KR20070029930A - Manufacturing method of printed circuit board having electronic components within - Google Patents

Abstract

A method for manufacturing a printed circuit board having electronic parts is provided to position the electronic parts with high precision by using a stiffener having adhesive strength. A method for manufacturing a printed circuit board having electronic parts includes the steps of: generating a core layer having a cavity and an inner layer circuit(S310); stacking the core layer on a double side tape of a stiffener having the double side tape(S330); attaching electronic parts on the double side tape to be received in the cavity(S340); filling the cavity with a filler(S350); hardening the filler by heating and pressing the filler(S350); and removing the stiffener and the double side tape(S360).

Description

Manufacturing method of printed circuit board having electronic components within}

1 is a view showing a method of manufacturing a printed circuit board for accommodating an electronic component according to the prior art.

2A to 2F illustrate a method of mounting an electronic component on a core layer according to an exemplary embodiment of the present invention.

3 is a flow chart of a method for mounting an electronic component on a core layer in accordance with one preferred embodiment of the present invention.

4A to 4I illustrate a method of manufacturing a multilayer printed circuit board using a stack via structure centering on the core layer in which the electronic components illustrated in FIG. 2F are embedded.

FIG. 5 is a diagram illustrating a multilayer printed circuit board using a stack via structure centering on a core layer having electronic components embedded therein according to another exemplary embodiment of the present invention. FIG.

FIG. 6 is a view illustrating a method of manufacturing a multilayer printed circuit board using a stack via structure centering on a core layer in which electronic components are embedded according to an exemplary embodiment of the present invention. FIG.

<Description of the symbols for the main parts of the drawings>

200: resin layer

210: inner layer circuit

220: hall

230: cavity

240: stiffener

245: double sided tape

250: electronic components

260: Filler

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more particularly, to a method of manufacturing a printed circuit board on which a semiconductor device is mounted using a stiffener that can be repeatedly used.

As a technology for the next-generation multifunctional / small package, the development of high density printed circuit boards incorporating components such as semiconductor devices is drawing attention.

There are many technologies for mounting a semiconductor device such as an integrated circuit (IC) chip on a printed circuit board (PCB) for high density. Such mounting techniques include wire bonding and flip chips.

Wire bonding bonds an electronic component printed on a printed circuit board to a printed circuit board by using an adhesive, and a lead frame of the printed circuit board and a metal terminal (ie, a pad) of the electronic component. ) Is connected by metal wires for information transmission and reception. The electronic component and the wire are molded with a thermosetting resin or a thermoplastic resin.

The flip chip is formed of a material such as gold, solder, or other metal on the electronic component to form external connection terminals (ie, bumps) of several tens of micrometers to hundreds of micrometers in size. Contrary to the bonding method, the bumped electronic component is flipped and mounted so that the surface faces the substrate.

The mounting method is to mount an electronic component on the surface of a printed circuit board, and cannot be smaller than the sum of the thicknesses of the printed circuit board and the electronic component in the overall thickness after mounting. In addition, since electrical connections are made between the electronic parts and the printed circuit board by using connection terminals (that is, pads and bumps), there is a problem of reliability such as disconnection or malfunction due to cutting or corrosion of the connection terminals.

Therefore, a semiconductor device such as an electronic component is mounted on the surface of the printed circuit board, that is, inside the printed circuit board instead of the outside, and a buildup layer is formed to form an electrical connection. Through this, miniaturization is pursued, minimization of wiring distance at high frequency (over 100MHz), and improvement of reliability problems that come from wire bonding or component connection in flip chip.

1 is a view showing a method of manufacturing a printed circuit board for accommodating a semiconductor device (for example, an electronic component, etc.) according to the prior art.

Referring to FIG. 1A, a cavity 32 for accommodating an electronic component is formed in the core substrate 30. A taper 32a is installed in the lower end opening of the cavity 32. The taper 32a is for preventing bubbles from remaining between the electronic component 20, the filling resin 41, and the core substrate 30 in the pressing process described later, and can ensure the reliability of the printed circuit board.

Referring to FIG. 1B, a UV tape 40 is attached to the bottom surface of the cavity 32 formed in the core substrate 30. The UV tape 40 is an adhesive tape capable of removing and peeling off the adhesive force of the adhesive surface by irradiating ultraviolet (UV: Ultra Violet).

Referring to FIG. 1C, the electronic component 20 is attached onto the UV tape 40 attached to the bottom surface of the cavity 32 formed in the core substrate 30. A die pad 38 of the electronic component 20 is attached to the adhesive surface of the UV tape 40.

Referring to FIG. 1D, the filling resin 41 is filled into the cavity 32.

Referring to FIG. 1E, the core substrate 30 filled with the filling resin 41 shown in FIG. 1D is pressed in the vertical direction by using the stainless steel press plates 100a and 100b. At the same time, the filling resin 41 is temporarily cured through heating. Thereafter, the UV tape 40 is irradiated with ultraviolet rays to remove the adhesive force and peel off.

However, the printed circuit board shown in FIG. 1 forms a taper 32a, which is a triangular shaped groove, in order to prevent the filling resin 41 from escaping and forming bubbles in the electronic component. The taper 32a ) Is difficult to process in a small printed circuit board. In addition, the UV tape 40 is used to fix the electronic component 20. When the ultraviolet rays are irradiated, the adhesive force is lost, so that only one use can be made. have.

In addition, when the electronic component is an integrated circuit chip, a lot of wiring regarding inputs and outputs is required. As a result, a printed circuit board has to have a multi-layer structure of 8 layers or more, over 6 layers, for wire connection. However, due to the limitations of the manufacturing apparatus, the manufacturing of a printed circuit board having more than six layers is not easy.

Accordingly, in order to solve the above problems, an object of the present invention is to provide a method of manufacturing a printed circuit board that can reduce the manufacturing cost by utilizing a reinforcement plate that can be repeatedly used.

Another object of the present invention is to provide a method of manufacturing a printed circuit board capable of positioning electronic components with high precision by using an adhesive reinforcing plate.

It is still another object of the present invention to provide a method of manufacturing a printed circuit board for wiring a high density I / O (input / output) pin using a stack via structure with a minimum number of layers and forming interlayer connections.

Still another object of the present invention is to provide a method of manufacturing a printed circuit board, which can reduce manufacturing costs by recycling expensive double-sided tape, which is an existing consumable.

It is still another object of the present invention to provide a method for manufacturing a printed circuit board which increases the process yield due to the high precision build-up process and can produce a thin substrate and a high reliability module.

Other objects of the present invention will be readily understood through the following description.

In order to achieve the above object, according to an aspect of the present invention, a method of manufacturing a printed circuit board comprising a core layer containing an electronic component, comprising: generating a core layer having a cavity and an inner layer circuit; Stacking the core layer on the double-sided tape of the reinforcing plate to which the double-sided tape is attached; Attaching the electronic component on the double-sided tape to be received in the cavity; Filling the cavity with filler; Heating and pressurizing the filler to cure; And removing the reinforcement plate and the double-sided tape.

Preferably, the method may further include forming an outer layer circuit having a stack via structure through an additive method or a subtractive method on both surfaces of the core layer in which the electronic component is embedded. Can be.

The stack via may be formed around the electrode of the electronic component. In addition, the stack via may be processed by any one of a mechanical drill, a CO 2 laser drill, an Nd-Yag laser drill, and wet etching.

Also preferably, the cavity may be processed by any one of a mechanical drill, a CO2 laser drill and an Nd-Yag laser drill.

In addition, the reinforcing plate is a metal substrate or a glass substrate that maintains the flatness even with temperature changes, the double-sided tape is weaker than the adhesive strength of the other surface is attached to the core layer and the electronic component is attached to the reinforcement plate. Can be. The reinforcement plate and the double-sided tape may be removed after the reinforcement plate is first removed.

In addition, the double-sided tape may be a silicon rubber (Si rubber) or polyimide adhesive tape or a material that can be used repeatedly.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art, although not explicitly described or shown herein, can embody the principles of the present invention and invent various methods and apparatus using the same that are included in the concept and scope of the present invention. In addition, it is to be understood that all detailed descriptions, including the principles, aspects, and embodiments of the present invention, as well as listing specific embodiments, are intended to include structural and functional equivalents.

Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments in conjunction with the accompanying drawings. In adding reference numerals to the components of each drawing, it should be noted that the same components as much as possible, even if displayed on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. Numbers (eg, first, second, etc.) used in the description of the present specification are merely identification symbols for sequentially distinguishing identical or similar entities.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A to 2F illustrate a method of mounting an electronic component on a core layer according to an exemplary embodiment of the present invention.

Referring to FIG. 2A, first, a Cu original plate (CCL: Cooper Clad Laminate) forming a core layer is formed of an inner layer circuit 210 having copper foil surfaces on both sides of a resin layer 200.

The inner layer circuit 210 may be formed in a subtractive method or an additive method according to a manufacturing process.

The subtractive method is generally referred to as a tent and etch method because it is etched after tenting the part and the hole where the circuit is to be formed with photoresist. A method of forming a circuit by exposing copper (Cu) in a portion where a circuit is to be formed and etching other portions of copper. That is, it is a method of shaving off copper using chemicals.

The additive method is a circuit forming method of a printed circuit board which forms a conductive pattern by plating a conductive material on an insulating substrate by a method of selectively depositing the conductive material through electroless plating or electroplating. Depending on the presence or absence of a seed layer for electrolytic copper plating, it is divided into a full-additive method and a semi-additive method. ) Is formed by a subtractive method, and the outer layer circuit is preferably formed by an additive method or a semi-additive method thereof. In addition, it is apparent that the inner layer circuit 210 or the outer layer circuit may be formed by various methods.

Hereinafter, although the inner layer circuit 210 will be described based on the subtractive method, the scope of the present invention is not limited.

When fabricating the inner layer circuit 210, the circuit is formed in a desired design form on a Cu original plate (CCL) or a Cu plated substrate. Applying a photosensitive photo resist on the substrate, the photo mask is in close contact with the substrate to form a circuit on the photo resist using ultraviolet light and etching unnecessary copper (Cu) using a chemical reaction ( Corrosion) to create the desired circuit.

In FIG. 2A, a Cu disc 200 for forming a core layer is introduced. The hole 220 is formed by drilling and copper plating through a mechanical drill or a laser drill (that is, a CO 2 laser drill or an Nd-Yag laser drill), chemical copper, and electrophoresis. In addition, the inner circuit 210 is formed through a mask and an etching and inspected for proper formation.

The cavity 230 for mounting the electronic component 250 is formed together when drilling to form the hole 220, or after the inner layer circuit 210 is formed, a mechanical drill, a CO2 laser drill, or an Nd-Yag laser drill. It can be formed separately through the process.

Referring to FIG. 2B, a stiffener 240 for mounting and fixing the electronic component 250 in the cavity 230 shown in FIG. 2A is prepared.

The printed circuit board and the electronic component are attached to the stiffener board 240. The reinforcement plate 240 may be formed of metal, glass, or a composite material that does not lose its flatness even at high temperatures and pressures. Here, maintaining the flat property even at high temperature and high pressure is said to maintain flatness. And reinforcing plate 240 is a material that can be used repeatedly, can be recycled. Later, when the electronic component 250 is mounted and the filler 250 is filled and cured for filling and curing, heating and pressurization are performed. Therefore, the electronic component 250 should be made of a material having heat resistance even at a high temperature.

For example, a metal board such as aluminum having good heating characteristics or a board capable of maintaining flatness such as glass may be recycled into the reinforcing plate 240.

The double-sided tape 245 having an adhesive force on both sides may be attached onto the reinforcing plate 240. As the double-sided tape 245, a silicon rubber sheet or a polyimide (PI) adhesive tape may be used. The silicone rubber sheet or polyimide adhesive tape may be one that is generally used to prevent warping in forming a flexible printed circuit board (FPCB). An adhesive silicone rubber sheet or polyimide adhesive tape is used to ensure that printed circuit boards and electronic components can be accurately positioned at desired locations.

Here, the double-sided tape 245 preferably has heat resistance so as not to be deformed by heating or pressing in the process of printing and curing the filler to protect the electronic component after mounting the electronic component on a printed circuit board. In addition, it is preferable to have a dust-free property that can prevent dust, and a material that does not change the adhesive force even at high temperatures.

The adhesive force of the double-sided tape 245 enables high precision positioning of the electronic component 250. Here, it is preferable that the double-sided tape 245 has a relatively weak adhesive strength of the portion in contact with the reinforcing plate 240 than the adhesive force of the portion in contact with the substrate or the electronic component 250. When the reinforcement plate 240 and the double-sided tape 245 are removed in the process illustrated in FIG. 2F, the reinforcement plate 240 attached to one surface of weak adhesive force is first removed, and then the double-sided tape 245 is removed from the electronic component ( The built-in 250 may be removed from the completed printed circuit board.

Referring to FIG. 2C, the core layer shown in FIG. 2A is attached onto the double-sided tape 245 attached to the reinforcing plate 240 prepared in advance as shown in FIG. 2B.

Referring to FIG. 2D, the electronic component 250 to be embedded in the cavity 230 formed in the core layer attached to the double-sided tape 245 attached on the reinforcing plate 240 is attached according to a predetermined position. The electronic component 250 has a connection terminal 255 for interlayer connection or electrical connection with an outer layer circuit to be formed later. The connection terminal 255 is attached to the double-sided tape 245 to attach the electronic component 250 to the double-sided tape 245. The connection terminal 255 may be a metal bump or a metal pad. In the present invention, the electronic component 250 may be a semiconductor device such as an integrated circuit chip.

Referring to FIG. 2E, the electronic component 250 is attached onto the reinforcing plate 240 in the cavity 230 formed in the core layer, and then encapsulated to fix the electronic component 250. The encapsulation process means that the space between the cavity 230 and the electronic component 250 is filled with the filler 260, that is, the molding so that the electronic component 250 can be fixed at a predetermined position without moving. It is the process of molding.

Filling may be accomplished by screen printing, mask printing, dispensing, or the like. The filler 260 may use a thermosetting resin, a thermoplastic resin, or a composite thereof.

After filling the filler 260, the filler 260 is cured by pressing and heating. As a result, the electronic component 250 is fixed at a designated position and embedded in the core layer.

Referring to FIG. 2F, the reinforcement plate 240 is removed after the filler 260 is cured.

Here, as described above, the double-sided tape 245 has a relatively weak adhesive force of the portion in contact with the reinforcing plate 240 than the adhesive force of the portion in contact with the substrate or the electronic component 250. When the reinforcement plate 240 and the double-sided tape 245 are removed, the reinforcement plate 240 attached to one surface having weak adhesive strength is first removed, and then the double-sided tape 245 is a printed circuit in which the electronic component 250 is completely embedded. It is removed from the substrate.

Accordingly, a core layer in which the electronic component 250 is embedded is formed. The reinforcing plate 240 and the double-sided tape 245 can be used repeatedly. That is, since a plurality of core layers in which the electronic component 250 is built may be generated by using the pair of reinforcing plates 240 and the double-sided tape 245, manufacturing cost is reduced.

In the present invention, by using a double-sided tape or a single-sided tape adhesive to the other surface of the reinforcing plate 240, it is possible to form a core layer containing the electronic component in the same process as shown in Figures 2a to 2e. That is, two core layers can be manufactured with the reinforcing plate 240 interposed therebetween, which reduces manufacturing costs and shortens the time for creating a plurality of core layers.

3 is a flowchart illustrating a method of mounting an electronic component on a core layer according to an exemplary embodiment of the present invention.

In step S310, the core layer in which the cavity 230, the inner layer circuit 210, and the hole 220 for mounting the electronic component 250 are formed is formed.

In operation S320, the reinforcing plate 240 having an adhesive force is prepared to fix the electronic component 250 at a desired position. On the reinforcing plate 240 is attached a double-sided tape 245 having an adhesive force on both sides, it can be used repeatedly.

Steps S310 and S320 are irrelevant in order.

In step S330, the core layer is laminated on the reinforcing plate 240 to which the double-sided tape 245 is attached.

In operation S340, the electronic component 250 is mounted in the cavity 230 formed in the core layer stacked on the reinforcing plate 240 to which the double-sided tape 245 is attached. The electronic component 250 is fixed on the surface on which the double-sided tape 245 is attached to the reinforcing plate 240.

In operation S350, the electronic component 250 undergoes an encapsulation process so that the electronic component 250 may be fixed at a desired position even after the reinforcing plate 240 having the double-sided tape 245 attached thereto is removed. The filler 260 is filled in the cavity 230 in which the electronic component 250 is mounted, and the filler 260 is cured through a heating and pressing process.

In step S360, the reinforcing plate 240 and the double-sided tape 245 are sequentially removed to form an inner layer circuit 210 and a hole 220, and a core layer in which the electronic component 250 is embedded. Since the weak reinforcing plate 240 is removed first, it is possible to reduce the burden by not applying a large force to the core layer, and then remove the double-sided tape 245 having a thin thickness.

In the present invention, it is preferable that the adhesive force of the double-sided tape 245 is weaker than the other surface to which the electronic component 250 is attached to one surface attached to the reinforcing plate 240. This is to remove the double-sided tape 245 after removing the reinforcing plate 240 first.

In addition, in the present invention, the adhesive force of the other surface to which the electronic component 250 is attached in the double-sided tape 245 is to be fixed by the electronic component 250 is fixed, and can be easily peeled off after the encapsulation process is finished. It is desirable to have adhesive force.

4A to 4I illustrate a method of manufacturing a multilayer printed circuit board using a stack via structure centering on the core layer in which the electronic components illustrated in FIG. 2F are embedded. The wiring to the high density I / O pins of the electronic component 250 is connected in a stack via structure to realize a minimum number of layers.

The stack via structure is shown in part A of FIG. 4I to form vias again over the vias. Using a stack via structure has the advantage that wiring can be made with fewer layers than a staggered via structure for the same number of wires. In addition, the substrate size can be made small overall.

The process of forming the build-up printed circuit board to form the stack via structure may be an additive process or a subtractive process as described above. In the additive process, Ajinomoto Build-up Film (ABF) is used as a material of the insulating layer for insulating between layers, and Resin Coated Copper Foil (RCC) or prepreg may be used in the subtractive process.

Since the via fill is easy when the dual additive process is used, the following description will focus on the additive process. However, this does not limit the scope of the present invention, it is also possible to form a stack via structure through a subtractive process.

Referring to FIG. 4A, an insulating layer 410 is formed on both surfaces (ie, upper and lower surfaces) of a core layer in which the electronic component 250 in which the reinforcing plate 240 illustrated in FIG. 2F is removed is embedded. The insulating layer 410 is made of ABF. When using a subtractive process, the insulating layer 410 is made of RCC or prepreg.

Referring to FIG. 4B, after the insulating layer 410 is formed, the via hole 420 is processed by a mechanical drill or a laser drill (ie, a CO 2 laser drill or a Nd-Yag laser drill). Alternatively, the via hole 420 is processed through a wet etching process. The via hole 420 serves to maintain an electrical connection for electrical signal transmission between layers.

Here, the wet etching process is to apply a dry film on the insulating layer 410, go through the exposure and development process according to the position where the via hole 420 is to be formed, and to dry the parts other than the part covered with the dry film. Process to remove.

Referring to FIG. 4C, via fill plating is performed to fill the via holes 420 processed in FIG. 4B with metal to form the outer layer 430. Via fill plating shortens the flow path of the electrical signal, resulting in faster signal transmission and better conductivity.

Referring to FIG. 4D, an outer circuit is formed on the outer layer 430. Formation of the outer layer circuit is by an additive method, a semi-additive method or a subtractive method.

4E to 4H, an outer layer circuit is formed to form an outer layer circuit on both sides by performing the same steps as those of FIGS. 4A to 4D again on a printed circuit board having four layers. A layer printed circuit board is formed.

Referring to FIG. 4I, a six-layer printed circuit board is subjected to solder mask printing (PSR printing: Photo Solder Resist printing). PSR inks are used to prevent solder attachment to unneeded parts so that the solder used to mount (ie, mount) the components to the printed circuit board can only be buried. Due to the physical characteristics of the PSR ink, the portion of the PSR ink remaining on the substrate is free of solder, and the portion of the PSR ink free of the PSR ink adheres to the solder to allow electronic components to be mounted thereon. In addition, PSR ink is applied to protect the surface circuit of the printed circuit board from the external environment.

After forming the roughness and removing contaminants on the outer layer circuit so that the PSR ink adheres well to the printed circuit board, the PSR ink is applied by screen printing or spray coater, and then exposed, developed, and completely The hardening process completes the solder mask printing process.

In FIG. 4I, PSR inks 490 and 493 are applied on the outermost outer circuit 470, and solders 496 for electrical connection with the outside are formed in portions where the PSR ink is not applied.

A portion A in FIG. 4I is a portion in which a stack via is formed. The stack via is formed in a portion of the electronic component 250 in which the electrode 255 for electrical connection with the circuit layer is in contact with the circuit layer. Through this, the wires connected to the electronic component 250 having the high density I / O pins may be formed at a high density, so that the wiring connection to the electronic component 250 may be completed with a low layer of 6 layers or less.

5 is a diagram illustrating a multilayer printed circuit board using a stack via structure centering on a core layer in which electronic components are embedded, according to another exemplary embodiment of the present invention.

Compared with the multilayer printed circuit board shown in FIG. 4I, the upper and lower surfaces of the six-layer printed circuit board are changed before the surface treatment and solder formation.

That is, as illustrated in FIG. 4I, a stack via may be formed under the lower surface of the electronic component, and the solder ball 496 may be mounted. In this case, when an embedded passive element or a passive chip is mounted on a surface of a printed circuit board formed on the upper part of the electronic component, an electrical signal of the electronic component may be transferred from an electrode of the electronic component to an upper passive element. Since it must be transferred to the passive device chip and then again to the solder ball 496, there is a disadvantage that the path is long.

Therefore, as shown in FIG. 5, when the upper and lower surfaces of the six-layer printed circuit board are changed to perform surface treatment and solder formation, the electrical signal of the electronic component is directly facing the electrode of the electronic component. Since the transfer to the chip is transferred to the lower solder ball 496 has the advantage that the path is shortened.

FIG. 6 is a diagram illustrating a method of manufacturing a multilayer printed circuit board using a stack via structure centering on a core layer in which electronic components are embedded, according to an exemplary embodiment of the present invention.

In operation S610, the first insulating layer 410 is stacked on both surfaces of the core layer having the electronic component illustrated in FIG. 2F.

In operation S620, the first via hole 420 penetrating the stacked first insulating layer 410 is processed by a mechanical drill or a laser drill.

In step S630, the processed first via hole 420 is filled with 100% (%) plating, and via fill plating is performed to plate the surface of the first insulating layer 410.

In step S640, the first outer layer circuit 430 is formed according to the circuit forming method by the additive method, the semi-additive method, or the subtractive method.

In operation S650, the second insulating layer 450 is stacked on both surfaces of the core layer in which the first outer layer circuits 430 are formed on both surfaces.

In operation S660, the second via hole 460 that penetrates the stacked second insulating layer 450 is processed by a mechanical drill or a laser drill.

In step S670, the processed second via hole 460 is filled with 100 percent (%) plating, and via fill plating is performed to plate the surface of the second insulating layer 450.

In step S680, the second outer layer circuit 470 is formed according to the circuit forming method by the additive method, the semi-additive method, or the subtractive method.

In step S690, PSR inks 490 and 493 are applied on the outermost outer circuit 470, and solder 496 for electrical connection with the outside is formed in the portion where the PSR ink is not applied. . This performs surface treatment and soldering.

As described above, the method of manufacturing a printed circuit board incorporating an electronic component according to the present invention may reduce manufacturing costs by utilizing a reinforcing plate that can be repeatedly used.

In addition, it is possible to position the electronic component with high precision by utilizing the adhesive reinforcement plate.

In addition, wiring to high-density I / O (input / output) pins can be implemented using a stack via structure with a minimum number of layers and forming interlayer connections.

In addition, the manufacturing cost can be reduced by recycling the double-sided tape, which is an expensive existing consumable.

In addition, the process yield due to the high-precision build-up process is increased, it is possible to produce thin substrates and high reliability modules.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art to which the present invention pertains without departing from the spirit and scope of the present invention as set forth in the claims below It will be appreciated that modifications and variations can be made.

Claims (10)

In the manufacturing method of a printed circuit board comprising a core layer containing an electronic component, Creating a core layer in which a cavity and an inner layer circuit are formed; Stacking the core layer on the double-sided tape of the reinforcing plate to which the double-sided tape is attached; Attaching the electronic component on the double-sided tape to be received in the cavity; Filling the cavity with filler; Heating and pressurizing the filler to cure; And Removing the reinforcing plate and double-sided tape Method of manufacturing a printed circuit board comprising a. The method of claim 1, The method may further include forming an outer layer circuit having a stack via structure through an additive method or a subtractive method on both surfaces of the core layer in which the electronic component is embedded. Manufacturing method. The method of claim 2, The stack via is formed on the electrode of the electronic component. The method of claim 2, And the stack via is processed by any one of a mechanical drill, a CO2 laser drill, an Nd-Yag laser drill, and wet etching. The method of claim 1, The cavity is a method of manufacturing a printed circuit board is processed by any one of a mechanical drill, a CO2 laser drill and a Nd-Yag laser drill. The method of claim 1, The reinforcing plate is a manufacturing method of a printed circuit board is a metal substrate or a glass substrate to maintain the flatness even with temperature changes. The method of claim 1, The double-sided tape is a method of manufacturing a printed circuit board is weaker than the adhesive strength of the one surface is attached to the reinforcement plate the other surface to which the core layer and the electronic component is attached. The method of claim 7, wherein And the double-sided tape is removed after the reinforcing plate is first removed. The method of claim 1, The double-sided tape is a silicon rubber (Si rubber) or polyimide adhesive tape manufacturing method of a printed circuit board. The method of claim 1, The double-sided tape is a method of manufacturing a printed circuit board that can be used repeatedly.

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