KR20060098460A - Plasma display apparatus - Google Patents

Abstract

SUMMARY OF THE INVENTION The present invention aims to provide a plasma display device in which temperature unbalance between signal transmission means is reduced and heat dissipation is improved. To achieve this object, the present invention provides a plasma display for displaying an image using gas discharge. A display panel, a chassis supporting the plasma display panel, a circuit unit disposed on one side of the chassis, the circuit unit generating an electrical signal for driving the plasma display panel, and transmitting an electrical signal from the circuit unit to the plasma display panel. At least one electronic element, each of which is disposed across the signal transmission means to transfer heat generated from the signal transmission means and the plurality of signal transmission means spaced apart from each other at predetermined intervals. plasma display device having a heat pipe To provide.

Description

Plasma display apparatus

1 is an exploded perspective view illustrating a plasma display device according to a first embodiment of the present invention.

FIG. 2 is a partially cutaway perspective view illustrating an example of the plasma display panel illustrated in FIG. 1.

FIG. 3 is a block diagram illustrating driving of a circuit unit shown in FIG. 1.

FIG. 4 is an enlarged separated perspective view for explaining a heat dissipation structure of the TCP illustrated in FIG. 1.

FIG. 5 is a cross-sectional view taken along the line VV of FIG. 4.

6 is a cross-sectional view corresponding to FIG. 5 as a modification of the embodiment shown in FIG. 1.

7 is an exploded perspective view illustrating a plasma display device according to a second embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100, 400: plasma display device

110: plasma display panel 140: chassis

150: circuit portion 170: TCP

172: electronic device 180: cover member

183: groove 190: heat conductive medium

200, 300: heat pipe 310, 320: heat sink

330, 340: Fan

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to a plasma display device in which temperature imbalance between signal transmission means is reduced and heat dissipation is improved.

Plasma display device is a flat panel display device that realizes images by using gas discharge phenomenon. It has large screen, high quality, ultra thin, light weight and wide viewing angle, and it is simpler to manufacture than other flat panel display devices. Due to its ease of size, it has recently been in the spotlight as a large flat panel display.

Typically, such a plasma display apparatus includes a plasma display panel, a chassis disposed substantially parallel to the plasma display panel, a circuit unit mounted at a rear of the chassis to drive the plasma display panel, the plasma display panel, the chassis. And a case accommodating the circuit portion.

In the plasma display apparatus as described above, the circuit unit and the plasma display panel are electrically connected by signal transmission means such as a tape carrier package (TCP) or a chip on film (COF). TCP is a package formed by mounting an element such as a driving IC in a tape form, and COF is an element mounted on a film constituting a flexible printed circuit (FPC). Such TCP and COF are widely used because they have flexibility and can reduce the size of a circuit part because many electronic devices can be mounted.

By the way, in the above TCP or COF, a lot of heat is generated from the electronic elements mounted on them when the plasma display panel is driven. However, when such heat is not smoothly discharged, the electronic devices are malfunctioned. Therefore, a problem occurs in the image display of the plasma display panel. In addition, this problem is that heat is concentrated in electronic elements of some TCP or COF, so that local thermal imbalance may occur. In order to solve this problem, a technique for limiting the heat dissipation amount of the electronic device, or by arranging a separate heat dissipation member has been studied. In particular, the former method applies an image algorithm that reduces heat dissipation of the electronic device. However, since this method causes a deterioration of image quality, it is not suitable for a structure in which heat generation of electronic devices is high, such as a high definition (HD) single scan method. In addition, a technique using a separate heat dissipation member such as an aluminum plate also has a problem in that the heat dissipation capacity is limited.

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma display device which solves the above problems and reduces the temperature imbalance between the signal transmission means and improves the heat dissipation function.

In order to achieve the above and other objects, the present invention provides a plasma display panel for displaying an image using gas discharge, a chassis for supporting the plasma display panel, and disposed on one side of the chassis, wherein the plasma A circuit unit for generating an electrical signal for driving a display panel, and a plurality of signal transmission means for transmitting an electrical signal from the circuit unit to the plasma display panel, each of which is provided with at least one electronic element, spaced at a predetermined interval from each other And a heat pipe disposed across the signal transmitting means so as to transfer heat generated from the signal transmitting means.

In the present invention, the heat pipe is preferably fixed to the chassis portion facing the signal transmitting means.

In addition, in the present invention, further comprising a cover member disposed to cover the electronic elements, the heat pipe may be fixed to the cover member facing the signal transmission means.

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the embodiments of the present invention below, the same reference numerals are used for the same members.

(First embodiment)

1 shows a plasma display device according to an embodiment of the present invention. Referring to FIG. 1, a plasma display panel 110 in which an image is implemented by gas discharge is illustrated in the plasma display apparatus 100. Various types of plasma display panels may be adopted as the plasma display panel 110. As an example, an alternating current plasma display panel having a surface discharge type three electrode structure as shown in FIG. 3 may be selected.

Referring to FIG. 2, the plasma display panel 110 includes a front panel 120 and a rear panel 130 that is coupled to face the front panel 120. The front panel 120 includes a front substrate 121 disposed at the front side, sustain electrode pairs 122 formed on a rear surface of the front substrate 121, and having an X electrode 123 and a Y electrode 124, respectively. And a front dielectric layer 125 formed to cover the sustain electrode pairs 122, and a passivation layer 126 formed on a rear surface of the front dielectric layer 125. The X electrode 123 and the Y electrode 124 serve as a common electrode and a scan electrode, respectively, and are spaced apart from each other by a discharge gap. The X electrode 123 includes an X transparent electrode 123a and an X bus electrode 123b formed to be connected thereto. Similarly, the Y electrode 124 is also formed to be connected to the Y transparent electrode 124a. The Y bus electrode 124b is provided.

The rear panel 130 includes a rear substrate 131 disposed at a rear side, address electrodes 132 formed on a front surface of the rear substrate 131 and extending in a direction crossing the sustain electrode pairs 122, and an address. A back dielectric layer 133 formed to cover the electrodes 132, barrier ribs 134 formed on the back dielectric layer 133 to define discharge cells 135, and a phosphor layer disposed in the discharge cells 135. 136 and a discharge gas filled in the discharge cells 135.

The chassis 140, which may be manufactured by casting, pressing, or the like, supports the plasma display panel 110 and the circuit unit 150. The chassis 140 may be formed using a metal having high thermal conductivity, such as aluminum, in order to effectively discharge heat transferred from the plasma display panel 110 to the outside. In addition, the chassis 140 preferably has a structure in which an edge of the chassis 140 is bent backward so that bending, bending, or deformation may be prevented. The plasma display panel 110 and the chassis 140 are adhered to each other using the double-sided tape 141.

A thermal conductive sheet 142 having a high thermal conductivity is interposed between the plasma display panel 110 and the chassis 140 to dissipate heat generated locally in the plasma display panel 110 and to be generated in the plasma display panel 110. Part of the heat is transferred to the chassis 140. Here, the heat conductive sheet 142 may be used, such as silicon glass, silicon heat dissipation sheet, acrylic heat dissipation pressure-sensitive adhesive sheet, urethane heat dissipation pressure-sensitive adhesive sheet, carbon sheet.

In addition, a circuit unit 150 is installed at the rear of the chassis 140, and the circuit unit 150 includes a plurality of electronic components. The circuit unit 150 drives the plasma display panel 110. As shown in FIG. 4, the circuit unit 150 includes an image processor 151, a logic controller 152, an address driver 153, and an X driver ( 154, a Y driver 155, a power supply unit 156, and the like. The image processor 151 converts an external analog image signal into a digital signal to generate internal image signals, for example, 8-bit red, green and blue image data, clock signals, and vertical and horizontal synchronization signals. The logic controller 152 generates driving control signals S _A , S _Y , and S _X according to an internal image signal from the image processor 151. The address driver 153 generates the display data signal by processing the address signal S _A among the driving control signals S _A , S _Y , and S _X from the logic controller 152, and generates the display data signal. Is applied to the address electrodes 132. The X driver 154 processes the X driving control signal S _X from the driving control signals S _A , S _Y , and S _X from the logic controller 152 and applies the X driving control signal S _X to the X electrodes 123. The Y driver 155 processes the Y driving control signal S _Y from the driving control signals S _A , S _Y , and S _X from the logic controller 152 and applies the Y driving control signal S _Y to the Y electrodes 124. In addition, the power supply unit 156 may operate on the image processing unit 151 and the logic control unit 152, and may require operations on the address driver 153, the X driver 154, and the Y driver 155. Generate and supply a voltage.

Meanwhile, the circuit unit 150 transmits an electrical signal to the plasma display panel 110 by signal transmission means. As a signal transmission means, a flexible printed cable (FPC), a tape carrier package (TCP), a chip on film (COF), or the like may be selected and used. According to the present exemplary embodiment, the FPCs 160 are disposed on the left and right sides of the chassis 140 as signal transmitting means, and at least one of the wiring units 171 in the tape form is provided on the lower side of the chassis 140 as the signal transmitting means. TCP 170 on which the electronic device 172 is mounted is arranged. And, as shown in Figure 1, TCP 170 are arranged spaced apart at a predetermined interval on the lower side of the chassis 140, respectively.

In the present embodiment, the circuit unit 150 is formed so that the plasma display panel 110 can be driven by a high definition single scan (HD) single scan method, and the TCPs 170 are the addresses of the circuit unit 150. The electrical signal generated from the driver 153 is transmitted to the address electrodes 132. That is, the wiring parts 171 of the TCP 170 are connected to the address electrodes 132 provided in the plasma display panel 110 via the lower edge of the chassis 140, and the other ends thereof. Is connected to the address driver 153 of the circuit unit 150. In addition, two electronic devices 172 such as an address driving IC are mounted on the wiring units 171 of the TCP 170, and the electronic devices 172 are disposed at the rear edge of the chassis 140. .

The elements 172 of the TCP 170 arranged as described above are covered by the cover members 180. In the present embodiment, the cover members 180 are disposed one-to-one corresponding to each TCP 170, but the present invention is not limited thereto, and one cover member may be commonly covered for each of the plurality of TCP 170. All TCPs 170 may be covered by one cover member. The cover members 180 protect the electronic devices 172 and perform a heat dissipation function of the electronic devices 172.

4 and 5, the electronic elements 172 covered by the cover member 180 are arranged to protrude from the wiring unit 171 toward the cover member 180, respectively. Groove portions 183 are formed on the cover member 180 facing the fields so that the protruding electronic elements 172 may be accommodated and protected, respectively. Here, the grooves 183 are formed in a shape in which their inner surfaces are closed, respectively, and are formed in such a size that an interval between the inner surface of the groove 183 and the outer surface of the electronic device 172 can be maintained at a predetermined interval. It is. However, the shape of the groove is not limited to that shown, and may be formed in a structure in which two electronic devices may be accommodated together.

A heat conducting medium 190 is disposed between the electronic device 172 and the groove 183 to quickly transfer heat generated from the electronic device 172 to the cover member 180 and prevent damage of the electronic device. That is, the liquid or gel-type thermal conductive medium 190 is disposed between the protruding outer surface of the electronic device 172 and the inner surface of the groove 183. Grease may be used as an example of the thermal conductive medium 190. The grease is prepared by adding a metal soap and a small amount of water to a liquid mineral oil-based oil and mixing the mixture in a colloidal state. It has a predetermined viscosity. Grease may include synthetic oils such as silicone oils instead of mineral oils.

The liquid or gel-type thermal conductive medium 190 as described above may be completely filled between the groove 183 and the electronic device 172, so that the heat generated from the electronic device 172 may pass through the thermal conductive medium 190. It is transmitted to the cover member 180. On the other hand, the viscosity of the heat conducting medium 190 in a general situation where the plasma display apparatus 100 is used vertically, it is preferable that the heat conducting medium 190 does not flow out of the groove portion 183 by gravity. .

The coupling structure between the TCP 170 and the chassis 140 is as follows. Two through holes 107a are formed in the TCP 170. Each through hole 170a is symmetrically formed on the side surfaces of the two electronic elements 172. In addition, through holes 180a are formed in the cover member 180 covering the electronic elements 172 of the TCP 170. The through holes 170a and 180a formed in the TCP 170 and the cover member 180 are coaxial. In addition, bosses 145 are disposed on the chassis facing the through holes 170a of the TCP 170. Since the bosses 145 are threaded on the inner surface and have a predetermined length, the bosses 145 support the TCP 170 spaced apart by a predetermined height on the chassis 140. Thus, by screwing the screws 195 inserted into the through holes 170a and 180a with the bosses 145, the TCP 170 and the protection member 180 are integrally coupled to the chassis 140.

1 and 5, the heat pipe 200 is arranged to extend across the TCP 170. In this embodiment, the heat pipe 170 is fixed to the cover members 180. The heat pipe 200 may be fixed to the cover members 180 by various methods. For example, the heat pipe 200 may be fixed by using a thermally conductive adhesive, brazing or welding. However, the arrangement position of the heat pipe is not limited to the above, and as shown in FIG. 6, it may be disposed on the chassis 140 facing the TCP 170. However, the heat pipes 200 may be disposed to be adjacent to the TCPs 170 so that heat generated by the TCPs 170 may be effectively transferred.

The heat pipe 200 is closed at both ends and filled with a working fluid 200c therein, and is installed inside the outer pipe 200a and the working fluid 200c on the condensation side of the heat pipe. It has a wick (200b) for moving to the evaporator side through the capillary phenomenon. The wick 200b is formed in a mesh structure. In addition, the working fluid 200c used in the heat pipe 200 uses methanol or distilled water, which is a liquid easily vaporized at room temperature. Looking at the principle of operation, the working fluid 200c vaporized in the evaporator relatively in contact with the high temperature portion absorbs a large amount of energy in accordance with the phase change. The vaporized working fluid 200c is moved to the inside of the wick 200b and is rapidly moved toward the condensation part, which is a relatively low temperature part, by convection. The steam reaching the condensate is liquefied again through heat transfer and exits out of the wick 200b. The escaped working fluid 200c is moved back to the evaporator by convection and capillary action. The heat pipe 200 has a thermal conductivity of approximately 10000 W / mK or more, which is a thermal conductivity performance of 2,000 times that of copper. Also, in the present embodiment, a heat pipe 200 having a substantially rectangular cross section is shown, but the present invention is not limited thereto, and a heat pipe having a circular or plate-shaped cross section may be adopted. In particular, in the case of having a rectangular or plate-shaped cross section, the contact area with the cover member is increased, thereby improving heat transfer performance. When the heat pipe is used as a raw tube, the diameter is 4 mm to 8 mm, and when it is used in a plate shape, the thickness is preferably 2 mm to 4 mm.

The heat pipe 200 as described above performs a function of dissipating heat generated in the TCP (170), more specifically the electronic device (172). For example, when the plasma display panel is driven so that heat dissipation is concentrated on the electronic elements 172 of some TCP 170, the cover members having different temperatures of the cover members 180 covering the some electronic elements 172 are different. Increase than Therefore, a temperature difference occurs between the cover members, and heat is transferred by the bottom pipe 200 from the relatively hot cover member to the relatively low cover member. This shortens local heat concentration, thereby balancing heat between TCP 170. 6, even when the heat pipe 200 is fixed to the chassis 140, the temperature of the chassis portion corresponding to the relatively high heat generating TCP 170 is increased. This is because some of the heat generated in the TCP is transferred to the chassis 140 by the bosses 145. Therefore, when the temperature imbalance occurs in the transverse direction in the chassis 140 as described above, heat of the high temperature portion is transferred to the low temperature portion by the heat pipe 200, and thus the temperature imbalance in the transverse direction can be eliminated.

Second Embodiment

7 illustrates a plasma display device 400 according to a second embodiment of the present invention. Here, the same reference numerals as in the first embodiment denote the same members.

The second embodiment differs from the first embodiment in that both sides 300a and 300b of the heat pipe 300 extend outward across the TCPs 170. In more detail, both sides 300a and 300b of the heat pipe extend through the outermost TCP 170 to a predetermined length and bend upward in the plasma display device to further extend the predetermined length. do. Heat sinks 340 are disposed on both sides 300a and 300b of the heat pipe. The heat sinks 340 have a base portion 342 and fins 341 disposed on the base portion, respectively. The fins 341 have a rectangular plate shape and are spaced apart at predetermined intervals. In this embodiment, the heat pipe 300 is arranged to be inserted to a predetermined depth of the base portion 342. Since both sides of the heat pipes 300a and 300b corresponding to the portions where the heat sinks 340 are disposed function as condensation units, these heat sinks 340 increase the heat transfer area of the condensation portion of the heat pipe. Heat transferred to the heat sinks 340 through the heat pipe 300 is effectively discharged to the outside. In addition, the heat sinks 340 may be integrally formed with the heat pipe 300.

In addition, in order to increase the heat transfer capability of the condensation unit of the heat pipe 300, separate fans 320 may be disposed. Therefore, not only the heat transfer area of the condensation part of the heat pipe 300 is increased by the heat sinks 340, but also the flow of air is increased by driving the fans 320, so that the heat dissipation function of the heat pipe 300 is improved. Is improved. The fans 320 may be used by various types of fans, such as a blowing fan or a suction fan, and it is preferable to use a fan with low noise. The fans 320 may be fixed to the chassis 140 or inside the case (not shown) covering the plasma display device. However, the number and arrangement position of the fans is not limited to the above.

In the case of the plasma display apparatus 400 according to the second embodiment, not only local thermal imbalance of the TCPs 170 arranged in the lateral direction can be solved, but also extensions of the heat pipes 300 extending to both sides are provided. By performing the function of the condenser, the heat dissipation ability of the heat transferred to the heat pipe is improved.

According to the present invention, not only the local thermal imbalance between the signal transmission means can be solved by the heat pipe, but also heat generated in the signal transmission means can be effectively radiated to the outside. Therefore, the electronic device can be driven stably, and stable image realization of the plasma display device can be realized.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (16)

A plasma display panel which displays an image using gas discharge; A chassis supporting the plasma display panel; A circuit unit disposed on one side of the chassis and configured to generate an electrical signal for driving the plasma display panel; A plurality of signal transmission means for transmitting an electrical signal from the circuit unit to the plasma display panel, each of which is provided with at least one electronic element and spaced apart from each other at a predetermined interval; And And a heat pipe disposed across the signal transmission means to transfer heat generated by the signal transmission means. The method of claim 1, And the heat pipe is fixed to a portion of the chassis facing the signal transfer means. The method of claim 1, At least one side of the heat pipe extends outwardly across the signal transmission means. The method of claim 3, And both sides of the heat pipe extend outwardly across the signal transmission means. The method of claim 3, And a heat sink arranged to increase a heat transfer area of the portion extending out of the heat pipe. The method of claim 3, And a fan disposed to increase heat radiation efficiency of the portion extending out of the heat pipe. The method of claim 1, And a cover member disposed to cover the electronic elements. The method of claim 7, wherein And the heat pipe is fixed to the cover member facing the signal transmission means. The method of claim 7, wherein The cover member is a plasma display device, characterized in that the groove is formed on the inner surface for accommodating the electronic device. The method of claim 9, And a liquid or gel-type thermal conductive medium is interposed between the electronic device and the groove. The method of claim 10, And the thermally conductive medium is grease. The method of claim 7, wherein And the cover member is disposed to correspond one-to-one to the signal transmission means. The method of claim 1, The signal transmission means is a plasma display device, characterized in that the TCP or COF. The method of claim 1, The plasma display panel is disposed at a predetermined interval to face the front substrate, the front substrate and a rear substrate defining a plurality of discharge cells between the front substrate and the discharge cells. And a sustain electrode pair, address electrodes extending to intersect the sustain electrode pair, and phosphor layers disposed in the discharge cells. The method of claim 14, And the signal transmitting means transfers an electrical signal generated from an address driver of the circuit unit to the address electrodes. The method of claim 15, And the address driver transfers a single scan type electrical signal to the address electrodes.

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