and forth along the respective sides of the glass substrate 5. The vacuum chuck 51 is coupled to a raising and lowering mechanism 12 and is raised and lowered for a very small distance, in a state such that the glass substrate 5 is held, according to the thickness of the glass substrate 5 which is input by an input device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a flat panel display (FPD) such as a semiconductor wafer or a glass substrate for a liquid crystal display panel.
The present invention relates to an edge processing apparatus for processing an edge of a substrate by supplying a processing liquid to an edge of the substrate such as an el display substrate or a mask substrate for a semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art For example, in a manufacturing process of a glass substrate for a liquid crystal display panel, a substrate on which a thin film is formed by supplying a photoresist to the surface by a coating device such as a spin coater or a roll coater is conveyed to an edge processing device. The edge processing apparatus performs the edge processing. As such edge processing, an edge cleaning process for supplying a rinse liquid to the edge of the substrate to remove unnecessary thin film formed on the edge of the substrate, or a developing solution for supplying edge liquid to the edge of the substrate is provided. There is a process such as a development accelerating process for accelerating the development near the edge (for example, JP-A-7-142380).

A substrate edge processing apparatus for performing such edge processing includes a support means for supporting the substrate from its lower surface, and a plurality of processing means for supplying a processing liquid to the edge of the substrate supported by the support means. The apparatus includes a liquid supply nozzle and an exhaust unit for sucking and removing the processing liquid supplied to the edge of the substrate. And when performing the edge processing of the substrate, the processing liquid supply nozzle is brought close to the edge of the substrate supported by the support means,
The edge of the substrate is processed by discharging the processing liquid from the processing liquid supply nozzle, and the processing liquid used for the processing is sucked and removed by exhausting the gas from the exhaust unit.

[0004]

There are several types of substrate thicknesses to be processed in such a substrate edge processing apparatus. For example, a rectangular glass substrate for a liquid crystal display panel has a thickness of 0.7 mm and a thickness of 1.1 m.
m are commonly used. It is difficult to process such substrates having different thicknesses with the same edge processing apparatus.

That is, when a substrate having a thickness of 0.7 mm is processed by an edge processing apparatus designed for a substrate having a thickness of 1.1 mm, the distance between the surface of the substrate and the processing liquid supply nozzle is reduced. Due to the increase in size, the processing liquid may not be sufficiently supplied to the surface of the substrate due to a change in the trajectory of the processing liquid caused by the suction action by the exhaust unit before reaching the substrate surface after being discharged from the processing liquid supply nozzle. In addition, a phenomenon occurs in which the position at which the processing liquid reaches the substrate surface becomes unstable, and the shape of the boundary between the cleaning region and the non-cleaning region deteriorates.

On the other hand, when a substrate having a thickness of 1.1 mm is processed by an edge processing apparatus designed for a substrate having a thickness of 0.7 mm, the surface of the substrate may come into contact with a processing liquid supply nozzle. If the processing liquid supply nozzle is too close to the surface of the substrate, a proper cleaning cannot be performed.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem. Even when processing substrates having different thicknesses, it is possible to prevent the occurrence of the above-described processing defect at the substrate edge and to prevent the substrate edge from being processed. An object of the present invention is to provide a substrate edge processing apparatus capable of appropriately processing an edge.

[0008]

According to the first aspect of the present invention, there is provided a supporting means for supporting a substrate from a lower surface thereof, a processing liquid supply nozzle for supplying a processing liquid to an edge of the substrate supported by the supporting means. In the substrate edge processing apparatus having the above, a moving means for moving the supporting means or the processing liquid supply nozzle in the vertical direction according to the thickness of the substrate to be processed is provided.

According to a second aspect of the present invention, in the first aspect of the invention, there is further provided an input means for inputting a thickness of the substrate to be processed, and the moving means is provided based on an input value by the input means. The support means or the processing liquid supply nozzle is moved up and down.

According to a third aspect of the present invention, in the first aspect of the present invention, there is further provided a measuring means for measuring the thickness of the substrate to be processed, and the moving means is provided based on a value measured by the measuring means. The support means or the processing liquid supply nozzle is moved up and down.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side view of a substrate edge processing apparatus according to a first embodiment of the present invention, and FIG. 2 is a plan view thereof. In FIG. 2, some covers and the like are omitted.

This substrate edge processing apparatus is for removing a resist applied near an edge of a rectangular plate-shaped glass substrate 5 which is a raw material of the substrate when manufacturing a liquid crystal display panel. A vacuum chuck 51 that supports the glass substrate 5 having a surface coated with a resist by spin coating from a lower surface thereof, and four resist removal heads 61 arranged corresponding to each side of the rectangular glass substrate 5. ,
A resist removing head moving mechanism 8 for reciprocating each resist removing head 61 along each side of the glass substrate 5.
1 is provided.

The vacuum chuck 51 is connected to an elevating mechanism 12 having a driving source such as an air cylinder built therein. Therefore, the vacuum chuck 51 can be moved up and down by a very small distance while holding the glass substrate 5.

The resist removing head 61 is for supplying a processing liquid to the edge of the glass substrate 5 supported by the vacuum chuck 51 to remove the resist. FIG.
FIG. 4 is a sectional view showing the resist removing head 61 together with a part of the vacuum chuck 51, and FIG. 4 is a front view showing the resist removing head 61 with the cover 13 cut away.

As shown in these figures, the resist removing head 61 includes eight processing liquid supply nozzles 14 for supplying a processing liquid such as a solvent to the edge surface of the glass substrate 5, and
Eight gas supply nozzles 15 for supplying a gas such as nitrogen gas or air to the edge surface of the glass substrate 5 and eight gas supply nozzles 15 for supplying a processing liquid such as a solvent to the edge back surface of the glass substrate 5. A processing liquid supply nozzle 16 for the back surface, two gas supply nozzles 17 for the back surface for supplying a gas such as nitrogen gas or air to the back surface of the edge of the glass substrate 5, and a process supplied to the edge of the glass substrate And an exhaust unit 18 for sucking and removing the liquid.

Each of the eight processing liquid supply nozzles 14 is connected to a processing liquid supply pipe 24. The processing liquid supply pipe 24 is connected to a processing liquid supply source via a pressurized tank (not shown). On the other hand, eight gas supply nozzles 15
Are connected to the gas supply pipe 25, respectively. Further, the gas supply pipe 25 is connected to a gas supply source via an electromagnetic valve (not shown) or the like.

Similarly, eight processing liquid supply nozzles 1 for the back surface
Numerals 6 are connected to the processing liquid supply pipes 26, respectively. Also,
The processing liquid supply pipe 26 is connected to a processing liquid supply source via a pressure tank (not shown). On the other hand, the two gas supply nozzles 17 are each connected to a gas supply pipe 27. The gas supply pipe 27 is connected to a gas supply source via an electromagnetic valve (not shown) or the like.

The exhaust section 18 is connected to an exhaust pipe 64 shown in FIGS. The exhaust pipe 64 is connected to exhaust means such as a vacuum pump and an exhaust fan via a damper operated by a solenoid valve (not shown).

When the resist applied near the edge of the glass substrate 5 is removed by the resist removal head 61, the processing liquid supply nozzle 14 and the processing liquid supply nozzle 16 for the back surface are used to remove the resist from both sides of the glass substrate 5. The processing liquid containing the resist dissolved by the processing liquid is supplied to the glass substrate by supplying the processing liquid and ejecting the gas from the gas supply nozzle 15 and the back side gas supply nozzle 17 toward both the edges of the glass substrate 5. Blow away from the edge of 5. The processing liquid blown outward from the edge of the glass substrate 5 is suction-removed by the exhaust unit 18.

Referring to FIGS. 1 and 2 again, the resist removing head moving mechanism 81 supports each resist removing head 61 via a support 82 and a pair of upper and lower guides attached to a fixed frame 84. It has four support arms 83 guided by the member 85 and movable along the edge of the rectangular glass substrate 5. Each support arm 83 is connected to a wire 89 wound around a drive pulley 87 linked to a drive motor 86 and a plurality of driven pulleys 88. Therefore, the drive motor 8
By rotating the resist removal head 6 forward and backward, each resist removal head 6
1 reciprocates along the edge of the glass substrate 5.

FIG. 5 is a block diagram showing the main electrical configuration of the above-described substrate edge processing apparatus.

The substrate edge processing apparatus includes a ROM 31 storing an operation program necessary for controlling the apparatus, a RAM 32 for temporarily storing data and the like during control, and a CPU 33 for executing a logical operation. It has a control unit 34. The control unit 34 includes a lifting mechanism 12 that drives the vacuum chuck 51 up and down via the interface 35,
It is connected to an input device 36 such as a keyboard.

Next, the operation of removing the resist from the glass substrate 5 in the above-described substrate edge processing apparatus will be described.

Prior to starting the processing, the glass substrate 5 from which the resist is to be removed is input from the input device 36 shown in FIG.
Enter the thickness of This input value is
5, and is stored in the RAM 32 of the control unit 34. Then, the control unit 34 controls the lifting mechanism 12 based on the input value.
Is controlled so that the distance between the lower end of the processing liquid supply nozzle 14 and the surface of the glass substrate 5 supported by the vacuum chuck 51 is adjusted to a value suitable for removing the resist. .

FIG. 6 is an enlarged schematic diagram showing the positional relationship between the vicinity of the edge of the glass substrate 5 and the processing liquid supply nozzle 14 and the processing liquid supply nozzle 16 for the back surface in such a state.

As shown in this figure, when the resist is removed from the glass substrate 5 having a thickness of T1, the lower end of the processing liquid supply nozzle 14 and the vacuum chuck 51 are removed.
The distance between the lower surface of the processing liquid supply nozzle 16 for the back surface and the rear surface of the glass substrate 5 supported by the vacuum chuck 51 is L2.
So that each of the nozzles 14, 16 and the vacuum chuck 51
Height position is set. Note that these distances L
1, L2 is usually on the order of several hundred microns.

In this state, the resist removing head 6
1, the processing liquid is supplied to both sides of the edge of the glass substrate 5 from the processing liquid supply nozzle 14 and the processing liquid supply nozzle 16 for the back side, and both ends of the glass substrate 5 are supplied from the gas supply nozzle 15 and the gas supply nozzle 17 for the back side. Spouts gas toward.

Then, the resist removing head moving mechanism 81
Thereby, each resist removal head 61 is moved along the edge of the glass substrate 5. Thus, the processing liquid is supplied to both sides of the edge of the glass substrate 5, and the resist applied near the edge of the glass substrate 5 is dissolved and removed. The processing solution used to remove the resist and the resist dissolved and removed are applied to the edge of the glass substrate 5 by gas ejected from the gas supply nozzle 15 and the gas supply nozzle 17 for the back surface toward both sides of the edge of the glass substrate 5. After being blown outward from the edge, it is sucked and removed by the exhaust unit 18. In this state, by moving each suction head 61 along the entire edge of the glass substrate 5, the resist can be removed by suction over the entire edge of the glass substrate 5.

In such a substrate edge processing apparatus,
When the thickness of the substrate from which the resist is to be removed as the edge processing is changed from T1 to T2, the thickness of the glass substrate 5 from which the resist is to be removed is input again from the input device 36 shown in FIG. This input value is stored again in the RAM 32 of the control unit 34 via the interface 35. Then, the control unit 34 controls the elevating mechanism 12 based on the input value to elevate and lower the vacuum chuck 51, thereby lowering the lower end of the processing liquid supply nozzle 14 and the surface of the glass substrate 5 supported by the vacuum chuck 51. Is adjusted so as to have a value suitable for resist removal.

FIG. 7 is an enlarged schematic view showing the positional relationship between the vicinity of the edge of the glass substrate 5 and the processing liquid supply nozzle 14 and the processing liquid supply nozzle 16 for the back surface in such a state.

As shown in this figure, even when the resist is removed from the glass substrate 5 whose thickness is T2, the vacuum chuck 51 moves the distance [T1-
T2], the processing liquid supply nozzle 14
Glass substrate 5 supported by the lower end of the substrate and the vacuum chuck 51
Is L1. Therefore, even when the thickness of the glass substrate 5 changes from T1 to T2, the lower end of the processing liquid supply nozzle 14 and the vacuum chuck 51
The distance from the surface of the glass substrate 5 supported on the substrate can be maintained at a value L1 suitable for resist removal, and the resist removal as edge processing can be performed with high accuracy.

On the other hand, as described above, the processing liquid supply nozzle 14
Glass substrate 5 supported by the lower end of the substrate and the vacuum chuck 51
When the vacuum chuck 51 is raised in order to make the interval with the front surface constant, the processing liquid supply nozzle 1 for the back surface
The distance between the upper end of the glass substrate 6 and the back surface of the glass substrate 5 supported by the vacuum chuck 51 changes from L2 to L3. This L3
Is [L2 + (T1-T2)], which is larger than L2 by [T1-T2]. However, on the back surface of the glass substrate 5, the resist is only attached linearly to the edge of the glass substrate 5, so that the lower end of the processing liquid supply nozzle 16 for the back surface and the back surface of the glass substrate 5 Even when the interval changes in this way, there is substantially no effect on the removal of the resist on the back surface of the glass substrate 5.

As described above, when inputting the thickness of the glass substrate 5 from the input device 36 shown in FIG. 5, the thickness of the glass substrate 5 to be processed is selected from among a plurality of predetermined thicknesses of the glass substrate 5. The thickness may be selected, or the actual thickness of the glass substrate 5 may be input as a numerical value. Similarly, the lifting mechanism 12 may move the vacuum chuck 51 up and down to any one of a plurality of preset positions, or move the vacuum chuck 51 up and down to a position calculated from a numerical value input by the input device 36. You may.

Next, another embodiment of the present invention will be described with reference to the drawings. FIG. 8 is a side view of a substrate edge processing apparatus according to a second embodiment of the present invention, and FIG. 9 is a cross-sectional view showing the resist removal head 61 together with a part of a vacuum chuck 51. The same members as those in the above-described first embodiment are denoted by the same reference numerals, and detailed description is omitted.

In the substrate edge processing apparatus according to the above-described first embodiment, the vacuum chuck 51 supporting the glass substrate 5 is moved up and down in accordance with the thickness of the glass substrate 5. In the substrate edge processing apparatus according to (1), the processing liquid supply nozzle 14 is moved up and down in accordance with the thickness of the glass substrate 5. More specifically,
In the substrate edge processing apparatus according to the second embodiment, the elevating mechanism 12 in the substrate edge processing apparatus according to the first embodiment is omitted, and the processing liquid supply nozzles 14 and the like are attached to the respective resist removal heads 61. It is raised and lowered by a lifting mechanism 42 including a built-in air cylinder 41.

That is, as shown in FIG. 9, eight processing solution supply nozzles 14 connected to a processing solution supply source via a pressure tank (not shown) and a gas supply source via a solenoid valve (not shown) and the like. The support member 43 supporting the eight gas supply nozzles 15 connected to the main body is fixed to the main body of the resist removal head 61 via an air cylinder 41. Therefore, each of the processing liquid supply nozzles 14 and each of the gas supply nozzles 15 move up and down together with the support member 43 by driving the air cylinder 41.

In the case where the resist near the edge of the glass substrate 5 is removed by the substrate edge processing apparatus configured as described above, the processing is performed similarly to the case of the substrate edge processing apparatus according to the first embodiment. Prior to the start, the thickness of the glass substrate 5 to be subjected to the resist removal is input from the input device 36 shown in FIG. This input value is stored in the RAM 32 of the control unit 34 via the interface 35. Then, the control unit 34 controls the lifting mechanism 4 based on the input value.
2 is controlled to raise and lower each processing liquid supply nozzle 14 and each gas supply nozzle 15 together with the support member 43 by driving the air cylinder 41, so that the glass supported by the lower end portion of the processing liquid supply nozzle 14 and the vacuum chuck 51. The distance from the surface of the substrate 5 is adjusted to a value suitable for removing the resist.

FIG. 10 is an enlarged schematic diagram showing the positional relationship between the vicinity of the edge of the glass substrate 5 and the processing liquid supply nozzle 14 and the processing liquid supply nozzle 16 for the back surface in such a state.

As shown in this figure, when the resist is removed from the glass substrate 5 having a thickness of T1, the processing liquid supply nozzle is used as in the case of the substrate edge processing apparatus according to the first embodiment. 14 and vacuum chuck 51
The distance between the lower surface of the processing liquid supply nozzle 16 for the back surface and the rear surface of the glass substrate 5 supported by the vacuum chuck 51 is L2.
So that each of the nozzles 14, 16 and the vacuum chuck 51
Height position is set.

In this state, the resist removing head 6
1, the processing liquid is supplied to both sides of the edge of the glass substrate 5 from the processing liquid supply nozzle 14 and the processing liquid supply nozzle 16 for the back side, and both ends of the glass substrate 5 are supplied from the gas supply nozzle 15 and the gas supply nozzle 17 for the back side. Spouts gas toward. Then, the resist removing head moving mechanism 8
By moving each resist removing head 61 along the entire edge of the glass substrate 5,
The resist is sucked and removed over the entire edge of.

In such a substrate edge processing apparatus, when the thickness of the substrate to be subjected to the resist removal as the edge processing is changed from T1 to T2, FIG.
Is input from the input device 36 shown in FIG. This input value is stored again in the RAM 32 of the control unit 34 via the interface 35. The control unit 34 controls the elevating mechanism 42 based on the input value, and raises and lowers the processing liquid supply nozzle 14 and the like by driving the air cylinder 41, thereby lowering the lower end of the processing liquid supply nozzle 14 and the vacuum chuck 51. Is adjusted so that the distance from the surface of the glass substrate 5 supported on the substrate becomes a value suitable for resist removal.

FIG. 11 is an enlarged schematic diagram showing the positional relationship between the vicinity of the edge of the glass substrate 5 and the processing liquid supply nozzle 14 and the processing liquid supply nozzle 16 for the back surface in such a state.

As shown in this figure, even when the resist is removed from the glass substrate 5 having a thickness of T2, the processing liquid supply nozzle 14 moves the distance [T] corresponding to the difference in the thickness of the substrate.
1-T2], the distance between the lower end of the processing liquid supply nozzle 14 and the surface of the glass substrate 5 supported by the vacuum chuck 51 is L1. For this reason, even when the thickness of the glass substrate 5 changes from T1 to T2, the lower end of the processing liquid supply nozzle 14 and the vacuum chuck 5
The distance from the surface of the glass substrate 5 supported by the substrate 1 can be maintained at a value L1 suitable for resist removal, and the resist removal as edge processing can be performed with high accuracy.

On the other hand, as described above, the processing liquid supply nozzle 14
Glass substrate 5 supported by the lower end of the substrate and the vacuum chuck 51
Processing liquid supply nozzle 1 to make the distance from the surface of
4 is lowered, unlike the first embodiment described above, the distance between the upper end of the processing liquid supply nozzle 16 for the back surface and the back surface of the glass substrate 5 supported by the vacuum chuck 51 is L2. Will be maintained. For this reason, there is no influence on the resist removal operation on the back surface of the glass substrate 5.

In any of the above-described embodiments, the thickness of the glass substrate 5 is input from the input device 36, and thus the vacuum chuck 51 or the processing liquid supply nozzle 1 is provided.
Although the case where the substrate 4 is moved in the vertical direction has been described, the thickness of the glass substrate 5 is measured by a measuring device, and the vacuum chuck 51 or the processing liquid supply nozzle 14 is automatically moved in the vertical direction based on the measurement result. It may be.

FIG. 12 is a schematic side view showing a CCD camera 43 as a measuring device used in the substrate edge processing apparatus according to this embodiment together with a part of the vacuum chuck 51.

As shown in this figure, a CCD camera 43 as a measuring device for measuring the thickness of the glass substrate 5
Are arranged so that the edge of the glass substrate 5 supported by the vacuum chuck 51 can be imaged. And this CC
The D camera 43 is connected to the interface 35 shown in FIG. 5 via the image processing device.

When the resist is removed from the glass substrate 5 by the substrate edge processing apparatus according to this embodiment, an image obtained by imaging the edge of the glass substrate 5 supported by the vacuum chuck 51 is used as an image. By performing the treatment, the thickness of the glass substrate 5 is measured. This measured value is stored again in the RAM 32 of the control unit 34 via the interface 35 shown in FIG. Then, the control unit 34 controls the elevating mechanism 12 or 42 based on the input value, and
1 or by raising and lowering the processing liquid supply nozzle 14,
The distance between the lower end of the processing liquid supply nozzle 14 and the surface of the glass substrate 5 supported by the vacuum chuck 51 is adjusted to a value suitable for resist removal. Then, the resist is removed by the same operation as in the above-described first and second embodiments.

It should be noted that the CCD camera 43 is moved to the glass substrate 5 facing the glass substrate 5 first supported by the vacuum chuck 51 among the four resist removal heads 61 described above.
Is built in one of the two resist removal heads 61 arranged on the long side, and when the resist removal head 61 starts running, the thickness of the glass substrate 5 is measured by the CCD camera 43, The distance between the lower end of the processing liquid supply nozzle 14 and the surface of the glass substrate 5 may be adjusted.

Further, as a measuring means for measuring the thickness of the glass substrate 5, instead of the CCD camera 43,
It is also possible to use a contact type displacement sensor 44 having a contact 45 as shown in FIG. When this contact type displacement sensor 44 is used, the vacuum chuck 51
The thickness of the glass substrate 5 is measured by bringing the contact 45 into contact with the glass substrate 5 supported by the glass substrate 5.

Note that, as shown in FIG.
The thickness of the glass substrate 5 may be measured by sandwiching the glass substrate 5 between a pair of contacts 45 instead of bringing the contact 45 into contact with the glass substrate 5 from the surface.

In each of the above embodiments, the case where the glass substrate 5 for a liquid crystal display panel is used as a substrate has been described. However, other substrates such as an FPD substrate, a semiconductor wafer, or a mask substrate for a semiconductor manufacturing apparatus are used. The present invention can be applied to an apparatus for performing edge processing of various substrates.

In each of the above-described embodiments, the case where the present invention is applied to the resist removal for removing the resist applied near the edge of the glass substrate 5 has been described. The present invention can be applied to other edge processing such as a development acceleration processing for supplying a developing solution to accelerate development near the edge.

[0054]

According to the first aspect of the present invention, since the supporting means or the moving means for moving the processing liquid supply nozzle in the vertical direction according to the thickness of the substrate to be processed is provided, substrates having different thicknesses can be used. Even in the case of processing, the edge of the substrate can be appropriately processed.

According to the second aspect of the present invention, the support means or the processing liquid supply nozzle can be moved in the vertical direction by the moving means based on the input value by the input means.

According to the third aspect of the present invention, the supporting means or the processing liquid supply nozzle can be moved in the vertical direction by the moving means based on the measured value by the measuring means.

[Brief description of the drawings]

FIG. 1 is a side view of a substrate edge processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view of the substrate edge processing apparatus according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a resist removal head 61 together with a part of a vacuum chuck 51.

FIG. 4 is a front view showing the cover 13 of the resist removing head 61 in a cutaway manner.

FIG. 5 is a block diagram showing a main electrical configuration of the substrate edge processing apparatus.

FIG. 6 shows the vicinity of the edge of the glass substrate 5 and the processing liquid supply nozzle 1
FIG. 4 is an enlarged schematic view showing a positional relationship between the fourth processing liquid supply nozzle 4 and a processing liquid supply nozzle 16 for a back surface.

FIG. 7 shows the vicinity of the edge of the glass substrate 5 and the processing liquid supply nozzle 1
FIG. 4 is an enlarged schematic view showing a positional relationship between the fourth processing liquid supply nozzle 4 and a processing liquid supply nozzle 16 for a back surface.

FIG. 8 is a side view of a substrate edge processing apparatus according to a second embodiment of the present invention.

FIG. 9 is a cross-sectional view showing the resist removal head 61 together with a part of the vacuum chuck 51.

FIG. 10 is an enlarged schematic view showing the positional relationship between the vicinity of the edge of the glass substrate 5 and the processing liquid supply nozzle 14 and the processing liquid supply nozzle 16 for the back surface.

FIG. 11 is an enlarged schematic view showing the positional relationship between the vicinity of the edge of the glass substrate 5, the processing liquid supply nozzle 14, and the processing liquid supply nozzle 16 for the back surface.

12 is a schematic side view showing the CCD camera 43 together with a part of the vacuum chuck 51. FIG.

13 is a schematic side view showing the contact type displacement sensor 44 together with a part of the vacuum chuck 51. FIG.

[Explanation of symbols]

 5 Glass Substrate 12 Elevating Mechanism 14 Processing Liquid Supply Nozzle 15 Gas Supply Nozzle 18 Exhaust Port 24 Processing Liquid Supply Pipe 34 Control Unit 36 Input Device 41 Air Cylinder 42 Elevating Mechanism 43 CCD Camera 44 Contact Displacement Sensor 51 Vacuum Chuck 61 Resist Removal Head 81 Resist Removal Head Moving Mechanism

Claims (3)

[Claims] An apparatus for processing an edge of a substrate, comprising: support means for supporting a substrate from a lower surface thereof; and a processing liquid supply nozzle for supplying a processing liquid to an edge of the substrate supported by the support means. An apparatus for processing an edge of a substrate, comprising: moving means for moving the supporting means or the processing liquid supply nozzle in the vertical direction according to the thickness of the substrate. 2. The substrate edge processing apparatus according to claim 1, further comprising an input unit for inputting a thickness of the substrate to be processed, wherein the moving unit is configured to input the thickness of the substrate based on an input value of the input unit. An edge processing apparatus for a substrate, wherein the support means or the processing liquid supply nozzle is moved in a vertical direction. 3. The substrate edge processing apparatus according to claim 1, further comprising a measuring unit for measuring a thickness of the substrate to be processed, wherein the moving unit is configured to perform measurement based on a value measured by the measuring unit. An edge processing apparatus for a substrate, wherein the support means or the processing liquid supply nozzle is moved in a vertical direction.