KR20070036118A - 발광 다이오드 및 그 제조 방법 - Google Patents
발광 다이오드 및 그 제조 방법 Download PDFInfo
- Publication number
- KR20070036118A KR20070036118A KR1020077000048A KR20077000048A KR20070036118A KR 20070036118 A KR20070036118 A KR 20070036118A KR 1020077000048 A KR1020077000048 A KR 1020077000048A KR 20077000048 A KR20077000048 A KR 20077000048A KR 20070036118 A KR20070036118 A KR 20070036118A
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- substrate
- polycrystalline
- layer
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 31
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 239000002245 particle Substances 0.000 claims abstract description 11
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 15
- 229910002601 GaN Inorganic materials 0.000 claims description 14
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 2
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 10
- 238000005245 sintering Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001513 hot isostatic pressing Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000007569 slipcasting Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
Landscapes
- Led Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04102423 | 2004-06-01 | ||
| EP04102423.3 | 2004-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20070036118A true KR20070036118A (ko) | 2007-04-02 |
Family
ID=35311905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077000048A Withdrawn KR20070036118A (ko) | 2004-06-01 | 2005-05-25 | 발광 다이오드 및 그 제조 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20080251809A1 (enExample) |
| EP (1) | EP1756878A2 (enExample) |
| JP (1) | JP2008501234A (enExample) |
| KR (1) | KR20070036118A (enExample) |
| CN (1) | CN100454598C (enExample) |
| TW (1) | TW200612581A (enExample) |
| WO (1) | WO2005119798A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8319238B2 (en) | 2009-01-14 | 2012-11-27 | Samsung Electronics Co., Ltd. | Light emitting device with improved light extraction efficiency |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008073400A1 (en) | 2006-12-11 | 2008-06-19 | The Regents Of The University Of California | Transparent light emitting diodes |
| WO2011037876A1 (en) | 2009-09-25 | 2011-03-31 | Cree, Inc. | Lighting device having heat dissipation element |
| JP5189211B2 (ja) | 2010-07-20 | 2013-04-24 | パナソニック株式会社 | 電球形ランプ |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4211758A (en) * | 1978-12-26 | 1980-07-08 | Gte Laboratories Incorporated | Ceramic compositions and articles prepared therefrom |
| JPH09172199A (ja) * | 1995-12-20 | 1997-06-30 | Mitsubishi Cable Ind Ltd | 窒化ガリウム系化合物半導体素子 |
| US6288417B1 (en) * | 1999-01-07 | 2001-09-11 | Xerox Corporation | Light-emitting devices including polycrystalline gan layers and method of forming devices |
| JP4723055B2 (ja) * | 1999-05-19 | 2011-07-13 | 日本特殊陶業株式会社 | アルミナ焼結体及びその製造方法並びに焼結アルミナ部材及び発光管 |
| CA2308933C (en) * | 1999-05-19 | 2008-07-22 | Ngk Spark Plug Co., Ltd. | Translucent polycrystalline ceramic and method for making same |
| US6646292B2 (en) * | 1999-12-22 | 2003-11-11 | Lumileds Lighting, U.S., Llc | Semiconductor light emitting device and method |
| US20020084748A1 (en) * | 2000-12-28 | 2002-07-04 | Ayala Raul E. | UV Reflecting materials for LED lamps using UV-emitting diodes |
| US6919585B2 (en) * | 2002-05-17 | 2005-07-19 | Lumei Optoelectronics, Inc. | Light-emitting diode with silicon carbide substrate |
-
2005
- 2005-05-25 CN CNB2005800180234A patent/CN100454598C/zh not_active Expired - Fee Related
- 2005-05-25 EP EP05741048A patent/EP1756878A2/en not_active Withdrawn
- 2005-05-25 JP JP2007514282A patent/JP2008501234A/ja active Pending
- 2005-05-25 WO PCT/IB2005/051708 patent/WO2005119798A2/en not_active Ceased
- 2005-05-25 KR KR1020077000048A patent/KR20070036118A/ko not_active Withdrawn
- 2005-05-25 US US11/569,702 patent/US20080251809A1/en not_active Abandoned
- 2005-05-27 TW TW094117502A patent/TW200612581A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8319238B2 (en) | 2009-01-14 | 2012-11-27 | Samsung Electronics Co., Ltd. | Light emitting device with improved light extraction efficiency |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080251809A1 (en) | 2008-10-16 |
| WO2005119798A3 (en) | 2006-03-16 |
| CN100454598C (zh) | 2009-01-21 |
| JP2008501234A (ja) | 2008-01-17 |
| WO2005119798A2 (en) | 2005-12-15 |
| CN1961433A (zh) | 2007-05-09 |
| EP1756878A2 (en) | 2007-02-28 |
| TW200612581A (en) | 2006-04-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20070102 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |