KR20070023541A - 도포장치 - Google Patents
도포장치Info
- Publication number
- KR20070023541A KR20070023541A KR1020060079207A KR20060079207A KR20070023541A KR 20070023541 A KR20070023541 A KR 20070023541A KR 1020060079207 A KR1020060079207 A KR 1020060079207A KR 20060079207 A KR20060079207 A KR 20060079207A KR 20070023541 A KR20070023541 A KR 20070023541A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- slit nozzle
- foreign matter
- moving mechanism
- door
- Prior art date
Links
- 239000011248 coating agent Substances 0.000 title claims abstract description 22
- 238000000576 coating method Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 230000001012 protector Effects 0.000 claims abstract description 15
- 239000000126 substance Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 5
- 238000001514 detection method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (3)
- 한쌍의 평행한 레일 사이에 기판 재치 스테이지를 배치하고, 이 기판 재치 스테이지를 걸치도록 슬릿노즐을 구비한 문형 이동기구를 상기 레일 사이에 주행 가능하게 걸친 도포장치에 있어서,상기 문형 이동기구는, 상기 한쌍의 평행한 레일의 각각에 상호 맞물리는 주행체와, 이들 주행체 사이를 연결하는 연결 빔과, 상기 주행체 사이에 승강 움직임 가능하게 지지된 노즐 베이스 플레이트를 구비하여, 상기 슬릿노즐에 의한 도포 방향을 기준으로 하여 앞쪽이 되는 상기 노즐 베이스 플레이트의 일부에 기판 상에 존재하는 미세한 이물질을 슬릿노즐의 수평 방향의 이동에 따라 배제하는 프로텍터가 장착되고, 이 프로텍터 보다도 더욱 앞쪽이 되는 연결 빔 또는 주행체의 일부에 기판 상에 존재하는 큰 이물질을 검출하여 상기 주행체를 정지시키는 신호를 출력하는 센서가 장착되어 있는 것을 특징으로 하는 도포장치.
- 제1항의 도포장치에 있어서, 상기 연결 빔은 평면에서 봤을 때 상기 노즐 베이스 플레이트를 사이에 두고 앞뒤로 배치되고, 이들 전후의 연결 빔을 상기 주행체 사이에 연결함으로써 전체로서 패널형상 프레임을 구성하는 것을 특징으로 하는 도포장치.
- 제1항의 도포장치에 있어서, 상기 연결 빔은 상기 문형 이동기구가 주행할 때에 기판 및 기판 재치 스테이지에 접촉하지 않는 한도에 있어서, 아래쪽 위치에 장착한 것을 특징으로 하는 도포장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060079207A KR100752508B1 (ko) | 2005-08-23 | 2006-08-22 | 도포장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2005-00240538 | 2005-08-23 | ||
KR1020060079207A KR100752508B1 (ko) | 2005-08-23 | 2006-08-22 | 도포장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070023541A true KR20070023541A (ko) | 2007-02-28 |
KR100752508B1 KR100752508B1 (ko) | 2007-08-27 |
Family
ID=41632000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060079207A KR100752508B1 (ko) | 2005-08-23 | 2006-08-22 | 도포장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100752508B1 (ko) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6441195A (en) * | 1987-08-06 | 1989-02-13 | Matsushita Electric Ind Co Ltd | Full-colored thin film electroluminescence device |
JP3676351B2 (ja) * | 1996-05-09 | 2005-07-27 | 富士通株式会社 | プラズマディスプレイパネルの蛍光体層形成装置および蛍光体層の形成方法 |
JP2005152826A (ja) * | 2003-11-27 | 2005-06-16 | Matsushita Electric Ind Co Ltd | 吐出装置および封止装置 |
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2006
- 2006-08-22 KR KR1020060079207A patent/KR100752508B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR100752508B1 (ko) | 2007-08-27 |
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