KR20060035308A - 유기 박막 증착 공정용 증발원 연속 공급장치 - Google Patents
유기 박막 증착 공정용 증발원 연속 공급장치 Download PDFInfo
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- KR20060035308A KR20060035308A KR1020040084747A KR20040084747A KR20060035308A KR 20060035308 A KR20060035308 A KR 20060035308A KR 1020040084747 A KR1020040084747 A KR 1020040084747A KR 20040084747 A KR20040084747 A KR 20040084747A KR 20060035308 A KR20060035308 A KR 20060035308A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/548—Controlling the composition
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (11)
- 유기물 분출부(30)를 유기물 안내관(40) 상부에 삽입하는 것을 특징으로 하는 유기 박막 증착 공정용 증발원 연속 공급장치
- 유기물 분출부(30) 상부에는 유기물 분출노즐(32)들이 형성되고 하부에는 유기물 분출 하부홈(31)이 형성된 것을 특징으로 하는 유기 박막 증착 공정용 증발원 연속 공급장치
- 유기물 안내관(40)을 증착 챔버(20)와 상부 증발원 용기(60) 사이에 설치하는 것을 특징으로 하는 유기 박막 증착 공정용 증발원 연속 공급장치
- 유기물 안내관(40)은 유기물 안내관 상부홈(41)이 형성되고, 안내관 상부 고정 플랜지(42)가 형성되고, 안내관 하부 고정 플랜지(43)가 형성되고, 안내관 하부홈(44)이 형성되고, 안내관 내부관(45)이 형성되는 것을 특징으로 하는 유기 박막 증착 공정용 증발원 연속 공급장치
- 유기물 안내관(40) 주위에 실린더 형의 열보존 자켓(50)을 설치하는 것을 특징으로 하는 유기 박막 증착 공정용 증발원 연속 공급장치
- 상부 증발원 용기(60)와 하부 증발원 용기(80) 사이에 게이트 밸브(70)를 설치하는 것을 특징으로 하는 유기 박막 증착 공정용 증발원 연속 공급장치
- 하부 증발원 용기(80)바닥에 푸쉬 앤드 풀 피드쓰루(120)를 설치하는 것을 특징으로 하는 유기 박막 증착 공정용 증발원 연속 공급장치
- 푸쉬 앤드 풀 피드쓰루(120) 상부가 증발원 하부 용기 걸림 돌출부(93)에 고정되는 것을 특징으로 하는 유기 박막 증착 공정용 증발원 연속 공급장치
- 푸쉬 앤드 풀 피드쓰루(120)를 사용하여 도가니(100)를 포함한 증발원 장치(90, 91, 92, 93, 110)를 밀어 올리거나 당겨 내리는 작동을 특징으로 하는 유기 박막 증착 공정용 증발원 연속 공급장치
- 물질이 재충전된 증발원 장치(90, 91, 92, 93, 100, 110)를 하부 증발원 용기(80)에 설치된 도어를 통하여 하부 증발원 용기에 설치하는 것을 특징으로 하는 유기 박막 증착 공정용 증발원 연속 공급장치
- 도가니 상부 입(103)이 형성된 도가니 상부(101)가 도가니 하부(102)를 덮거나, 스크루 탭을 통하여 잠그는 것을 특징으로 하는 유기 박막 증착 공정용 증발원 연속 공급장치
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR20040084747A KR100958778B1 (ko) | 2004-10-22 | 2004-10-22 | 유기 박막 증착 공정용 증발원 연속 공급장치 |
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KR20040084747A KR100958778B1 (ko) | 2004-10-22 | 2004-10-22 | 유기 박막 증착 공정용 증발원 연속 공급장치 |
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KR20060035308A true KR20060035308A (ko) | 2006-04-26 |
KR100958778B1 KR100958778B1 (ko) | 2010-05-18 |
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KR20040084747A KR100958778B1 (ko) | 2004-10-22 | 2004-10-22 | 유기 박막 증착 공정용 증발원 연속 공급장치 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100793366B1 (ko) * | 2006-07-04 | 2008-01-11 | 삼성에스디아이 주식회사 | 유기물 증착장치 및 그 증착방법 |
KR100804700B1 (ko) * | 2006-10-19 | 2008-02-18 | 삼성에스디아이 주식회사 | 증착 장치 |
KR100823508B1 (ko) * | 2006-10-19 | 2008-04-21 | 삼성에스디아이 주식회사 | 증발원 및 이를 구비한 증착 장치 |
WO2010035130A2 (en) * | 2008-09-29 | 2010-04-01 | Applied Materials, Inc. | Evaporator for organic materials |
US8986783B2 (en) | 2009-11-30 | 2015-03-24 | Samsung Display Co., Ltd. | Method of forming thin film from multiple deposition sources |
KR20170003128A (ko) * | 2015-06-30 | 2017-01-09 | 주식회사 선익시스템 | 증착 장치 |
EP4190937A4 (en) * | 2020-11-18 | 2023-12-27 | Lg Chem, Ltd. | DEPOSITION DEVICE FOR ORGANIC LIGHT-LIGHT DIODE |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114599814A (zh) * | 2019-10-31 | 2022-06-07 | 应用材料公司 | 材料沉积布置、真空沉积系统和用于制造材料沉积布置的方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3516819B2 (ja) * | 1996-09-12 | 2004-04-05 | 株式会社アルバック | モノマーの蒸発システム、同蒸発システムを備えた真空処理室、および有機化合物膜の成膜方法 |
KR20030078203A (ko) * | 2002-03-28 | 2003-10-08 | (주)한백 | 유기금속화학증착장치용 반응기의 가스분사장치 |
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2004
- 2004-10-22 KR KR20040084747A patent/KR100958778B1/ko not_active IP Right Cessation
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100793366B1 (ko) * | 2006-07-04 | 2008-01-11 | 삼성에스디아이 주식회사 | 유기물 증착장치 및 그 증착방법 |
KR100804700B1 (ko) * | 2006-10-19 | 2008-02-18 | 삼성에스디아이 주식회사 | 증착 장치 |
KR100823508B1 (ko) * | 2006-10-19 | 2008-04-21 | 삼성에스디아이 주식회사 | 증발원 및 이를 구비한 증착 장치 |
WO2010035130A2 (en) * | 2008-09-29 | 2010-04-01 | Applied Materials, Inc. | Evaporator for organic materials |
WO2010035130A3 (en) * | 2008-09-29 | 2010-06-17 | Applied Materials, Inc. | Evaporator for organic materials |
US8986783B2 (en) | 2009-11-30 | 2015-03-24 | Samsung Display Co., Ltd. | Method of forming thin film from multiple deposition sources |
KR20170003128A (ko) * | 2015-06-30 | 2017-01-09 | 주식회사 선익시스템 | 증착 장치 |
EP4190937A4 (en) * | 2020-11-18 | 2023-12-27 | Lg Chem, Ltd. | DEPOSITION DEVICE FOR ORGANIC LIGHT-LIGHT DIODE |
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Publication number | Publication date |
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KR100958778B1 (ko) | 2010-05-18 |
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