KR20130080645A - Susceptor for manufacturing semiconductor - Google Patents

Susceptor for manufacturing semiconductor Download PDF

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Publication number
KR20130080645A
KR20130080645A KR1020120001565A KR20120001565A KR20130080645A KR 20130080645 A KR20130080645 A KR 20130080645A KR 1020120001565 A KR1020120001565 A KR 1020120001565A KR 20120001565 A KR20120001565 A KR 20120001565A KR 20130080645 A KR20130080645 A KR 20130080645A
Authority
KR
South Korea
Prior art keywords
susceptor
pocket
lifting
main body
wafer
Prior art date
Application number
KR1020120001565A
Other languages
Korean (ko)
Inventor
김인겸
Original Assignee
주식회사 엘지실트론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지실트론 filed Critical 주식회사 엘지실트론
Priority to KR1020120001565A priority Critical patent/KR20130080645A/en
Publication of KR20130080645A publication Critical patent/KR20130080645A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

In an embodiment, a susceptor for supporting a wafer in a reactor chamber during a chemical vapor deposition process includes: a body; And at least one pocket part detachable from the recessed space of the main body and forming a space for accommodating the wafer.

Description

Susceptor for manufacturing semiconductor

Embodiments relate to susceptors for semiconductor manufacturing.

A thin layer of material can be grown on a semiconductor wafer by chemical vapor deposition (CVD).

The wafer is then received on a susceptor in a reactor so that one side thereof is exposed to the reactant gas. At this time, the susceptor rotates slowly about 50 rpm so that the reaction gas is uniformly distributed on the wafer.

The basic principle of the CVD method described above is to deposit a desired material on a wafer by introducing a reaction gas containing a material to be deposited into the reactor to cause pyrolysis on the heated substrate surface.

In the case of an epitaxial reactor, SiHCl 3 (trichlorosilane) is generally used as a reaction gas. In order to smoothly transport the reaction gas, a carrier gas such as H 2 is used as a transport medium. In the CVD method, a chemical reaction in which a reactive gas is inevitably decomposed to form a deposited film is involved, and a dominant chemical reaction may vary depending on the reaction environment.

1 shows a perspective view of a general susceptor 10 and FIG. 2 shows a partial cross-sectional view of the susceptor 10 shown in FIG. 1.

1 and 2, the wafer 20 is mounted in a recessed pocket 12 inside the body 10, and rotates the susceptor 10 to deposit a desired layer of material onto the wafer 20. do. In this case, when the contamination 30 or the defect 30 is generated only in the upper part of the pin hole 14 formed in the main body 10 or one of the plurality of pockets 12, the contamination 30 ), There is a problem in that the susceptor 10 must be replaced with a whole including the pocket 12 without the defect 30.

The embodiment provides a susceptor for semiconductor manufacturing having a detachable pocket portion and a lifting portion.

According to an embodiment, a susceptor for supporting a wafer in a reactor chamber during a chemical vapor deposition process comprises: a body; And at least one pocket part detachable from the recessed space of the main body and forming a space for accommodating the wafer.

In this case, at least one through hole is formed through the main body facing the wafer, and the susceptor may be detachable to the through hole, and may further include a lifting part for lifting the pocket part.

The lifting portion may be integral with or separate from the pocket portion. In addition, the reactor is a single type of reactor, and the susceptor may have one pocket. Alternatively, the reactor may be a batch reactor, and the at least one pocket part may include a plurality of pocket parts.

The pocket part and the lifting part have a size suitable for being tightly coupled to the main body so as not to be separated during rotation of the susceptor. The pocket part and the susceptor may have a circular shape.

Since the susceptor for manufacturing a semiconductor according to the embodiment has a detachable pocket part and a lifting part, when partial contamination or a defect occurs in a plurality of pocket parts and / or lifting parts, the susceptor may not be replaced without replacing the whole susceptor. Since only the defective pocket part and / or lifting part need to be replaced locally, the unreplaced pocket part and / or lifting part can be reused, thereby providing quality control and cost reduction.

1 shows a perspective view of a general susceptor.
FIG. 2 is a partial cross-sectional view of the susceptor shown in FIG. 1.
3 shows a perspective view of a susceptor according to an embodiment.
4A and 4B show cross-sectional views of the susceptor shown in FIG. 3 according to an embodiment.
5A and 5B show cross-sectional views of the susceptor shown in FIG. 3 according to another embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to facilitate understanding of the present invention. However, the embodiments according to the present invention can be modified into various other forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. Embodiments of the invention are provided to more fully describe the present invention to those skilled in the art.

3 shows a perspective view of a susceptor 100 according to an embodiment.

The susceptor 100 shown in FIG. 3 serves to support the wafer in a reactor chamber during the chemical vapor deposition process. For example, the susceptor 100 may be manufactured using carbon graphite or silicon carbide, but the material of the susceptor 100 is not limited or limited.

In an embodiment, the susceptor 100 includes a main body 110 and at least one pocket portion 120.

If the reactor for chemical vapor deposition is of a single type, the susceptor 100 has only one pocket 120.

Alternatively, when the reactor for chemical vapor deposition is a batch reactor, as shown in FIG. 3, the susceptor 100 has a plurality of pockets 120.

Hereinafter, the present embodiment will be described assuming that the susceptor 100 has a plurality of pockets 120, but the present embodiment may be applied even when the susceptor 100 has one pocket 120. Of course.

4A and 4B show cross-sectional views of the susceptor 100 shown in FIG. 3 according to an embodiment. That is, FIG. 4A illustrates an exploded cross-sectional view of the main body 110, the pocket part 120, and the lifting part 130, and FIG. 4B illustrates the main body 110, the pocket part 120, and the lifting part 130. The bonding cross section is shown.

According to the embodiment, the pocket portion 120 has a structure formed to be detachable in the space 114 recessed to a certain depth in the main body 110. Therefore, the pocket part 120 accommodates the wafer 20 after being inserted into the recessed space 114 to accommodate the wafer 20 by gravity. At this time, the inner surface 122 of the pocket portion 120 may have an inclined curved surface unlike in FIGS. 4A and 4B, but the embodiment is not limited thereto, and the inner surface of the pocket portion 120 is not limited thereto. 122 may have various shapes to accommodate the wafer 20.

In the susceptor 100, at least one through hole 112 is formed through the main body 110 facing the wafer 20. For example, as illustrated in FIGS. 4A and 4B, a plurality of through holes 112 may be formed.

In this case, the susceptor 100 may be detachable from the through-hole 112 of the main body 110, and may further include a lifting part 130 for lifting the pocket part 120.

For example, the lifting part 130 may take a form separated from the pocket part 120 as shown in FIGS. 4A and 4B. In this case, referring to FIG. 4A, after the lifting part 130 is inserted into the through hole 112 of the main body 110, the pocket part 120 is pushed into the main body 110 by pushing the pocket part 120 in the gravity direction. Combine. Subsequently, referring to FIG. 4B, when the lifting pin 200 is pushed up in the direction of the arrow 300, the pocket part 120 is separated from the main body 110 in the opposite direction of gravity.

5A and 5B show cross-sectional views of the susceptor 100 shown in FIG. 3 according to another embodiment. That is, FIG. 5A illustrates an exploded cross-sectional view of the main body 110, the pocket part 120, and the lifting part 130, and FIG. 4B illustrates a combined cross-sectional view of the main body 110, the pocket part 120, and the lifting part 130. Indicates

In addition, the lifting unit 130 may be implemented integrally with the pocket portion 120 as shown in Figure 5a and 5b. In this case, referring to FIG. 5A, when the pocket part 120 is pushed in the gravity direction to be coupled to the main body 110, the lifting part 130 integral with the pocket part 120 is also inserted into the through hole 112. Thereafter, as shown in FIG. 5B, when the lifting pin 200 is pushed up in the direction of the arrow 300, the pocket part 120 is separated from the main body 110 in the direction opposite to gravity.

In addition, the pocket part 120 and the lifting part 130 may have a size suitable for being closely attached to the main body 100 so as not to be separated from the main body 110 when the susceptor 100 rotates. For example, referring to FIGS. 4A to 5B, the pocket part 120 has a size D1 suitable for being tightly coupled to the recessed portion 114 of the main body 100, and the lifting part 130 has a main body. It may have a size (D2) suitable to be in close contact with the through hole 112 of the (100).

In addition, the pocket part 120 and the susceptor 100 may have a circular shape as shown in FIGS. 3 to 5B. In this case, for example, the susceptor 100 for receiving a 150 mm diameter wafer 20 may have a circular pocket portion 120 of approximately 160 mm diameter.

However, the present invention is not limited thereto, and the susceptor 100 may be formed in various forms according to the size and shape of the reaction chamber in which the chemical vapor deposition process may easily occur. For example, the pocket part 120 may be formed in an oval shape.

The pocket part 120 and the lifting part 130 of the susceptor 100 according to the present embodiment are detachable. Therefore, when the contamination 300 or the defect 300 occurs in some pockets or lifting portions in the plurality of pockets 120 or / and the lifting portions 130, the susceptor 100 does not need to be replaced entirely. Since only the corresponding pocket portion 120 and / or the lifting portion 130 where the 300 or the defect 300 has occurred may be replaced locally, the unreplaced pocket portion 120 or / and the lifting portion 130 may be reused. It can do the quality control and cost reduction effect.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

10, 100: susceptor 14, 110: main body
20: wafer 120: pocket part
130; Lifting part 200: lifting pin

Claims (7)

A susceptor for supporting a wafer in a reactor chamber during a chemical vapor deposition process,
main body; And
A susceptor for manufacturing a semiconductor, the susceptor comprising: at least one pocket part detachable from the recessed space of the main body and forming a space for accommodating the wafer. The susceptor for manufacturing a semiconductor according to claim 1, wherein at least one through hole is formed through the main body facing the wafer. The susceptor for manufacturing a semiconductor according to claim 2, further comprising a lifting part detachable from the through hole and lifting the pocket part. The susceptor for semiconductor manufacturing according to claim 3, wherein the lifting portion is integrated with the pocket portion. The susceptor for manufacturing a semiconductor according to claim 3, wherein the lifting portion is detachable from the pocket portion. The susceptor of claim 1, wherein the reactor is a single type of reactor, and the susceptor has one pocket. The susceptor for semiconductor manufacturing according to claim 1, wherein the reactor is a batch reactor, and the at least one pocket part includes a plurality of pocket parts.
KR1020120001565A 2012-01-05 2012-01-05 Susceptor for manufacturing semiconductor KR20130080645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120001565A KR20130080645A (en) 2012-01-05 2012-01-05 Susceptor for manufacturing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120001565A KR20130080645A (en) 2012-01-05 2012-01-05 Susceptor for manufacturing semiconductor

Publications (1)

Publication Number Publication Date
KR20130080645A true KR20130080645A (en) 2013-07-15

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Application Number Title Priority Date Filing Date
KR1020120001565A KR20130080645A (en) 2012-01-05 2012-01-05 Susceptor for manufacturing semiconductor

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150146186A (en) * 2014-06-23 2015-12-31 엘지이노텍 주식회사 Wafer carrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150146186A (en) * 2014-06-23 2015-12-31 엘지이노텍 주식회사 Wafer carrier

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