KR20050046576A - Method for manufacturing transparent conductive film - Google Patents

Abstract

(Problem) Providing the manufacturing method of the transparent conductive film for touch panels in which the unevenness | corrugation by a mark is suppressed and a defect, a deformation | transformation, etc. of an image generate | occur | produce and a display quality is not reduced when it is set as a display.

(Solution) The transparent conductive film 70 in which the first film 16 having the hard coat layer and / or the antiglare layer and the second film 62 having the transparent conductive film are laminated with the adhesive layer 44 interposed therebetween. In the manufacturing method of the first method, the first layer on which the adhesive layer is formed is wound on the core while supplying spacers to both ends between the second surface of the separator 10 and the first film 16 of the first film 18 on which the adhesive layer is formed. The process of forming a roll body of a film, removing the separator 10 while releasing it from the roll body of the 1st film 18 in which an adhesive bond layer was formed, and from the roll body wound around the core with the spacer interposed at both ends. It is set as the manufacturing method which has a lamination process of supplying and adhering the 2nd film 62.

Description

The manufacturing method of a transparent conductive film {METHOD FOR MANUFACTURING TRANSPARENT CONDUCTIVE FILM}

The present invention relates to a method for producing a transparent conductive film having a hard coat layer and / or an antiglare layer, and more particularly, to a method for producing a transparent conductive film roll suitable for an electrode plate or the like of an analog touch panel.

A large number of film resistive touch panels are used for liquid crystal displays, and the transparent conductive film used for such a touch panel includes a hard coat treatment film having a hard coat layer formed on a first surface of a first transparent substrate, 2. The transparent conductive film which laminated | stacked the electrically conductive film which has a transparent conductive film on the 1st surface of 2 transparent base materials, and laminated | stacked with adhesive on the 2nd surface of each film is known (refer patent document 1).

Such a transparent conductive film is produced continuously by forming an adhesive bond layer on one surface of a hard coat process film or a conductive film, adhering and laminating | stacking with another film, and is wound up and preserve | saved once as a roll body. And the continuous transparent electroconductive film wound as a roll body is cut | disconnected to a predetermined size, and unwound from a roll state, and is used for use.

The process of forming the adhesive bond layer in the manufacturing method of such a transparent conductive film is normally formed by forming an adhesive bond layer in a separator, and sticking one film which should form an adhesive bond layer. The film in which the adhesive bond layer was formed is wound up once as a roll body. The film in which the adhesive bond layer was formed is adhere | attached and laminated | stacked separately, being supplied and unwound from each roll body in the lamination process, and the other film wound similarly as a roll body, and a transparent conductive film is manufactured.

(Patent Document 1) Japanese Unexamined Patent Publication No. 2002-73282 (Scope of Claim)

By the way, in the manufacturing process of the above-mentioned conventional transparent conductive film, if there are unevenness | corrugation by at least one of the hard-coat process film and the conductive film before lamination | stacking, if a bubble and a deformation | transformation exist in the transparent conductive film after lamination | stacking, It is easy to occur. In particular, since liquid crystal displays have improved image accuracy year by year, and small bubbles and deformations of the transparent conductive film, which have not been a problem in conventional liquid crystal displays, cause image defects. Further prevention is required.

This invention is made | formed in view of the said problem, The objective is manufacturing the transparent conductive film which suppresses the unevenness | corrugation by a mark, and produces a defect, a deformation | transformation, etc. of an image, and does not reduce a display quality when it is set as a display. To provide a method.

The 1st invention of this application is a 1st film which has a hard-coat layer and / or an antiglare layer in the 1st surface of a 1st base material, and the 2nd film which has a transparent conductive film in the 1st surface of a 2nd base material interposes an adhesive bond layer. As a manufacturing method of the transparent conductive film laminated | stacked and laid down,

1st film manufacturing process in which an adhesive bond layer was formed which makes an adhesive bond layer in a 1st film and forms a roll body of a 1st film which has an adhesive bond layer, and adhere | attaches and laminates the 1st film and said 2nd film in which the said adhesive bond layer was formed, It has a lamination process made into a transparent conductive film,

The first film manufacturing process in which the adhesive layer is formed,

An adhesive sheet forming step of forming an adhesive layer on the first side of the separator,

1st film formation process in which the adhesive bond layer was formed which supplies and adhere | attaches the said 1st film to the adhesive bond layer of the said adhesive sheet,

And winding a roll body of the first film on which the adhesive layer is formed by winding it around the core while supplying spacers to both ends between the second surface of the separator and the first film layer of the first film on which the adhesive layer is formed. In having a process,

The said 2nd film is a roll body of the 2nd film wound on the core by supplying a spacer to both ends,

The lamination step is a first film supply step in which an adhesive layer is formed, wherein the first film on which the adhesive layer is formed is removed from the roll body, and the spacer and the separator are removed, and the second film is removed from the roll body, and the spacer is removed at the same time. It has a 2nd film supply process, and the bonding process of laminating | stacking the 1st film and the 2nd film in which the said adhesive bond layer was formed through the adhesive bond layer, It is characterized by the above-mentioned.

In the second invention of the present application, a first film having a hard coat layer and / or an antiglare layer on a first surface of a first substrate and a second film having a transparent conductive film on a first surface of a second substrate are interposed between an adhesive layer. As a manufacturing method of the transparent conductive film laminated | stacked and laid down,

The 2nd film manufacturing process in which the adhesive bond layer was formed which makes an adhesive bond layer in a 2nd film and forms a roll body of a 2nd film which has an adhesive bond layer, and the 2nd film in which the said adhesive bond layer was formed, and the said 1st film were adhere | attached, It has a lamination process made into a transparent conductive film,

The second film manufacturing process in which the adhesive layer is formed,

An adhesive sheet forming step of forming an adhesive layer on the first side of the separator,

A second film formation step having an adhesive layer, wherein the second film is supplied to and adhered to an adhesive layer of the adhesive sheet;

And a winding-up step of forming a roll body of the second film on which the adhesive layer is formed by winding it over the core while supplying spacers to both ends between the second surface of the separator and the second film layer of the second film on which the adhesive layer is formed. Will,

The said 1st film is a roll body of the 1st film wound up on the core by supplying a spacer to both ends,

The lamination step is a second film supply step in which an adhesive layer is formed, wherein the second film having the adhesive layer formed thereon is removed from the roll body, and the spacer and the separator are removed. It has a 1st film supply process and the adhesion process of laminating | stacking the 2nd film and the 1st film in which the said adhesive bond layer was formed through the adhesive bond layer, It is characterized by the above-mentioned.

In both of the first invention and the second invention, both the first film and the second film to be laminated are wound with the spacers interposed therebetween and provided in a lamination process as a roll body. Since the spacer has a function for preventing the wound film from being in close contact with each other and the pressure applied to the film in the state of being rolled up and preserved as a roll body by the spacer, the foreign material is the outermost surface of the film, for example. Even when attached on the hard coat layer or on the antiglare layer or the transparent conductive layer, unevenness due to damage is less likely to occur.

In particular, the first film having the adhesive layer or the second film having the adhesive layer is plastically deformed in the adhesive layer due to the pressure generated when the film is rolled up when foreign matter adheres and is mixed with the film without the adhesive layer. Since the scratches are more easily generated because they are not generated and recovered, the pressure applied to the adhesive layer becomes smaller by winding the spacers in between, which makes it difficult to generate scratches.

In addition, although the antiglare layer formed the unevenness | corrugation on the surface by mixing transparent particle | grains, for example, when a 1st film which has an antiglare layer or the 1st film in which the adhesive bond layer was formed and left to stand by this structure, a foreign material will be mixed. As in the case of S, it is easy to generate a scar, but the wound is effectively suppressed by wrapping the spacers interposed therebetween.

In the case where the transparent conductive film, which is a product manufactured through the lamination process, is wound around the core to form a roll body, it is a preferred embodiment to wind the spacer between them.

In addition, although the 1st film in 1st invention and the 2nd film in 2nd invention are all supplied to the 1st film in which the adhesive bond layer was formed as a roll body, or the 2nd film manufacturing process in which the adhesive bond layer was formed, such a roll body also uses a spacer. It is preferable to wind it in between.

In the manufacturing method of the electroconductive film mentioned above, it is preferable to supply so that the said spacer may have an adhesive bond layer in one surface, and the adhesive bond layer formation surface of the said spacer may contact the said separator in the said winding process.

By using a spacer having an adhesive layer, a problem of shifting sideways when the film is wrapped around the core while supplying the spacer to both ends and a problem of the spacer falling out is prevented from occurring and a problem that the spacer is wound in a distorted state. Running and process operability are obtained. In addition, it is possible to prevent the occurrence of a problem that the spacer is displaced or dislodged during the movement of the roll, which is overlapped with the spacer in a predetermined manner.

In the transparent conductive film obtained by the present invention, the first film and the second film are preferably bonded to and laminated with the second surface of the first substrate and the second surface of the second substrate through an adhesive layer.

By such a configuration, a transparent conductive film having excellent optical characteristics can be obtained.

In this case, although the unprocessed layer may be sufficient as the 2nd surface of the 1st base material which comprises a 1st film, and the 2nd surface of the 2nd base material which comprises a 2nd film, it is preferable that the oligomer prevention layer is formed in at least one. . The oligomer prevention layer has the function of preventing the oligomer contained in the 1st base material-the 2nd base material to transfer to an adhesive bond layer, and a transparent conductive film from becoming a bad appearance. As for an oligomer prevention layer, it is more preferable that it is formed in each 2nd surface of a 1st base material and a 2nd base material.

In this invention, it is preferable as a low cost that the said spacer consists of a thermoplastic resin film.

In the said invention, it is preferable that the width of the said spacer is 5 mm-100 mm.

When the width of the spacer is smaller than 5 mm, since the pressure applied to each film in the roll bodies of the first to second films cannot be sufficiently reduced, scratches tend to occur. In addition, when the width of the spacer is larger than 100 mm, when the film is released from the roll body and pulled, the trace of the spacer is generated and the film area that becomes poor in appearance becomes large.

Best Mode for Carrying Out the Invention

Although it does not specifically limit regarding the material of the spacer used by this invention, When it is left as a roll body, it must not produce adhesion | attachment or adhesion | attachment, such as a transparent conductive film, an antiglare layer, etc. of a film. Specifically, cushioning properties include rigid thermoplastic resins such as polyesters such as polyethylene terephthalate, polyamide, polyvinyl chloride, polystyrene, polyethylene, and polypropylene, rice paper, nonwoven fabric, urethane foam sheet, and polyethylene foam sheet. This excellent material can be illustrated. When the material excellent in cushioning property is used as a spacer, since the streak does not generate | occur | produce in the edge part of a spacer, since the effective area | region of the transparent conductive film obtained can be made wider, it is more preferable.

DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described with reference to the drawings. In the following example, although the example of 1st invention which forms an adhesive bond layer in the 1st film which has a hard-coat layer, and laminated | stacks with a 2nd film was shown, the 2nd which forms an adhesive bond layer in a 2nd film and laminates with a 1st film The invention can also be carried out in the same manner.

FIG. 1 is a model diagram illustrating a first film production process in which an adhesive bond layer is formed by winding an adhesive bond layer on a first film.

The separator 10 is unrolled from the roll body 20 and apply | coated the adhesive agent 34 to the 1st surface (upper surface) by the doctor blade 36, It is dried in the oven 38, and the separator 17 which has an adhesive bond layer is carried out. Is formed. After the 1st film 16 is unwound and supplied from the roll body 22 and crimped | bonded with the separator 17 which has an adhesive bond layer by the 1st pressing roll 30, the spacer 14 which has an adhesive bond layer is made into the 2nd separator of a separator. It is supplied to both ends of the surface (lower surface), adhere | attached by the 2nd press roll 32, and is wound up to the core as the 1st film 12 in which the adhesive bond layer was formed which has a spacer at both ends, and it is set as the roll body 26. The spacer 24 does not exist in the width direction center part of a 1st film, and the part which does not apply pressure between a space | gap or a film is formed when it rolls up as the roll body 26.

The structure of the 1st film 12 in which the adhesive bond layer was formed which has a spacer at both ends is illustrated in FIG. 2 (a) is a perspective view, in which spacers 14 are bonded to both ends of the first film 12 on which an adhesive layer is formed. (B) is sectional drawing which shows the A-A cross section of FIG. The separator in which the adhesive layer 44 was formed in the 2nd surface of the 1st base material 42 of the 1st film 16 in which the hard coat layer or the antiglare layer 40 was formed in the 1st surface of the 1st base material 42 ( 10) are stacked. The spacer 14 is adhered to the second surface (lower surface) of the separator 10. The adhesive layer between the spacer 14 and the separator 10 is not shown.

FIG. 3 is a model diagram illustrating a lamination process for producing a transparent conductive film using the first film 12 having an adhesive layer formed by the method illustrated in FIG. 1.

The first film 12 having the adhesive layer formed on the roll body 26 produced in the process illustrated in FIG. 1 is simultaneously peeled off and wound up as a roll body 72 by the spacer 14 and the separator 10. The 1st film is supplied to the 3rd press roll 68 (1st film supply process in which the adhesive bond layer was formed). The second film 62 is unwound from the roll body 60 while being separated from the spacer 64 and wound up as a roll body 66 (second film supply step), and the adhesive layer is exposed by peeling off the separator 10. It is crimped | bonded and laminated by the 1st film in which the adhesive bond layer was formed, and the 3rd press roll 68, and the transparent conductive film 70 is formed (adhesion process). The spacer 76 having an adhesive layer is supplied to both ends of the obtained transparent conductive film 70 and adhered by the fourth pressing roll 69, and then wound around the core as a roll body 82.

In FIG. 5, the spacer bonding process which makes the transparent conductive film 70 adhere | attach with the 4th pressing roll 69, supplying a spacer to the both ends of the width direction, and makes it the transparent conductive film 80 which has a spacer in perspective view Indicated. The spacer 76 may be directly wound and fed to the roll body when winding up without using the fourth pressing roll.

4 is a cross-sectional view showing a B-B cross section of the transparent conductive film 80 having a spacer. The transparent conductive film 70 has a transparent conductive layer on the first film 16 having the hard coat layer 40 formed on the first surface of the first substrate 42 and the first surface of the second substrate 50. The 2nd film (conductive film) 62 with which the 52 was formed has the structure which adhere | attached the 2nd surface of the 1st base material 42 and the 2nd base material 50 with the adhesive bond layer 44, and was laminated | stacked. In the B-B cross section of the transparent conductive film 80 which has a spacer, the spacer 76 is laminated | stacked with the adhesive bond layer 77 in between. In the width direction center part of a transparent conductive film, the spacer 76 does not exist and when it rolls up as the roll body 82, the part which pressure is not applied between a space | gap and a film is formed.

As for the "both ends" in supply of the 1st film of this invention, the 1st film in which an adhesive bond layer was formed, the 2nd film, the 2nd film in which an adhesive bond layer was formed, and the transparent conductive film, the edge of a left-right spacer is each film It does not need to coincide with the end of, it means that it is just located at almost the end. In addition, the left and right spacers need not be the same width. The separator used for a 1st film, the 1st film in which an adhesive bond layer was formed, the 2nd film, the 2nd film in which an adhesive bond layer was formed, and a transparent conductive film may be the same, and may differ, respectively.

Although the winding width of an electroconductive film roll is not specifically limited, Usually, it is 300 mm-2000 mm.

Although the structure of the transparent conductive film 70 is not limited to what was illustrated in FIG. 4, one surface is a transparent conductive layer.

As for the surface of the 1st film 16, the antiglare layer may be formed in the 1st surface of the 1st base material 42 instead of the hard coat layer 40, and the two layers of a hard coat layer and an antiglare layer are formed. You may be. Another functional layer may be formed between the first film 16 and the hard coat layer 40 or between the first film 16 and the antiglare layer. In this functional layer is a reflection layer, a transparent dielectric layer formed of SiO _2, TiO ₂ and the like. The functional layer may be composed of a plurality of layers.

In addition, the 2nd film (conductive film) 62 may be a thing in which at least 1 functional layer was formed between the 2nd base material 50 and the transparent conductive layer 52, for example. In this functional layer is an anti-reflection layer formed in the first film in the same manner as SiO _2, TiO _2, etc., a transparent dielectric layer and the like.

As the 1st base material 42 and the 2nd base material 50, a well-known transparent resin base material can be used without a restriction | limiting. Specifically, polyester resin, such as PET, acetate resin, polyether sulfone resin, polycarbonate resin, polyamide resin, polyimide resin, polyolefin resin, (meth) acrylic resin, polyvinyl chloride Resin, polyvinylidene chloride resin, polystyrene resin, polyvinyl alcohol resin, polyallylate resin, polyphenylene sulfide resin and the like. The same material may be used for a 1st base material and a 2nd base material, and another material may be used.

As the material constituting the transparent conductive layer 52 of the second film (conductive film 62), the hard coat layer of the first film 16, and the antiglare layer constituent material, all known materials can be used without limitation.

In the second film 62, when the transparent dielectric layer is formed between the second substrate 50 and the transparent conductive layer 52, the constituent material is inorganic such as titanium oxide formed by sputtering, vacuum evaporation, or the like. Polyurethane resin, acrylic resin, siloxane polymer, etc. which are formed by a material and a coating method are illustrated.

A well-known material can be used as a material which comprises the oligomer prevention layer preferably formed in the 2nd surface of a 1st base material, and the 2nd surface of a 2nd base material. Specifically, resin materials such as acrylic resins, urethane resins, melamine resins, ultraviolet curable resins, epoxy resins, composite materials of the above resin materials and inorganic materials such as alumina, silica, mica, gold, platinum, silver, palladium, Metal oxides such as metal materials such as copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, and alloys of these metals, indium oxide, tin oxide, titanium oxide, cadmium oxide or a mixture of two or more selected from these And metal compounds such as copper iodide and the like.

The formation method of an oligomer prevention layer is suitably selected from a well-known method according to the material to be used, and is used. When using the resin material mentioned above or the composite material using these resin as an oligomer prevention layer, the coating method using a coater, the spray method, the spin coat method, and the in-line coat method can be used, for example.

When using a metal material, a metal oxide, and a metal compound as an oligomer prevention layer component material, a vacuum vapor deposition method, sputtering method, an ion plating method, a spray decomposition method, a chemical plating method, an electroplating method, etc. can be used, for example.

The adhesive which comprises the adhesive bond layer 44 which laminate | stacks a 1st film and a 2nd film can use a well-known material without a restriction | limiting, Specifically, an acrylic resin type adhesive, a silicone type adhesive, a rubber type adhesive etc. are illustrated as a preferable material. Moreover, when forming an adhesive bond layer in a spacer, it is preferable to use a pressure sensitive adhesive (adhesive) as an adhesive agent. Also known as such pressure-sensitive adhesives can be used without limitation, such as rubber-based, acrylic resin-based pressure-sensitive adhesives, and appropriately selected in consideration of the peelability when the film is used again by unwinding.

Example

(Example 1)

The HC film (1st film) which has the hard-coat process layer of thickness 5micrometer which consists of acrylurethane resin on the 1st surface of 125-micrometer-thick PET film (1st base material) was obtained.

A 25-micrometer-thick acrylic pressure-sensitive adhesive layer was formed on the 38-micrometer-thick separator using a fountain coater, and adhered to the surface (second surface) where the hard coat treatment layer of the PET film as the first base material of the first film was not formed. It was made into the HC film adhesive product (the 1st film in which the adhesive layer was formed). The HC film adhesive was wound around both ends of the HC film adhesive after inserting a polyolefin-based coextrusion protective film (adhesive force: 30mN / 25mm according to JIS-Z-1552) to be bonded to the separator at both ends. All.

An ITO deposited film was formed on the first side of a 23 μm-thick PET film (second base material) to produce an ITO film (second film), and a 10 mm wide PET film was formed on both ends as spacers. Winding while inserting to the non-surface (second side).

The HC film adhesive product (first film having an adhesive layer formed) was released from the roll body, and at the same time, the polyolefin-based coextrusion protective film, which was a separator and a spacer, was wound. The ITO film (2nd film) was unwound from the roll body, the surface (second surface) in which the ITO vapor deposition film was not formed, and the acrylic adhesive layer were affixed, while winding the PET film of width 10mm which is a spacer, and obtained the transparent conductive film. .

As a result of calculating the damage incidence rate of this transparent conductive film, the mark of phi <300 micrometers was (4 piece / m <2>), and the mark of phi> 300 micrometers was (2 piece / m <2>). The magnitude (φ) of the scar was indicated by the size of the foreign matter that caused it. Marking inspection The sampling was extracted 1000 mm x 1000 mm from the roll body, and the inspection method was examined by visual inspection of the reflected light under a fluorescent lamp. The calculation method about the size (phi) of a foreign material is shown in FIG.

(Comparative Example 1)

Same as in Example 1, except that no polyolefin coextrusion protective film (spacer) was inserted in the process of winding the HC film adhesive product, and no PET film (spacer) having a width of 10 mm was inserted in the process of winding the ITO film. The transparent conductive film was obtained by the method.

As a result of calculating the damage incidence of this transparent conductive film, the rubbing with φ <300 μm was (16 pieces / m 2) and the rubbing with φ ≧ 300 μm was (7 pieces / m 2). Marking inspection The sampling was extracted 1000 mm x 1000 mm from the roll body, and the inspection method was examined by visual inspection of the reflected light under a fluorescent lamp.

According to the manufacturing method of the transparent conductive film of this invention, the number of other strokes is suppressed compared with the past, and when it is set as a display, the advantage of being able to manufacture a transparent conductive film roll, without defect of a image, a deformation | transformation, etc. generate | occur | produce, and degrading a display quality. There is this.

1 is a model diagram illustrating a first film manufacturing process in which an adhesive layer is formed.

FIG. 2 is a diagram illustrating a structure of a first film on which an adhesive layer is formed, having spacers at both ends. FIG.

3 is a model diagram illustrating a lamination step of manufacturing a transparent conductive film.

4 is a cross-sectional view showing a transparent conductive film having a spacer.

5 is a diagram illustrating a step of adhering spacers to both ends in the width direction of the transparent conductive film.

Fig. 6 is a diagram showing a calculation method of φ which is a foreign matter size.

* Explanation of symbols for the main parts of the drawings *

16: 1st film

18: first film having an adhesive layer formed

10: separator

62: second film

70: transparent conductive film

Claims (6)

The transparent conductive film in which the 1st film which has a hard-coat layer and / or antiglare layer in the 1st surface of a 1st base material, and the 2nd film which has a transparent conductive film in the 1st surface of a 2nd base material are laminated | stacked through the adhesive bond layer. As a manufacturing method of A 1st film manufacturing process in which the adhesive bond layer was formed and the 1st film in which the adhesive bond layer was formed, and the said 2nd film are adhere | attached, forming an adhesive bond layer in a 1st film and making it into the roll body of a 1st film which has an adhesive bond layer. Has a lamination step of laminating to form a transparent conductive film, The first film manufacturing process in which the adhesive layer is formed, An adhesive sheet forming step of forming an adhesive layer on the first side of the separator, 1st film formation process in which the adhesive bond layer was formed which supplies and adhere | attaches the said 1st film to the adhesive bond layer of the said adhesive sheet, And a winding-up step of forming a roll body of the first film on which the adhesive layer is formed by winding it around the core while supplying spacers to both ends between the second surface of the separator and the first film layer of the first film on which the adhesive layer is formed. In that, The said 2nd film is a roll body of the 2nd film wound on the core by supplying a spacer to both ends, The lamination step is a first film supply step in which an adhesive layer is formed, wherein the first film on which the adhesive layer is formed is removed from the roll body, and the spacer and the separator are removed, and the second film is removed from the roll body, and the spacer is removed at the same time. It has a 2nd film supply process, and the bonding process of laminating | stacking the 1st film and 2nd film in which the said adhesive bond layer was formed through the adhesive bond layer, The manufacturing method of the transparent conductive film characterized by the above-mentioned. The transparent conductive film in which the 1st film which has a hard-coat layer and / or antiglare layer in the 1st surface of a 1st base material, and the 2nd film which has a transparent conductive film in the 1st surface of a 2nd base material are laminated | stacked through the adhesive bond layer. As a manufacturing method of The 2nd film manufacturing process in which the adhesive bond layer was formed which makes an adhesive bond layer in a 2nd film and forms a roll body of a 2nd film which has an adhesive bond layer, and the 2nd film in which the said adhesive bond layer was formed, and the said 1st film were adhere | attached, It has a lamination process made into a transparent conductive film, The second film manufacturing process in which the adhesive layer is formed, An adhesive sheet forming step of forming an adhesive layer on the first side of the separator, A second film formation step of forming an adhesive layer for supplying and bonding the second film to the adhesive layer of the adhesive sheet; And a winding-up step of forming a roll body of the second film on which the adhesive layer is formed by winding it over the core while supplying spacers to both ends between the second surface of the separator and the second film layer of the second film on which the adhesive layer is formed. Will, The said 1st film is a roll body of the 1st film wound up on the core by supplying a spacer to both ends, The lamination step includes a second film supply step in which an adhesive layer is formed to unwind the second film on which the adhesive layer is formed from the roll body and remove spacers and separators, and a second step of unwinding the first film from the roll body and removing the spacer. 1 A film supply process and the adhesion process of laminating | stacking the 2nd film and the 1st film in which the said adhesive bond layer was formed through the adhesive bond layer, The manufacturing method of the transparent conductive film characterized by the above-mentioned. The conductive film according to claim 1 or 2, wherein the spacer has an adhesive layer on one side thereof, and in the winding step, the spacer is supplied such that the adhesive layer forming surface of the spacer is brought into contact with the separator. Manufacturing method. The said transparent conductive film is a said 1st film and a 2nd film, The 2nd surface of a 1st base material, and the 2nd surface of a 2nd base material adhere | attached and laminated | stacked through the adhesive bond layer of Claim 1 or 2. The manufacturing method of the transparent conductive film characterized by the above-mentioned. The method for producing a transparent conductive film according to claim 1 or 2, wherein the spacer is made of a thermoplastic resin film. The width | variety of the said spacer is 5 mm-100 mm, The manufacturing method of the transparent conductive film of Claim 1 or 2 characterized by the above-mentioned.