KR20060049053A - 구리 스트라이크 도금욕 - Google Patents

구리 스트라이크 도금욕 Download PDF

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Publication number
KR20060049053A
KR20060049053A KR1020050070828A KR20050070828A KR20060049053A KR 20060049053 A KR20060049053 A KR 20060049053A KR 1020050070828 A KR1020050070828 A KR 1020050070828A KR 20050070828 A KR20050070828 A KR 20050070828A KR 20060049053 A KR20060049053 A KR 20060049053A
Authority
KR
South Korea
Prior art keywords
copper
acid
strike plating
plating bath
bath
Prior art date
Application number
KR1020050070828A
Other languages
English (en)
Korean (ko)
Inventor
요코 오기하라
마사오 나카자와
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20060049053A publication Critical patent/KR20060049053A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020050070828A 2004-08-05 2005-08-03 구리 스트라이크 도금욕 KR20060049053A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00229199 2004-08-05
JP2004229199A JP4480509B2 (ja) 2004-08-05 2004-08-05 銅ストライクめっき浴

Publications (1)

Publication Number Publication Date
KR20060049053A true KR20060049053A (ko) 2006-05-18

Family

ID=35756351

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050070828A KR20060049053A (ko) 2004-08-05 2005-08-03 구리 스트라이크 도금욕

Country Status (4)

Country Link
US (1) US20060027462A1 (ja)
JP (1) JP4480509B2 (ja)
KR (1) KR20060049053A (ja)
TW (1) TW200609390A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210138399A (ko) * 2020-05-12 2021-11-19 주식회사 써켐 청화동 도금액 및 이를 이용하는 청화동 도금방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5653743B2 (ja) * 2009-12-25 2015-01-14 株式会社荏原製作所 金属膜形成方法および装置
CN107665870A (zh) * 2017-11-15 2018-02-06 贵溪博远金属有限公司 一种铜钯银键合线

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2737485A (en) * 1952-09-22 1956-03-06 Gen Motors Corp Electrodeposition of copper
US2841542A (en) * 1955-12-19 1958-07-01 Udylite Res Corp Electrodeposition of copper
US7135404B2 (en) * 2002-01-10 2006-11-14 Semitool, Inc. Method for applying metal features onto barrier layers using electrochemical deposition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210138399A (ko) * 2020-05-12 2021-11-19 주식회사 써켐 청화동 도금액 및 이를 이용하는 청화동 도금방법

Also Published As

Publication number Publication date
TW200609390A (en) 2006-03-16
US20060027462A1 (en) 2006-02-09
JP4480509B2 (ja) 2010-06-16
JP2006045623A (ja) 2006-02-16

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