KR20070093710A - Heat sink and flat panel display apparatus comprising the same - Google Patents

Abstract

A heat sink and a flat panel display apparatus comprising the same are provided to radiate heat smoothly generated from heat-radiating elements by installing a display device pivoted in a lateral direction or a longitudinal direction. A heat sink includes a base part and a plurality of radiating fins. The base part faces a surface of a heat-radiating element(155) including a driving circuit chip to drive a panel(110) for displaying images. The radiating fins are protruded from the base part to a direction opposite to a heat-radiating element direction. The heat-radiating fins are formed in a vertical direction. Openings of adjacent radiating fins are formed to be crossed each other. In the adjacent heat-radiating fins, the openings correspond to each other. The heat-radiating element is formed with IPM(Intelligent Power Module).

Description

Heat sink and flat panel display apparatus comprising the same

1 is a view schematically showing a flat panel display device having a conventional heat sink.

FIG. 2 is a diagram illustrating a state in which the flat panel display device illustrated in FIG. 1 is used in a pivot form rotated in a vertical direction.

FIG. 3 is a diagram schematically illustrating a moving direction of air in a heat sink of the flat panel display device illustrated in FIG. 2.

4 is a diagram schematically illustrating a flat panel display device having a heat sink according to an embodiment of the present invention.

FIG. 5 is a partially cutaway exploded perspective view illustrating a panel of the flat panel display device illustrated in FIG. 4.

FIG. 6 is a diagram illustrating a heat sink of the flat panel display shown in FIG. 4.

FIG. 7 is a diagram schematically illustrating a moving direction of air passing through the heat sink illustrated in FIG. 6.

8 is a diagram illustrating a heat sink according to another embodiment of the present invention.

Brief description of symbols for the main parts of the drawings

110: panel 140: chassis

150: circuit portion 151: circuit board

155: heat generating element 160, 260: heat sink

161: base 165, 265: heat dissipation fin

165h, 265h: opening

The present invention relates to a heat sink and a flat panel display device having the same, and more particularly, to a heat sink having a structure for smoothly dissipating heat generated from a heating element to the outside, even when the flat panel display device is installed in either a horizontal or vertical direction. A sink and a flat panel display device having the same.

Recently, flat panel display devices have been actively developed. Such flat panel display apparatuses include liquid crystal displays, plasma display apparatuses, field emission display devices, vacuum fluorescent display devices, and the like.

Among them, a plasma display panel is formed by discharging a discharge gas between two substrates on which a plurality of electrodes are formed, and then applying a discharge voltage between electrodes extending long across the substrates, thereby generating a discharge voltage. The phosphor formed in a predetermined pattern by the ultraviolet rays is excited to obtain a desired image.

At this time, the voltage applied to the electrode is controlled in response to an image signal received from the outside, for this purpose, the driving circuit chip for driving the plasma display device on the circuit board to control a large amount of the image signal for a moment. As a result, a large load is generated on the driving circuit chip, and as a result, a lot of heat is generated. In particular, an intelligent power module (IPM) may be used as a heating element including a driving circuit chip in a plasma display device. When the IPM is used, more heat is generated than an ordinary driving circuit chip due to the integration. Done.

1 is a view schematically showing a plasma display device having a conventional heat sink 11. Referring to the drawing, the plasma display apparatus 10 includes a heat sink 11. The base portion (not shown) of the heat sink 11 is adhered to the rear surface of a drive circuit chip (not shown) such as an IPM mounted on the circuit board 12 by an adhesive member (not shown). The heat dissipation fins 11a of the heat sink are formed vertically in the vertical direction to face each other.

The heat generated from the heat generating element moves through the base of the heat sink 11 and the heat dissipation fin 11a by the conduction phenomenon, thereby raising the temperature of the heat sink 11 and dissipating the heat dissipation fin 11a which is the end of the heat sink. ) Emits heat into the air due to radiation and the surrounding air becomes hot. Due to the convection phenomenon, the surrounding cold air flows into the heat dissipation fin 11a of the heat sink 11, and the hot air rises upward to fly away, whereby cooling occurs in the heat sink 11 and the driving circuit chip.

However, as shown in FIG. 2, the plasma display apparatus 10 is often used in the form of a pivot rotated in the vertical direction. In the case of the display apparatus 10 having the conventional heat sink 11, the heat sinks 11 are arranged as shown in FIG. 3. Referring to the drawings, the heat dissipation fins 11a are formed horizontally to face each other. Therefore, the surrounding cold air A is not evenly contacted with the heat dissipation fins 11a and exits to both sides as shown in FIG. 3, thereby preventing the above cooling effect. As a result, there is a problem that may cause damage to the components due to overheating.

SUMMARY OF THE INVENTION An object of the present invention is to provide a heat sink capable of smoothly cooling heat generated by a heating element even when the flat panel display device is pivoted in a vertical direction, and a flat panel display device having the same.

The present invention provides a light emitting device, comprising: a base portion facing a surface of a heating element including a driving circuit chip for driving a panel for implementing an image; And a heat sink including a plurality of heat dissipation fins protruding from the base in a direction opposite to the side where the heat generating element is, and having at least one opening.

In addition, according to another aspect of the present invention, there is provided a display device comprising: a panel displaying an image; A chassis disposed on one side of the panel and supporting the panel; A circuit unit installed on a surface of the chassis opposite to the side of the panel and including at least one circuit board on which a heating element including at least one driving circuit chip for driving the panel is disposed; And a heat sink having a base facing the surface of the heat generating element including the driving circuit chip, and a plurality of heat dissipation fins protruding from the base in a direction opposite to the side of the heat generating element and having at least one opening. A flat panel display device is disclosed.

The heat dissipation fins may be vertically formed vertically. In this case, the openings formed in the heat dissipation fins of one row of the heat sink and the heat dissipation fins of the other row adjacent to the one row may be formed to be staggered or substantially in a straight line.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 4 is a view schematically showing a flat panel display device having a heat sink according to an embodiment of the present invention, and FIG. 5 is a partially cutaway perspective view illustrating a panel of the flat panel display device shown in FIG. 4. 6 is a diagram illustrating a heat sink of the flat panel display device illustrated in FIG. 4, and FIG. 7 is a diagram schematically illustrating a moving direction of air passing through the heat sink illustrated in FIG. 6.

The flat panel display device according to the embodiment shown in Figs. 4 to 7 is a plasma display device. The plasma display apparatus includes a panel 110, a chassis 140, a circuit unit, and a heat sink.

The panel 110 illustrated in FIG. 5 includes a front panel 120, a back panel 130 that is coupled to face the front panel 120, a partition wall 134, sustain electrode pairs 122, Address electrodes 132 and the phosphor layer 136.

The front panel 120 is formed on the front substrate 121 disposed at the front and the rear surface of the front substrate 121, and a pair of sustain electrodes each formed of a pair of X electrode 123 and Y electrode 124 for each discharge cell. And 122. The X electrode 123 and the Y electrode 124 constituting the sustain electrode pair 122 serve as a common electrode and a scan electrode, and are spaced apart from each other by a discharge gap. The X electrode 123 may include an X transparent electrode 123a and an X bus electrode 123b formed to be connected thereto. Likewise, the Y electrode 124 may also be connected to the Y transparent electrode 124a. It may be formed to have a formed Y bus electrode 124b.

In addition, the rear panel 130 is disposed on the rear of the front substrate 121, the rear substrate 131 to form a discharge space 135 between the front substrate 121 and the rear substrate, Address electrodes 132 are formed on the front surface of the substrate 131 and extend in a direction crossing the sustain electrode pairs 122. In this case, the phosphor layer 136 is formed in the discharge spaces 135.

The sustain electrode pairs 122 may be covered by the front dielectric layer 125. In this case, the passivation layer 126 may be formed on the rear surface of the front dielectric layer 125. In addition, the address electrodes 132 may be covered by the rear dielectric layer 133. In this case, the partition wall 134 is formed on the rear dielectric layer 133.

The panel described above is an AC plasma display panel having a surface discharge type three electrode structure. However, the present invention is not limited thereto, and any panel of the flat panel display device including the circuit unit in which the circuit element with high heat generation is provided may belong to the present invention.

The chassis 140 is coupled to the rear surface of the panel 110 to implement an image to support the panel 110. The circuit board 151 mounts a heating element 155 including at least one driving circuit chip for driving the panel 110. In this case, the heat sink 160 is disposed to be in contact with the rear surface of the heat generating element 155 to function to discharge heat generated from the heat generating element 155 to the outside. Here, the plurality of circuit boards 151 constitute the circuit unit 150.

The panel 110 and the chassis 140 are joined by an adhesive member 103, for example double-sided tape. A panel heat dissipation means 105 may be provided between the panel 110 and the chassis 140 to transfer heat generated from the panel 110 to the chassis 140. The circuit unit 150 is disposed on the rear surface of the chassis 140. The circuit unit 150 may include a plurality of circuit boards 151, such as a driving circuit board, a logic board, a power board, and a logic buffer board. It functions to drive 110.

The heat generating element 155 including the driving circuit chip is mounted on the circuit board 151, and the rear surface of the heat generating element 155 is disposed to be in contact with the heat sink 160. In this case, the heat generating element 155 in contact with the heat sink 160 may be an intelligent power module (IPM) element or an insulating field effect transistor (MOSFET). The IPM device is made of a switching device, a device driving circuit, and a basic protection circuit as a single module. The IPM device is a highly integrated heating device that operates according to a signal by only supplying power and providing a signal without additional components. Therefore, the IPM element generates more heat than the normal heating element due to the integration, and the heat sink 160 is disposed to contact the rear surface of the IPM in order to discharge the heat to the outside smoothly. desirable.

In this case, the heat sink 160 includes a base 161 (see FIG. 6) and heat dissipation fins 165 (see FIG. 6). The base 161 is in contact with the heat generating element 155 including the driving circuit chip. The heat transfer member 163 may be interposed between the heat generating element 155 and the heat sink 160. The heat transfer member 163 smoothly transfers heat generated from the heat generating element to the heat sink. The heat transfer member 163 preferably has a high heat transfer coefficient and elasticity. A heat conductive sheet, a thermal grease, or the like may be used. Thus, the base 161 receives heat generated from the heat generating element 155 by conduction.

The heat dissipation fins 165 protrude rearward from the base 161. When the plasma display apparatus is installed in the horizontal direction, the heat dissipation fins 165 are vertically formed to face each other. At least one opening 165h is formed in each of the heat dissipation fins 165. However, the heat dissipation fins 165 are not necessarily formed in vertical rows in the vertical direction, and may be irregularly formed. In this case, the direction toward each of the heat dissipation fins 165 may be a vertical direction.

The circuit unit 150 transmits an electrical signal to the panel 110 through the signal transmission member 170. The signal transmission member 170 may be a flexible circuit board such as a tape carrier package (TCP), a chip on film (COF), and the like, and in this case, the signal transmission members 170 may be formed on at least one of the tape-shaped wiring portions 171. One mounting element 172 may be mounted and packaged.

Hereinafter, a process of cooling the heat generating element 155 by the heat sink 160 disposed to contact the rear surface of the heat generating element 155 will be described in detail.

The circuit board 151 is disposed at the rear of the chassis 140, and the heat generating element 155 is disposed at a predetermined interval behind the circuit board 151. In this case, the heat sink 160 is disposed in a direction opposite to the circuit board 151 of the heat generating element 155, that is, the rear surface of the heat generating element 155. In addition, a heat transfer member 163 may be interposed between the heat generating element 155 and the heat sink 160. The heat sink 160 serves to allow heat generated from the heat generating element 155 to escape to the outside.

That is, the base 161 of the heat sink is disposed to be in direct contact with the rear surface of the heat generating element 155 or indirectly through the heat transfer member 163 to receive heat generated by the heat generating element 155 and conducted. Conductive heat is transferred to the heat sink fins 165 of the heat sink. The heat dissipation fins 165 are formed in plural so as to have a large area in contact with the air. The heat radiation fins 165 are discharged to the outside by radiation and the surrounding air becomes a high temperature. Due to convection, the surrounding cold air (A) flows around the heat dissipation fin 165 of the heat sink, and the hot air is raised upward and blown away to cool the heat sink 160 and the heat generating element 155. This happens.

When the plasma display device according to the present embodiment is used in a pivoted form, the plasma display device 100 is installed in the vertical direction. When the plasma display apparatus 100 is installed in the vertical direction, the heat sinks 160 are disposed adjacent to each other in the horizontal direction as shown in FIG. 7. One or more openings 165h are formed in each of the heat dissipation fins 165 of the heat sink. The shape of the opening 165h may not only be rectangular as shown in FIG. 6, but various modifications may be made, such as a circular or elliptical groove or a triangle.

The openings 165h formed in the first heat dissipation fin 165a and the openings formed in the second heat dissipation fin 165b are staggered from each other. Similarly, the openings formed in the second heat dissipation fin 165b and the openings formed in the third heat dissipation fin 165c are staggered from each other. As such, the openings 165h formed in one of the heat dissipation fins and the openings formed in the heat dissipation fins adjacent to the one of the heat dissipation fins are staggered from each other. Therefore, as shown in FIG. 7, the sixth heat dissipation fin 165f, the fifth heat dissipation fin 165e, the fourth heat dissipation fin 165d, and the third heat dissipation in which cold air at the lower portion of the lower portion is caused by convection. The heat sink 160 is cooled while sequentially passing through the fin 165c, the second heat dissipation fin 165b, and the first heat dissipation fin 165a.

On the other hand, if the conventional plasma display device 10 shown in Figs. 1 to 3 is installed in the vertical direction, the heat dissipation fins 11a of the heat sink 11 extend horizontally and thus vertically move air ( Interfere with the flow of A) heat radiation did not occur smoothly.

8 illustrates a heat sink in accordance with another embodiment of the present invention. The heat sink according to the embodiment shown in FIG. 8 has a different shape from the heat sink of the plasma display device according to the embodiment shown in FIGS. 4 to 7.

In the heat sink 260 illustrated in FIG. 8, the openings 265h formed in the first heat dissipation fin 265a and the openings formed in the second heat dissipation fin 265b are located almost in a straight line. The openings 265h formed in the third to sixth heat dissipation fins 265c, 265d, 265e, and 265f are also aligned with each other.

In the plasma display apparatus 100 including the heat sinks 160 and 260 having the above-described configuration, the cold air A that is underneath is heated not only when it is installed and used in the horizontal direction but also when it is used while being pivoted in the vertical direction. The heat generating elements 155 may be cooled by cooling the heat radiating fins 165 and 265 while passing through the heat radiating fins 165 and 265 of the sinks 160 and 260. That is, even when the plasma display apparatus 100 is installed in any direction, the plasma display apparatus 100 is suitable for performing heat dissipation of the heat sinks 160 and 260.

The number and opening area of the openings 165h and 265h of the heat sinks 160 and 260 may be appropriately determined in consideration of the reduction in heat dissipation area when the openings 165h and 265h are formed and the heat dissipation increase in the pivot form.

In the above description, two heat sinks 160 and 260 are installed on each circuit board 151, but one or three heat sinks 160 and 260 are installed on each circuit board 151. Of course it can be.

Further, although the above embodiments relate to a plasma display device, the present invention can be applied to other flat panel display devices such as liquid crystal display devices, field emission display devices, vacuum fluorescent devices, and the like.

The heat sink of the present invention and the flat panel display device having the same have an effect of smoothly dissipating heat generated by the heating element when the display device is installed and used in a horizontal or vertically pivoted form.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (11)

A base portion facing the surface of the heat generating element including a driving circuit chip for driving a panel for implementing an image; And And a plurality of heat dissipation fins protruding from the base in a direction opposite to the side of the heat generating element and having at least one opening. According to claim 1, The heat dissipation fins are vertically formed vertically up and down. According to claim 1, And at least one opening of each of the radiating fins adjacent to each other is staggered from each other. According to claim 1, And at least one opening of each of the heat radiating fins adjacent to each other is formed to correspond to each other. The method according to any one of claims 1 to 4, The heat generating element is an heat sink of the IPM (intelligent power module) element. A panel displaying an image; A chassis disposed on one side of the panel and supporting the panel; A circuit unit installed on a surface of the chassis opposite to the side of the panel, the circuit unit including at least one circuit board on which a heating element including at least one driving circuit chip for driving the panel is disposed; And And a heat sink having a base facing the surface of the heat generating element including the driving circuit chip, and a plurality of heat dissipation fins protruding from the base in a direction opposite to the side of the heat generating element and having at least one opening. Flat panel display device. The method of claim 6, The heat dissipation fins are vertically formed vertically vertical display device. The method of claim 6, And at least one opening of each of the heat dissipation fins adjacent to each other is staggered from each other. The method of claim 6, And at least one opening of each of the radiating fins adjacent to each other is formed to correspond to each other. The method of claim 6, And a heat transfer member disposed between the heat generating element and the heat sink. The method according to any one of claims 6 to 10, The heating device is a flat panel display device is an IPM (intelligent power module) device.

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