KR20060026611A - A plasma display device - Google Patents

Abstract

The plasma display device of the present invention improves the adhesion of the hybrid circuit module and the heat sink to improve the reliability of heat dissipation of the hybrid circuit module by reducing the thermal resistance between the hybrid circuit module and the heat sink. A chassis base for attaching and supporting a plasma display panel to one side thereof, a driving circuit board mounted on the other side of the chassis base and connected to control the plasma display panel, and a hybrid provided in the driving circuit board to control the plasma display panel. And a circuit module, wherein a heat sink is attached to the hybrid circuit module via a heat conductive sheet, and a part of the heat conductive sheet is deformed and filled in an uneven portion formed on an opposite side of the heat sink and the hybrid circuit module.塡) it is.

Plasma Display, Chassis Base, Thermal Conductive Sheet, Concave-Convex, Depth

Description

Plasma Display Device {A PLASMA DISPLAY DEVICE}

1 is an exploded perspective view schematically showing a plasma display device according to the present invention.

2 is an exploded perspective view of the hybrid circuit module and the heat sink.

FIG. 3 is a cross-sectional view of the first embodiment with a hybrid circuit module and a heat sink of FIG. 2 attached and cut along a line A-A. FIG.

4 is a cross-sectional view of a second embodiment in a state cut along the line A-A by attaching the hybrid circuit module and the heat sink of FIG.

The present invention relates to a plasma display device, and more particularly, to a plasma display device for improving thermal radiation reliability of a hybrid circuit module.

The plasma display device generates a plasma by gas discharge and displays the image using the plasma (Plasma Display Panel, hereinafter referred to as 'PDP'), a chassis base supporting the PDP, and the chassis base PDP. It includes a plurality of driving circuit boards mounted on the opposite side and connected to a display electrode or an address electrode located inside the PDP through a flexible printed circuit and a connector.

Since the PDP seals two glass substrates face to face and forms a discharge space therein, the mechanical resistance against impact is weak. In order to support the PDP, the chassis base is made of metal having high mechanical rigidity. In addition to the function of maintaining the rigidity of the PDP as described above, the chassis base has a mounting support function of the driving circuit board, a heat sink function of the PDP, and electromagnetic interference (EMI). It is in charge of grounding function.

The PDP is attached to the front of the chassis base via double-sided tape so that the chassis base achieves the above functions, and the driving circuit boards are mounted to the rear of the chassis base. These drive circuit boards are mounted with a set screw on a plurality of bosses formed on the rear surface of the chassis base.

The driving circuit boards include a circuit and hybrid circuit modules for controlling the display electrode and the address electrodes of the PDP. These hybrid circuit modules generate high heat when driven by high frequency switching operation. Therefore, the hybrid circuit module has a heat sink on one side thereof to dissipate heat generated during the switching operation.

However, an air layer is formed between the hybrid circuit modules and the heat sink that are attached to each other. This air layer acts as a thermal resistance to heat conduction from the hybrid circuit module to the heat sink, thereby reducing the heat transfer efficiency transferred from the hybrid circuit module to the heat sink.

The present invention is to solve the problems described above, the object is to improve the adhesion between the hybrid circuit module and the heat sink, the reliability of the heat dissipation of the hybrid circuit module by reducing the thermal resistance between the hybrid circuit module and the heat sink It is to provide a plasma display device that improves.

A plasma display device according to the present invention includes a plasma display panel, a chassis base for attaching and supporting the plasma display panel to one side thereof, a driving circuit board mounted at the other side of the chassis base and connected to control the plasma display panel, and And a hybrid circuit module provided on the driving circuit board to control the plasma display panel, wherein a heat sink is attached to the hybrid circuit module through a heat conductive sheet, and irregularities are formed on opposite sides of the heat sink and the hybrid circuit module. A part of the heat conductive sheet is deformed and filled in the portion.

The thermally conductive sheet is preferably formed of a material deformable in the vertical direction and the planar direction by the vertical force applied to the hybrid circuit module and the heat sink. The depth of the uneven portion is preferably formed to be shallower than the depth that can be filled by the horizontal and vertical deformation of the thermal conductive sheet. That is, the depth of the concave-convex portion is preferably formed to a depth that one side of the thermal conductive sheet is deformed to completely fill the concave-convex portion to completely remove the air layer therein. Therefore, the more difficult the deformation of the thermal conductive sheet is, the shallower the depth of the uneven portion is formed, and the easier the deformation of the thermal conductive sheet, the deeper the depth of the uneven portion may be formed. That is, the depth of the uneven portion is preferably set appropriately in accordance with the material of the thermal conductive sheet.

The uneven portion may be formed on one side of the hybrid circuit module facing the heat sink (the surface of the metal substrate forming one outer surface of the hybrid circuit module) or on one side of the heat sink facing the hybrid circuit module.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view schematically showing a plasma display device according to the present invention.

The plasma display device includes a PDP 11 for displaying an image by using gas discharge and a heat radiation sheet for conducting and diffusing heat generated in the PDP 11 due to gas discharge in a planar direction. (13), a drive circuit board 15 electrically connected to the PDP 11 (not shown) to drive the PDP 11, and a PDP 11 attached to the front surface to support and drive the circuit board 15; It includes a chassis base 17 for mounting and supporting the back.

In the above, the PDP 11 is configured to display an image by using gas discharge. Since the present invention relates to the coupling relationship between the PDP 11 and other components, a detailed description of the PDP 11 is omitted here. do. The heat dissipation sheet 13 is provided on the rear surface of the PDP 11 by conducting and dissipating heat generated by the PDP 11 causing gas discharge in the plane direction of the PDP 11. The heat dissipation sheet 13 may be made of an acrylic heat dissipation material, a graphite heat dissipation material, a metal heat dissipation material, or a carbon nanotube heat dissipation material. The chassis base 17 attaches and supports the rear surface of the PDP 11 via the heat dissipation sheet 13, and supports the driving circuit boards 15 to the other side. The driving circuit board 15 may be mounted to a boss (not shown) provided in the chassis base 17 with a set screw 19. In addition, the driving circuit board 15 includes various circuits and a hybrid circuit module 21 for controlling a display electrode (not shown) and an address electrode (not shown) included in the PDP 11. The hybrid circuit module 21 may be provided in plural and only one is shown in FIG. 1 for convenience.

As shown in FIG. 2, when the PDP 11 is driven, the hybrid circuit module 21 selects corresponding electrodes according to the reset period, the scan period, and the sustain period, and applies an appropriate pulse waveform thereto. Since it generates heat, it is provided with a heat sink 25 attached to one side via a heat conductive sheet 23 so as to radiate this heat to be protected from a heat load and to be continuously driven. The hybrid circuit module 21 has a metal substrate 21a which is installed in parallel with the driving circuit board 15 and the elements are placed in a wiring pattern (not shown) formed through an insulating layer on the substrate 21a. It is provided by connecting, and may be formed in a structure that covers the connection structure with a resin (not shown).

The thermal conductive sheet 23 attaches one side of the hybrid circuit module 21 to the heat sink 25 facing the hybrid circuit module 21, thereby increasing the adhesion between the hybrid circuit module 21 and the heat sink 25, and thus, the hybrid circuit module ( It is preferable to form a close attachment structure so that heat generated in 21 can be quickly transferred to the heat sink 25 through the heat conductive sheet 25. That is, the thermal conductive sheet 23 is formed in a structure that eliminates or minimizes the air layer that may be formed between the attachment surfaces of the hybrid circuit module 21 and the heat sink 25.

In order to form a more intimate attachment structure between the hybrid circuit module 21 and the heat sink 25, the heat sink 25 and the hybrid circuit module 21 have uneven portions 27 and 29 on their opposite sides, respectively. It can be provided. When attaching the hybrid circuit module 21 and the heat sink 25, part of the heat conductive sheet 23 is deformed and filled in these uneven parts 27 and 29. As shown in FIG.

Therefore, the thermal conductive sheet 23 is preferably formed of a material that can be deformed in the vertical direction and the planar direction by the pressing force in the vertical direction applied to the hybrid circuit module 21 and the heat sink 25. That is, the thermal conductive sheet 23 may be formed of a silicon sheet, an acrylic sheet, a urethane sheet, a graphite sheet, a foam sheet, or the like. The thermally conductive sheet 23 made of such a material is completely filled in the uneven parts 27 and 29 by the above-described deformation while attaching the hybrid circuit module 21 and the heat sink 25 to each other.

Accordingly, the uneven parts 27 and 29 may be formed to a depth d at which the heat conductive sheet 23 may be deformed and filled. That is, the uneven parts 27 and 29 may be formed deeper as the heat conductive sheet 23 is easily deformed, but when the heat conductive sheet 23 is hardly deformed, the uneven parts 27 and 29 are formed to have a shallower depth d. It is preferable to prevent the formation of an air layer in the cavity. That is, the depth d of the uneven parts 27 and 29 may be formed to be shallower than the maximum value at which the heat conductive sheet 23 may be deformed in the vertical direction. Since the depths d of the uneven parts 27 and 29 may be formed in various ways according to the material of the thermal conductive sheet 23, detailed description of data comparing the depth d and the material is omitted.

3 illustrates that the uneven portion 27 is provided at one side of the hybrid circuit module 21. The uneven portion 27 may be formed at one side of the hybrid circuit module 21 opposite to one side of the heat sink 25 when the hybrid circuit module 21 and the heat sink 25 are attached to each other. That is, the uneven portion 27 is preferably formed on the surface of the metal substrate 21a forming one outer surface of the hybrid circuit module 21. The uneven portion 27 may be formed by sanding the metal substrate 21a with grinding particles to form a constant roughness or by spraying conductive particles, and may be press-processed or rolled into a molding machine having a constant roughness. It may be formed.

When the heat conductive sheet 23 is inserted between the hybrid circuit module 21 and the heat sink 25, and an external force is applied to the heat sink 25 or the hybrid circuit module 21, the thickness of the heat conductive sheet 23 is increased. While thinning, a part of the thermal conductive sheet 23 on the hybrid circuit module 21 side is filled in the uneven portion 27 to remove the air remaining therein, and is attached to the hybrid circuit module 21 with a larger surface area to be closely connected. To form an attachment structure.

Therefore, the thermal resistance to heat conduction between the hybrid circuit module 21 and the heat sink 25 is minimized, so that heat generated in the hybrid circuit module 21 is transferred to the heat sink 25 more quickly. In this case, the hybrid circuit module 21 side forms a tighter attachment structure than the heat sink 25 side.

4 illustrates that the uneven portion 29 is provided at one side of the heat sink 25. The uneven portion 29 may be formed in the same manner as the uneven portion 27 described above. The first embodiment of FIG. 3 has the uneven portion 29 formed on the hybrid circuit module 21 side, whereas the second embodiment has a difference in having the uneven portion 29 provided on the heat sink 25 side. However, since the effects of both are similar, detailed description thereof will be omitted. In this case, the heat sink 25 side forms a tighter attachment structure than the hybrid circuit module 21 side.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the plasma display device according to the present invention, the hybrid circuit module is provided with an uneven portion on the opposite side of the heat sink, and is pressurized through the heat conductive sheet therebetween to fill a portion of the heat conductive sheet with the uneven portion to feed the hybrid circuit By attaching the module and the heat sink to each other, the air layer formed between the hybrid circuit module and the heat sink is minimized to improve the adhesion between the two, thereby minimizing the thermal resistance to heat conduction between the hybrid circuit module and the heat sink. Since heat conduction performance of the hybrid circuit module is increased in the heat sink, the reliability of heat dissipation of the hybrid circuit module is improved.

Claims (6)

A plasma display panel; A chassis base to attach and support the plasma display panel to one side thereof; A driving circuit board mounted on the other side of the chassis base and connected to control the plasma display panel; And A hybrid circuit module provided in the driving circuit board to control a plasma display panel; And a heat sink attached to the hybrid circuit module via a heat conductive sheet, wherein a portion of the heat conductive sheet is deformed and filled in an uneven portion formed on an opposite side of the heat sink and the hybrid circuit module. The method of claim 1, And the thermal conductive sheet is formed of a material deformable in the vertical direction and the planar direction by the vertical force applied to the hybrid circuit module and the heat sink. The method of claim 2, And the depth of the concave-convex portion is formed to be shallower than the depth that can be charged by deformation in the horizontal and vertical directions of the thermal conductive sheet. The method of claim 1, The uneven part is a plasma display device formed on one side of the hybrid circuit module facing the heat sink. The method of claim 4, wherein The uneven part is a plasma display panel formed on the surface of the metal substrate forming one outer surface of the hybrid circuit module. The method of claim 1, The uneven portion is a plasma display device formed on one side of the heat sink facing the hybrid circuit module.

Images