KR20060129880A - Manufacturing equipment for semiconductor - Google Patents

Abstract

An apparatus of fabricating a semiconductor device is provided to prevent a wafer from being badly dried due to moisture by installing a moisture detecting sensor which detects moisture contained in an isopropyl alcohol steam. An apparatus comprises a chamber(400), a container(200) for storing an isopropyl alcohol solution, a vapor supply tube connecting the container with the chamber, a nitrogen gas supply unit connected to the container, and a liquid separating container(520) installed in the vapor supply tube. The liquid separating container has a moisture detecting sensor(510) on a bottom surface of the liquid separating container.

Description

Manufacturing Equipment for Semiconductor Devices {MANUFACTURING EQUIPMENT FOR SEMICONDUCTOR}

1 is a cross-sectional view schematically showing a manufacturing apparatus for a semiconductor device of the present invention.

2 is a cross-sectional view showing the liquid separation container shown in FIG.

** Explanation of Signs of Major Parts of Drawings **

100: IPA chemical supply container

200: IPA chemical storage container

300: nitrogen gas storage container

400: chamber

500: moisture detection unit

510: moisture detection sensor

520: liquid separation container

600: control unit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing device for semiconductor devices, and more particularly, to a manufacturing device for semiconductor devices capable of separating moisture that may be contained in IPA vapor (isopropyl alcohol vapor) supplied onto a wafer.

In general, as semiconductor devices are highly integrated, particles that may occur on the wafer surface may have a great influence on the characteristics of the semiconductor device to be manufactured.

That is, the particles may be generated on the surface of the wafer while going through various processes when manufacturing a semiconductor device. Therefore, in recent years, a wafer cleaning technique for removing particles generated on the surface of the wafer is very important in the manufacturing process of semiconductor devices.

In general, the wafer cleaning technique may be classified into a chemical solution treatment process, a rinse process, and a drying process. The chemical solution treatment process is a process of processing a wafer with a chemical solution, the rinsing process is a process of washing the chemical solution treated semiconductor wafer with deionized water, the drying process is a process of drying the wafer.

It will be described with respect to the wafer drying equipment of the conventional semiconductor device manufacturing equipment used in the drying process.

The conventional wafer drying apparatus may include a storage container receiving a liquid IPA (isopropyl alcohol) chemical liquid, a nitrogen gas supply unit supplying nitrogen gas to the storage container, and a chamber in communication with the storage container. In the chamber, a wafer to be dried is introduced.

It will be described the operation of the conventional wafer drying equipment through such a configuration.

The storage container is supplied with a predetermined amount of the IPA chemical liquid and stored. Subsequently, the nitrogen gas supply unit communicates with the upper or lower end of the storage container to supply a predetermined amount of nitrogen gas into the storage container.

Here, the inert gas nitrogen gas is supplied to the IPA chemical liquid stored in the storage container, to induce bubbles to occur in the storage container.

In this case, the IPA chemical liquid in the reservoir may be in a vapor state and may be supplied into the chamber along a conduit. Therefore, IPA vapor can be supplied on the wafer.

In addition, the wafer may be dried by being rotated by being seated on a seating part such as a spin chuck.

However, when the IPA chemical liquid supplied into the storage container is supplied beyond the predetermined amount to the uppermost end of the storage container, even though nitrogen gas is supplied into the storage container, part of the IPA chemical liquid is vapor and the other part is in liquid state. May enter the conduit.

As such, when the conduit contains both moisture and vapor, which are IPA chemicals, and is supplied to the wafer, even if the wafer is dried as described above, unnecessarily supplied moisture may cause drying defects.

Therefore, due to the drying defects may cause product defects, and eventually there is a problem of lowering the product productivity.

Accordingly, the present invention has been made to solve the above problems, an object of the present invention is to separate and detect the moisture that can be included in the IPA vapor supplied to dry the wafer to control the process of the semiconductor device To provide a manufacturing facility for the.

The present invention provides a manufacturing device for a semiconductor device.

In one embodiment according to an aspect of the present invention, the manufacturing facility is a chamber, an IPA chemical liquid storage container, a steam supply pipe connecting the IPA chemical liquid storage container and the chamber, nitrogen connected to the IPA chemical liquid storage container It includes a gas supply unit and a liquid separation vessel installed in the steam supply pipe.

In one embodiment, the liquid separation vessel may further include a moisture detection sensor on the bottom surface of the liquid separation vessel.

In still another embodiment, the steam supply pipe includes a first steam supply pipe connecting the IPA chemical liquid storage container and the liquid separation container, and a second steam supply pipe connecting the liquid separation container and the chamber. One end of the first steam supply pipe may be connected to the lower portion of the liquid separation vessel, and one end of the second steam supply pipe may be connected to the upper portion of the liquid separation vessel.

In another embodiment, the moisture sensor may be further connected to the control unit for controlling the process.

Hereinafter, with reference to the accompanying drawings, it will be described an embodiment according to an aspect of the present invention.

1 is a cross-sectional view schematically showing a manufacturing apparatus for a semiconductor device of the present invention, Figure 2 is a cross-sectional view showing a liquid separation container shown in FIG. In addition, the manufacturing equipment of the present invention may be a wafer drying equipment.

Referring to FIG. 1, the manufacturing facility includes a chamber 400, an IPA chemical storage container 200 in which a predetermined amount of IPA chemical solution 10 is stored, the IPA chemical storage container 200, and the chamber 400. ) Is connected to the steam supply pipe 410 and the IPA chemical liquid storage container 200, the nitrogen gas supply unit and the steam supply pipe for supplying nitrogen gas (N ₂ ) in the IPA chemical liquid storage container 200 ( The liquid separation container 520 installed at 410 may be provided.

The chamber 400 may include a spin chuck 420 connected to the rotation shaft 421 therein and a wafer W adsorbed and seated on an upper surface of the spin chuck 420. Although not shown in the figure, a plurality of vacuum holes may be provided in the upper surface portion of the spin chuck 420.

The IPA chemical liquid storage container 200 may include an IPA supply pipe 110 connected to the IPA chemical liquid supply container 100. The IPA supply pipe 110 may be equipped with a first pump P1 and a first valve 130 for opening and closing a flow path.

A water level sensing unit may be installed inside the IPA chemical storage container 200.

The water level detecting unit is installed to fit in the shaft 220 and the shaft 220 mounted vertically in the interior of the IPA chemical storage container 200, and is proportional to the height of the water surface of the variable IPA chemical (10) It may be provided with a buoyancy body 230 to move up and down along the axis (220).

In addition, the water level detection sensors 210 for electrically detecting the buoyancy body 230 may be formed by forming a predetermined interval perpendicular to the inner surface of the IPA chemical liquid storage container 200.

For example, the buoyancy body 230 may be provided with a magnetic, and the water level detection sensors 210 may detect the magnetic and transmit an electrical signal to the controller 600.

The nitrogen gas supply unit connects a nitrogen gas storage container 300 in which nitrogen gas is stored, and a gas supply pipe 310 connecting the lower end portions of the nitrogen gas storage container 300 and the IPA chemical liquid storage container 200 to each other. It can be provided. In addition, the gas supply pipe 310 may further include a second pump 320 and a second valve 330 for opening and closing the flow path.

The gas supply pipe 310 may further include an exhaust pipe 350 branched from the gas supply pipe 310 to exhaust residual gas.

The liquid separation container 520 may be connected to the steam supply pipe 410.

The steam supply pipe 410 may include a first steam supply pipe 411 connecting the upper end of the IPA chemical storage container 200 to the lower end A of the liquid separation container 520, and the liquid separation container 520. It may be composed of a second steam supply pipe 412 connecting the upper end (B) of the) and the chamber 400.

The moisture detection sensor 510 may be mounted on the bottom surface of the liquid separation container 520.

The moisture sensor 510 may be electrically connected to the controller 600 for controlling the process.

The moisture sensor 510 may detect moisture that may flow into the steam supply pipe 410 and output a detection signal that is an electrical signal. The moisture detection sensor 510 may use a capacitive proximity switch, and may transmit the detection signal to the controller 600 when moisture is detected.

The control unit 600 has a reference value for a predetermined amount of moisture is built in, and if the amount of moisture detected from the moisture sensor 510 is greater than or equal to the reference value to stop the process.

In addition, the controller 600 may be electrically connected to the water level detection sensors 210 mounted inside the IPA chemical storage container 200.

The control unit 600 may be electrically connected to the process driving unit 610 for driving the process. The process driving unit 610 may be electrically connected to the pumps 120 and 320 and the valves 130 and 330.

In addition, the controller 600 may be electrically connected to an alarm 620 that generates an alarm when the process is stopped. The controller 600 may be electrically connected to the display unit 630 which displays the moisture detection state of the moisture detection sensor 510 in real time.

Next will be described the operation and effect of the embodiment having the configuration as described above.

Referring to FIG. 1, the controller 600 may transmit an electrical signal to the process driving unit 610 to drive the first pump 120 and open the first valve 130. Subsequently, the IPA chemical liquid 10 stored in the IPA chemical liquid supply container 100 may be supplied to the IPA chemical liquid storage container 200 through the IPA supply pipe 110.

In this case, the second and third valves 330 and 430 installed in the steam supply pipe 410 and the gas supply pipe 310 may be in a closed state.

The IPA chemical liquid 10 may be stored in the IPA chemical liquid storage container 200 and the amount of the IPA chemical liquid stored by the water level sensing unit may be checked.

The operation of the water level detection unit is as follows.

The buoyancy body 230 may simultaneously rise along the axis 220 as the water level of the IPA chemical solution 10 rises, and the water level detection sensors 210 detect the rising buoyancy body 230. To transmit an electrical signal to the controller 600. When the buoyancy body 230 rises to a predetermined position and is detected by the water level sensor 210 at a predetermined position, the control unit 600 receiving the electrical signal from the water level sensor 210 is the first. The operation of the pump 120 may be stopped and the first valve 130 may be closed.

Next, the controller 600 may operate the second pump 320 and open the second valve 330. Subsequently, the nitrogen gas stored in the nitrogen gas storage container 300 may be supplied into the IPA chemical storage container 200 through the gas supply pipe 310.

The nitrogen gas supplied into the IPA chemical storage container 200 may generate bubbles in the IPA chemical storage container 200 to change the IPA chemical liquid 10 into a vapor state. The IPA vapor generated as described above may be introduced into the steam supply pipe 410 and supplied into the chamber 400.

Subsequently, the spin chuck 420 in the chamber 400 may be rotated by the rotation shaft 421 receiving power from the outside. The wafer W seated on the spin chuck 420 may be dried by being rotated as described above as well as being supplied with the IPA vapor.

However, when water is contained in the IPA steam and flows into the first steam supply pipe 411, the water contained in the IPA steam in the liquid separation container 520 sinks downward, and the steam is lighter than air. It may be discharged to the second steam supply pipe 412. Therefore, the water contained in the IPA steam in the liquid separation vessel 520 may be separated, and only the steam may be supplied to the chamber 400.

In addition, the moisture detection sensor 510 may detect an amount of water that sinks to the bottom surface of the liquid separation container 520 in real time to transmit an electrical signal to the control unit 600. The controller 600 may stop the process when the amount of moisture detected by the moisture sensor 510 is greater than a predetermined reference value. Therefore, moisture may not be introduced into the chamber 400.

That is, the controller 600 may transmit an electrical signal to the process driver 610, and the process driver 610 stops the driving of the first and second pumps 120 and 320 and the first and the first and second pumps 120 and 320. 3 valves (130, 330, 430) can be immediately closed. Therefore, the controller 600 may stop the process before the moisture is introduced into the chamber 400.

In addition, in the above case, the control unit 600 may generate an alarm informing the process stop by transmitting an electrical signal to the alarm 620. The controller 600 may transmit an electrical signal to the display unit 630, and the display unit 630 may visually display a state in which moisture is generated in the steam supply pipe 410. That is, although not shown in the drawing, an LED lamp may be mounted on the display unit 630 to turn on the lamp when moisture is generated.

On the other hand, when the water level detection sensors 210 mounted in the IPA chemical storage container 200 abnormally operated, the process may be stopped as described above.

Referring to FIG. 1, when any one of the water level detection sensors 210 does not normally detect the position of the buoyancy body 230, an electrical signal indicating an abnormal state may be transmitted to the controller 600. . Subsequently, the controller 600 may transmit an electrical signal to the process driver 610 to stop the process as described above.

That is, when the water level sensor 210 at the uppermost position C of the water level sensors 210 malfunctions and does not detect the buoyancy body 230 normally, the IPA chemical solution 10 is the IPA. It may be continuously supplied in the chemical storage container 200. Therefore, when supplied to the position of the steam supply pipe 410, because it is introduced into the steam supply pipe 410 can be supplied to the chamber 400 of the liquid IPA.

Meanwhile, only the liquid separation container 520 may be installed in the steam supply pipe 410.

Therefore, when moisture is included in the IPA vapor and flows into the liquid separation vessel 520, water that is heavier than air sinks to the bottom surface of the liquid separation vessel 520, and lighter than air, the vapor is lighter than the liquid separation vessel 520. Ascending to the top of the) may be supplied to the chamber 400 through the second steam supply pipe (412). Of course, the liquid separation vessel 520 may be separated from the steam supply pipe at predetermined intervals in order to discharge moisture that may be stored in the liquid separation vessel 520 to the outside.

Therefore, according to the present invention, when the IPA vapor is supplied to the chamber, by installing a moisture sensor to detect the moisture that can be included in the IPA vapor in advance, it is easy to prevent the wafer from drying poor due to the moisture It can be effective.

In addition, by connecting the liquid separation vessel to the steam supply pipe, even if a predetermined amount of moisture in the IPA steam, IPA vapor is discharged, and the moisture is separated separately, so that the moisture detected by the sensor to detect the wafer due to the moisture It is easy to prevent the drying defects of the product, and has the effect of minimizing the product defects.

Claims (4)

chamber; IPA chemical reservoirs; A steam supply pipe connecting the IPA chemical storage container and the chamber; A nitrogen gas supply unit connected to the IPA chemical storage container; And Semiconductor device manufacturing equipment comprising a liquid separation vessel installed in the steam supply pipe. The method of claim 1, The liquid separation container is a semiconductor device manufacturing equipment, characterized in that further comprising a moisture sensor on the bottom surface of the liquid separation container. The method of claim 2, The steam supply pipe includes a first steam supply pipe connecting the IPA chemical liquid storage container and the liquid separation container, and a second steam supply pipe connecting the liquid separation container and the chamber, and one end of the first steam supply pipe And a one end of the second steam supply pipe is connected to an upper portion of the liquid separation vessel. The method of claim 2, The moisture detection sensor is a semiconductor device manufacturing equipment, characterized in that electrically connected with a control unit for controlling the process.

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