KR20080004780A - Plasma display device - Google Patents

Abstract

A plasma display apparatus is provided to prevent friction between a driver integrated circuit package and an address buffer board by attaching a soundproofing member at an edge of the address buffer board. A chassis base(17) is attached to a plasma display panel(11). The chassis base supports the plasma display panel. A printed circuit board assembly is mounted on the chassis base. A driver integrated circuit package(27) has a driver integrated circuit(25) and is connected to the printed circuit board assembly. The driver integrated circuit generates a voltage to selectively support to an address electrode of the plasma display panel. A soundproofing member(40) is disposed between the printed circuit assembly and the driver integrated circuit package. Each surface of the soundproofing member is contacted to a surface of the printed circuit board assembly and a surface of the driver integrated circuit package.

Description

Plasma display device {PLASMA DISPLAY DEVICE}

1 is a perspective view showing the configuration of a plasma display device according to a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional view taken along line II-II of FIG. 1.

3 is a perspective view illustrating a relationship in which a soundproof member is coupled between a driver integrated circuit package and an address buffer board according to a first embodiment of the present invention.

4 is a partial cross-sectional view illustrating a relationship in which a soundproof member is coupled between a driver integrated circuit package and an address buffer board according to a second embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

11; Plasma display panel 15; Circuit board assembly

15b; Address buffer board 25; Driver integrated circuit

27; Driver integrated circuit package 40; Sound insulation

The present invention relates to a plasma display device, and more particularly, to a plasma display device capable of effectively dissipating heat generated from a driver integrated circuit package of a plasma display device to prevent malfunction of a driver integrated circuit.

In general, a plasma display device is a device that displays an image on a plasma display panel (PDP) using plasma generated by gas discharge.

The plasma display apparatus includes a plasma display panel for implementing an image, a chassis base for supporting the plasma display panel, and a plasma display panel mounted on the chassis base to face the plasma display panel, through a flexible printed circuit (FPC) and a connector. It includes a circuit board assembly connected to the display electrode or the address electrode located inside the panel. The case may further include a case surrounding the plasma display panel, the chassis base, and the circuit board assembly to form an appearance of the plasma display apparatus.

The plasma display panel generally seals two glass substrates face to face and forms discharge cells therein. A plasma display panel is a display panel that displays an image by exciting phosphors by vacuum ultraviolet rays caused by gas discharge in a discharge cell. The display panel has excellent display capacity, brightness, contrast, viewing angle, and the like. Can be.

The chassis base is formed of a metal material having high mechanical rigidity to support the plasma display panel, and is supported by attaching the plasma display panel through a double-sided tape. In addition to the function of maintaining the rigidity of the plasma display panel, the chassis base functions to mount and support the circuit board assembly, the heat sink function of the plasma display panel, and the grounding of electromagnetic interference (EMI). .

The plasma display panel supported on the chassis base addresses the discharge cells by the address electrodes and the display electrodes provided therein, and sustains and discharges the discharge cells to implement an image.

To this end, the plasma display panel draws out the electrodes provided therein to the outside through the flexible circuit, and is connected to the circuit board assembly through the flexible circuit and controlled according to the control signal of the circuit board assembly.

The address electrode is connected to the circuit board assembly via a driver integrated circuit package having a driver integrated circuit and a flexible circuit. The address electrode is supplied with an address voltage through a driver IC. That is, a driver integrated circuit (Driver IC) is used to input data to the address electrode in the plasma display panel. The driver IC package is classified into a chip on film (COF), a chip on board (COB), a tape carrier package (TCP), and the like according to a packaging method.

However, when a driver integrated circuit is attached on the tape carrier package film, one terminal of the tape carrier package is connected to the address electrode of the panel, and the other terminal is connected to the connector on the address buffer board.

In this configuration, when data is input to the address electrode, current flows through the data integrated circuit and the tape carrier package film. As a result, the tape carrier package film is shaken, and the edge of the address buffer board which is in contact with the tape carrier package film causes a noise caused by the shake.

An object of the present invention is to provide a plasma display device capable of efficiently reducing noise generated from a driver integrated circuit package by preventing direct friction between the driver integrated circuit package and the address buffer board of the plasma display device.

In order to achieve the above object, the present invention provides a plasma display panel, a chassis base for attaching and supporting a plasma display panel, a circuit board assembly mounted on the chassis base, and a driver for generating a voltage to be selectively supplied to an address electrode of the plasma display panel. It is desirable to include a driver integrated circuit package having an integrated circuit and connected to the circuit board assembly, and a soundproof member interposed between the circuit board assembly and the driver integrated circuit package.

In the above configuration, the soundproof member is formed in a plate shape in which each surface is in surface contact with one surface of the circuit board of the circuit board assembly and one surface of the driver integrated circuit package, and may be adhered to the circuit board surface of the circuit board assembly through an adhesive. .

The soundproof member may extend along another surface of the circuit board assembly to be in contact with one surface of the circuit board assembly, and may be attached to the other surface of the circuit board of the circuit board assembly through an adhesive.

The soundproof member may be made of a nonwoven fabric, and may be formed of a plate-shaped sound absorbing material.

The soundproof member may be formed by applying a soundproof material in a paste state to one surface of a circuit board of the circuit board assembly.

The driver integrated circuit package may be configured as a tape carrier package (TCP), and the circuit board assembly may be configured as an address buffer board for controlling address electrodes.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. While many specific details are set forth in order to provide a more general understanding of the invention, such as the following description and the annexed drawings, these specific details are illustrated for the purpose of illustrating the invention and are meant to limit the invention to those details. It is not. And a detailed description of known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted.

FIG. 1 is a perspective view showing the configuration of a plasma display device according to a first embodiment of the present invention, and FIG. 2 is a partial cross-sectional view taken along the line II-II of FIG.

1 and 2, a plasma display device according to an embodiment of the present invention includes a plasma display panel 11, a thermal conductive sheet 13, a circuit board assembly 15 (PBA; printed circuit board assembly), and a chassis base ( 17), the driver integrated circuit package 27, the soundproof member 40.

First, the plasma display panel 11 includes a front panel and a rear panel which are integrally bonded by a sealing material. The plasma display panel 11 includes discharge cells therein so that any visible light can be emitted through plasma generation. Implement color images. The plasma display panel 11 is configured to display an image by using gas discharge, and the present invention relates to the coupling relationship between the plasma display panel 11 and other components. Detailed description will be omitted.

The thermal conductive sheet 13 is interposed between the plasma display panel 11 and the chassis base 17 to conduct heat generated by the plasma display panel 11 to cause gas discharge in the planar direction of the plasma display panel 11. Diverge.

The circuit board assembly 15 is electrically connected to the plasma display panel 11 to drive the plasma display panel 11 and is mounted to the boss 18 of the chassis base 17 with a set screw 19. Among the circuit board assemblies 15, the image board 15e receives an image signal from the outside to generate a control signal for driving the address electrode 21 and a control signal for driving the display electrode (not shown). The address buffer board 15b, the scan electrode driving board 15c and the sustain electrode driving board 15d are respectively supplied. The power board 15a supplies the power required for driving the plasma display device as a whole.

The address buffer board 15b, the scan electrode driver board 15c, and the sustain electrode driver board 15d constituting the circuit board assembly 15 are each a flexible circuit 23 to drive the plasma display panel 11. It is connected to the plasma display panel 11.

The chassis base 17 attaches and supports the plasma display panel 11 to the front thereof with a double-sided tape 16 (bonding material), and supports the circuit board assemblies to the rear thereof. The chassis base 17 may be formed by pressing a thin metal material.

The driver integrated circuit package 27 includes a driver integrated circuit 25 for generating a voltage to be selectively supplied to the address electrode 21 of the plasma display panel 11 and is connected to the address buffer board 15b.

The soundproof member 40 is interposed between the address buffer board 15b constituting the circuit board assembly 15 and the driver integrated circuit package 27. As shown in FIG. 2, when the terminal of the driver integrated circuit package 27 is connected to the connector 30 of the address buffer board 15b, the soundproof member 40 is connected to the address buffer board ( It is in contact with the edge of 15b) to prevent the vibration from shaking.

An embodiment of the present invention exemplifies a structure in which the address buffer board 15b and the plasma display panel 11 are connected to the flexible circuit 23, and will be described for convenience.

3 is a perspective view illustrating a relationship in which a soundproof member is coupled between a driver integrated circuit package and an address buffer board according to a first embodiment of the present invention.

1 to 3, a configuration in which a soundproof member is coupled between a driver integrated circuit package and an address buffer board according to an exemplary embodiment of the present invention will be described.

The driver integrated circuit package 27 is interposed between the address buffer board 15b and the address electrode 21 of the plasma display panel 11. The driver integrated circuit package 27 according to the exemplary embodiment of the present invention is configured as a tape carrier package (TCP) in which the driver integrated circuit 25 is directly mounted on a film constituting the flexible circuit 23.

The driver integrated circuit 25 selectively supplies an address voltage to the address electrode 21 of the plasma display panel 11 according to the control signal of the address buffer board 15b. The discharge cells of the plasma display panel 11 are selected by the address voltage supplied to the address electrode 21 and the scan voltage supplied to the scan electrode. The driver integrated circuit 25 supplying the address voltage as described above is provided in the driver integrated circuit package 27 in a packaged state.

The driver integrated circuit package 27 has an input terminal connected to the connector 30 of the address buffer board 15b and an output terminal connected to the address electrode 21 of the plasma display panel 11 through the flexible circuit 23. do.

The address electrode 21 of the plasma display panel 11 is led out to the outside through the flexible circuit 23 to be disposed at the rear end of the chassis base 17 and the driver integrated circuit 25. Is connected to the address buffer board 15b.

Meanwhile, the soundproof member 40 according to the embodiment of the present invention has an address buffer contacting the driver integrated circuit package 27 such that the driver integrated circuit package 27 corresponds to a position where the driver integrated circuit package 27 is mounted on the address buffer board 15b. It is located at the edge of the board (15b). The soundproof member 40 may be formed long along the long side direction of the address buffer board 15b in correspondence with the driver integrated circuit packages 27 and may have a rectangular shape.

That is, the soundproof member 40 is formed in a plate shape in which one surface thereof is in surface contact with one surface of the address buffer board 15b and one surface of the driver integrated circuit package 27, respectively. The soundproof member 40 is adhered to one surface of the address buffer board 15b through an adhesive.

Soundproof member 40 may be made of a non-woven fabric, it may be formed of a plate-shaped sound absorbing material. In addition, the soundproof member 40 may be formed by applying a soundproof material in a paste state to one surface of the address buffer board 15b.

As described above, the soundproof member 40 according to the first embodiment of the present invention has a driver integrated circuit package 27 when a terminal of the driver integrated circuit package 27 is connected to the connector 30 of the address buffer board 15b. It is interposed in the edge part of the address buffer board 15b which contact | connects. The soundproof member 40 is preferably formed of a soundproof material and a sound absorbing material so as to prevent friction noise generated when the driver integrated circuit package 27 directly hits the address buffer board 15b.

With this configuration, the sound insulation member 40 is in surface contact between the driver integrated circuit package 27 and the edge portion of the address buffer board 15b, respectively, so that the direct contact between the driver integrated circuit package 27 and the address buffer board 15b is achieved. The noise generated by can be suppressed.

On the other hand, in the detailed description of the present invention has been described with reference to specific embodiments, of course, various modifications are possible without departing from the scope of the invention.

In the first embodiment described above, the configuration in which the sound insulation member 40 is in contact with the driver integrated circuit package 27 in a state in which the sound insulation member 40 is adhered to only one surface of the address buffer board 15b has been described. By improving the shape of the ramen soundproofing member 40, the combination of the driver integrated circuit package 27 and the address buffer board 15b may be variously changed.

For example, as shown in FIG. 4, the soundproof member 50 is extended to the other surface in contact with one surface of the address buffer board 15b, and the other surface in contact with one surface and one surface of the address buffer board 15b through an adhesive. It can be glued to each side.

4 is a partial cross-sectional view illustrating a relationship in which a soundproof member is coupled between a driver integrated circuit package and an address buffer board according to a second embodiment of the present invention.

In addition, the material of the soundproof member 50 may be made of a thermally conductive material capable of heat dissipation as well as soundproofing (or sound absorption).

In this case, the soundproof member 50 has a larger area in contact with the driver integrated circuit package 27 and the address buffer board 15b to reduce the heat transfer area between the driver integrated circuit package 27 and the address buffer board 15b. By forming wide, heat dissipation of the driver integrated circuit package 27 may be effectively performed.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined not only by the claims below but also by the equivalents of the claims.

As described above, in the plasma display apparatus according to the present invention, the terminal of the driver integrated circuit package is connected to the connector of the address buffer board, and the soundproof member is attached to the edge portion of the address buffer board where the driver integrated circuit package interferes. Contact between the integrated circuit package and the address buffer board can be prevented.

In addition, it is possible to prevent the generation of noise due to the shaking of the driver integrated circuit package.

Claims (10)

A plasma display panel; A chassis base to which the plasma display panel is attached and supported; A circuit board assembly mounted to the chassis base; A driver integrated circuit package having a driver integrated circuit generating a voltage to be selectively supplied to an address electrode of the plasma display panel and connected to the circuit board assembly; And And a soundproof member interposed between the circuit board assembly and the driver integrated circuit package. The method of claim 1, And the soundproof member is formed in a plate shape in which one surface thereof is in surface contact with one surface of the circuit board of the circuit board assembly and one surface of the driver integrated circuit package. The method of claim 1, The soundproof member is bonded to the circuit board surface of the circuit board assembly through an adhesive. The method of claim 2, And the soundproof member extends along another surface of the circuit board assembly that is in contact with one surface of the circuit board. The method of claim 4, wherein And the soundproof member is attached to the other side of the circuit board of the circuit board assembly through an adhesive. The method of claim 2, And the soundproof member is made of a nonwoven fabric. The method of claim 2, And the soundproof member is formed of a plate-shaped sound absorbing material. The method of claim 1, The soundproof member is formed by applying a soundproof material in a paste state to one surface of a circuit board of the circuit board assembly. The method of claim 1, The driver integrated circuit package includes a Tape Carrier Package (TCP). The method of claim 1, The circuit board assembly includes an address buffer board for controlling an address electrode.

Images