KR20050107760A - 웨이퍼 연마 및 패드 컨디셔닝 방법 - Google Patents

웨이퍼 연마 및 패드 컨디셔닝 방법 Download PDF

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Publication number
KR20050107760A
KR20050107760A KR1020057015513A KR20057015513A KR20050107760A KR 20050107760 A KR20050107760 A KR 20050107760A KR 1020057015513 A KR1020057015513 A KR 1020057015513A KR 20057015513 A KR20057015513 A KR 20057015513A KR 20050107760 A KR20050107760 A KR 20050107760A
Authority
KR
South Korea
Prior art keywords
pad
polishing pad
wafer
polishing
conditioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020057015513A
Other languages
English (en)
Korean (ko)
Inventor
앤드류 스코트 로윙
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Publication of KR20050107760A publication Critical patent/KR20050107760A/ko
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020057015513A 2003-02-25 2004-02-23 웨이퍼 연마 및 패드 컨디셔닝 방법 Ceased KR20050107760A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/373,513 2003-02-25
US10/373,513 US6899612B2 (en) 2003-02-25 2003-02-25 Polishing pad apparatus and methods

Publications (1)

Publication Number Publication Date
KR20050107760A true KR20050107760A (ko) 2005-11-15

Family

ID=32868728

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057015513A Ceased KR20050107760A (ko) 2003-02-25 2004-02-23 웨이퍼 연마 및 패드 컨디셔닝 방법

Country Status (6)

Country Link
US (1) US6899612B2 (https=)
JP (1) JP2006518943A (https=)
KR (1) KR20050107760A (https=)
CN (1) CN1771110A (https=)
TW (1) TW200505634A (https=)
WO (1) WO2004077520A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101526010B1 (ko) * 2007-01-29 2015-06-04 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 화학 기계적 연마 패드

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005012684A1 (de) * 2005-03-18 2006-09-21 Infineon Technologies Ag Verfahren zum Steuern eines CMP-Prozesses und Poliertuch
US7241206B1 (en) * 2006-02-17 2007-07-10 Chien-Min Sung Tools for polishing and associated methods
US7494404B2 (en) * 2006-02-17 2009-02-24 Chien-Min Sung Tools for polishing and associated methods
DE102007024954A1 (de) 2007-05-30 2008-12-04 Siltronic Ag Poliertuch für DSP und CMP
WO2015037606A1 (ja) * 2013-09-11 2015-03-19 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
CN105745261B (zh) * 2013-12-25 2018-09-28 Dic株式会社 多孔体和研磨垫
JP6809779B2 (ja) * 2015-08-25 2021-01-06 株式会社フジミインコーポレーテッド 研磨パッド、研磨パッドのコンディショニング方法、パッドコンディショニング剤、それらの利用
US9802293B1 (en) * 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
JP7118841B2 (ja) * 2018-09-28 2022-08-16 富士紡ホールディングス株式会社 研磨パッド
CN119167661B (zh) * 2024-11-20 2025-03-21 苏州大学 球形抛光头氧化铈抛光液斜轴抛光加工表面形貌预测方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US182401A (en) * 1876-09-19 Thomas baeeett
US5569062A (en) 1995-07-03 1996-10-29 Speedfam Corporation Polishing pad conditioning
EP0769350A1 (en) 1995-10-19 1997-04-23 Ebara Corporation Method and apparatus for dressing polishing cloth
US6245679B1 (en) 1996-08-16 2001-06-12 Rodel Holdings, Inc Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
US6224465B1 (en) 1997-06-26 2001-05-01 Stuart L. Meyer Methods and apparatus for chemical mechanical planarization using a microreplicated surface
US6139402A (en) 1997-12-30 2000-10-31 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
WO2000030159A1 (en) 1998-11-18 2000-05-25 Rodel Holdings, Inc. Method to decrease dishing rate during cmp in metal semiconductor structures
US6419553B2 (en) 2000-01-04 2002-07-16 Rodel Holdings, Inc. Methods for break-in and conditioning a fixed abrasive polishing pad
US6679769B2 (en) * 2000-09-19 2004-01-20 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
US6641471B1 (en) 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
US20020182401A1 (en) 2001-06-01 2002-12-05 Lawing Andrew Scott Pad conditioner with uniform particle height
US6659846B2 (en) * 2001-09-17 2003-12-09 Agere Systems, Inc. Pad for chemical mechanical polishing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101526010B1 (ko) * 2007-01-29 2015-06-04 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 화학 기계적 연마 패드

Also Published As

Publication number Publication date
US20040166780A1 (en) 2004-08-26
WO2004077520A3 (en) 2004-10-14
CN1771110A (zh) 2006-05-10
TW200505634A (en) 2005-02-16
WO2004077520A2 (en) 2004-09-10
US6899612B2 (en) 2005-05-31
JP2006518943A (ja) 2006-08-17

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