KR20060112811A - A plasma display device - Google Patents

Abstract

A plasma display device is provided to enhance a heat dissipation effect by forming a heat dissipation fin and a ventilation fan at a cover plate. A plasma display panel(11) is attached to one side of a chassis base(17). A printed circuit board assembly is attached to the other side of the chassis base. A driver IC package is connected with a terminal of an electrode drawn from the plasma display panel. A driver IC printed circuit board assembly is installed at the driver IC package and is connected with the printed circuit board assembly in order to generate a pulse to be applied to the electrode of the plasma display panel. A reinforcing member(29) is formed at a front end of the chassis base in order to support one side of the driver IC package. A cover plate(31) is installed at an opposite side of the reinforcing member in order to support the other side of the driver IC package. A ventilation fan(41) is installed at a corresponding end of the cover plate. A heat dissipation fin is formed at the cover plate.

Description

Plasma Display Device {A PLASMA DISPLAY DEVICE}

1 is an exploded perspective view of a plasma display device according to an embodiment of the present invention.

2 is a cross-sectional view taken along the line A-A of FIG.

FIG. 3 is an exploded perspective view of the cover plate and the air blowing pen having the heat dissipation fin in FIG. 1.

4 is an exploded perspective view illustrating a cover plate and a blower pen according to a modification of the present invention.

The present invention relates to a plasma display device having a driver IC heat dissipation structure capable of efficiently dissipating heat generated from a driver IC of a tape carrier package (TCP).

As is known, a plasma display apparatus is an apparatus for displaying an image on a plasma display panel using a plasma generated by gas discharge. In such a plasma display device, an electrode printed on a plasma display panel is generally electrically connected to a driving circuit through a flexible printed circuit (FPC), which is connected to a pixel of the panel. A driver IC is applied which applies an address voltage in accordance with a signal controlled by a drive circuit to selectively form a wall voltage.

As such, it has been widely used as a voltage application structure using an FPC and an IC, and a chip on board (COB) in which an IC is mounted on a printed circuit board (PCB), and a film constituting the FPC. Chip-on-film (COF), in which ICs are directly mounted, has recently been used in tape carrier packages (TCPs), which are small and inexpensive.

On the other hand, in order to express more than 256 gradations in the plasma display panel, at least eight address discharges must be performed for 1/60 second corresponding to 1 TV field, so that a lot of heat is generated in the COF, COB, or TCP mounted on the chassis base. Electromagnetic interference (EMI) occurs.

Therefore, the COB or COF is provided with a plate-shaped reinforcement plate, which serves to fix the COB or COF to the chassis base while reinforcing structural strength, and the reinforcement plate has good heat generated from the IC to the outside. It also serves as a heat sink to allow for divergence.

On the other hand, in TCP, a method of dissipating heat generated from a driver IC into the air by attaching a heat dissipation sheet on the driver IC in order to dissipate heat generated from the driver IC is adopted. However, this method does not have good heat dissipation efficiency, so the heat sink size of the driver IC of TCP is excessively larger than that of the driver IC of TCP, so that the heat dissipation of the driver IC of TCP can be handled. Therefore, in order to prevent failures such as the rupture of the driver IC of TCP, it is necessary to reduce the amount of heat generated by itself, which is usually accompanied by an algorithm that adversely affects the image quality, which may cause the overall image quality deterioration.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a plasma display device that efficiently radiates high heat generated by a driver IC of TCP to the outside of a cover plate.

It is also an object of the present invention to provide a plasma display device that quickly dissipates high heat generated by a driver IC of TCP.

A plasma display device according to the present invention includes a plasma display panel, a chassis base for attaching the plasma display panel to one side thereof, and a circuit board assembly mounted at the other side thereof, and a driver IC connected to a terminal of an electrode drawn from the plasma display panel. A package IC provided in the driver IC package and connected to the circuit board assembly to generate a pulse to be selectively applied to an electrode of the plasma display panel, and provided at a tip of the chassis base to support one side of the driver IC package. A reinforcing member, a cover plate mounted on an opposite side of the reinforcing member to support the other side of the driver IC package, a blowing pen provided at an end corresponding side of the cover plate, and a direction of wind generated by the blowing pen; According to the award Comprises a heat-formed on the cover plate.

The blowing pen may be accommodated in a bracket provided on one side of the cover plate. In this case, the blowing pen may be coupled to a position corresponding to at least one end of the cover plate provided along the long side length direction of the chassis base. The blower pen may be coupled to at least one end of the reinforcing member supporting one side of the driver IC package. In addition, the blowing pen may be coupled to at least one end of the cover plate.

The heat dissipation fin is preferably formed long over the entire length of the cover plate in the wind traveling direction generated by the blowing pen. At this time, the advancing direction of the wind generated from the blowing pen coincides with the long side length direction of the chassis base. This heat dissipation fin is preferably formed to protrude from the outer surface of the cover plate. The heat dissipation fins may be formed in a segment shape spaced apart from each other along the long side length direction of the chassis base.

The blowing pen is disposed in a state perpendicular to the extending direction of the channel formed between the heat dissipation fin and the adjacent heat dissipation fin in the width direction of the cover plate.

The heat dissipation fin is preferably formed integrally along the longitudinal direction of the cover plate.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view of a plasma display device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and FIG. 3 is an exploded cover plate and a blower pen having a heat dissipation fin in FIG. 1. The partially exploded perspective view shown.

The plasma display device has a PDP 11 that displays an image using gas discharge, and a heat radiation that is attached to the rear surface of the PDP 11 to conduct and diffuse heat generated in the PDP 11 in a plane direction (xy plane direction). The sheet 13, the circuit board assembly 15 electrically connected to the PDP 11 to drive the PDP 11, and the PDP 11 are attached to and supported by a double-sided tape 16 on the front thereof, and the circuit board And a chassis base 17 for mounting and supporting the assemblies 15 on its back.

Since the present invention relates to the coupling relationship between the PDP 11 and other components using the above-described PDP 11, a detailed description of the PDP 11 is omitted here. The heat dissipation sheet 13 is provided on the rear surface of the PDP 11 to conduct and diffuse heat generated by the PDP 11 to cause gas discharge in the plane direction (x-y plane direction) of the PDP 11. The heat dissipation sheet 13 may be formed of an acrylic heat dissipation material having excellent thermal conductivity, a graphite heat dissipation material, a metal heat dissipation material, or a carbon nanotube heat dissipation material.

The circuit board assembly 15 is mounted to the boss 18 of the chassis base 17 with a set screw 19. Of these circuit board assemblies 15, the image processing / control board 15a receives an image signal from the outside to control signals necessary for driving the address electrode 21 and control signals required for driving the display electrode (not shown). Is generated and applied to the address drive board 15b, the scan drive board 15c and the sustain drive board 15d, respectively. The power supply board 15e supplies the power required for driving this plasma display device as a whole.

Among the circuit board assemblies 15, the address drive board 15b, the scan drive board 15c, and the sustain drive board 15d are connected to the PDP 11 by the FPC 23 to drive the PDP 11 described above. Are respectively connected to the corresponding electrodes. This embodiment illustrates a structure in which the address drive board 15b and the PDP 11 are connected to the FPC 23.

The driver IC 25 is interposed between the address driving board 15b and the address electrode 21 of the PDP 11. The driver IC 25 selectively applies an address pulse to the address electrode 21 of the PDP 11 in accordance with the control signal of the address drive board 15b. The discharge cells of the PDP 11 are selected by the address pulses applied to the address electrodes 21 and the scan pulses applied to the scan electrodes (not shown). The driver IC 25 applying the address pulse in this manner is provided in the driver IC package 27 (hereinafter referred to as "TCP") in a packaged state. The TCP 27 has an input terminal connected to the address driving board 15b and an output terminal connected to the address electrode 21 of the PDP 11 through the FPC 23.

The address electrode 21 of the PDP 11 is drawn out to the outside of the PDP 11 through the FPC 23, and is disposed at the rear end of the chassis base 17 and the TCP 27 and the driver IC 25. It is connected to the address driving board 15b through.

The chassis base 17 may be formed by pressing a thin metal material. In this case, the chassis base 17 may be bent or have a reinforcing member 29 to have mechanical rigidity that can withstand torsional and bending forces.

As shown in FIG. 1, the reinforcing member 29 may be appropriately formed at a position to avoid spatial interference with the circuit board assembly 15 installed on the rear surface of the chassis base 17. Among them, one reinforcing member 29 may be provided at the rear end of the chassis base 17. This reinforcing member 29 supports the driver IC 25 and the TCP 27 provided thereon.

That is, in the rectangular chassis base 17 having a long side (x axis direction) and a short side (y axis direction), the reinforcing member 29 has its longitudinal direction (x axis) at the rear end of the long side of the chassis base 17. Direction) is formed long.

The cover plate 31 is attached to the front end of the chassis base 17, that is, the reinforcing member 29, with the TCP 27 and the driver IC 25 interposed therebetween. The cover plate 31 is fixed to the reinforcing member 29 by a fastening member (not shown). The cover plate 31 dissipates heat generated during its driving while fixing the driver IC 25 provided in the reinforcing member 29.

The cover plate 31 may be independently configured to correspond to the TCP 27 and the driver IC 25 respectively provided in the longitudinal direction of the chassis base 17 along the long side length direction (x axis direction) thereof. (Not shown), it may be formed long in the long side direction (x-axis direction) of the chassis base 17 to cover the plurality of TCP (27) and driver IC (25) as shown.

The elongated cover plate 31 can facilitate mounting of the cover plate 31 as compared with being formed independently one by one, and can prevent the close contact force from being concentrated on only the specific driver IC 25.

That is, the reinforcing member 29 is mounted on the long side end of the chassis base 17, and the cover plate 31 is mounted on the reinforcing member 29, and between the cover plate 31 and the reinforcing member 29. The TCP 27 and the driver IC 25 are arranged in this. That is, the TCP 27 and the driver IC 25 are supported on one side by the reinforcing member 29 and the other on the other side by the cover plate 31.

3, the cover plate 31 is provided with heat dissipation fins 33 on the outer surface thereof. The heat dissipation fin 33 is formed long along its entire length along the longitudinal direction of the cover plate 31 and protrudes in the protruding direction of the driver IC 25 from the outer surface of the cover plate 31. The heat dissipation fin 33 dissipates high heat generated when the driver IC 25 is driven to the cover plate 31. Therefore, the plasma display panel 11 is less affected by the heat generated by the driver IC 25.

On the other hand, the plasma display device of the present embodiment further includes a blowing pen 41 for forcibly blowing in order to quickly dissipate the driver IC 25. The blowing pen 41 may be variously coupled to a position corresponding to at least one end of the cover plate 31 provided along the long side length direction (x-axis direction) of the chassis base 17.

In addition, the blowing pen 41 may be directly installed and used, but may be accommodated and installed in the bracket 43 as shown. This embodiment exemplifies housing the blowing pen 41 in the bracket 43 and mounting the bracket 43 to the cover plate 31.

To this end, the bracket 43 is provided with a fastening hole 43a in the flange. The end of the cover plate 31 facing the fastening hole 43a is provided with a fastening hole 31a. The fastening hole 43a of the bracket 43 is formed as a through hole, and the cover plate 31 side fastening hole 31a is preferably formed as a screw hole. At this time, the fastening screw 43b penetrating the fastening hole 43a is screwed to the fastening hole 31a on the cover plate 31 side. The blower pen 41 is provided at the longitudinal end of the cover plate 31 through the fastening holes 43a and 31a and the fastening screw 43b. The blower pen 41 may be installed at both ends of the cover plate 31 in the lengthwise direction.

In addition, the blowing pen 41 is coupled to a position corresponding to one end of the cover plate 31. 1 illustrates that the blowing pen 41 is coupled to one end of each of the reinforcing members 29 in the two reinforcing members 29. That is, the blowing pen 41 is provided at the end of the reinforcing member 29 corresponding to the end of the cover plate 31. 3 illustrates that the blowing pen 41 is coupled to the end of the cover plate 31.

The blowing pen 41 is provided at both ends of the cover plate 31 or both ends of the reinforcing member 29 as described above, rather than being provided at one end of the cover plate 31 or one end of the reinforcing member 29. For example, it is desirable to form a stronger wind by sending wind at one end and sucking wind at the other end. In this case, heat generated from the driver IC 25 provided in a plurality along the long side length direction of the chassis base 17 may be dissipated more quickly.

On the other hand, the heat dissipation fin 33 is preferably formed long along the traveling direction of the wind generated from the blowing pen 41. In this case, the heat dissipation fin 33 on the outer surface of the cover plate 31 can maximize the heat dissipation effect without disturbing the wind path generated from the blowing pen 41.

Here, the channel 32 formed between the heat dissipation fin 33 disposed along the width direction of the cover plate 31 and the heat dissipation fin 33 adjacent thereto is extended in the longitudinal direction of the cover plate 31. This direction of extension coincides with the direction of wind travel.

A modification of the present invention will now be described with reference to FIG. 4.

4 is an exploded perspective view illustrating a cover plate and a blower pen according to a modification of the present invention.

Referring to this, the modification of the present invention is based on the structure of the above-described embodiment, and includes segmented heat dissipation fins 133. The heat dissipation fins 133 are spaced apart from each other along one direction of the chassis base 17, that is, along the long side length direction of the chassis base 17.

Also in this case, the blowing pen 41 may be provided on any one side or both sides of the direction in which the channel 32 between the heat dissipation fins 33 adjacent to each other formed on the cover plate 31 is extended. The blowing pen 41 is provided in a state perpendicular to the extending direction of the panel 32.

One side of the blower pen 41 is disposed close to the driver IC 25 through the cover plate 31 or the reinforcing member 29 to forcely blow the air toward the driver IC 25. As a result, the heat dissipation performance of the driver IC 25 can be improved. To this end, the blowing pen 41 may be formed at various positions on the chassis base 17, the reinforcing member 29 and the cover plate 31, and in various structures. In addition, the segment type heat dissipation fin 133 may be formed in various structures such as or linear.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the plasma display device according to the present invention, a reinforcing member is provided on one side of the chassis base, and the cover plate is mounted on the reinforcing member via TCP provided with a driver IC, and both sides of the driver IC are provided. And a heat dissipation fin on the cover plate and a blower pen on one side of the cover plate, forcibly dissipating high heat generated in the driver IC by forcibly blowing through the channel between the heat dissipation fin and the adjacent heat dissipation fin. It works. Therefore, there is an effect of reducing the heat generated from the driver IC to the plasma display panel.

Claims (11)

A plasma display panel; A chassis base attaching the plasma display panel to one side thereof and mounting the circuit board assembly to the other side thereof; A driver IC package connected to a terminal of an electrode withdrawn from the plasma display panel; A driver IC circuit board assembly provided in the driver IC package and connected to the circuit board assembly to generate pulses to be selectively applied to electrodes of the plasma display panel; A reinforcing member provided at the front end of the chassis base to support one side of the driver IC package; A cover plate mounted on an opposite side of the reinforcing member to support the other side of the driver IC package; A blowing pen provided at an end corresponding side of the cover plate; And It includes a heat dissipation fin formed on the cover plate in the direction of the wind generated by the blowing pen Plasma display device. According to claim 1, The blower pen is a plasma display device accommodated in a bracket provided on one side of the cover plate. The method of claim 2, And the blower pen is coupled to a position corresponding to at least one end of the cover plate provided along the long side of the chassis base. The method of claim 2, The blower pen is coupled to at least one end of the reinforcing member for supporting one side of the driver IC package. The method of claim 2, And the blower pen is coupled to at least one end of the cover plate. According to claim 1, The heat dissipation fins are formed to extend over the entire length of the cover plate in the direction of the wind generated by the blowing pen. The method of claim 6, And a propagation direction of wind generated from the blower pen coincides with a longitudinal side direction of the chassis base. The method of claim 6, The heat dissipation fins are formed to protrude on the outer surface of the cover plate. The method of claim 8, The heat dissipation fins are formed in a segment shape spaced apart from each other along the longitudinal direction of the long side of the chassis base. According to claim 1, And a blower pen disposed in a width direction of the cover plate in a state perpendicular to an extension direction of a channel formed between the heat dissipation fin and an adjacent heat dissipation fin. According to claim 1, And the heat dissipation fins are integrally formed in the cover plate along a length direction thereof.

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