KR100766963B1 - Plasma display device - Google Patents

Abstract

A plasma display device is provided to improve a heat transfer process between a driver IC and a chassis base by increasing a heat transferring area of a member between the driver IC package and the chassis base. A plasma display panel(11) is attached to one side of a chassis base(17) for supporting the plasma display panel. A printed circuit board assembly is installed in the chassis base. A driver IC package(27) includes a driver IC for generating a pulse to be selectively supplied to an address electrode of the plasma display panel. The driver IC package is connected to the printed circuit board assembly. A supporting member is formed in the chassis base. A heat-radiating member(40) is installed at the outside of the supporting member. A coupling member is coupled with the supporting member when the driver IC package is loaded into the supporting member and the heat-radiating member.

Description

Plasma display device {PLASMA DISPLAY DEVICE}

1 is a perspective view showing the configuration of a plasma display device according to an embodiment of the present invention.

2 is a cross-sectional view illustrating a coupling relationship between a driver IC package and a chassis base according to an exemplary embodiment of the present invention.

3 is an exploded perspective view illustrating a coupling relationship between a driver IC package and a chassis base according to an exemplary embodiment of the present invention.

4 is a partial cross-sectional view schematically illustrating a coupling relationship between a driver IC package and a chassis base according to an exemplary embodiment of the present invention.

5 is a coupling diagram of FIG. 4.

<Description of the symbols for the main parts of the drawings>

11; Plasma display panel 15; Circuit board assembly

15b; Address buffer board 27; Driver IC Package

30; Support member 40; Heat dissipation member

The present invention relates to a plasma display device, and more particularly, to a plasma display device capable of efficiently dissipating heat generated from a driver IC package of a plasma display device to prevent malfunction of a driver IC.

In general, a plasma display device is a device that displays an image on a plasma display panel (PDP) using plasma generated by gas discharge.

The plasma display apparatus includes a plasma display panel for implementing an image, a chassis base for supporting the plasma display panel, and a plasma display panel mounted on the chassis base to face the plasma display panel, through a flexible printed circuit (FPC) and a connector. It includes a circuit board assembly connected to a display electrode or an address electrode located inside the panel, and a case surrounding the plasma display panel, the chassis base and the circuit board assembly to form an appearance of the plasma display device.

The plasma display panel generally seals two glass substrates face to face and forms discharge cells therein. A plasma display panel is a display panel that displays an image by exciting phosphors by vacuum ultraviolet rays caused by gas discharge in a discharge cell. The display panel has excellent display capacity, brightness, contrast, viewing angle, and the like. Can be.

The chassis base is formed of a metal material having high mechanical rigidity to support the plasma display panel, and is supported by attaching the plasma display panel through a double-sided tape. In addition to the function of maintaining the rigidity of the plasma display panel, the chassis base functions to mount and support the circuit board assembly, the heat sink function of the plasma display panel, and ground the electromagnetic interference (EMI). .

The plasma display panel supported on the chassis base addresses the discharge cells by the address electrodes and the display electrodes provided therein, and sustains and discharges the discharge cells to implement an image.

To this end, the plasma display panel draws out the electrodes provided therein to the outside through the flexible circuit, and is connected to the circuit board assembly through the flexible circuit and controlled according to the control signal of the circuit board assembly.

The address electrode is connected to the circuit board assembly via a driver IC package having a driver IC and a flexible circuit. The address pulse is supplied to the address electrode through the driver IC. The driver IC package is classified into a chip on film (COF), a chip on board (COB), a tape carrier package (TCP), and the like according to a packaging method.

Here, the chip on film refers to the integrated circuit (IC) is directly mounted on the film constituting the flexible circuit, the chip on board refers to the integrated circuit is mounted on a printed circuit board (PCB), the chip On film is a structure that is not mounted on a printed circuit board, the price is relatively inexpensive and is widely used.

The chip-on film has a reinforcement plate for reinforcing structural strength, and the reinforcement plate is provided with a simple plate-shaped member, and is fixed to the chassis base through screws to support the flexible circuit and to fix the same. Do it.

However, in the chip-on film mounted on the chassis base, not only a lot of heat is generated, but also electromagnetic interference occurs to leak outwards. The heat generated from the chip-on film is released to some extent through the heat sink, and part of the heat is emitted through the chassis base to prevent the chip-on film from excessively rising. It causes a problem that causes black lines to occur on the screen due to a malfunction of.

Moreover, the electromagnetic interference generated in the chip-on film also affects the driving circuit, thereby destabilizing signal processing.

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma display device capable of efficiently dissipating heat generated from a driver IC package of a plasma display device, effectively grounding electromagnetic interference to prevent malfunction of the driver IC, and to stabilize signal processing of the driving circuit. To provide.

In order to achieve the above object, the present invention provides a plasma display panel, a chassis base for attaching and supporting a plasma display panel, a circuit board assembly mounted on the chassis base, and a driver for generating pulses to be selectively supplied to address electrodes of the plasma display panel. Driver IC package having an IC and connected to the circuit board assembly, a support member formed on the chassis base, a heat dissipation member provided on the outer side of the support member, and fastened to the support member with the driver IC package placed on the support member and the heat dissipation member. It is preferable to include a fastening member to be.

In the above configuration, the support members may be formed in a cylindrical shape in which the support members are spaced apart from each other along the long side direction of the chassis base to correspond to the driver IC packages, and a screw groove is formed on an inner circumferential surface thereof.

The heat dissipation member may include an insertion hole through which the support member is inserted into the inner circumferential surface, and may be formed of a cylindrical thermal conductive material that is in surface contact with the driver IC package and the chassis base, respectively.

The driver IC package may be configured as a chip on film.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. While many specific details are set forth in order to provide a more general understanding of the invention, such as the following description and the annexed drawings, these specific details are illustrated for the purpose of illustrating the invention and are meant to limit the invention to those details. It is not. And a detailed description of known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted.

1 is a perspective view showing the configuration of a plasma display device according to an embodiment of the present invention.

Referring to FIG. 1, a plasma display device according to an exemplary embodiment of the present invention includes a plasma display panel 11, a thermal conductive sheet 13, a circuit board assembly 15 (PBA; printed circuit board assembly), and a driver IC package ( 27), chassis base 17, support member 30, fastening member, heat dissipation member (40).

First, the plasma display panel 11 includes a front panel and a rear panel which are integrally bonded by a sealing material. The plasma display panel 11 includes discharge cells therein so that any visible light can be emitted through plasma generation. Implement color images. The plasma display panel 11 is configured to display an image by using gas discharge, and the present invention relates to the coupling relationship between the plasma display panel 11 and other components. Detailed description will be omitted.

The thermal conductive sheet 13 is interposed between the plasma display panel 11 and the chassis base 17 to conduct heat generated by the plasma display panel 11 to cause gas discharge in the planar direction of the plasma display panel 11. Diverge.

The circuit board assemblies 15 are electrically connected to the plasma display panel 11 to drive the plasma display panel 11 and mounted to the boss 18 of the chassis base 17 with a set screw 19. Among the circuit board assemblies 15, the image board 15e receives an image signal from the outside to generate a control signal for driving the address electrode 21 and a control signal for driving the display electrode (not shown). The address buffer board 15b, the scan electrode driving board 15c and the sustain electrode driving board 15d are respectively supplied. The power board 15a supplies the power required for driving the plasma display device as a whole.

In the circuit board assembly 15, the address buffer board 15b, the scan electrode driving board 15c, and the sustain electrode driving board 15d are respectively connected to the flexible circuit 23 to drive the plasma display panel 11 described above. It is connected to the plasma display panel 11.

The driver IC package 27 includes a driver IC 25 for generating a pulse to be selectively supplied to the address electrode 21 of the plasma display panel 11 and is connected to the address buffer board 15b.

The chassis base 17 attaches and supports the plasma display panel 11 to the front thereof with a double-sided tape 16 (bonding material), and supports the circuit board assemblies to the rear thereof. The chassis base 17 may be formed by pressing a thin metal material.

An embodiment of the present invention exemplifies a structure in which the address buffer board 15b and the plasma display panel 11 are connected to the flexible circuit 23, and will be described for convenience.

2 is a cross-sectional view illustrating a coupling relationship between a driver IC package and a chassis base according to an embodiment of the present invention, and FIG. 3 is an exploded perspective view illustrating a coupling relationship between a driver IC package and a chassis base according to an embodiment of the present invention. .

2 and 3, a coupling configuration of a driver IC package and a chassis base according to an exemplary embodiment of the present invention will be described.

The address buffer board 15b described below is an embodiment of the circuit board assembly 15, and the address electrode 21 refers to an embodiment of the electrode of the plasma display panel 11.

The driver IC 25 is interposed between the address buffer board 15b and the address electrode 21 of the plasma display panel 11. The driver IC package 27 according to the embodiment of the present invention is composed of a chip on film (COF) in which the driver IC 25 is directly mounted on the film forming the flexible circuit 23.

The driver IC 25 selectively supplies an address voltage pulse to the address electrode 21 of the plasma display panel 11 in accordance with the control signal of the address buffer board 15b. The discharge cell of the plasma display panel 11 is selected by the address voltage pulse supplied to the address electrode 21 and the scan voltage pulse supplied to the scan electrode. The driver IC 25 for supplying the address voltage pulse in this manner is provided in the driver IC package 27 in a packaged state.

The driver IC package 27 has an input side connected to the address buffer board 15b and an output side connected to the address electrode 21 of the plasma display panel 11 through the flexible circuit 23.

The address electrode 21 of the plasma display panel 11 is drawn out to the outside through the flexible circuit 23, and the driver IC package 27 and the driver IC 25 disposed at the front end of the rear surface of the chassis base 17 are removed. Is connected to the address buffer board 15b.

On the other hand, the support member 30 according to the embodiment of the present invention is formed in the chassis base 17 corresponding to the mounting position of the driver IC package 27 to support the mounting state of the driver IC package 27. That is, the support member 30 is formed at equal intervals along the long side direction of the chassis base 17 corresponding to the driver IC packages 27 and has a cylindrical shape in which a screw groove 32 is formed on an inner circumferential surface thereof. .

The fastening member includes a screw 52 and a washer 50, and couples the driver IC package 27 and the chassis base 17 through the support member 30.

The heat dissipation member 40 has an insertion hole 42 into which the support member 30 is inserted into the inner circumferential surface thereof, and is formed in a cylindrical shape in surface contact with the driver IC package 27 and the chassis base 17, respectively. In addition, the heat dissipation member 40 is preferably formed of a thermally conductive material.

As described above, the heat dissipation member 40 is made of a thermally conductive material and is separately contacted with the driver IC package 27 and the chassis base 17 separately from the support member 30 so that the chassis base from the driver IC package 27 is removed. Heat transfer to (17) can be made more effective.

That is, while the support member 30 is reinforced between the driver IC package 27 and the chassis base 17, an area in contact with the driver IC package 27 and the chassis base 17 is formed to be wider, and the driver IC package 27 and By forming a wide heat transfer area between the chassis base 17, heat dissipation of the driver IC package 27 can be effectively performed.

In addition, heat generated from the driver IC package 27 can be efficiently released to the chassis base 17 side, and the electromagnetic interference can be effectively grounded to prevent malfunction of the driver IC and to stabilize signal processing of the drive circuit.

4 is a partial cross-sectional view schematically illustrating a coupling relationship between a driver IC package and a chassis base according to an exemplary embodiment of the present invention, and FIG. 5 is a coupling diagram of FIG. 4.

4 and 5, a coupling relationship between a driver IC package and a chassis base according to an exemplary embodiment of the present invention will be described.

First, the inner circumferential surface of the heat dissipation member 40 is inserted into an outer circumferential surface of the support member 30 formed on one side of the chassis base 17 so that the support member 30 and the heat dissipation member 40 are coupled to each other.

Subsequently, the center of the hole 28 formed in the driver IC package 27 and the center of the screw groove 32 of the support member 30 coincide with each other, and the washer 50 is placed in the hole 28 and then screwed. Tighten with (52).

As described above, when the driver IC package 27 is coupled to the chassis base 17 via the support member 30 and the heat dissipation member 40, the heat generated from the driver IC package 27 is transferred to the support member 30. And a heat dissipation member 40 to the chassis base 17.

Therefore, as the areas in contact with the driver IC package 27 and the chassis base 17 respectively increase, heat transfer efficiency of the driver IC package 27 is improved by facilitating heat transfer from the driver IC package 27 to the chassis base 17. You can increase it.

On the other hand, the detailed description of the present invention has been described with reference to specific embodiments, of course, various modifications are possible without departing from the scope of the invention.

In the above embodiment has been described to configure the heat dissipation member 40 separately from the support member 30, but those skilled in the art to form the support member 30 and the heat dissipation member 40 integrally. can do.

For example, the area of the support member in contact with the driver IC package and the chassis base may be made larger, and the material of the support member may be formed of a thermally conductive material.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined not only by the claims below but also by the equivalents of the claims.

As described above, the plasma display device according to the present invention increases heat transfer area of a member in contact between the driver IC package and the chassis base to improve heat transfer from the driver IC package to the chassis base, thereby effectively dissipating the driver IC package.

In addition, the heat generated from the driver IC package can be efficiently released to the chassis base side, and electromagnetic interference can be effectively grounded to prevent malfunction of the driver IC and to stabilize signal processing of the driver circuit.

Claims (7)

A plasma display panel; A chassis base to which the plasma display panel is attached and supported; A circuit board assembly mounted to the chassis base; A driver IC package having a driver IC for generating a pulse to be selectively supplied to an address electrode of the plasma display panel, the driver IC package being connected to the circuit board assembly; A support member formed on the chassis base; A heat dissipation member provided at an outer side of the support member; And And a fastening member fastened to the support member while the driver IC package is placed on the support member and the heat dissipation member. The method of claim 1, And the support members are spaced apart from each other along the long side of the chassis base to correspond to the driver IC packages. The method of claim 2, And the support member is formed in a cylindrical shape having a screw groove formed on an inner circumferential surface thereof. The method of claim 1, The heat dissipation member is a plasma display device having an insertion hole for inserting the support member in the inner peripheral surface. The method of claim 1, And the heat dissipation member has a cylindrical shape in surface contact with the driver IC package and the chassis base, respectively. The method of claim 1, The heat dissipation member is a plasma display device formed of a thermally conductive material. The method of claim 1, The driver IC package includes a chip on film.

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