KR20070032323A - Pusher and electronic component handling apparatus - Google Patents

Abstract

The pusher 30 is comprised from the pusher base 31 and the pusher 32 attached to the pusher base 31 so that attachment or detachment is possible. Specifically, the flange part 321 is provided in the base of the presser 32, and the plate shape 33 of a "c" shape is provided in the pusher base 31 in plan view. Then, by pressing the flange 32 of the pusher 32 by the plate 33 and sliding the pusher 32 against the pusher base 31, the pusher 32 is not required. ) Is removable by the pusher 30.

Pushing member, electronic component handling device

Description

Pushing member and electronic component handling device {PUSHER AND ELECTRONIC COMPONENT HANDLING APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressing member capable of pressing an electronic component with an appropriate load in an apparatus for testing an electronic component such as an IC device, and an electronic component handling apparatus having such a pressing member.

In the manufacturing process of electronic components, such as an IC device, the electronic component test apparatus which tests the performance and a function of the finally manufactured IC device, the device in the intermediate stage, etc. is needed.

The test of the IC device using the electronic component test apparatus is performed as follows, for example. After returning the IC device under test to the handler above the test head provided with the socket, the connection terminal of the socket is brought into contact with the external terminal of the IC device by pressing the IC device under test into the socket with a pusher. As a result, the IC device under test is electrically connected to the tester body through the socket, the test head, and the cable. Then, by applying the test signal supplied from the tester main body to the test head via the cable to the device under test, and sending the response signal read out from the IC device under test to the tester body through the test head and the cable, the device under test Measure the electrical properties of

In the above handler, the pusher which presses the IC device under test to the socket is suitable so that the external terminal of the IC device under test and the connection terminal of the socket are securely contacted, and the connection terminal of the IC device or the socket under test is not damaged. It is configured to press the IC device under test with a load.

Therefore, when the type of IC device under test is changed when the type of IC device under test is changed, it is necessary to replace it with a pusher corresponding thereto.

By the way, in recent years, testing of 32, 64, and 128 IC devices under test, for example, has been performed to improve the throughput. Accordingly, the handler is provided with the same number of pushers as the number of simultaneous measurements of the IC device under test, and the pushers are usually fixed to the adapter with bolts. Therefore, the replacement of the pushers in accordance with the varieties of the IC device under test requires a plurality of pushers to be removed and installed using a wrench, which is very complicated. When a variety of varieties, the burden of such a pusher replacement operation becomes larger.

This invention is made | formed in view of such a fact, and an object of this invention is to provide the pressing member and the electronic component handling apparatus which can respond easily to the kind change of an electronic component, and can press an electronic component with a suitable load.

In order to achieve the above object, firstly, the present invention provides a pusher for pressing a terminal of an electronic component under test into a contact portion of a test head in an electronic component handling apparatus, the presser in contact with the electronic component under test, A pusher base is provided, and the pusher provides a pusher, wherein the pusher base is detachably installed without a tool (invention 1).

According to the above invention (Invention 1), since the presser can be replaced without using a tool, by appropriately using the presser according to the thickness of the electronic component, it is possible to easily cope with the change of varieties of the electronic component, and has an appropriate load. Electronic components can be pressed.

In the said invention (invention 1), it is preferable that the said presser is pushed by the pressing member with respect to the support member provided in the said pusher base, or the said pusher base in order to support the said pusher to the said pusher base (invention) 2). According to this invention (invention 2), the pusher can be securely fixed to the pusher base.

In the said invention (invention 1 and 2), it is preferable that the said pusher is positioned in the said pusher base by a positioning means (invention 3). According to this invention (invention 3), positioning of the pusher relative to the pusher base can be reliably performed, and thus the electronic component can be pressed at an appropriate position.

In the said invention (invention 1), the said presser has a flange part in the base, The pusher base is provided with the support member which can support the flange part of the said presser, and the opening part is formed in a part of the said support part. The presser may be detachable to the pusher base by inserting the flange portion into the support portion from the opening of the support portion or by removing the flange portion from the support portion (invention 4).

In the said invention (invention 4), it is preferable that the said pusher base is provided so that the protrusion member which can protrude toward the said pusher side and can retract to the inside of the said pusher base is pressed against the said pusher side (invention) 5). According to this invention (invention 5), the flange portion of the presser can be pushed to the support provided in the pusher base, so that the presser can be securely fixed to the pusher base. In addition, although the ball of a ball plunger can be illustrated as a protruding member, it is not limited to this.

In the said invention (invention 5), it is preferable that the said presser is formed with the recessed part by which the protrusion member provided in the said pusher base can be engaged (invention 6). In this invention (invention 6), by positioning the recess of the presser and the protruding member of the pusher base, positioning of the pusher relative to the pusher base can be reliably performed.

In the said invention (invention 4), the said presser may be provided so that the protrusion member which can protrude toward the said pusher base side and can retract to the inside of the said pusher may be pressed against the pusher base (invention 7). According to this invention (invention 7), the flange portion of the presser can be pushed to the support provided in the pusher base, so that the presser can be securely fixed to the pusher base.

In the above invention (Invention 7), it is preferable that a recess is formed in the pusher base to which the protruding member provided on the pusher can be engaged (Invention 8). In this invention (invention 8), since the recess of the pusher base and the protruding member of the pusher are engaged, positioning of the pusher relative to the pusher base can be reliably performed.

In the said invention (invention 4), the said pusher base is projected so that the protrusion member which can protrude from the surface of the side in which the said presser is installed, and can retract to the inside of the said pusher base is pressed against the side in which the said pusher is installed. It is provided, and the said protruding member may be couple | bonded with the side end part of the said presser located in the predetermined position in the said pusher base (invention 9).

In the above invention (invention 9), by positioning the pusher base side end portion and the pusher base protruding member, positioning of the pusher relative to the pusher base can be reliably performed.

In the said invention (invention 4), the support part provided in the said pusher base may push the said pusher toward the said pusher base side (invention 10). According to this invention (invention 10), a presser can be fixed to a pusher base reliably.

In the said invention (invention 10), the support part provided in the said pusher base is comprised by the support member which is movable with respect to the said pusher base, The said support member may be urged to the said pusher base side by an elastic body. (Invention 11) The support part provided in the said pusher base is comprised by the support member which consists of elastic bodies, The said support member may be made to fix the said presser to the said pusher base by the elastic force of the said support member itself ( Invention 12).

In the said invention (invention 1), the said presser is provided with the convex part which became convex toward the said pusher base side, The said pusher base is provided with the space part by which the convex part of the said presser is screwable, The said presser is the said The pusher base may be detachable from the pusher base by inserting the convex portion of the pusher into the space portion of the pusher base or by removing the pusher base from the space portion (invention 13).

In the said invention (invention 13), the said pusher base is provided so that the protrusion member which can protrude to the said space part and can retract to the inside of the said pusher base will be pressed toward the wall part side facing the said protrusion member in the said space part. It is preferable that it is (Invention 14). According to this invention (invention 14), the convex part of the presser can be pushed to one wall part of the space part of the pusher base, and thus the presser can be fixed to the pusher base reliably.

In the said invention (Invention 14), it is preferable that the convex part of the said presser is provided with the recessed part by which the protrusion member provided in the said pusher base can be engaged (invention 15). In this invention (invention 15), by positioning the recess of the convex part of the presser and the projecting member of the pusher base, positioning of the presser with respect to the pusher base can be reliably performed.

Secondly, the present invention provides an electronic component handling apparatus capable of pushing a terminal of an electronic component under test to a contact portion of a test head in order to perform an electronic component test, wherein the pusher (Inventions 1 to 15) is provided. An electronic component handling apparatus is provided (Invention 16).

According to the pressing member and the electronic component handling apparatus of the present invention, since the presser can be replaced without using a tool, by appropriately using the presser according to the thickness of the electronic component, it is possible to easily cope with the change of the variety of the electronic component. The electronic components can be pressed with the appropriate load.

1 is an overall side view of an IC device test apparatus including a handler according to an embodiment of the present invention.

2 is a perspective view of a handler according to the embodiment;

3 is a sectional view of principal parts in a test chamber according to the embodiment;

4 is an exploded perspective view showing the structure of the pusher and the socket vicinity in the handler according to the embodiment;

5 is a plan view (a), a partial sectional front view (b), a bottom view (c), and a sectional view (d) of the pusher in the handler according to the embodiment;

6 is a perspective view showing a match plate in the handler according to the embodiment;

7 is a cross-sectional view of the vicinity of the pusher and the socket in the handler according to the embodiment;

8 is a perspective view illustrating a replacement operation of a match plate in the handler according to the embodiment;

9 is a plan view (a) and a sectional view (b) of a pusher according to another embodiment of the present invention.

10 is a plan view (a) and a sectional view (b) of a pusher according to another embodiment of the present invention.

11 is a plan view (a) of a pusher, a perspective view (b) of a plate, and a cross-sectional view (c) of a pusher according to another embodiment of the present invention.

12 is a plan view (a) and a sectional view (b) of a pusher according to another embodiment of the present invention.

13 is a plan view (a) of a pusher, a perspective view of a presser (b), and a sectional view (b) of a pusher according to another embodiment of the present invention.

Explanation of the sign

1: Electronic component handling device (handler)

10: IC device (electronic component) test device

Pusher: 30, 30A, 30B, 30C, 30D, 30E

31, 31A, 31B, 31C, 31D, 31E: Pusher Base

32, 32A, 32B, 32C, 32D, 32E: Presser

33, 33C, 33D: Plate (support member)

34, 34A, 34B, 34E: Ball Plungers

341, 341A, 341B, 341E: Ball (protrusion member)

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail based on drawing.

1 is an overall side view of an IC device test apparatus including an electronic component handling device (hereinafter referred to as a "handler") according to an embodiment of the present invention, FIG. 2 is a perspective view of a handler according to the embodiment, FIG. Fig. 4 is an exploded perspective view showing the structure of the pusher and the socket in the handler according to the embodiment, and Fig. 5 is a plan view of the pusher in the handler according to the embodiment. (a), partial cross-sectional front view (b), bottom view (c) and sectional view (d), FIG. 6 is a perspective view showing a match plate in the handler according to the embodiment, FIG. 7 is a handler according to the embodiment Fig. 8 is a perspective view illustrating the replacement operation of the match plate in the handler according to the embodiment.

First, the whole structure of the IC device test apparatus provided with the handler which concerns on embodiment of this invention is demonstrated. As shown in FIG. 1, the IC device test apparatus 10 includes a handler 1, a test head 5, and a test main device 6. The handler 1 sequentially returns IC devices (an example of electronic components) to be tested to sockets provided in the test head 5, classifies the IC devices after the test is classified according to the test results, and stores them in a predetermined tray. Execute the action.

The socket provided in the test head 5 is electrically connected to the test main device 6 via the cable 7, and the test main device is connected to the test device via the cable 7. 6) and test the IC device by the test electric signal from the test main device 6.

The control part which controls the handler 1 is built in the lower part of the handler 1 mainly, but the space part 8 is provided in a part. In this space part 8, the test head 5 is arrange | positioned freely and it becomes possible to mount an IC device to the socket on the test head 5 via the through hole formed in the handler 1. .

This handler 1 is an apparatus for testing an IC device as an electronic component to be tested in a temperature state (high temperature) or a low temperature state (low temperature) higher than normal temperature, and the handler 1 is shown in FIG. Likewise, the chamber 100 includes a thermostat 101, a test chamber 102, and a heat removal tank 103. The upper part of the test head 5 shown in FIG. 1 is inserted into the test chamber 102 as shown in FIG. 3, whereby the test of the IC device 2 is performed.

As shown in Fig. 2, the handler 1 of the present embodiment includes an IC storage unit 200 for storing IC devices for conducting tests therefrom and classifying and storing IC devices that have been tested. Test in the chamber part 100 and the chamber part 100 including the loader part 300 which transfers the IC device under test sent from the storage part 200 to the chamber part 100, the test head 5, and the chamber part 100. The unloader unit 400 is configured to carry out and classify the performed test-ended IC. Inside the handler 1, the IC device is stored in the test tray and conveyed.

The IC devices before being set in the handler 1 are housed in a plurality of customer trays not shown, and are supplied to the IC storage unit 200 of the handler 1 shown in FIG. 2 as they are, and from the customer trays. The IC device 2 is transferred to the test tray TST conveyed into the handler 1 and loaded. Inside the handler 1, as shown in FIG. 3, the IC device moves in a state loaded on the test tray TST, and is subjected to a high or low temperature stress and tested whether or not it operates properly. (Inspection), and classified according to the test results. Hereinafter, the inside of the handler 1 is explained in detail individually.

First, a part related to the IC storage unit 200 will be described.

As shown in FIG. 2, the IC storage unit 200 includes a pre-test IC stocker 201 storing an IC device before a test, and a tested IC stocker 202 storing IC devices classified according to the test results. Is installed.

The IC stocker 201 before and after the test and the IC stocker 202 finished with the test are provided with a tray-supported tray 203 and an elevator that can enter and descend from the lower portion of the tray support-frame 203 and move upward. 204 is provided. A plurality of customer trays are stacked and supported by the tray support frame 203, and only the stacked customer trays are moved up and down by the elevator 204.

In the IC stocker 201 before the test shown in Fig. 2, a customer tray in which the IC device on which the test is performed is stored is stacked and held. In addition, the IC stocker 202 which has been tested is stacked and held with a customer tray in which IC devices classified after finishing the test are stored.

Second, the part related to the loader part 300 is demonstrated.

The customer tray stored in the IC stocker 201 before the test is loaded by the tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105 as shown in FIG. 2. Window portion 306 from the bottom of the device substrate 105. In the loader section 300, the IC device under test on the customer tray is transferred to the preciser 305 by the XY transfer device 304, where the IC devices under test are connected to each other. After correcting the position of, the IC device under test transferred to the presizer 305 is further transferred to the test tray TST stopped by the loader 300 using the XY transfer device 304. Load it.

The XY conveyance apparatus 304 which transfers and loads an IC device under test from a customer tray to a test tray TST is equipped with two rails 301 hypothesized on the apparatus board | substrate 105 as shown in FIG. The movable rail 302 which can reciprocate (make this direction Y direction) between the test tray TST and the customer tray by these two rails 301, and is supported by this movable arm 302 And a movable head 303 which is movable along the movable arm 302 in the X direction.

An adsorption head is attached to the movable head 303 of this XY conveyance apparatus 304 in the downward direction, and this adsorption head moves while sucking air, and it adsorb | sucks an IC device under test from a customer tray, Transfer the test IC device to the test tray (TST) and load it.

Third, the part related to the chamber 100 is demonstrated.

The test tray TST described above is transported to the chamber 100 after the IC device under test is loaded from the loader 300, and each IC device under test is tested in a state of being mounted on the test tray.

As shown in FIG. 2, the chamber part 100 includes a thermostat 101 which imparts a target high or low temperature thermal stress to an IC device under test in a test tray TST, and in the thermostat 101. The thermal stress applied from the test chamber 102 in which the IC device under test in the thermal stress applied state is mounted in the socket on the test head 5 and the IC device tested in the test chamber 102. It is comprised by the heat removal tank 103 to remove.

In the heat removal tank 103, when high temperature is applied in the thermostat 101, the IC device under test is cooled by blowing air to return to room temperature, and when low temperature is applied in the thermostat 101, the IC under test is tested. The device is heated with warm air or a heater to return to a temperature such that no dew condensation occurs. Then, the removed IC device under test is carried out to the unloader unit 400.

As shown in FIG. 3, in the test chamber 102, a test head 5 is disposed below and a test tray TST is carried over the test head 5. On the other hand, the insight tray 16 (refer FIG. 4) which accommodated the IC device 2 is provided in the test tray TST. Here, all the IC devices 2 held by the test trays TST are electrically contacted with the test heads 5 sequentially, and a test is performed on all the IC devices 2 in the test trays TST. On the other hand, after the test is completed, the test tray TST is discharged to the unloader unit 400 shown in FIG. 2 after the temperature of the IC device 2, which has been removed by the heat removal tank 103, is returned to room temperature. .

In addition, as shown in FIG. 2, the upper part of the thermostat 101 and the heat removal tank 103 includes an inlet opening for transferring the test tray TST from the apparatus substrate 105 to the apparatus substrate 105. Exit openings for sending out the test tray TST are formed, respectively. In the device substrate 105, a test tray conveying device 108 for entering and exiting the test tray TST from these openings is mounted. These conveying apparatus 108 is comprised by the rotating roller etc., for example. By the test tray conveyance apparatus 108 provided on this apparatus board | substrate 105, the test tray TST discharged | emitted from the heat removal tank 103 is conveyed to the unloader part 400. FIG.

In the insert 16 of this embodiment, as shown in FIG. 4, the rectangular recessed IC storing part 19 which accommodates the IC device 2 under test is formed in the center part. Moreover, the guide hole 20 into which the guide pin 35 of the pusher 30 is mentioned is formed in the center part of the both ends of the insert 16, and the test tray TST is formed in the both ends of the insert 16, respectively. Mounting holes 21 are provided in the mounting pieces.

As shown in FIG. 4, the socket board 50 is arrange | positioned on the test head 5, and the socket 40 which has the probe pin 44 which is a connection terminal is fixed on it. The probe pin 44 is provided in the number and pitch corresponding to the connection terminal of the IC device 2, and is elastically supported upwards by the spring other than the figure.

4, the socket guide 41 is being fixed on the socket board 50 so that the probe pin 44 provided in the socket 40 may be exposed. On both sides of the socket guide 41, two guide pins 35 formed on the pusher 30 are inserted, and a guide bush 411 for positioning between these two guide pins 35 is provided. It is installed. In addition, the socket guide 41 is provided with four stopper portions 412 which may be used to define the lower limit of the pusher 30.

As shown in FIG. 3 and FIG. 4, the pusher 30 is provided above the test head 5 corresponding to the number of sockets 40. As shown in FIGS. 4 and 5, the pusher 30 according to the present embodiment is detachable from the pusher base 31 fixed to the adapter 62 to be described later and the lower center portion of the pusher base 31. It consists of a presser 32 which is installed freely.

Guide pins 35 inserted into the guide holes 20 of the insert 16 and the guide bush 411 of the socket guide 41 are provided at both ends of the lower side of the pusher base 31, and the pusher base 31 is provided. The stopper pin which can contact the stopper part 412 of the socket guide 41, and can define a lower limit when the pusher 30 moves downward by the drive of the Z-axis drive apparatus 70 in the lower 4 corners of 36 is provided.

In addition, a substantially rectangular concave portion 311 is formed in the lower central portion of the pusher base 31 over the front side of the pusher base 31 (upper side in FIG. 5C) in plan view. In addition, along the three sides of the concave portion 311, the plate 33 having a 'C' shape in a plan view is fixed to the pusher base 31 by four pins 331. The plate 33 is provided so that the three inner sides may protrude slightly toward the recess 311 side. The gap between the recess 311 and the plate 33 of these pusher bases 31 constitutes a pusher support part, and is open to the front side of the pusher base 31.

In the center part of the pusher base 31, the ball plunger 34 is embedded so that the ball 341 of a tip may protrude into the recessed part 311. As shown in FIG. The ball 341 of the ball plunger 34 is pressed in the direction of the recess 311 of the pusher base 31 by the action of a spring provided inside the ball plunger 34, and elastically by external force. It can enter into the ball plunger 34 (inside of the pusher base 31).

On the other hand, the presser 32 has a predetermined height corresponding to the thickness of the IC device 2 under test, and has a rectangular base (pusher base 31 side) in plan view from the presser 32. The flange part 321 is formed in four sides of the part to be located. The width of the base of the presser 32 is slightly smaller than the width of the recess 311 of the pusher base 31, and the width of the flange portion 321 of the pusher 32 is the pusher base 31. The plate 33 provided in () is set substantially the same as the width which protrudes into the recessed part 311, and the thickness of the flange part 321 of the pusher 32 is the recessed part (of the pusher base 31). It is set slightly smaller than the depth of 311).

In the central portion of the base of the pusher 32, a concave hole 322 to which the balls 341 of the ball plunger 34 provided in the pusher base 31 can be engaged is formed.

To install the presser 32 in the pusher base 31, the base of the pusher 32 is formed by the opening of the pusher support part of the pusher base 31 (the recess 311 at the front side of the pusher base 31). The pusher base 31 by inserting it into the recessed part 311 from the opening part of the opening part, and holding the flange part 321 of the presser 32 in the recessed part 311 by the plate 33. Slide in the direction of the center.

When the presser 32 comes to the center of the pusher base 31, the ball 341 of the ball plunger 34 engages with the concave hole 322 of the presser 32, whereby Positioning is made. In addition, since the ball 341 of the ball plunger 34 is pressed toward the presser 32 side, the presser 32 is fixed by pushing the flange part 321 to the plate 33.

To remove the presser 32 from the pusher base 31, the presser 32 is slid in the opening direction of the pusher support of the pusher base 31 (to the front side of the pusher base 31). good. In this manner, the pusher 32 is detachable from the pusher 31.

As shown in FIGS. 3 and 6, the pusher 30 is fixed to the adapter 62 using two bolts 63. As shown in FIG. 6, each adapter 62 is held in a mounting hole 61 of the match plate 60, and the match plate 60 is connected to a Z-axis drive device 70. It is supported by the rail R provided under the both ends of 72) (refer FIG. 8). The match plate 60 is supported by the drive plate 72 so that the test tray TST can be inserted between the pusher 30 and the socket 40 so as to be located above the test head 5. . The pusher 30 held in the match plate 60 as described above is free to move in the test head 5 direction and the drive plate 72 direction, that is, in the Z-axis direction.

In addition, the test tray TST is conveyed between the pusher 30 and the socket 40 from the perpendicular | vertical direction (X-axis direction) to the paper surface in FIG. As a conveying means of the test tray TST in the chamber 100, a conveying roller etc. are used. In the conveyance movement of the test tray TST, the drive plate of the Z-axis drive device 70 is raised along the Z-axis direction, and the test tray TST is between the pusher 30 and the socket 40. There is a sufficient gap to be inserted.

As shown in FIG. 3, the pressing part 74 is fixed to the lower surface of the drive plate 72, and the upper surface of the adapter 62 held by the match plate 60 can be pressed. The drive shaft 78 is fixed to the drive plate 72, and a drive source (not shown) such as a motor is connected to the drive shaft 78, and the drive shaft 78 is moved up and down along the Z-axis direction to obtain an adapter ( 62) can be pressed.

On the other hand, the match plate 60 is adapted to the adapter 62 and the pusher in accordance with the shape of the IC device 2 to be tested, the number of sockets of the test head 5 (the number of IC devices 2 to be measured at the same time), and the like. Together with 30, the structure is free to exchange. By allowing the exchange of the match plates 60 in this way, the Z-axis drive device 70 can be made universal.

In this embodiment, in the chamber 100 comprised as mentioned above, as shown in FIG. 3, the ventilation apparatus 90 for temperature regulation is provided in the sealed casing 80 which comprises the test chamber 102. As shown in FIG. It is installed. The blower 90 for temperature regulation has the fan 92 and the heat exchange part 94, draws in air in the casing 80 by the fan 92, and supplies the casing 80 through the heat exchange part 94. FIG. The inside of the casing 80 is made into a predetermined temperature condition (high temperature or low temperature) by discharging it to the inside of the inside).

Fourth, a part related to the unloader unit 400 will be described.

Also in the unloader part 400 shown in FIG. 2, XY conveyance apparatuses 404 and 404 of the same structure as the XY conveyance apparatus 304 provided in the loader part 300 are provided, and this XY conveyance apparatus 404 is provided. ), 404 transfers the IC device that has been tested from the test tray TST carried to the unloader unit 400 to the customer tray.

As shown in FIG. 2, in the device substrate 105 of the unloader unit 400, a pair of customer trays transported to the unloader unit 400 is disposed to face the top surface of the device substrate 105. Two pairs of window portions 406 and 406 are formed.

On the lower side of each window 406, an elevator 204 for raising and lowering the customer tray is provided. In this case, the customer-tested IC device, which has been tested, is moved and stacked, and the customer tray is lowered. Guide the full tray to the tray transfer arm 205.

Next, in the IC device test apparatus 10 described above, a method of testing the IC device 2 will be described.

The IC device 2 is mounted on the test tray TST, i.e., dropped into the IC accommodating part 19 of the insert 16 shown in FIG. After being heated in the furnace, it is conveyed into the test chamber 102.

When the test tray TST equipped with the IC device 2 stops on the test head 5, the Z-axis driving device is driven, and the pressing portion 74 fixed to the driving plate 72 is the adapter 62. Press the pusher 30 through. Then, as shown in FIG. 7, the pusher 32 of the pusher 30 pushes the package main body of the IC device 2 toward the socket 40 side, and as a result, the connection terminal of the IC device 2 is obtained. Is connected to the probe pin 331 of the socket 40.

Here, the downward movement of the pusher 30 is limited to the stopper pin 36 of the pusher 30 contacting the stopper portion 412 of the socket guide 41, but the pusher 32 of the pusher 30 By having a predetermined height corresponding to the thickness of the IC device 2 under test, the pusher 30 has an appropriate load without damaging the IC device 2 or the probe pin 44, and the pusher 30 has the IC device 2. Can be pushed into the socket.

 In this state, a test electrical signal is transmitted from the test main device 6 to the IC device 2 under test via the probe pin 44 of the test head 5. The response signal read out from the IC device 2 is sent to the test main device 6 via the test head 5, whereby the performance, function, and the like of the IC device 2 are tested.

When the test of the IC device 2 is finished, the X-Y transfer device 404 stores the IC device 2 that has been tested in the customer tray in accordance with the test result.

In the case of changing the varieties of the IC device 2, when the thickness of the IC device 2 is changed, as shown in Fig. 8, the door (shown on the back side of the test chamber 102 of the handler 1) D) is opened and the match plate 60 supported by the rail R of the drive plate 72 is taken out.

Then, the pusher 32 of the pusher 30 held on the match plate 60 is removed from the pusher base 31, and instead, the pusher 32 corresponding to the thickness of the IC device 2 according to the variety change is pressed. The ruler 32 is installed in the pusher base 31 and the match plate 60 is pushed into the handler 1. The presser 32 can be replaced by simply sliding the presser 32 with respect to the pusher base 31, and since a tool such as a wrench is not required, the type of IC device 2 is changed. Can be easily responded to.

The embodiments described above are described to facilitate understanding of the present invention and are not described to limit the present invention. Therefore, each element disclosed in the said embodiment is intended to include all the design changes and equivalents which belong to the technical scope of this invention. For example, the pusher 30 according to the present embodiment may be changed as follows.

[First Modification Example]

9 is a plan view (a) and a cross-sectional view (b) of a pusher according to another embodiment of the present invention. Like the pusher 30A shown in FIG. 9, the ball plunger 34A may be embedded on the pusher 32A side. In this pusher 30A, the ball 341A of the ball plunger 34A protrudes toward the pusher base 31A from the base center part of the pusher 32A. On the other hand, in the center part of the recessed part 311 of the pusher base 31A, the recessed hole 312A by which the ball 341A of the ball plunger 34A provided in the pusher 32A can be engaged is formed.

When installing the presser 32A to the pusher base 31, the base of the pusher 32A is opened in the recessed part 311 at the front side (right side in FIG. 9 (a)) of the pusher base 31A. It inserts into the recessed part 311 from the side, and the presser 32A slides toward the center part of the pusher base 31A.

When the presser 32A comes to the center of the pusher base 31A, the ball 341A of the ball plunger 34A provided in the presser 32A is engaged with the recessed hole of the pusher base 31A, whereby the pusher The positioning of 32A is made. In addition, since the ball 341A of the ball plunger 34A is pressed toward the pusher base 31A, the pusher 32A is fixed by pushing the flange portion 321 to the plate 33.

When removing the presser 32A from the pusher base 31A, the presser 32A may slide to the front side of the pusher base 31A in the inverse of the above. In this manner, the pusher 32A is detachable from the pusher 30A.

Second Modification

10 is a plan view (a) and a cross-sectional view (b) of a pusher according to another embodiment of the present invention. Like the pusher 30B shown in FIG. 10, the ball plunger 34B is not a central portion of the recess 311 of the pusher base 31B, but a pusher (located at a predetermined position in the pusher base 31B). It may be embedded at a position engaged with the side end of the base of 32B). Thus, the recessed part to which the ball 341B of the ball plunger 34B is engaged is not necessary for the presser 32B of the pusher 30B.

When attaching the presser 32B to the pusher base 31, the base of the pusher 32B opens the recessed part 311 at the front side (right side in FIG. 10 (a)) of the pusher base 31B. The presser 32B is inserted into the recessed part 311 from the direction of the center part of the pusher base 31B.

The presser 32B comes to the center part of the pusher base 31B, and the end (the end located in the back side of the pusher base 31B) of the base of the pusher 32B is the recessed part 311 of the pusher base 31B. ), The ball 341B of the ball plunger 34B is coupled to the side end portion (end of the front side of the pusher base 31B) of the base of the pusher base 31B, whereby the pusher ( The positioning of 32B) is made.

When removing the presser 32B from the pusher base 31B, it is good to slide the presser 32B to the front side of the pusher base 31B in reverse to the above. In this manner, the pusher 32B is detachable from the pusher 30B.

[Third Modification]

11 is a plan view (a) of a pusher, a perspective view (b) of a plate, and a cross-sectional view (c) of a pusher according to another embodiment of the present invention. Like the pusher 30C shown in Fig. 11, a plate 33C made of an elastic body (for example, a leaf spring member) may be used without using a ball plunger. As shown in Fig. 11 (b), the plate 33C in this embodiment has a 'c' shape in plan view, and its two ends 332C are approximately V in side view. It is shaped like a chair.

On the other hand, as shown to Fig.11 (a), the recessed part 311C of the pusher base 31C has the plate 33C in the front side (right side in FIG. 11 (c)) of the pusher base 31C. It extends to width.

The plate 33C is fixed to the pusher base 31C by four pins 331, and the end portion 333C of the plate 33C in the present embodiment has the pusher base (expanded to the width of the plate 33C). 31 is located in the recess 311.

When attaching the presser 32 to the pusher base 31C, the base of the presser 32C is inserted into the recessed part 311C from the opening of the recessed part 311C in the front side of the pusher base 31C, and the plate ( The presser 32 slides toward the center of the pusher base 31C while holding the flange portion 321 of the presser 32C into the recess 311C by 33C.

The presser 32C comes to the center part of the pusher base 31C, and the edge part (end part located in the back side of the pusher base 31C) of the base of the pusher 32C is 311C of the recesses of the pusher base 31C. ), The side end (base end of the front side of the pusher base 31C) of the base of the presser 32C is coupled to the end 332C of the plate 33C, whereby the presser 32C ) Positioning is made. At this time, the end portion 332C of the plate 33C presses the presser 32C on the oblique surface in the bottom direction and the upward direction of the recess 311C of the pusher base 31C, thereby pressing it. The chair 32C is fixed to the pusher base 31C.

In the case where the presser 32 is removed from the pusher base 31C, the presser 32C may be slid to the front side of the pusher base 31C in the reverse direction. In this manner, the pusher 32C is detachable from the pusher 30C.

On the other hand, in the present embodiment, the end portion 332C of the plate 33C is coupled to the side end portion of the base of the presser 32C, but the present invention is not limited thereto, for example, the flange portion of the presser 32C ( The groove part may be provided in 321, and the end part 332C of the plate 33C may be couple | bonded with this groove part.

Fourth Modification

12 is a plan view (a) and a cross-sectional view (b) of a pusher according to another embodiment of the present invention. Like the pusher 30D shown in FIG. 12, the pusher 32D may be fixed by moving or elastically holding the plate 33D with respect to the pusher base 31D without using a ball plunger. As shown in Fig. 12B, the plate 33D is supported by four pins 37D that are slidable in the thickness direction of the pusher base 31D through the pusher base 31D.

The upper end of the pin 37D protrudes upward of the pusher base 31D, and the upper end of the pin 37D is pushed from the pusher base 31D between the upper end of the pin 37D and the pusher base 31D. A spring 38D pressurized in the direction to isolate is provided. The plate 33D is pressed toward the pusher base 31D by the elastic force of the spring 38D.

On the other hand, the thickness of the flange part 321D of the presser 32D in this embodiment is provided slightly larger than the depth of the recessed part 311D of the pusher base 31D.

When attaching the presser 32D to the pusher base 31D, the base of the pusher 32D opens the recess 311D at the front side of the pusher base 31D (the right side in Fig. 12 (a)). The presser 32D in the center of the pusher base 31D while being inserted into the recess 311D and holding the flange portion 321D of the pusher 32D in the recess 311 by the plate 33D. Slide in the direction.

When the presser 32D comes to the center part of the pusher base 31D, the end of the base of the presser 32D (the end located in the back side of the pusher base 31D) is the recessed part 311D of the pusher base 31D. ), The positioning of the pusher 32D is achieved. At this time, since the plate 33D is pressed toward the pusher base 31D by the spring 38D, the pusher 32D is fixed to the pusher base 31D by the pressing force of the plate 33D.

When removing the presser 32D from the pusher base 31D, it is good to slide the presser 32D to the front side of the pusher base 31D in reverse to the above. In this manner, the pusher 32D is detachable from the pusher 30D.

[Variation 5]

It is a top view (a) of the pusher, the perspective view (b) of a presser, and sectional drawing (b) of a pusher concerning another embodiment of this invention. Like the pusher 30E shown in FIG. 13, the ball plunger 34E is such that the ball 341E protrudes into a space portion 313E (a quadrangular pillar shape in the present embodiment) formed at the center of the pusher base 31E. It may be embedded in the horizontal direction. The ball 341E of the ball plunger 34E in such a pusher 30E is able to retract to the inner side of the pusher base 31E. On the other hand, the periphery of the opening part of the space part 313E of the pusher base 31E in this embodiment becomes the rectangular recessed part 311E in planar view where the base of the pusher 32E can be screwed together. .

On the other hand, the presser 32E is provided with the quadrilateral columnar convex part 323E which can be screwed to the space part 313E of the pusher base 31E on the upper part, and is formed in one side wall of the recessed part 323E, A concave hole 322E to which the balls 341E of the ball plunger 34E provided in the pusher base 31E can be engaged is formed.

When attaching the presser 32E to the pusher base 31E, the convex part 323E of the pusher 32E is inserted into the space part 313E of the pusher base 31E. When the base of the pusher 32E is in contact with the recess 311E of the pusher base 31E, the ball 341E of the ball plunger 34E provided in the pusher base 31E becomes the convex part of the pusher 32E. Is engaged with the concave hole 322E of 322E, whereby positioning of the pusher 32E is achieved. In addition, since the ball 341E of the ball plunger 34E is pressed toward the space portion 313E side of the pusher base 31E, the presser 32E is the pusher base 323E of the pusher 32E. It is fixed well by being pushed to one side wall of the space portion 313E of 31E.

In the case where the pusher 32E is removed from the pusher base 31E, the convex portion 323E of the pusher 32E may be removed from the space portion 313 of the pusher base 31E. In this manner, the pusher 32E is detachable from the pusher 30E.

The pressing member and the electronic component handling apparatus of the present invention are useful for efficiently performing tests of various kinds of electronic components.

Claims (16)

A pusher for pressing a terminal of an electronic component under test to a contact portion of a test head in an electronic component handling device, A presser in contact with the electronic component under test, and a pusher base supporting the presser, The pusher is pusher, characterized in that the pusher base is detachably installed without a tool. The method of claim 1, The pusher is pushed by a pressing member against a support member provided on the pusher base or the pusher base to support the pusher on the pusher base. The method according to claim 1 or 2, The pusher is positioned on the pusher base by a positioning means. The method of claim 1, The presser has a flange portion at the base, The pusher base is provided with a support member capable of supporting the flange portion of the presser, Openings are formed in a part of the support, The pusher is detachable to the pusher base by inserting the flange portion into the support portion from the opening portion of the support portion or by removing the flange portion from the support portion. The method of claim 4, wherein The pusher base is provided with a protruding member that can protrude toward the pusher side and can be retracted to the inner side of the pusher base so as to be pressed against the pusher side. The method of claim 5, The pusher, the pusher is characterized in that the concave portion is formed to be coupled to the projecting member provided on the pusher base. The method of claim 4, wherein The pusher is provided with a protrusion member protruding toward the pusher base side and retractable to the inner side of the pusher such that the pusher is pressed against the pusher base. The method of claim 7, wherein The pusher base, the pusher, characterized in that the recessed portion that can be coupled to the projecting member provided in the pusher is formed. The method of claim 4, wherein The pusher base is provided so that the projecting member can protrude from the surface of the side on which the presser is installed, and is retractable to the inner side of the pusher base so as to be pressed against the side on which the presser is installed, The pusher is capable of engaging with the side end portion of the pusher located at a predetermined position in the pusher base. The method of claim 4, wherein The supporter provided in the said pusher base pushes the said pusher toward the said pusher base side, The pusher characterized by the above-mentioned. The method of claim 10, The support part provided in the said pusher base is comprised by the support member which is movable with respect to the said pusher base, The support member is pushed to the pusher base side by an elastic body. The method of claim 10, The support part provided in the said pusher base is comprised by the support member which consists of elastic bodies, The support member is a pusher, characterized in that for fixing the pusher to the pusher base by the elastic force of the support member itself. The method of claim 1, The presser has a convex portion that is convex toward the pusher base side, The pusher base has a space portion in which the convex portion of the pusher is screwed, The pusher is detachable to the pusher base by inserting a convex portion of the pusher into the space portion of the pusher base or by removing the pusher base from the space portion. The method of claim 13, The pusher base is provided with a protrusion member protruding into the space portion and retractable to the inside of the pusher base so as to be pressed toward the wall portion facing the protrusion member in the space portion. The method of claim 14, The convex portion of the presser, the pusher, characterized in that the concave portion to which the projecting member provided in the pusher base can be coupled is formed. An electronic component handling device capable of pushing a terminal of an electronic component under test to a contact portion of a test head for performing an electronic component test, An electronic component handling apparatus comprising the pusher according to any one of claims 1 to 15.

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