KR100696498B1 - Heat sink and display apparatus including the same - Google Patents

Abstract

The present invention provides a heat sink having a structure capable of effectively dissipating heat to the outside in proportion to the amount of heat generated in each portion of a driving circuit chip which performs one function of an electric device, and a display device having the same. In order to achieve the above object, the present invention provides a plurality of extension parts having different extension lengths in proportion to the amount of heat generated in each portion of the driving circuit chip, which extends from the base portion and the base portion disposed in contact with the driving circuit chip. A heat sink having heat dissipation plates is provided.

Description

Heat sink and display apparatus including the same}

1 is a rear view showing a part of a conventional plasma display device from the rear.

FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.

3 is an exploded perspective view schematically illustrating a heat sink and a display device having the same according to a preferred embodiment of the present invention.

4 is an exploded perspective view schematically illustrating an example of the panel of FIG. 3.

5 is an exploded perspective view illustrating an enlarged portion A of FIG. 3.

FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. 5.

<Brief Description of Major Codes in Drawings>

100: display device 110: panel

140: chassis member 150: circuit portion

151: circuit board 155: driving circuit chip

157: heat conductive member 160: heat sink

161: base 165: heat dissipation plate

165_c: central heat sink 165_e: outer heat sink

166: first extension 167: second extension

180: case

The present invention relates to a heat sink and a display device having the same, and more particularly, a heat sink having a plurality of heat sink plates so as to smoothly discharge heat generated from a driving circuit chip to the outside, and a display device having the same. It is about.

BACKGROUND ART In general, a plasma display device is a flat panel display device that displays an image by using a gas discharge phenomenon, and has recently been in the spotlight as a flat panel display device because it is possible to realize a thin screen and a high quality large screen having a wide viewing angle.

In such a plasma display apparatus, a plasma display panel is formed by injecting and encapsulating a discharge gas into discharge cells formed between flat panel panels facing each other, and discharge cells filled with discharge gas by applying a voltage between electrodes crossing the discharge cells. The image is realized by emitting visible light by exciting the phosphor by ultraviolet rays generated by causing a discharge therein.

In this case, the voltage applied to the electrode is controlled in response to an externally received image signal. For this purpose, a driving circuit chip for driving the plasma display apparatus on the circuit board controls a large amount of the image signal for an instant. As a result, a large load is generated on the driving circuit chip to generate high temperature heat.

In particular, an IPM (intelligent power module) may be used as a driving circuit chip in the plasma display device. When the IPM is used, more heat is generated than a conventional driving circuit chip due to the effect of circuit integration.

Accordingly, the conventional plasma display apparatus includes a heat sink 60 as shown in FIGS. 1 and 2.

The heat sink 60 is bonded to the back surface of the drive circuit chip 55 such as IPM mounted on the circuit board 51. In this case, the heat sink 60 includes a base portion 61 and heat dissipation plates 65 extending from the base portion, and forms an air flow path between the heat dissipation plates 65 so that the heat sink 60 is removed from the driving circuit chip. The hot air 11 generated is induced to rise naturally due to convection, thereby allowing the driving circuit chip 55 to dissipate heat.

On the other hand, the amount of heat generated in the drive circuit chip 55 is different depending on each part of the drive circuit chip 55. In this case, the heat generation amount is relatively large in the central portion of the drive circuit chip in which the circuit is dense, and the heat generation amount is relatively small in the outer portion of the drive circuit chip 55. However, the heat dissipation plates provided in the heat sink bonded to the driving circuit chip 55 have the same length. Therefore, the amount of heat radiation from the heat sink to the outside in the portion where the high temperature heat is generated and the portion where the low temperature heat is generated in the drive circuit chip 55 is the same.

As a result, there is a problem that the heat dissipation amount at the portion where the high temperature of the driving circuit chip 55 is generated is not sufficient. In addition, a heat dissipation plate having a size capable of dissipating heat higher than the appropriate discharge amount is disposed in a portion where the low temperature occurs in the driving circuit chip, thereby causing unnecessary materials to be wasted.

The present invention is to solve the above problems, the heat sink having a structure capable of effectively dissipating the heat to the outside according to the amount of heat generated in each portion of the drive circuit chip that performs one function of the electrical device and An object of the present invention is to provide a display device having the same.

Still another object of the present invention is to provide a heat sink having a structure in which a heat dissipation amount of the heat sink is increased and interference with adjacent components does not occur, and a display device having the same.

In order to achieve the above object, the heat sink according to the first embodiment of the present invention is a base portion disposed in contact with the driving circuit chip and extends from the base portion, and is generated at each portion of the driving circuit chip. A plurality of heat dissipation plates having different extension lengths in proportion to the amount of heat is provided.

Here, the highest heat may be generated in the center portion of the driving circuit chip, and in this case, the longest extension length of the heat dissipation plate positioned in the center portion of the driving circuit chip among the heat dissipation plates is longest, and the heat dissipation positioned at the outer portion of the driving circuit chip It is preferable that extension length becomes small so that it is a board.

Meanwhile, at least a heat dissipation plate positioned at the center of the driving circuit chip may include a first extension part extending substantially at right angles from the base portion and a second bent portion of the heat dissipation circuit chip at substantially right angles from the first extension part. An extension may be provided.

In this case, the heat dissipation plate including the first extension part and the second extension part is at least two, and the second extension part of the heat dissipation plate located at the relatively center part of the driving circuit chip and the relatively outer part of the driving circuit chip. Preferably, the second extension portions of the located heat dissipation plates are arranged side by side at a predetermined distance from the rear and the front, respectively.

It is preferable that a heat conducting member is interposed between the driving circuit chip and the heat sink so that heat generated in the driving circuit chip can be smoothly transferred to the base portion.

In addition, the driving circuit chip is an IPM (Intelligent Power Module), the heat sink is preferably attached to the back of the driving circuit chip.

Meanwhile, the heat sink according to the second embodiment of the present invention is:

A base disposed in contact with the driving circuit chip; And

It has a plurality of heat dissipation plates extending side by side from the base,

At least one of the heat dissipation plates includes a heat dissipation plate having a first extension part extending from the base part and a second extension part bent from and extending from the first extension part.

In this case, there are at least two heat dissipation plates including the first extension part and the second extension part, and the second extension part of the heat dissipation plate located at a portion generating high temperature heat of the driving circuit chip and the relative of the driving circuit chip. As a result, it is preferable that the second extension parts of the heat dissipation plate located at the site generating the low-temperature heat are disposed at the rear and the front with a predetermined interval, respectively.

Meanwhile, the display device according to the preferred embodiment of the present invention is:

A panel for implementing an image;

A chassis member disposed at the rear of the panel to support the panel;

A circuit unit installed at the rear of the chassis member and having at least one circuit board for mounting at least one driving circuit chip for driving the panel; And

And a heat sink having a base portion disposed to contact the driving circuit chip, and a plurality of heat dissipation plates extending from the base portion and having different extension lengths in proportion to the amount of heat generated in each portion of the driving circuit chip. .

In this case, at least a heat dissipation plate positioned at a portion where the high temperature of the driving circuit chip is generated may include: a first extension part extending substantially perpendicularly from the base part; And a second extension portion bent from the first extension portion.

On the other hand, the panel is preferably a plasma display panel that implements an image using plasma discharge.

Hereinafter, a heat sink and a display device having the same according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In this case, as shown in FIGS. 3 to 6, the heat sink 160 according to the preferred embodiment of the present invention may be generated from at least one driving circuit chip 155 that performs at least one function of the electric device. It functions to release heat to the outside. Here, the electric device means, for example, a device that performs a certain function according to an electrical signal from a driving circuit chip, such as a display device, a computer, an audio device, a video device, a PDA, and the like.

In this case, the heat sink 160 may be provided in the display apparatus 100. Therefore, hereinafter, the heat sink 160 provided in the display apparatus 100 will be described as an example.

As shown in FIG. 3, the display apparatus 100 according to an exemplary embodiment of the present invention includes a panel 110, a chassis member 140, and a circuit unit 150 together with a heat sink 160. .

The panel 110 is disposed so that two substrates face each other, thereby realizing an image. Various types of display panels may be used as the panel 110, and the panel 110 may include a front panel 120 and a rear panel 130, and may be a plasma display panel using plasma discharge. In this case, FIG. 4 illustrates an example of an AC plasma display panel having a surface discharge type 3-electrode structure among plasma display panels. However, the present invention is not limited thereto, and the display device including the driving circuit chip generating high heat belongs to the present invention.

Referring to FIG. 4, the panel 110 includes a front panel 120, a back panel 130 coupled to face the front panel 120, a partition wall 134, and a pair of sustain electrodes 122. And the address electrodes 132 and the phosphor layer 136.

In more detail, the front panel 120 is formed on the front substrate 121 disposed at the front and the rear surface of the front substrate 121, and the X electrode 123 and the Y electrode 124 for each discharge cell. Sustain electrode pairs 122 formed of a pair of?

The X electrode 123 and the Y electrode 124 constituting the sustain electrode pair 122 serve as a common electrode and a scan electrode, and are spaced apart from each other by a discharge gap. In this case, the X electrode 123 may include an X transparent electrode 123a and an X bus electrode 123b formed to be connected thereto. Likewise, the Y electrode 124 may also be connected to the Y transparent electrode 124a. It may be formed to have a Y bus electrode 124b formed to be

In addition, the rear panel 130 is disposed on the rear of the front substrate 121, the rear substrate 131 to form a discharge space 135 between the front substrate 121 and the rear substrate Address electrodes 132 are formed on the front surface of the substrate 131 and extend in a direction crossing the sustain electrode pairs 122. In this case, the phosphor layer 136 is formed in the discharge spaces 135.

In this case, the sustain electrode pairs 122 may be covered by the front dielectric layer 125. In this case, the passivation layer 126 may be formed on the rear surface of the front dielectric layer 125. In addition, the address electrodes 132 may be covered by the back dielectric layer 133. In this case, the partition wall 134 is formed on the back dielectric layer 133.

The panel 110 implementing the image in this structure is coupled to the chassis member 140 as shown in FIG. The chassis member 140 supports the panel 110 from the rear side. In this case, the panel 110 and the chassis member 140 are joined by an adhesive member 103, for example, a double-sided tape. In addition, a panel heat dissipation means 105 may be provided between the panel 110 and the chassis member 140 to transfer heat generated from the panel 110 to the chassis member 140.

The circuit unit 150 is disposed on the rear surface of the chassis member 140. The circuit unit 150 functions to drive the panel 110 and includes at least one circuit board 151 such as a logic board, a power board, and a logic buffer board. The circuit board 151 mounts at least one driving circuit chip 155 for driving the panel 110.

The circuit unit 150 may transmit an electrical signal to the panel 110 through the signal transmission member 170. The signal transmission member 170 may be a flexible circuit board such as a tape carrier package (TCP), a chip on film (COF), and the like, and in this case, the signal transmission members 170 may be formed on the wiring part 171 in a tape shape. At least one mounting element 172 may be mounted and packaged.

At least one driving circuit chip 155 is disposed on the rear surface of the circuit board 151 so as to be in contact with the heat sink 160. In this case, the heat sink 160 discharges heat generated from the driving circuit chip 155 to the outside.

The panel 110 and the chassis member 140 configured as described above may be accommodated by the case 180. The case 180 may include a front cabinet 181 installed in front of the panel 110, and It may be made of a back cover 182 installed at the rear of the chassis member 140.

Meanwhile, as illustrated in FIGS. 5 and 6, the heat sink 160 includes a base 161 and a plurality of heat dissipation plates 165. The base 161 is in contact with the driving circuit chip 155 to receive heat generated from the driving circuit chip 155. The heat dissipation plates 165 extend from the base 161 at a predetermined angle, and the heat dissipation plates 165 are spaced apart from each other.

In this case, the plurality of heat dissipation plates 165 may have different extension lengths according to the amount of heat generated in each portion of the driving circuit chip 155. That is, the extended length of the heat dissipation plate is long at the portion where the high heat amount is generated in the driving circuit chip 155, and the extended length of the heat dissipation plate is short at the portion where the low heat amount is generated in the driving circuit chip 155.

Typically, the driving circuit chip 155 has a lot of circuits are formed in the center and a lot of heat generated from these circuits. That is, high heat is generated in the center portion of the driving circuit chip 155, and relatively low heat is generated in the outer portion of the driving circuit chip 155. Therefore, in this case, the extension length of the heat dissipation plate 165_c positioned at the center of the driving circuit chip is long, and the extension length of the heat dissipation plate 165_e located at the outer portion of the driving circuit chip is shortened. In this case, the extension length of the heat dissipation plate may be gradually shortened from the central portion of the driving circuit chip 155 to the outer portion.

Thus, the heat dissipation amount at the portion where the high temperature heat is generated in the driving circuit chip 155 is larger than the heat dissipation amount at the portion where the relatively low temperature heat is generated in the driving circuit chip 155, thereby In the portion where the high temperature of the chip 155 occurs, the amount of heat emitted to the outside becomes sufficient. In addition, the extension length of the heat dissipation plate 165 is relatively short in the portion where the low temperature occurs in the driving circuit chip 155, and as a result, the heat sink 160 generates an appropriate amount of heat dissipation according to each portion of the driving circuit chip. Have.

On the other hand, when the length of the heat dissipation plate 165 is too long, other components adjacent thereto, in FIG. 6, interference with the case 180 occurs. Therefore, the length extending in one direction of the heat dissipation plate 165 needs to be equal to or less than a predetermined value so as not to cause interference with the adjacent parts. In this case, the heat sink 160 according to the embodiment of the present invention is at least a certain value so that the height does not interfere with adjacent parts such as, for example, the case 180, and at least so that the extended length has a sufficient amount of heat radiation It is desirable to have a shape that is curved once.

That is, at least one heat dissipation plate 165 in the heat sink 160 includes a first extension part 166 and a second extension part 167 that is bent at a predetermined angle from the first extension part 166. can do. In this case, the base portion 161 is attached to the rear surface of the driving circuit chip 155, the first extension portion 166 is formed to extend in the rear substantially perpendicular to the base portion 161, the second The extension part 167 may be formed to be bent at a predetermined angle from the first extension part 166.

In this case, the predetermined angle means an angle which does not cause interference with the component adjacent to the second extension part 167 and the case 180 in FIG. 6. For this purpose, for example, The first extension part 166 may be extended to a height where interference with an adjacent component does not occur, and the second extension part 167 may be disposed to be bent and extended substantially perpendicularly from the first extension part 166. In this case, the predetermined angle may mean 90 degrees. Thus, the heat dissipation plate 165 may be formed long enough without causing interference with components adjacent thereto.

On the other hand, as described above, when the outer portion is less heat generation than the center portion of the drive circuit chip 155, the central heat dissipation plate 165_c located in the relatively center portion of the drive circuit chip 155, the drive circuit It may be formed longer than the outer heat dissipation plate 165_e located at the relatively outer portion of the chip 155.

That is, the length of the first extension part 166_c of the central heat sink 165_c is longer than the first extension part 166_e of the outer heat sink 165_e, and the second length of the central heat sink 165_c is increased. The extension part 167_c may be disposed behind the second extension part 167_e of the outer heat dissipation plate 165_e. In this case, the second extension part 167_c of the central heat dissipation plate 165_c and the second extension part 167_e of the outer heat dissipation plate 165_e are arranged to be parallel to each other.

On the other hand, in the drawings, the heat dissipation plate 165 is shown to be disposed over the up and down, but is not limited to this, the heat dissipation plate 165 may be arranged to extend to the left or right or alternatively to have a constant angle with the vertical direction. have.

In this case, the driving circuit chip 155 in contact with the heat sink 160 may be an intelligent power module (IPM). This IPM consists of a switching element, a driving circuit, and a basic protection circuit as a single module. The IPM is a highly integrated driving circuit chip that operates only on a power supply and a signal, without additional components. Therefore, the IPM generates more heat than a normal driving circuit chip due to the integration, and the heat sink is preferably disposed to be in contact with the rear surface of the IPM in order to smoothly discharge the heat to the outside.

Unlike this, although not shown in the drawing, the driving circuit chip 155 may be a large power switching element such as a field emission transistor (FET). In this case, a plurality of driving circuit chips may be attached to the base 161. .

Meanwhile, a heat conductive member 157 may be interposed between the driving circuit chip 155 and the heat sink 160. The heat transfer member 157 smoothly transfers heat generated from the driving circuit chip to a heat sink. The heat transfer member 157 preferably has a high heat transfer coefficient and elasticity. A heat conductive sheet, a thermal grease, or the like may be used. have.

According to the present invention having the above configuration, the extension length of the heat dissipation plate provided in the heat sink varies depending on the amount of heat generated in each portion of the driving circuit chip, so that heat can be sufficiently discharged to the outside according to the amount of heat generated. As a result, the reliability of the driving circuit chip and the reliability of the display device are increased, and the driving circuit chip is not deteriorated due to at least high heat, thereby extending its lifespan.

In addition, by allowing the heat dissipation plate to be bent at least once, the heat dissipation area is increased and at the same time, no interference with other adjacent parts occurs.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. will be. Therefore, the true technical protection scope of the present invention will be defined by the matter described in the appended claims.

Claims (19)

It has a function of dissipating heat generated from at least one driving circuit chip to perform at least one function of the electrical device to the outside, A base disposed in contact with the driving circuit chip; And And a plurality of heat dissipation plates extending from the base and having a different extension length in proportion to the amount of heat generated in each portion of the driving circuit chip. The method of claim 1, The highest heat is generated in the center portion of the drive circuit chip, The heat sink is characterized in that the extension length of the heat dissipation plate located in the center portion of the drive circuit chip of the heat dissipation plate is the longest, the extension length is smaller as the heat dissipation plate located on the outer portion of the drive circuit chip. The method of claim 2, At least the heat dissipation plate located at the center of the driving circuit chip is: A first extension extending substantially perpendicularly from said base; And And a second extension bent to an outer portion of the heat dissipation circuit chip at substantially right angles from the first extension. The method of claim 3, wherein At least two heat dissipation plates including the first extension part and the second extension part, The second extension portion of the central heat dissipation plate positioned at the relatively center portion of the driving circuit chip is the second extension portion of the outer heat dissipation plate at the rear of the second extension portion of the outer heat dissipation plate located at the relatively outer portion of the driving circuit chip. Heat sink, characterized in that arranged side by side at a predetermined interval. The method of claim 1, And a heat conduction member interposed between the driving circuit chip and the heat sink so that heat generated from the driving circuit chip can be smoothly transferred to the base portion. The method of claim 1, The driving circuit chip is an IPM (Intelligent Power Module), the heat sink is a heat sink, characterized in that attached to the back of the driving circuit chip. As dissipating heat generated from at least one driving circuit chip that performs at least one function of the electrical device, A base disposed in contact with the driving circuit chip; And It has a plurality of heat dissipation plates extending side by side from the base, At least one of the heat dissipation plates includes a heat dissipation plate including a first extension part extending from the base part and a second extension part bent from the first extension part and extended. The method of claim 7, wherein At least two heat dissipation plates including the first extension part and the second extension part, The second extension part of the high temperature heat dissipation plate positioned at the site of generating high temperature heat of the driving circuit chip is located at the rear of the second extension part of the low temperature heat dissipation plate located at the site of generating relatively low temperature heat of the driving circuit chip. And a second extension portion of the low temperature heat dissipation plate, arranged side by side with a predetermined distance. The method of claim 8, The length of the first extension portion of the heat dissipation plate is shorter at the outer portion of the driving circuit chip than the center portion of the driving circuit chip, The second extension portion of the central heat dissipation plate positioned at the relatively center portion of the driving circuit chip is the second extension portion of the outer heat dissipation plate at the rear of the second extension portion of the outer heat dissipation plate located at the relatively outer portion of the driving circuit chip. Heat sink, characterized in that arranged side by side at a predetermined interval. The method of claim 7, wherein And a heat conducting member interposed between the driving circuit chip and the heat sink so that heat generated from the driving circuit chip can be smoothly discharged through the heat sink. The method of claim 7, wherein The driving circuit chip is an IPM (Intelligent Power Module), the heat sink is a heat sink, characterized in that attached to the back of the driving circuit chip. A panel for implementing an image; A chassis member disposed at the rear of the panel to support the panel; A circuit unit installed at the rear of the chassis member and having at least one circuit board for mounting at least one driving circuit chip for driving the panel; And A heat sink having a base portion disposed in contact with the driving circuit chip, and a plurality of heat dissipation plates extending from the base portion and having different extension lengths in proportion to the amount of heat generated in each portion of the driving circuit chip. Display device, characterized in that. The method of claim 12, The heat dissipation plate located at a portion where the high temperature of the driving circuit chip is generated: A first extension extending substantially perpendicularly from said base; And And a second extension portion bent from the first extension portion. The method of claim 12, The extended length of the heat dissipation plate located in the center portion of the drive circuit chip of the heat dissipation plate is the longest, the display device, characterized in that the extension length is smaller as the heat dissipation plate located on the outer portion of the drive circuit chip. The method of claim 14, The at least two heat dissipation plates; A first extension extending substantially perpendicularly from said base; And a second extension bent from the first extension, The second extension portion of the central heat dissipation plate positioned at the relatively center portion of the driving circuit chip is the second extension portion of the outer heat dissipation plate at the rear of the second extension portion of the outer heat dissipation plate located at the relatively outer portion of the driving circuit chip. Display apparatus, characterized in that arranged side by side at a predetermined interval. The method according to claim 13 or 15, Further comprising a case covering the panel and the chassis member, And the second extension portion of the heat dissipation plate is bent and extended from the first extension portion at an angle where interference with the case does not occur. The method of claim 12, And a heat conduction member interposed between the driving circuit chip and the heat sink so that heat generated from the driving circuit chip can be smoothly discharged through the heat sink. The method of claim 12, The driving circuit chip is an IPM (Intelligent Power Module) display device. The method of claim 12, The panel is a display device, characterized in that the plasma display panel for implementing an image using the plasma discharge.

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