KR20060100771A - Plasma display apparatus - Google Patents

Abstract

An object of the present invention is to provide a plasma display device having a structure in which heat generated from an electronic element provided in the signal transmission means can be more effectively discharged. A chassis configured to support the plasma display panel on one side, a circuit portion disposed on the other side of the chassis, and configured to generate an electrical signal for driving the plasma display panel, and to transmit an electrical signal from the circuit portion to the plasma display panel. At least one electronic device is provided, and includes a plurality of signal transmission means spaced apart from each other at a predetermined interval, and the chassis so as to form a space extending through the at least one signal transmission means, After slitting, increase the predetermined height in the other direction At least one heat dissipating part protruding to be formed is formed, and the signal transmitting means is coupled to the inner surface of the heat dissipating part to extend so that heat generated from the electronic device can be transferred to the heat dissipating part. do.

Description

Plasma display apparatus

1 is a partially cutaway perspective view illustrating a plasma display device according to an exemplary embodiment of the present invention.

FIG. 2 is a partially cutaway perspective view illustrating an example of the plasma display panel illustrated in FIG. 1.

FIG. 3 is a block diagram illustrating driving of a circuit unit shown in FIG. 1.

4 is an enlarged perspective view for describing a heat dissipation structure of the TCP illustrated in FIG. 1.

FIG. 5 is a cross-sectional view taken along the line VV of FIG. 4.

FIG. 6 is an enlarged perspective view illustrating a modified example of the embodiment illustrated in FIG. 1, in which a plurality of TCPs extend through a space formed by one heat dissipation unit.

Explanation of symbols on the main parts of the drawings

100: plasma display device

110: plasma display panel 140: chassis

150: circuit portion 170: TCP

172: electronic device 181: separation part

182: connection 183: groove

185: heat dissipation unit 190: heat conductive medium

The present invention relates to a plasma display device, and more particularly, to a plasma display device having a structure in which heat generated from an electronic element provided in the signal transmission means can be more effectively discharged.

Plasma display device is a flat panel display device that realizes images by using gas discharge phenomenon. It has large screen, high quality, ultra thin, light weight and wide viewing angle, and it is simpler to manufacture than other flat panel display devices. Due to its ease of size, it has recently been in the spotlight as a large flat panel display.

Typically, such a plasma display apparatus includes a plasma display panel, a chassis disposed substantially parallel to the plasma display panel, a circuit unit mounted at a rear of the chassis to drive the plasma display panel, the plasma display panel, the chassis. And a case accommodating the circuit portion.

In the plasma display apparatus as described above, the circuit unit and the plasma display panel are electrically connected by signal transmission means such as a tape carrier package (TCP), a chip on film (COF), or the like. TCP is formed in a package by mounting an element such as a driving IC in a tape form, and COF is an element mounted on a film constituting a flexible printed circuit (FPC). Such TCP and COF are widely used because they have flexibility and can reduce the size of a circuit part since many devices can be mounted.

By the way, in the above TCP or COF, a lot of heat is generated from the electronic elements mounted on them when the plasma display panel is driven. However, when such heat is not smoothly discharged, the electronic devices are malfunctioned. Therefore, a problem occurs in the image display of the plasma display panel. In particular, when the plasma display panel is driven by a high definition (HD) single scan method, since a large amount of heat is generated in electronic elements mounted in TCP or COF connecting the address driver and the address electrodes of the circuit part, There is a need for means that can effectively release the heat generated from these electronic elements.

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma display device having a structure in which heat generated from an electronic device provided in a signal transmission means can be more effectively discharged.

In order to achieve the above object and other objects, the present invention is a plasma display panel, a chassis for supporting the plasma display panel on one side, and disposed on the other side of the chassis, to drive the plasma display panel A circuit unit for generating an electrical signal, and a plurality of signal transmission means for transmitting an electrical signal from the circuit unit to the plasma display panel, each of which includes at least one electronic device and is spaced apart from each other at predetermined intervals. At least one heat dissipation part is formed in the chassis and protrudes to have a predetermined height in the other direction after the slitting so as to form a space in which one signal transmitting means penetrates and extends. The signal transmission means so that heat can be transferred to the heat radiating portion Provides a plasma display device, it characterized in that the extension is bonded to the inner side heat exchanger portion.

In the present invention, a plurality of heat dissipation parts may be formed in the chassis so as to correspond one-to-one to each signal transmission means. In addition, a plurality of signal transmission means may be coupled to the one heat dissipation unit.

In the present invention, the heat dissipation portion is preferably a handle shape having a substantially trapezoid cross section.

In addition, the heat radiating portion is preferably formed with a groove portion on the inner surface in order to accommodate the electronic device.

Next, the plasma display apparatus 100 according to an exemplary embodiment of the present invention will be described in detail with reference to FIGS. 2 to 5. 1 shows a plasma display apparatus 100.

Referring to FIG. 1, a plasma display panel 110 in which an image is implemented by gas discharge is illustrated in the plasma display apparatus 100. Various types of plasma display panels may be adopted as the plasma display panel 110. As an example, an AC plasma display panel having a three-electrode surface discharge type structure as shown in FIG. 2 may be selected. However, the present invention is not limited to the structure of the plasma display panel shown in FIG.

Referring to FIG. 2, the plasma display panel 110 includes a front panel 120 and a rear panel 130 that is coupled to face the front panel 120. The front panel 120 includes a front substrate 121 disposed at the front side, sustain electrode pairs 122 formed on a rear surface of the front substrate 121, and having an X electrode 123 and a Y electrode 124, respectively. And a front dielectric layer 125 formed to cover the sustain electrode pairs 122, and a passivation layer 126 formed on a rear surface of the front dielectric layer 125. The X electrode 123 and the Y electrode 124 serve as a common electrode and a scan electrode, respectively, and are spaced apart from each other by a discharge gap. The X electrode 123 includes an X transparent electrode 123a and an X bus electrode 123b formed to be connected thereto. Similarly, the Y electrode 124 is also formed to be connected to the Y transparent electrode 124a. The Y bus electrode 124b is provided.

The rear panel 130 includes a rear substrate 131 disposed at a rear side, address electrodes 132 formed on a front surface of the rear substrate 131 and extending in a direction crossing the sustain electrode pairs 122, and an address. A back dielectric layer 133 formed to cover the electrodes 132, barrier ribs 134 formed on the back dielectric layer 133 to define discharge cells 135, and a phosphor layer disposed in the discharge cells 135. 136 and a discharge gas filled in the discharge cells 135.

The chassis 140, which may be manufactured by casting, pressing, or the like, supports the plasma display panel 110 disposed at the front and the circuit unit 150 disposed at the rear. The chassis 140 may be formed of a metal having high thermal conductivity and excellent rigidity, such as aluminum, in order to effectively discharge heat transferred from the plasma display panel 110 to the outside and maintain support rigidity. In addition, the chassis 140 preferably has a structure in which an edge of the chassis 140 is bent backward so that bending, bending, or deformation may be prevented. The plasma display panel 110 and the chassis 140 are adhered to each other using the double-sided tape 141.

A thermal conductive sheet 142 having a high thermal conductivity is interposed between the plasma display panel 110 and the chassis 140 to dissipate heat generated locally in the plasma display panel 110 and to be generated in the plasma display panel 110. Part of the heat is transferred to the chassis 140. Here, the heat conductive sheet 142 may be used, such as silicon glass, silicon heat dissipation sheet, acrylic heat dissipation pressure-sensitive adhesive sheet, urethane heat dissipation pressure-sensitive adhesive sheet, carbon sheet.

In addition, a circuit unit 150 is installed at the rear of the chassis 140, and the circuit unit 150 includes a plurality of electronic components. The circuit unit 150 drives the plasma display panel 110. As shown in FIG. 3, the circuit unit 150 includes an image processor 151, a logic controller 152, an address driver 153, and an X driver ( 154, Y drive unit 155, power supply unit 156, and the like. The image processor 151 converts an external analog image signal into a digital signal to generate internal image signals, for example, 8-bit red, green and blue image data, clock signals, and vertical and horizontal synchronization signals. The logic controller 152 generates driving control signals S _A , S _Y , and S _X according to an internal image signal from the image processor 151. The address driver 153 generates the display data signal by processing the address signal S _A among the driving control signals S _A , S _Y , and S _X from the logic controller 152, and generates the display data signal. Is applied to the address electrodes 132. The X driver 154 processes the X driving control signal S _X from the driving control signals S _A , S _Y , and S _X from the logic controller 152 and applies the X driving control signal S _X to the X electrodes 123. The Y driver 155 processes the Y driving control signal S _Y from the driving control signals S _A , S _Y , and S _X from the logic controller 152 and applies the Y driving control signal S _Y to the Y electrodes 124. In addition, the power supply unit 156 may operate on the image processing unit 151 and the logic control unit 152, and may require operations on the address driver 153, the X driver 154, and the Y driver 155. Generate and supply a voltage.

Meanwhile, the circuit unit 150 transmits an electrical signal to the plasma display panel 110 by signal transmission means. As a signal transmission means, a flexible printed cable (FPC), a tape carrier package (TCP), a chip on film (COF), or the like may be selected and used. According to the present exemplary embodiment, the FPCs 160 are disposed on the left and right sides of the chassis 140 as signal transmitting means, and at least one of the wiring units 171 in the tape form is provided on the lower side of the chassis 140 as the signal transmitting means. TCP 170 on which the electronic device 172 is mounted is arranged. And, as shown in Figure 1, TCP 170 are arranged spaced apart at a predetermined interval on the lower side of the chassis 140, respectively.

In the present embodiment, the circuit unit 150 is formed so that the plasma display panel 110 can be driven by a high definition single scan (HD) single scan method, and the TCPs 170 are the addresses of the circuit unit 150. The electrical signal generated from the driver 153 is transmitted to the address electrodes 132. That is, the wiring parts 171 of the TCP 170 are connected to the address electrodes 132 provided in the plasma display panel 110 via the lower edge of the chassis 140, and the other ends thereof. Is connected to the address driver 153 of the circuit unit 150. In addition, two electronic devices 172 such as an address driving IC are mounted on the wiring units 171 of the TCP 170, and the electronic devices 172 are disposed at the rear edge of the chassis 140. .

When the plasma display panel 110 is driven, a lot of heat is generated because the electronic devices 172 must process many electrical signals. However, when such heat is not smoothly discharged, the electronic devices 172 may be malfunctioned. Therefore, a problem may occur in the image display of the plasma display panel.

In order to solve this problem, the present embodiment discloses a structure in which heat generated from the electronic devices 172 is transferred to the chassis 140 to radiate heat. 4 and 5, the heat dissipation structure will be described in detail. 4 is an enlarged and exploded perspective view illustrating the heat dissipation structure of the TCP 170 illustrated in FIG. 1, and FIG. 5 is a cross-sectional view taken along the line VV of FIG. 4.

The chassis 140 has the shape of a generally flat plate except for the bent portion of the edge. However, the heat dissipation parts 185 protruding to have a predetermined height rearward after a portion of the chassis is slitting (slitting) are formed in a portion where the TCP 170 is disposed. In more detail, it slits a portion of the chassis in parallel. Thereafter, when the slinged portion is applied to the rear by pressing or the like, the slinged portion becomes a heat radiating portion 185 having a predetermined height. The heat dissipation portion 185 has a handle shape having a trapezoidal cross section, and is spaced 181 disposed substantially parallel to the flat portion 147 of the chassis, and from both sides of the spaced portion 181 of the chassis. With connections 182 extending to the flat portion 147. By the heat dissipation unit 185 having the structure as described above, a space in which the TCP 170 can be extended is formed. Thus, the TCPs 170 extend across the space surrounded by the heat dissipation portions 185, and the TCP 170 are coupled to the inner side surfaces of the heat dissipation portions 185.

In this embodiment, the heat dissipation unit 185 is disposed one-to-one correspondence for each TCP 170, the present invention is not limited to this, a plurality of TCP 170 is to be commonly coupled to the inner surface of one heat dissipation unit All TCPs 170 may be commonly coupled to the inner side of one heat dissipation unit. 6 illustrates a state in which a plurality of TCP 170 is commonly coupled to the inner side of one heat dissipation unit.

4 and 5, the electronic devices 172 are arranged to protrude from the wiring unit 171 toward the separation unit 181, and the spacers 181 facing the electronic devices 172 are disposed. The grooves 183 are formed on the fields so that the protruding electronic elements 172 may be accommodated and protected, respectively. Here, the grooves 183 are formed in a shape in which their inner surfaces are closed, respectively, and are formed in such a size that an interval between the inner surface of the groove 183 and the outer surface of the electronic device 172 can be maintained at a predetermined interval. It is. However, the shape of the groove is not limited to that shown, and may be formed in a structure in which two electronic elements 172 may be accommodated together.

A heat conducting medium 190 is disposed between the electronic device 172 and the groove 183 to quickly transfer heat generated from the electronic device 172 to the separation unit 181, and to prevent damage of the electronic device. That is, the liquid or gel-type thermal conductive medium 190 is disposed between the protruding outer surface of the electronic device 172 and the inner surface of the groove 183. Grease may be used as an example of the thermal conductive medium 190. The grease is prepared by adding a metal soap and a small amount of water to a liquid mineral oil-based oil and mixing the mixture in a colloidal state. It has a predetermined viscosity. Grease may include synthetic oils such as silicone oils instead of mineral oils.

The liquid or gel-type thermal conductive medium 190 as described above may be completely filled between the groove 183 and the electronic device 172, so that the heat generated from the electronic device 172 may pass through the thermal conductive medium 190. It is delivered to the spacer 181. On the other hand, the viscosity of the heat conducting medium 190 in a general situation where the plasma display apparatus 100 is used vertically, it is preferable that the heat conducting medium 190 does not flow out of the groove portion 183 by gravity. .

In the heat radiation structure of the TCP 170 having the above structure, the mechanism of heat radiation is as follows. First, heat generated from the electronic elements 172 by driving the TCP 170 is first transferred to the spacers 181. A portion of the heat transferred to the spacers 181 is radiated to the outside by heat transfer to the outside air, but the remaining heat is quickly conducted to the entire chassis via the connecting portion 182. Thereafter, the conducted heat is radiated to the outside through heat exchange with the outside air. Therefore, since the heat generated from the electronic elements 172 can be released to the outside using a large heat transfer area, the overall heat dissipation capacity is greatly increased.

The coupling structure between the TCP 170 and the heat dissipation unit 185 is as follows. Two through holes 170a are formed in the TCP 170. Each through hole 170a is symmetrically formed on the side surfaces of the two electronic elements 172. In addition, through holes 181a are formed in the spaced apart portion 181 of the heat dissipation unit covering the electronic elements 172 of the TCP 170. The through holes 170a and 181a formed in the TCP 170 and the spacer 181 are coaxial. Therefore, the screws 195 are inserted into the through holes 170a and 181a to screw the TCP 170 to the heat dissipation unit 185.

According to the present invention, since the heat generated from the electronic element of the signal transmission means can be effectively radiated to the outside by the heat radiating portion, the electronic element can be driven stably, stable implementation of the image in the plasma display device having the same This becomes possible.

In addition, since the heat dissipation part can be easily formed by pressing after slitting the chassis, the overall process is also simplified.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (12)

A plasma display panel; A chassis supporting the plasma display panel on one side; A circuit unit disposed on the other side of the chassis and configured to generate an electrical signal for driving the plasma display panel; And And a plurality of signal transmission means for transmitting an electrical signal from the circuit unit to the plasma display panel, each of which is provided with at least one electronic element and spaced apart from each other at a predetermined interval. At least one heat dissipation part is formed in the chassis to protrude to have a predetermined height in the other direction after being slit so as to form a space through which the at least one signal transmitting means extends, And the signal transmitting means is coupled to the inner surface of the heat dissipation unit so that heat generated from the electronic element can be transferred to the heat dissipation unit. The method of claim 1, And a plurality of heat dissipating parts are formed in the chassis so as to correspond one-to-one to each signal transmitting means. The method of claim 1, And a plurality of signal transmission means are coupled to the one heat dissipation unit. The method of claim 1, And the heat dissipation portion has a handle shape having a substantially trapezoid cross section. The method of claim 1, And a groove portion is formed on an inner side surface of the heat dissipation portion to accommodate the electronic device. The method of claim 5, And a liquid or gel-type thermal conductive medium is interposed between the electronic device and the groove. The method of claim 6, And the thermally conductive medium is grease. The method of claim 1, And the heat dissipation unit and the signal transmission means are screwed together. The method of claim 1, The signal transmission means is a plasma display device, characterized in that the TCP (tape carrier package) or COF (chip on film). The method of claim 1, The plasma display panel is disposed on the front substrate, spaced apart from the front substrate at predetermined intervals, a rear substrate defining a plurality of discharge cells together with the front substrate, and an address arranged to cause an address discharge in the discharge cells. And electrodes and phosphor layers disposed in the discharge cells. The method of claim 10, And the signal transmitting means transfers an electrical signal generated from an address driver of the circuit unit to the address electrodes. The method of claim 11, And the address driver transfers a single scan type electrical signal to the address electrodes.

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