TW201624605A - Wafer tray - Google Patents

Abstract

Disclosed is a wafer tray comprising a carrier tray and cover embedded on upper surface of carrier tray. Upper surface of the carrier tray has a plurality of downward recess wafer bearing region. A portion of sidewall top of each wafer bearing region has a first convex tongue extending to bearing region center. The first convex tongue is along edge of bearing region for covering a first partial arc outer peripheral edge of wafer. Edge of the cover has a second convex tongue. The second convex tongue is applicable of covering a second partial arc outer peripheral edge of a plurality of wafers. The first and second partial arc outer peripheral edges commonly surround whole outer peripheral edge of wafer for putting pressure on wafer so as to prevent warpage of wafer; in addition, bottom wall and sidewall of each wafer bearing region and a first convex tongue connected to sidewall are integrated. Wafer is heated by bottom wall. The first convex tongue and bottom wall are integrated so that temperature of both is the same. The first convex tongue would not influence scan result due to different temperature in scanning process for wafer tray.

Description

Wafer tray

The present invention relates to the field of semiconductor technologies, and in particular, to a wafer tray.

Some processes in the fabrication of semiconductor devices require wafers to be carried on wafer trays. For example, Metal Organic Chemical Vapor Deposition (MOCVD) is gradually used to manufacture high-brightness LED chips due to its advantages of easy growth control, high purity and high uniformity of the epitaxial layer.

In the MOCVD chamber, a heater is deposited in the chamber for the decomposition of the material gas to deposit on the wafer surface on the wafer tray.

In the prior art, a plurality of wafers carried on a wafer tray have a plurality of wafers, and the plurality of wafers are prone to warpage during heating.

In addition, how to accurately obtain the temperature of the wafer on the wafer tray by scanning the wafer tray is also one of the technical problems in the art. This is because: in order to prevent wafer warpage in the prior art, one or more cover plates are disposed on the upper surface of the tray, and the cover plates surround the outer circumferences of all the wafers, and the cover plates are removed after the deposition is completed. Then, the deposited wafer is removed; since the cover plates are added, there is inevitably a gap between all the cover plates and the tray supporting the wafer, and the vapor deposition reaction chamber is usually at a low pressure close to the vacuum, and all the heat is only It can be transmitted by radiation and conduction, and cannot be transmitted by convection. Therefore, these uneven gaps will cause the temperature difference between the cover and the lower tray to be large and the temperature distribution on the cover is not uniform, which will further interfere with the temperature on the wafer. Measurement and adjustment.

In view of this, the present invention provides a new wafer tray which can avoid wafer warpage and can accurately obtain the temperature of the wafer thereon by scanning.

The object of the invention is to avoid wafer warpage and to accurately obtain the temperature of the wafer thereon by scanning.

To achieve the above object, an aspect of the present invention provides a wafer tray comprising:

a carrier disk having a plurality of downwardly recessed wafer carrying regions on the upper surface, the wafer carrying regions for placing wafers, and a portion of the sidewalls of each of the wafer carrying regions has a first tab extending toward a center of the carrying region a bottom wall, a side wall of each wafer carrying area, and a first tab connected to the side wall, wherein the first tab is adapted to cover a first outer peripheral edge of the wafer along an edge of the carrying area The first portion of the curved outer periphery is less than or equal to half of the outer periphery of the wafer;

a cover plate embedded on an upper surface of the carrier tray, an edge of the cover plate having a second tab, the second tab being adapted to cover a curved outer periphery of the second portion of the plurality of wafers The first and second portions of the curved outer periphery collectively surround the entire outer periphery of the wafer.

Preferably, the cover plate is a piece, and the second tab on the cover plate is complementary to the first tab on the carrier plate for covering the entire outer periphery of the wafer;

Or the cover plate is formed by splicing a plurality of pieces, and the second tongues on the plurality of cover plates are complementary to the first tongue on the carrier plate for covering the entire outer circumference of the wafer.

Preferably, the cover plate is embedded in a central area of the carrier tray, the plurality of wafer bearing areas are disposed around the cover plate, and the second tab of the cover plate edge extends away from the center of the carrier disk. a first tab on the wafer carrying area extending toward a center of the carrying tray; or the cover is disposed around the plurality of wafer carrying areas, embedded in an edge region of the carrying tray, the cover The second tab of the edge of the board extends toward the center of the carrier, and the first tab on the wafer carrying area extends away from the center of the carrier.

Preferably, the upper surface of the carrier disk has a plurality of grooves, each groove forming a wafer carrying area, and the cover plate is fixed or not fixed to the carrier.

Preferably, the wafer tray further comprises a plurality of wafer carriers, the wafer carrier is located on an upper surface of the carrier, each wafer carrier forming a wafer carrying area, the cover and the The carrier tray is fixed.

Preferably, the plurality of wafer carriers are fixed or not fixed on an upper surface of the carrier.

Preferably, the cover plate is fixed to the upper surface of the carrier tray by screws.

Preferably, the wafer carrying area has a bottom wall having opposite upper and lower surfaces, the upper surface being a wafer bearing surface, and the lower surface is planar, concave, convex or Stepped.

Preferably, the cover plate and the carrying tray are adapted to rotate integrally: a) the rotating shaft is connected to the center of the carrying tray, the carrying tray drives the cover to rotate; or b) the rotating shaft is connected at the In the center of the cover plate, the cover plate drives the carrier tray to rotate, and the carrier tray has a hole suitable for the passage of the rotating shaft.

Preferably, the shaft has a square or triangular cross section, and for a), the center of the carrier has a square or triangular groove correspondingly; for b), the center of the cover has a square or triangular groove correspondingly. .

Preferably, for a), the center of the carrier tray further has a stop for the shaft to abut, and the cover has a hollowed area matching the stop.

Preferably, the cover plate and the carrying tray are adapted to rotate integrally: a) a rotating shaft is coupled to the center of the carrying tray, the carrying tray drives the plurality of wafer carriers and the cover plate rotates; or b) the rotating shaft is connected at the center of the cover plate, the cover plate drives the plurality of wafer carriers and the carrier disk to rotate, the carrier disk has a hole suitable for the passage of the rotating shaft.

Preferably, the shaft has a square or triangular cross section, and for a), the center of the carrier has a square or triangular groove correspondingly; for b), the center of the cover has a square or triangular groove correspondingly. .

Preferably, for a), the center of the carrier tray further has a stop for the shaft to abut, and the cover has a hollowed area matching the stop.

Another aspect of the invention provides an additional wafer tray comprising:

a plurality of wafer carriers each having a downwardly recessed wafer carrying area for placing wafers, a portion of the sidewalls of each of the wafer carrying regions having a top portion extending toward the center of the carrying region a first tab, a bottom wall of each of the wafer carrying areas, a sidewall, and a first tab connected to the sidewall, wherein the first tab is adapted to cover the first portion of the wafer along an edge of the carrying region a curved outer periphery, the first portion of the curved outer periphery being less than or equal to half the outer periphery of the wafer;

a cover plate embedded on an upper surface of the plurality of wafer carriers and exposing the plurality of wafer carrying regions, the cover plate being fixed to the plurality of wafer carriers, the edge of the cover plate having a second a tab, the second tab adapted to cover a second portion of the curved outer periphery of the plurality of wafers, the first and second portions of the arcuate outer periphery collectively surrounding an entire outer periphery of the wafer.

Preferably, the cover plate is a block, and the second tab on the cover plate is complementary to the first tab on the plurality of wafer carriers for covering the entire outer periphery of the wafer; or The cover plate is a plurality of blocks, and the second tabs on the plurality of cover plates are complementary to the first tabs on the plurality of wafer carriers for covering the entire outer periphery of the wafer.

Preferably, the plurality of wafer carriers are disposed around the cover plate, and the second tab of the edge of the cover plate extends away from the center of the cover plate, and the first tongue edge of the plurality of wafer carriers Extending toward a center of the cover plate; or the cover plate is disposed around the plurality of wafer carriers, the second tab of the edge of the cover plate extends toward a center of the cover plate, and the plurality of wafer carriers A tab extends away from the center of the cover.

Preferably, the wafer carrying area has a bottom wall having opposite upper and lower surfaces, the upper surface being a wafer bearing surface, and the lower surface is planar, concave, convex or Stepped.

Compared with the prior art, the technical solution of the present invention has the following advantages: 1) providing a wafer tray comprising a carrier tray and a cover plate embedded on the upper surface of the carrier tray, the upper surface of the carrier tray having a plurality of downward recesses a wafer carrying area for placing a wafer, and a portion of the sidewall of each of the wafer carrying areas has a first tab extending toward a center of the carrying area, the first tab being adapted to be along an edge of the carrying area Covering a curved outer periphery of the first portion of the wafer, the edge of the cover has a second tab, the second tab is adapted to cover a second outer portion of the curved outer periphery of the plurality of wafers, the first and second portions are curved The outer periphery collectively surrounds the entire outer periphery of the wafer; since the curved outer periphery of the first portion on the carrying area is less than or equal to half of the outer periphery of the wafer, the wafer can be slid into the carrying area when placed, and placed after the cover is placed The upper cover, the first tongue and the second tongue are at the same height, pressing the entire outer edge of the wafer to prevent warpage of the wafer; further, the bottom wall, the side wall and the side wall of each wafer bearing area are connected The first tongue is integrally formed, the bottom The wall heats the wafer, and the first tab is integrally formed with the bottom wall through the side wall, and the integrally formed bottom wall, the side wall and the first tongue have good heat conduction performance, so that the three temperatures are the same, so that the temperature is the same During the scanning of the wafer tray, the first tab does not interfere with the scanning result due to temperature differences. Third, since the cover plate is embedded in the carrier tray, the complementary regions of the two are not located at the center of the carrier tray, and the first tab is complementary to the second tab, and the two are not located at the center of the carrier tray, so the cover plate and the carrier tray are suitable. In one rotation, the rotation rotates the wafers between the two, and the high-speed rotating wafer tray can make the reaction gas uniformly mixed on the surface of the wafer, and form a stratosphere on the surface of the wafer, which helps to improve deposition film formation. Uniformity.

2) In the alternative, a) the cover plate is a piece, and the second tongue on the cover plate is complementary to the first tongue on the carrier plate, that is, the two form an end-to-end closed ring, which can cover the entire periphery of the wafer The edge is pressed against the entire outer edge of the wafer; b) the cover plate is formed by splicing a plurality of pieces, and the second tongues on the plurality of cover plates are collectively complementary to the first tongue on the carrier plate, that is, on each cover plate The second tabs are joined together to form an end-to-end closed loop with the first tab to apply pressure to the entire outer periphery of the wafer. This solution provides two solutions for the cover.

3) In the alternative, a) the cover plate is embedded in the central area of the carrier tray, and the plurality of wafer bearing areas are disposed around the cover plate. In this case, the second tab of the edge of the cover plate extends away from the center of the carrier tray. a first tab on the wafer carrying area extending in a direction toward the center of the carrier; b) a cover disposed around the plurality of wafer carrying areas, embedded in an edge region of the carrier, in which case the edge of the cover The second tab extends toward the center of the carrier, and the first tab on the wafer carrying area extends away from the center of the carrier. The solution provides the positional relationship between the two types of cover plates and the wafer carrying area, and provides the extending direction of the first tab and the second tongue in each positional relationship.

4) In the alternative, a) the upper surface of the carrier has a plurality of grooves, each groove forming a wafer carrying area, and since the wafer carrying area is designed by slotting the upper surface of the carrier, the cover Whether it is fixed or not fixed to the carrier, both can be rotated integrally. In the case of non-fixation, since the cover plate is embedded on the upper surface of the carrier tray, the complementary regions of the two are not located at the center of the carrier, and the first tab is complementary to the second tab, and neither is located at the center of the carrier, so The rotation of the disc drives the cover to rotate, or the latter drives the former to rotate, both of which have a card and relationship, and can rotate integrally. b) the wafer tray further comprises a plurality of wafer carriers, the wafer carriers are located on the upper surface of the carrier tray, and each wafer carrier forms a wafer carrying area, in which case the cover plate is fixed to the carrier tray; and a) The solution is different. In this solution, the wafer carrying area is formed by the groove on the additional wafer carrier. In this case, the carrier and the cover should be rotated integrally, and the two need to be fixed. The wafer carrier is sandwiched between the two, and will not shift as the two rotate.

The present invention also provides another wafer tray. Compared with the prior art, another wafer tray of the present invention has the following advantages: providing a wafer tray comprising a plurality of wafer carriers and a cover plate fixed to each other, each A wafer carrier has a downwardly recessed wafer carrying area for placing a wafer, and a portion of the sidewall of each of the wafer carrying areas has a first tab extending toward a center of the carrying area, the first The tab is adapted to cover the first portion of the curved outer periphery of the wafer along the edge of the carrying area, the edge of the cover has a second tab, and the second tab is adapted to cover the second outer peripheral edge of the plurality of wafers The first and second portions of the curved outer periphery collectively surround the entire outer periphery of the wafer; since the first portion of the curved outer periphery of the carrying portion is less than or equal to half of the outer periphery of the wafer, the wafer can be slid into the wafer when placed After the loading zone is placed, the upper cover is fixed, and the first tongue and the second tongue are at the same height, and the entire outer edge of the wafer is pressed to prevent wafer warpage; further, each wafer bearing area Bottom wall, side wall, and The first tab of the wall connection is integrally formed, the bottom wall provides temperature to the wafer, and the first tab is integrally formed by the side wall and the bottom wall, so that the two temperatures are the same, so that during the scanning of the wafer tray, The first tab does not interfere with the scan result due to temperature differences. Third, in this solution, since each wafer carrier is fixed on the cover plate, the wafer carrier can be replaced. Research shows that under the heating of the same heater, the lower surface of the bottom wall of the wafer carrying area has When different topography, such as plane, concave, convex or stepped, the temperature of the wafers carried on them is different, so that during the heating process, the wafers with different topography can be replaced according to the heating adjustment of the wafer. plate.

As described in the prior art, there are a plurality of wafers carried on an existing wafer tray, and the plurality of wafers are prone to warpage during heating. In addition, how to accurately obtain the temperature of the wafer on the wafer tray by scanning the wafer tray is also one of the technical problems in the art. In view of the above problems, the present invention provides a new wafer tray comprising a carrier disk and a cover plate embedded on the upper surface of the carrier disk, the upper surface of the carrier disk having a plurality of downwardly recessed wafer bearing areas, the wafer bearing area For placing a wafer, a portion of the sidewall of each of the wafer carrying regions has a first tab extending toward the center of the carrying region, the first tab being adapted to cover the first portion of the curved outer periphery of the wafer along the edge of the carrying region The edge of the cover has a second tab adapted to cover the second outer peripheral edge of the plurality of wafers, and the first and second portions of the curved outer periphery collectively surround the entire periphery of the wafer Since the curved outer periphery of the first portion of the carrying area is less than or equal to half of the outer periphery of the wafer, the wafer can be slid into the carrying area when placed, and after being placed, the cover is closed, the first tongue and the first The two tabs are at the same height, and pressurize the entire outer edge of the wafer to prevent warpage of the wafer; in addition, the bottom wall, the side wall of each wafer carrying area, and the first tab connected to the side wall are integrally formed, and the bottom wall pair Wafer provides temperature, and first Tongue and through the side wall is integrally formed in the bottom wall are connected, so both have the same temperature, so that the scanning process in the wafer tray, a first temperature tabs that would not interfere with the scan results pair. Furthermore, since the cover plate is embedded in the carrier tray, the complementary regions of the two are not located at the center of the carrier tray, and the first tab is complementary to the second tab, and neither is located at the center of the carrier tray, so the cover plate and the carrier tray are suitable. In one rotation, the rotation rotates the wafers between the two, and the high-speed rotating wafer tray can make the reaction gas uniformly mixed on the surface of the wafer, and form a stratosphere on the surface of the wafer, which helps to improve deposition film formation. Uniformity.

The above described objects, features and advantages of the present invention will become more apparent from the aspects of the appended claims.

FIG. 1 is a schematic exploded view of a wafer tray according to an embodiment of the present invention. Fig. 2 is a cross-sectional view showing a part of the structure of the wafer tray in Fig. 1 after assembly. Fig. 3 is a schematic view showing the structure of the wafer 3 assembled in the wafer tray in Fig. 1. Figure 4 is a cross-sectional view of the portion of the structure in Figure 3 after assembly. Referring to Figures 1 and 4, the wafer tray contains:

The carrier disk 1 has a plurality of downwardly recessed wafer carrying regions 10 on the upper surface thereof, and the wafer carrying region 10 is used for placing the wafers 3, and a portion of the sidewalls of each of the wafer carrying regions 10 has a top portion extending toward the center of the carrying region 10. a first tab 11 , a bottom wall of each of the wafer carrying areas 10 , a sidewall and a first tab 11 connected to the sidewall, wherein the first tab 11 is adapted to cover the wafer 3 along the edge of the carrying region 10 a first portion of the curved outer periphery, the first portion of the curved outer periphery being less than or equal to half of the outer periphery of the wafer 3;

The cover plate 2 is embedded on the upper surface of the carrier tray 1. The edge of the cover plate 2 has a second tab 21, and the second tab 21 is adapted to cover a second portion of the curved outer periphery of the plurality of wafers 3, The first and second portions of the curved outer periphery collectively surround the entire outer periphery of the wafer 3.

The components are described separately below.

Referring to FIG. 1 and FIG. 2, the upper surface of the carrier 1 in this embodiment has a plurality of grooves, each of which forms a wafer carrying area 10 having five wafer carrying areas 10. In other embodiments, the wafer carrier area 10 formed on a carrier 1 may have other numbers.

Still referring to FIGS. 1 and 2, since the wafer 3 needs to slide into the carrying area 10, the first peripheral curved outer periphery of the first tab 11 needs to be less than or equal to half of the outer periphery of the wafer 3.

In addition, the bottom wall, the sidewall of each wafer carrying area 10, and the first tab 11 connected to the sidewall are integrally formed because the bottom wall of the carrying area 10 is wafer-to-wafer during processing of the wafer 3. 3 Heating, in the present embodiment, the bottom wall is served by the carrier disk 1. During the scanning of the wafer tray above, the first tongue 11 may interfere with the scanning result if the temperature is different from the bottom wall.

The material of the carrier plate 1 may be graphite.

Referring to FIGS. 1 to 4, it can be seen that the cover 2 is embedded in the central area of the carrier 1 and the five wafer carrying areas 10 are disposed around the cover 2, thus the second convex of the edge of the cover 2. The tongue 21 extends away from the center of the carrier tray 1, and the first tab 11 on the wafer carrying area 10 extends in the direction toward the center of the carrier tray 1. In other embodiments, the cover plate 2 can also be disposed around a plurality of wafer carrying areas 10, and the cover plate 2 is embedded in the edge region of the carrier tray 1. In this case, the second tab 21 at the edge of the cover plate 2 is oriented along the bearing. The disk 1 extends in the center direction, and the first tab 11 on the wafer carrying area 10 extends in a direction away from the center of the carrier disk 1.

Referring to Figures 1 and 3, in the present embodiment, the cover plate 2 is a piece, and the second tab 21 on the cover plate 2 is complementary to the first tab 11 on the carrier tray 1, that is, the two form a The end-to-end closed ring can cover the entire outer periphery of the wafer 3 and press the entire outer edge of the wafer 3. In other embodiments, the cover plate 2 may also be formed by splicing a plurality of pieces, and the second tongues 21 on the plurality of cover plates 2 are commonly complementary to the first tongues 11 on the carrier disk 1, that is, on each of the cover plates 2 The second tabs 21 are joined together to form an end-to-end closed loop with the first tabs 11 to press the entire outer periphery of the wafer 3.

During processing of the wafer 3, the cover 2 and the carrier 1 are adapted to rotate integrally. In this embodiment, since the wafer carrying area 10 is designed to be grooved on the upper surface of the carrier disk 1, the carrier disk 1 and the cover plate 2 can be integrally rotated even if they are not fixed. This is because, since the cover plate 2 is embedded on the upper surface of the carrier tray 1, the complementary regions of the two are not located at the center of the carrier tray 1, and the first tab 11 and the second tab 21 are complementary, both of which have a card relationship. One rotation.

The integral rotation of the cover plate 2 and the carrier tray 1 can be achieved in two ways: a) a rotating shaft (not shown) is connected to the center of the carrier tray 1, and the carrier tray 1 drives the cover plate 2 to rotate, in the process, the wafer The wafer 3 in the bearing area 10 is also rotated; or b) the rotating shaft is connected to the center of the cover 2, and the cover 2 drives the carrier 1 to rotate. At this time, the carrier 1 has a hole suitable for the shaft to pass through, the above process The wafer 3 in the wafer carrying area 10 is also rotated.

In a specific implementation, the rotating shaft may have a square shape or a triangular shape (cross section). For the a) solution, the center of the carrier disk 1 has a square or triangular groove correspondingly; for the b) solution, the center of the cover plate 2 has a square shape or Triangle slot. Preferably, for the a) solution, as shown in FIG. 1, the center of the carrier tray 1 further has a stopper 12 for the shaft to abut. In this case, the cover plate 2 has a stopper 12 thereon. Matching hollowed out area 22.

Referring to FIGS. 1 and 2, the bottom wall of the wafer carrying area 10 has opposing upper and lower surfaces, and the upper surface is a bearing surface, which may be planar, concave, convex or stepped. Studies have shown that under the heating of the same heater, when the lower surface with different morphologies, such as plane, concave, convex or stepped, the temperature of the wafer 3 carried thereon is different, and thus can be adjusted according to the heat of the wafer 3. It is necessary to select the lower surface of the load-bearing area with different topography. For the concave surface and the convex surface, the concave surface and the convex surface having different curvatures may be used. For the step shape, the stepped shape may be a long difference in height and a difference in step height.

Fig. 5 is a structural schematic view showing the wafer tray in the process of assembling with the wafer 3 in another embodiment of the present invention. Figure 6 is a cross-sectional view of the portion of the structure in Figure 5 after assembly. Referring to Figures 5 and 6, the cover 2 and the carrier 1 can also be secured by the fixture 4. The fixing device 4 described above may be a screw or other type of fixing device. The fixing device 4 can pass through the carrier 1 and the cover 2 in order from bottom to top to achieve the fixation between the two, and can also pass through the cover 2 and the carrier 1 in order from the top to the bottom to realize the two. Fixed between. In the former case, if the fixing device is a screw, the head of the screw may not penetrate the surface of the cover 2.

In another embodiment of the present invention, a wafer tray is provided, and the wafer tray is substantially the same as the wafer trays in FIGS. 1 to 6 except that the wafer carrying area 10 is loaded by an additional wafer. The groove on the disc is formed. Correspondingly, the wafer tray comprises a plurality of wafer carriers in addition to the cover plate 2 and the carrier tray 1. In this embodiment, the cover 2 is fixed to the carrier 1 and the above fixing is achieved, for example, by screws. The two are fixed and can sandwich the wafer carrier between the cover 2 and the carrier 1 and will not be displaced as the two rotate. In this case, the wafer carrier may or may not be fixed to the carrier 1.

In this embodiment, the integral rotation of the cover 2 and the carrier 1 can be achieved by the following two schemes: a) the rotating shaft is connected to the center of the carrier 1 , and the carrier 1 drives the plurality of wafer carriers and the cover 2 to rotate; Or b) the rotating shaft is connected at the center of the cover plate 2, the cover plate 2 drives a plurality of wafer carriers and the carrier disk 1 rotates. In this case, the carrier disk 1 has a hole suitable for the passage of the rotating shaft.

In a specific implementation, the rotating shaft may have a square shape or a triangular shape (cross section). For the a) solution, the center of the carrier disk 1 has a square or triangular groove correspondingly; for the b) solution, the center of the cover plate 2 has a square shape or Triangle slot. Preferably, for the a) solution, the center of the carrier tray 1 also has a stop for the shaft to abut, and the cover 2 has a hollowed area that matches the stop.

A further embodiment of the present invention further provides a wafer tray, wherein the wafer tray is different from the wafer tray in the foregoing embodiment in that: the carrier tray 1 is not provided, but the plurality of wafer carriers are fixed on the cover 2 . The above fixing is achieved, for example, by screws. Each wafer carrier has a downwardly recessed wafer carrier region 10, i.e., wafer carrier region 10 is provided by a recess in the wafer carrier.

The advantage of this embodiment is that since each wafer carrier is fixed on the cover plate 1, the wafer carrier can be replaced, so that during the heating process, the carrier having different shapes can be replaced according to the heat adjustment of the wafer 3. The lower surface, for example, the lower surface is a flat, concave, convex or stepped wafer carrier.

In particular, the wafer carrier can have two symmetrical ears with screws fixed to the ears. In other embodiments, the screw can also pass through the edge region of the wafer carrier.

In a specific implementation process, the screws preferably pass through the wafer carrier and the cover 2 in order from bottom to top to achieve the fixation therebetween, so that when the wafer carrier is replaced, the screw can be screwed down. The new wafer carrier is replaced so that the wafers carried on other wafer carriers are not contaminated during the replacement process. In addition, the above-mentioned bottom-up fixing manner can also make the head of the screw not penetrate the surface of the cover plate 2, and the upper surface of the cover plate 2 can be cleaned. In other embodiments, the screws may also pass through the cover 2 and the wafer carrier in order from top to bottom to achieve both.

The material of the screw 4 may be graphite or tungsten.

It can be seen that whether the wafer carrying area 10 is provided by the groove on the carrier disk 1 or by the groove on the wafer carrier, with or without the carrier disk 1, the top part of the side wall of the carrying area 10 extends toward the center of the carrying area. The first tab 11 is complementary to the second tab 21 of the edge of the cover 2, and both are at the same height and collectively surround the entire outer periphery of the wafer 3, so that the entire outer periphery of the wafer 3 can be pressed to avoid crystals. Warp during the processing of the circle 3. In addition, the bottom wall, the sidewall of each wafer carrying area 10, and the first tab 11 connected to the sidewall are integrally formed, that is, the first tab 11 is prevented from being in the bottom wall during scanning of the wafer tray. The temperature is different and interferes with the scan results.

Although the present invention has been disclosed above, the present invention is not limited thereto. Any changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be determined by the scope defined by the appended claims.

1‧‧‧ Carrying tray
10‧‧‧ wafer bearing area
11‧‧‧First tongue
12‧‧ ‧stop
2‧‧‧ Cover
21‧‧‧second tongue
22‧‧‧ hollow area
3‧‧‧ wafer
4‧‧‧Fixed devices

1 is a schematic exploded view of a wafer tray in an embodiment of the present invention;

Figure 2 is a cross-sectional view showing a portion of the structure of the wafer tray in Fig. 1 after assembly;

Figure 3 is a schematic view showing the structure of the wafer assembly in the wafer tray process of Figure 1;

Figure 4 is a cross-sectional view of the portion of the structure in Figure 3 after assembly;

5 is a schematic structural view of a wafer tray in a process of assembling with a wafer in another embodiment of the present invention;

Figure 6 is a cross-sectional view of the portion of the structure in Figure 5 after assembly.

1‧‧‧ Carrying tray

10‧‧‧ wafer bearing area

11‧‧‧First tongue

12‧‧ ‧stop

2‧‧‧ Cover

21‧‧‧second tongue

22‧‧‧ hollow area

Claims (18)

A wafer tray comprising: a carrier having an upper surface having a plurality of wafer carrying regions recessed downwardly, the plurality of wafer carrying regions for placing wafers, and a sidewall of each of the wafer carrying regions One portion has a first tab extending toward a center of each of the wafer carrying regions, and a bottom wall of each of the wafer carrying regions, the sidewall, and the first tab connected to the sidewall are integrally formed, wherein the first portion a tab along an edge of each of the wafer carrying regions is adapted to cover a first portion of the curved outer periphery of the plurality of wafers, the first portion of the curved outer periphery being less than or equal to half of the outer periphery of the wafer; and a cover plate embedded in The upper surface of the carrier has a second tab, the second tab is adapted to cover a second outer peripheral edge of the plurality of wafers, the first portion of the curved outer periphery and The second portion of the curved outer periphery collectively surrounds the entire outer periphery of the plurality of wafers. The wafer tray of claim 1, wherein the cover plate is a piece, and the second tongue on the cover plate is complementary to the first tab on the carrier plate for covering the plurality of The entire outer periphery of the wafer; or the cover plate is formed by splicing a plurality of pieces, and the plurality of second tongues on the cover plate are collectively complementary to the first tongue on the carrier plate for covering the The entire outer circumference of the plurality of wafers. The wafer tray of claim 1, wherein the cover is embedded in a central area of the carrier, the plurality of wafer carrying areas are disposed around the cover, and the second tab of the cover edge Extending in a direction away from a center of the carrier, the first tab on the plurality of wafer carrying regions extends toward a center of the carrier; or the cover is disposed around the plurality of wafer carrying regions, embedded in the In the edge region of the carrier, the second tab of the edge of the cover extends toward a center of the carrier, and the first tab on the wafer carrying region extends away from the center of the carrier. The wafer tray of claim 1, wherein the upper surface of the carrier has a plurality of grooves, each of the grooves forming the wafer carrying area, the cover being fixed or unsecured with the carrier. The wafer tray of claim 1, further comprising a plurality of wafer carriers, the plurality of wafer carriers being located on an upper surface of the carrier, each of the wafer carriers forming the wafer carrying area The cover plate is fixed to the carrier tray. The wafer tray of claim 5, wherein the plurality of wafer carriers are fixed or not fixed to an upper surface of the carrier. The wafer tray of claim 5, wherein the cover is fixed to an upper surface of the carrier by a screw. The wafer tray of claim 1, wherein the bottom wall of the wafer carrying area has opposite upper and lower surfaces, the upper surface being a wafer bearing surface, the lower surface being flat and concave , convex or stepped. The wafer tray of claim 4, wherein the cover plate and the carrier tray are adapted to rotate integrally: a) a rotating shaft is coupled to the center of the carrier tray, the carrier tray drives the cover plate to rotate; or b The rotating shaft is connected to the center of the cover plate, and the cover plate drives the carrying tray to rotate. The carrying tray has a hole suitable for the passage of the rotating shaft. The wafer tray of claim 9, wherein the shaft has a square or triangular cross section, and for a), the center of the carrier has a square or triangular groove correspondingly; and b), the cover The center accordingly has a square or triangular groove. The wafer tray of claim 10, wherein for the a), the center of the carrier tray further has a stopper for the shaft to abut, and the cover has a hollowed area matching the stopper . The wafer tray of claim 5, wherein the cover plate and the carrier tray are adapted to rotate integrally: a) a rotating shaft is coupled to the center of the carrier tray, the carrier tray drives the plurality of wafer carriers and The cover plate is rotated; or b) the rotating shaft is coupled to the center of the cover plate, and the cover plate drives the plurality of wafer carriers and the carrier disk to rotate, the carrier disk having a hole suitable for the passage of the rotating shaft. The wafer tray of claim 12, wherein the shaft has a square or triangular cross section, and for a), the center of the carrier has a square or triangular groove correspondingly; and b), the cover The center accordingly has a square or triangular groove. The wafer tray of claim 13 wherein, for a), the center of the carrier tray further has a stop for the shaft to abut, the cover having a hollowed area matching the stop. A wafer tray comprising: a plurality of wafer carriers, each of the wafer carriers having a wafer carrying area recessed downwardly, the wafer carrying area for placing a wafer, each of the wafer carrying areas a portion of the top of the sidewall has a first tab extending toward the center of the carrier region, the bottom wall of each wafer carrying region, the sidewall, and the first tab connected to the sidewall being integrally formed, wherein the first tab is along the An edge of the wafer carrying region is adapted to cover a first portion of the curved outer periphery of the plurality of wafers, the first portion of the curved outer periphery being less than or equal to half of an outer circumference of the plurality of wafers; and a cover plate embedded in the plurality of An upper surface of the wafer carrier and exposing the plurality of wafer carrying regions, the cover plate being fixed to the plurality of wafer carriers, the edge of the cover having a second tab, the second tab being adapted to cover the plurality The second portion of the wafer has a curved outer periphery, and the first portion of the curved outer periphery and the second portion of the curved outer periphery collectively surround the entire outer periphery of the plurality of wafers. The wafer tray of claim 15, wherein the cover plate is a block, and the second tab on the cover plate is complementary to the first tab on the plurality of wafer carriers for covering The entire outer periphery of the plurality of wafers; or the cover plate is formed by splicing a plurality of pieces, and the plurality of second tongues on the cover plate are commonly complementary to the first tongue on the plurality of wafer carriers For covering the entire outer circumference of the plurality of wafers. The wafer tray of claim 15, wherein the plurality of wafer carriers are disposed around the cover plate, and the second tab of the edge of the cover plate extends away from a center of the cover plate, the plurality of The first tab on the wafer carrier extends in a direction toward a center of the cover; or the cover is disposed around the plurality of wafer carriers, the second tab of the edge of the cover facing the center of the cover The direction extends, and the first tab on the plurality of wafer carriers extends in a direction away from a center of the cover. The wafer tray of claim 15, wherein the bottom wall of the wafer carrying area has opposite upper and lower surfaces, the upper surface being a wafer carrying surface, the lower surface being flat and concave , convex or stepped.