KR20060129566A - Structure of susceptor inside plasma enhanced chemical vapor deposition device - Google Patents

Structure of susceptor inside plasma enhanced chemical vapor deposition device Download PDF

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KR20060129566A
KR20060129566A KR1020050048184A KR20050048184A KR20060129566A KR 20060129566 A KR20060129566 A KR 20060129566A KR 1020050048184 A KR1020050048184 A KR 1020050048184A KR 20050048184 A KR20050048184 A KR 20050048184A KR 20060129566 A KR20060129566 A KR 20060129566A
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susceptor
heater
chemical vapor
vapor deposition
lower plate
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KR1020050048184A
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Korean (ko)
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KR100750968B1 (en
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권용철
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주식회사 알지비
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
    • H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Abstract

A susceptor structure within a plasma enhanced chemical vapor deposition mechanism, which can prevent deformation generated during susceptor processing or thermal deformation generated during the deposition process, is provided. A susceptor structure within a plasma enhanced chemical vapor deposition mechanism comprises: an upper plate(10) on which an escape groove is continuously formed such that a heater for heating a susceptor(100) is inserted into the escape groove to form a pattern, and which has a plurality of projected fixing blocks(16) mounted on a flat face thereof; and a lower plate(20) which has the same size as the upper plate and is assembled to a lower side of the upper plate, and into which inserting grooves(22) are penetrated such that the projected fixing blocks are inserted into the inserting grooves during assembling of the upper and lower plates, wherein boundary surfaces of the upper and lower plates are welded to integrate the upper and lower plates, and outer peripheries of the fixing blocks passing through the inserting grooves are welded again to prevent processing deformation during welding.

Description

플라즈마화학적기상증착 기구 내의 서셉터 구조{Structure of susceptor inside plasma enhanced chemical vapor deposition device }Structure of susceptor inside plasma enhanced chemical vapor deposition device

도 1a와 도 1b는 종래의 플라즈마화학적기상증착 기구를 일부 절개하여 보인 절개사시도와 서셉터의 단면도.1A and 1B are cutaway perspective views and cross-sectional views of a susceptor showing a partial incision of a conventional plasma chemical vapor deposition apparatus;

도 2는 본 발명이 설치된 플라즈마화학적기상증착 기구를 일부 절개하여 보인 절개사시도.Figure 2 is a cutaway perspective view showing a partial incision of the plasma chemical vapor deposition apparatus is installed.

도 3은 본 발명에 따른 서셉터의 사시도.3 is a perspective view of a susceptor according to the present invention.

도 4는 본 발명에 따른 서셉터의 분해 사시도.4 is an exploded perspective view of the susceptor according to the present invention.

도 5는 본 발명에 따른 서셉터의 단면도.5 is a cross-sectional view of a susceptor according to the present invention.

*도면의 주요부분에 대한 부호 설명** Description of symbols on the main parts of the drawings *

10: 상플레이트 12: 히터10: upper plate 12: heater

14: 도피홈 15: 고정캡14: escape groove 15: fixed cap

16: 고정블럭 20: 하플레이트16: fixed block 20: lower plate

22: 삽입홈 30: 기판22: insertion groove 30: substrate

40: 새도우프레임 100: 서셉터40: shadow frame 100: susceptor

200: 반응실200: reaction chamber

본 발명은 플라즈마화학적기상증착(이하 "PECVD"라 한다)기구 내의 서셉터(Susceptor) 구조에 관한 것으로, 더욱 상세하게는 유리를 기판으로 하는 PECVD 공정 도중 열손실을 보상하기 위하여, 설정온도보다 높은 히터의 온도 내지 기공시 발생하는 서셉터의 열변형을 방지하도록 한 PECVD 기구 내의 서셉터 구조에 관한 것이다.The present invention relates to a susceptor structure in a plasma chemical vapor deposition (hereinafter referred to as "PECVD") apparatus, and more particularly, to compensate for heat loss during a PECVD process using glass as a substrate. The present invention relates to a susceptor structure in a PECVD apparatus to prevent thermal deformation of the susceptor generated at the temperature of the heater or the pore.

일반적으로 PECVD는 원료가스인 플라즈마 속에서 생성된 활성입자가 기판 표면에서 화학반응을 촉진시켜 박막을 형성시키는 기술로서, 특히 재료간의 상호 확산이나 기판 물질과의 반응의 경감, 재료에 따라서 박막의 저온형성이 가능한 장점이 있다.In general, PECVD is a technology in which active particles generated in plasma, which is a raw material gas, promote chemical reactions on the surface of a substrate to form a thin film. In particular, the low temperature of the thin film may be reduced depending on the material. It is possible to form.

이러한 PECVD는 실리콘 산화막 형성에 사용에 되고 있음은 물론, 유리를 기판으로 하는 액정 디스플레이용 박막 트랜지스터 등에도 실용화되고 있다.Such PECVD is used not only for forming a silicon oxide film but also for practical use in thin film transistors for liquid crystal displays using glass as a substrate.

공지의 예로서, PECVD 기구는 도 1a 내지 도 1b에 도시된 바와 같이, 반응실(1) 내에 기판(2)이 올려지는 서셉터(3)와, 히터(4)를 통한 복사, 열전도를 이용하여 상기 기판(2)을 가열한다.As a well-known example, the PECVD apparatus uses a susceptor 3 on which the substrate 2 is placed in the reaction chamber 1 and radiation and heat conduction through the heater 4, as shown in FIGS. 1A to 1B. The substrate 2 is heated.

이때, 박막의 구성원자를 포함하는 원료가스를 반응실(1) 내부로 공급하여 원료가스 분자의 들뜸, 분해를 통해 기상 및 기판표면에 화학반응을 일으킨다.At this time, the raw material gas including the members of the thin film is supplied into the reaction chamber 1 to cause chemical reactions on the gas phase and the substrate surface through the excitation and decomposition of the raw material gas molecules.

한편, 히터(4)는 반응실(1) 주위에 설치하여 복사가열을 수행하기도 하고, 서셉터(3)에 설치하여 열전도를 통해 서셉터(3)를 직접 가열시킨다.On the other hand, the heater 4 is installed around the reaction chamber 1 to perform radiant heating, or installed in the susceptor 3 to directly heat the susceptor 3 through heat conduction.

특히, 서셉터(3)를 직접 가열하는 방법은 증착온도까지 이르게 하려면 무리한 온도까지 요구하게 되므로 히터(4)에 손상을 주게 되어 수명을 단축시키는 단점이 발생하고, 서셉터(3)는 단순한 원형의 평판이므로 열이 전달되면 중심부에 온도가 가장 높고, 모서리에 온도는 낮게 되어 전체적인 온도 균일도가 나빠지므로 기판(2)에 성장한 박막 두께의 균일도는 크게 떨어졌으며, 나아가 열변형으로 인해 서셉터(3)가 휘어지는 치명적인 문제점이 발생하였다.In particular, the method of directly heating the susceptor 3 requires an excessive temperature to reach the deposition temperature, thus causing damage to the heater 4 and shortening the lifespan, and the susceptor 3 has a simple circular shape. Since heat is transmitted, the temperature is the highest in the center when the heat is transferred, the temperature is lowered at the corners, and the overall temperature uniformity is worsened. Therefore, the uniformity of the thickness of the thin film grown on the substrate 2 is greatly reduced. A fatal problem of bending) occurred.

본 발명은 이러한 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 서셉터 가공시 발생하는 변형 내지 증착공정 수행 중 열변형을 방지하는 플라즈마화학적기상증착 기구 내의 서셉터 구조를 제공하는데 있다.SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and an object of the present invention is to provide a susceptor structure in a plasma chemical vapor deposition apparatus that prevents deformation occurring during susceptor processing or thermal deformation during the deposition process.

하나의 바람직한 실시 양태에 있어서 본 발명에 따른 서셉터는 상, 하로 구성되는 지지플레이트가 일체로 마련되고, 특히 하플레이트에는 히터를 삽입시킨 후 2단의 고정캡으로 히터를 고정, 밀폐시키며, 용접을 차례로 수행하여 반응가스로 인한 히터의 손상을 방지한다.In one preferred embodiment, the susceptor according to the present invention is provided with a support plate consisting of a top, a bottom, in particular, the lower plate is fixed to the heater with a two-stage fixing cap after the heater is inserted, welded In order to prevent damage to the heater due to the reaction gas.

여기에 커버의 역할인 상블럭을 재용접시켜 히터의 완벽한 밀폐를 수행하도록 한다.Here, the upper block, which serves as a cover, is rewelded so that the heater is completely sealed.

특히, 하블럭에는 고정블럭이 결합되어 있고, 이는 다시 상블럭과 조립되어 전술한 용접가공으로 인한 상, 하플레이트의 변형을 방지하도록 하며, 히터의 가열로 인한 상, 하플레이트의 열변형 또한 방지할 수 있다.In particular, the lower block is coupled to a fixed block, which is assembled with the upper block again to prevent deformation of the upper and lower plates due to the above-described welding process, and also prevents thermal deformation of the upper and lower plates due to heating of the heater. can do.

본 발명의 다른 목적 및 효과는 이하의 상세한 설명으로부터 명확하게 되고, 본 발명의 바람직한 실시예를 나타내는 상세한 설명 및 실시예는 본 발명의 범주를 제한하는 것이 아니다.Other objects and effects of the present invention will become apparent from the following detailed description, and the detailed description and examples showing the preferred embodiments of the present invention do not limit the scope of the present invention.

상술한 목적을 달성하기 위한 본 발명은, 플라즈마화학기상증착 기구의 서셉터로서, 상기 서셉터를 가열하는 히터가 삽입되어 패턴을 이루도록 도피홈이 연속하여 형성되어 있으며, 돌출된 고정블럭이 평면상에 다수개로 장착되어 있는 하플레이트와, 상기 하플레이트와 동일한 크기로 구비되어 상기 하플레이트의 상측에 조립되고, 조립시 상기 돌출된 고정블럭이 삽입되도록 삽입홈이 관통되어 있는 상플레이트와, 상기 상, 하플레이트가 일체를 이루도록 상, 하플레이트의 경계면을 용접하고, 용접시 가공변형을 방지하기 위하여 상기 삽입홈을 관통한 고정블럭의 외주연을 재용접하여 이루어지는 것을 특징으로 한다.The present invention for achieving the above object, as a susceptor of the plasma chemical vapor deposition mechanism, the escape groove is formed continuously to form a pattern by inserting a heater for heating the susceptor, the protruding fixed block is planar A lower plate mounted on the plurality of lower plates, an upper plate having the same size as the lower plate, assembled to an upper side of the lower plate, and having an insertion groove penetrated therein so as to insert the protruding fixing block during assembly; To weld the interface between the upper and lower plates so that the lower plate is integrated, and to prevent welding deformation during welding, the outer periphery of the fixed block penetrating the insertion groove is rewelded.

또한, 상기 히터가 삽입되는 도피홈은 상기 히터의 굵기보다 깊게 형성되어 있고, 하나 이상의 고정캡이 상기 도피홈에 차례로 삽입되어 상기 히터를 밀폐, 고정하고 있으며, 상기 고정캡이 삽입된 상기 도피홈을 용접으로 밀폐시켜 증착시 상기 히터로 반응가스가 침투하는 것을 방지하는 것을 특징으로 한다.In addition, the escape groove into which the heater is inserted is formed deeper than the thickness of the heater, one or more fixing caps are inserted into the escape grooves in order to seal and fix the heater, and the escape groove into which the fixing cap is inserted It is characterized in that the sealing by welding to prevent the reaction gas penetrates into the heater during deposition.

이하, 본 발명에 따른 하나의 바람직한 실시예를 첨부도면을 참조하여 상세히 설명한다. 먼저, 도면에 걸쳐 기능적으로 동일하거나, 유사한 부분에는 동일한 부호를 부여한다.Hereinafter, one preferred embodiment according to the present invention will be described in detail with reference to the accompanying drawings. First, like reference numerals designate functionally identical or similar parts throughout the drawings.

도 2는 본 발명이 설치된 플라즈마화학적기상증착 기구를 일부 절개하여 보인 절개사시도이고, 도 3은 본 발명에 따른 서셉터의 사시도이고, 도 4는 본 발명에 따른 서셉터의 분해 사시도이고, 도 5는 본 발명에 따른 서셉터의 단면도이다.2 is a partially cutaway perspective view of the plasma chemical vapor deposition apparatus is installed in the present invention, Figure 3 is a perspective view of the susceptor according to the present invention, Figure 4 is an exploded perspective view of the susceptor according to the present invention, Figure 5 Is a cross-sectional view of a susceptor according to the present invention.

도 2 내지 도 5를 참조하면, 본 발명에 따른 플라즈마화학적기상증착 기구 내의 서셉터 구조는 플라즈마화학기상증착 기구의 서셉터(100)로서, 상기 서셉터(100)를 가열하는 히터(12)가 삽입되어 패턴을 이루도록 도피홈(14)이 연속하여 형성되어 있으며, 돌출된 고정블럭(16)이 평면상에 다수개로 장착되어 있는 상플레이트(10)와, 상기 상플레이트(10)와 동일한 크기로 구비되어 상기 상플레이트(10)의 하측에 조립되고, 조립시 상기 돌출된 고정블럭(16)이 삽입되도록 삽입홈(22)이 관통되어 있는 하플레이트(20)와, 상기 상, 하플레이트(10,20)가 일체를 이루도록 상, 하플레이트(10, 20)의 경계면을 용접하고, 용접시 가공변형을 방지하기 위하여 상기 삽입홈(22)을 관통한 고정블럭(16)의 외주연을 재용접하여 이루어진다.2 to 5, the susceptor structure in the plasma chemical vapor deposition apparatus according to the present invention is a susceptor 100 of the plasma chemical vapor deposition apparatus, the heater 12 for heating the susceptor 100 is The escape grooves 14 are continuously formed to be inserted into a pattern, and the same size as that of the upper plate 10 and the upper plate 10 in which a plurality of protruding fixing blocks 16 are mounted on a plane. It is provided on the lower side of the upper plate 10, the lower plate 20 through which the insertion groove 22 is penetrated so that the protruding fixed block 16 is inserted during assembly, and the upper and lower plates 10 Weld the boundary surfaces of the upper and lower plates 10 and 20 to form a single body, and re-weld the outer circumference of the fixing block 16 penetrating the insertion groove 22 to prevent the machining deformation during welding. Is done.

일실시예에 따라 도시된 바와 같이, 서셉터(100)의 상면으로는 증착되어질 기판(30)이 안착되어 있고, 기판(30)의 외주면을 따라 새도우프레임(40)이 상측에 위치하고 있다.As shown in accordance with one embodiment, the substrate 30 to be deposited is seated on the upper surface of the susceptor 100, and the shadow frame 40 is positioned above the outer circumferential surface of the substrate 30.

기판(30)은 전술한 바와 같이, 유리, 비내열성인 폴리아미드 필름 등과 같은 다양한 기판(30) 재료가 적용될 수 있다.As described above, the substrate 30 may be applied with various substrate 30 materials such as glass, non-heat resistant polyamide film, and the like.

서셉터(100)는 기판(30)이 안착되는 곳으로 평탄한 수평면으로 이루어져 있고, 내부에는 히터(12)가 장착되어 있어, 서셉터(100)에 안착된 기판(30)을 히터(12)의 전열에 의해서 기판(30)의 표면온도를 높여 증착을 수행한다.The susceptor 100 is composed of a flat horizontal plane where the substrate 30 is seated, and a heater 12 is mounted therein, so that the substrate 30 seated on the susceptor 100 may be mounted on the susceptor 100. The deposition is performed by increasing the surface temperature of the substrate 30 by heat transfer.

따라서, 기판(30)으로의 균일한 전열을 위해서 서셉터(100) 역시 균일한 수평면을 가지고 있어야 함은 당연하다.Therefore, it is natural that the susceptor 100 should also have a uniform horizontal plane for uniform heat transfer to the substrate 30.

본 발명에 따른 서셉터(100)는 바람직하게 2개의 플레이트(10, 20)로 구성되어 있으며, 특히 상플레이트(10)에는 히터(12)가 장착되어 전열을 수행한다.The susceptor 100 according to the present invention is preferably composed of two plates 10 and 20, in particular, the upper plate 10 is equipped with a heater 12 to perform heat transfer.

이러한 상플레이트(10)에는 일정한 패턴을 이루는 도피홈(14)이 연속하여 형성되어 있고, 도피홈(14)의 형성된 깊이는 여기에 삽입되는 히터(12)의 굵기보다 깊게 형성되어 있다.The upper plate 10 has a continuous escape groove 14 forming a predetermined pattern, the depth formed of the escape groove 14 is formed deeper than the thickness of the heater 12 is inserted therein.

히터(12)는 인코넬(Inconel)관에 히터코일을 삽입하고, 산화마그네슘(MgO)을 충진하여 가공한 것으로, 전술한 일정한 패턴을 갖는 도피홈(14)을 따라 삽입된다.The heater 12 is processed by inserting a heater coil into an Inconel tube and filling magnesium oxide (MgO), and is inserted along the escape groove 14 having a predetermined pattern.

히터(12)는 견고히 도피홈(14)에 고정되어 있어야 하고, 이러한 히터(12)의 상측으로 도피홈(14)을 따라 고정캡(15)이 하나 이상, 바람직하게는 이중으로 겹쳐져 장착된다.The heater 12 must be firmly fixed to the escape groove 14, and the fixing cap 15 is mounted to the upper side of the heater 12 along the escape groove 14 at least one, preferably double.

이러한 고정캡(15)은, 반응실(200) 내의 반응가스의 침투를 방지하도록 밀폐하는 역할과, 전술한 히터(12)를 도피홈(14)에 고정하는 역할을 수행한다.The fixing cap 15 serves to seal to prevent penetration of the reaction gas in the reaction chamber 200 and to fix the heater 12 to the escape groove 14.

나아가, 본 발명에서는 상기 고정캡(15)이 삽입된 도피홈(14)을 따라 용접으로 개구된 도피홈(14) 밀폐시켜 증착시 상기 히터(12)로 반응가스가 침투하는 것을 완벽히 방지한다.Furthermore, in the present invention, the fixing cap 15 seals the escape groove 14 opened by welding along the escape groove 14 into which the fixed cap 15 is inserted, thereby completely preventing the reaction gas from penetrating into the heater 12 during deposition.

상플레이트(10)의 상면으로는 돌출된 고정블럭(16)이 평면상에 다수개로 장착되어 있다.On the upper surface of the upper plate 10, a plurality of protruding fixed blocks 16 are mounted on the plane.

고정블럭(16)은 후술하는 커버의 역할인 하플레이트(20)와 조립되어 연마, 용접 등의 후가공시 가공변형을 방지하므로, 고정블럭(16)은 상플레이트(10) 상에 골고루 분포되어 장착되어 있다.The fixed block 16 is assembled with the lower plate 20, which serves as a cover to be described later, to prevent processing deformation during post-processing such as polishing and welding, so that the fixed block 16 is evenly distributed and mounted on the upper plate 10. It is.

하플레이트(20)는 상플레이트(10)와 동일한 크기로 마련되어 있고, 특히 상기 고정블럭(16)이 삽입되도록 삽입홈(22)이 관통되어 있다.The lower plate 20 is provided with the same size as the upper plate 10, and in particular, the insertion groove 22 is penetrated so that the fixing block 16 is inserted.

삽입홈(22)을 관통한 고정블럭(16)의 외주연은 모따기가 되어 있어 용접시 비드가 고정블럭(16)의 외주연과 삽입홈(22)에 채워져 견고한 결합을 이루게 되고, 특히 고정블럭(16)의 높이와 상플레이트(20)의 두께는 동일하게 형성되어나 고정블럭(16)의 높이가 작게 형성됨이 바람직하다.The outer circumference of the fixed block 16 penetrating the insertion groove 22 is chamfered so that the bead is filled in the outer circumference of the fixed block 16 and the insertion groove 22 during welding to form a rigid coupling, in particular the fixed block Although the height of the 16 and the thickness of the upper plate 20 is the same, it is preferable that the height of the fixed block 16 is formed small.

이렇게 결합된 고정블럭(16)은 전술한 바와 같이 상, 하플레이트(10, 20)의 평탄도를 유지시키며, 히터(12)의 전열에도 평탄도를 유지시키는 역할을 수행한다.The combined fixed block 16 maintains the flatness of the upper and lower plates 10 and 20 as described above, and maintains the flatness even in the heat transfer of the heater 12.

결합된 상, 하플레이트(10, 20)는 다시 그 외면, 바람직하게는 경계면을 용접시켜 반응가스가 경계면을 따라 침투하는 것을 방지하고, 열변형에 따른 상, 하플레이트(10, 20)의 휨을 완벽히 방지한다.The combined upper and lower plates 10 and 20 are welded to the outer surface, preferably the interface, to prevent the reaction gas from penetrating along the interface and to prevent warpage of the upper and lower plates 10 and 20 due to thermal deformation. Prevent it completely.

최종적으로 결합된 상, 하플레이트(10, 20)의 표면을 정삭, 연마하여 기판(30)은 수평을 유지하면서 장착된다.The substrate 30 is mounted while keeping the level of the upper and lower plates 10 and 20 finally bonded and polished.

즉, 전기 설명으로부터 명확해지듯이, 이 발명은 반응실(200)에 설치되는 서셉터(100)가 가공 내지 전열에 의한 열변형으로 휘어지는 것을 방지할 수 있는 서셉터의 구조를 제공하여 더욱 정밀하게 기판(30)의 증착을 수행하도록 할 수 있다.That is, as will be clear from the foregoing description, the present invention provides a structure of the susceptor which can prevent the susceptor 100 installed in the reaction chamber 200 from being warped by heat deformation due to processing or heat transfer. The deposition of the substrate 30 may be performed.

본 발명은 그 정신 또는 주요한 특징으로부터 일탈하는 일없이, 다른 여러 가지 형태로 실시할 수 있다. 그 때문에, 전술한 실시예는 모든 점에서 단순한 예시에 지나지 않으며, 한정적으로 해석해서는 안된다. 본 발명의 범위는 특허청구의 범위에 의해서 나타내는 것으로써, 명세서 본문에 의해서는 아무런 구속도 되지 않는다. 다시, 특허청구범위의 균등 범위에 속하는 변형이나 변경은, 모두 본 발명의 범위 내의 것이다.This invention can be implemented in other various forms, without deviating from the mind or main characteristic. For this reason, the above-described embodiments are merely examples in all respects and should not be interpreted limitedly. The scope of the present invention is shown by the scope of the claims, and is not limited by the specification text. Again, all variations and modifications belonging to the equivalent scope of the claims are within the scope of the present invention.

이상에서 상세히 설명한 바와 같이, 본 발명에 따른 플라즈마화학적기상증착 챔버 내의 서셉터 구조에 의하면, 서셉터 가공시 발생하는 변형 내지 증착공정 수행 중 열변형을 방지하고, 반응가스가 서셉터로 침투하는 것을 완벽히 방지할 수 있는 서셉터의 구조를 제공하여 더욱 정밀한 증착을 수행할 수 있는 효과가 발생한다.As described in detail above, according to the susceptor structure in the plasma chemical vapor deposition chamber according to the present invention, the deformation during the susceptor processing to prevent thermal deformation during the deposition process, and the reaction gas to penetrate the susceptor By providing a susceptor structure that can be completely prevented, the effect of more precise deposition occurs.

Claims (3)

플라즈마화학기상증착 기구의 서셉터로서, 상기 서셉터를 가열하는 히터가 삽입되어 패턴을 이루도록 도피홈이 연속하여 형성되어 있으며, 돌출된 고정블럭이 평면상에 다수개로 장착되어 있는 하플레이트와, 상기 하플레이트와 동일한 크기로 구비되어 상기 하플레이트의 상측에 조립되고, 조립시 상기 돌출된 고정블럭이 삽입되도록 삽입홈이 관통되어 있는 상플레이트와, 상기 상, 하플레이트가 일체를 이루도록 상, 하플레이트의 경계면을 용접하고, 용접시 가공변형을 방지하기 위하여 상기 삽입홈을 관통한 고정블럭의 외주연을 재용접하여 이루어지는 것을 특징으로 하는 플라즈마화학적기상증착 기구 내의 서셉터 구조.A susceptor of a plasma chemical vapor deposition apparatus, the lower plate having a plurality of protruding fixed blocks mounted on a plane, and having a plurality of protruding fixing blocks formed in a continuous manner so that a heater for heating the susceptor is inserted to form a pattern. It is provided with the same size as the lower plate is assembled on the upper side of the lower plate, the upper plate and the lower plate through which the insertion groove is penetrated so that the protruding fixing block is inserted during assembly, Susceptor structure in the plasma chemical vapor deposition apparatus characterized in that the welding of the interface, and the welding of the outer periphery of the fixed block penetrating the insertion groove to prevent processing deformation during welding. 제 1항에 있어서,The method of claim 1, 상기 히터가 삽입되는 도피홈은 상기 히터의 굵기보다 깊게 형성되어 있고, 하나 이상의 고정캡이 상기 도피홈에 차례로 삽입되어 상기 히터를 밀폐, 고정하고 있으며, 상기 고정캡이 삽입된 상기 도피홈을 용접으로 밀폐시켜 증착시 상기 히터로 반응가스가 침투하는 것을 방지하는 것을 특징으로 하는 플라즈마화학적기상증착 기구 내의 서셉터 구조.The escape groove into which the heater is inserted is formed deeper than the thickness of the heater, and one or more fixing caps are inserted into the escape grooves in order to seal and fix the heater, and to weld the escape groove into which the fixing cap is inserted. Susceptor structure in a plasma chemical vapor deposition apparatus characterized in that the sealed to prevent the penetration of the reaction gas into the heater during deposition. 제 1항에 있어서,The method of claim 1, 상기 히터는 인코넬(Inconel)관에 히터코일이 삽입되어 있으며, 산화마그네 슘(MgO)을 충진시켜 가공된 것을 특징으로 하는 플라즈마화학적기상증착 기구 내의 서셉터 구조.The heater is a susceptor structure in the plasma chemical vapor deposition apparatus, characterized in that the heater coil is inserted into the Inconel tube, and processed by filling the magnesium oxide (MgO).
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