KR20050034873A - Plasma display device - Google Patents

Abstract

According to the present invention, a plasma display device is disclosed. The plasma display apparatus includes a plasma display panel, a chassis base disposed in parallel with the plasma display panel, and at least one circuit board coupled to the chassis base to drive the plasma display panel. At least one chassis member is further provided between the bases, and an electronic component provided on the circuit board is coupled to the chassis member. According to the disclosed plasma display device, heat dissipation of electronic components can be promoted, and workability and handling for installing a circuit board can be improved. In addition, the degree of freedom in designing the parts of the plasma display device can be secured.

Description

Plasma display device

The present invention relates to a plasma display device, and more particularly, to a plasma display device having an air cooling unit to improve heat radiation efficiency.

The plasma display device is a flat panel display device for displaying an image by using a discharge phenomenon. The plasma display device is excellent in various display capacities such as display capacity, brightness, contrast, afterimage, and viewing angle. It is attracting attention as a replaceable display device.

The plasma display apparatus includes a plasma display panel including a front panel and a rear panel, a chassis base disposed to face the plasma display panel, and a heat dissipation sheet interposed between the plasma display panel and the chassis base. A circuit portion for driving the plasma display panel is provided on the back side.

Here, the circuit part is made up of various kinds of circuit boards having different connection specifications such as the weight, heat generation amount, and the like, and the height and position of the connection part for installing the same in the chassis base, even if the circuit board performs the same function. There is a difference in the connection specifications and the like.

However, in order to directly couple these various types of circuit boards to one chassis base, an integrated design is required. For this purpose, connection specifications and maintenance conditions of each circuit board are constrained, thereby limiting the freedom of component design. There is.

In order to solve such a problem, according to the technique disclosed in Japanese Patent Laid-Open No. 2003-066862, circuit boards constituting the circuit portion are properly distributed and arranged on a plurality of subplates and mounted on the chassis base. Therefore, even if the connection specification or the like is changed due to the design change, it is possible to cope with this by the structural change of the subplate, thereby securing the degree of freedom in the part design.

However, according to the prior art, for the heat dissipation of electronic components such as a field effect transistor (FET) provided in the circuit board, a heat sink must be provided for each element. Therefore, there is a problem that the heat dissipation area is limited to the heat dissipation plate to prevent efficient heat dissipation, and the process is wasted in preparing and installing the heat dissipation plate to be provided in plurality, and the manufacturing cost increases.

In particular, since the heat sink is installed on the back of the electronic component, heat emitted from the heat sink located on the circuit board deteriorates other circuit elements provided in the circuit board. Therefore, there is a problem that the driving efficiency of the plasma display device is lowered and the quality of the product is lowered.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and the object of the present invention is to provide a plasma display device having an improved structure such that heat dissipation of electronic components is promoted, and a process for reducing heat dissipation and manufacturing cost can be reduced. have.

Another object of the present invention is to provide a plasma display device having improved workability and handleability for installing a circuit board.

It is still another object of the present invention to provide a plasma display device having an improved structure to ensure freedom of component design.

In order to achieve the above object, the plasma display device of the present invention, a plasma display panel, a chassis base disposed in parallel with the plasma display panel and at least one coupled to the chassis base to drive the plasma display panel. In the plasma display device having a circuit board, at least one chassis member is further provided between the circuit board and the chassis base, and an electronic component provided on the circuit board is coupled to the chassis member. Here, the chassis member may be provided as a thermally conductive plate.

In addition, at least one of the chassis members may be coupled to at least one of the circuit boards.

In addition, the chassis member may include a first coupling portion coupled to the chassis base, a second coupling portion coupled to the circuit board, and a third coupling portion coupled to the electronic component.

A boss is provided in the chassis base, and a first through hole is provided in the circuit board, and the first coupling part is provided as an opening, and a fastening means penetrates the first through hole and the first coupling part to the boss. Can be fastened.

In addition, a second through hole may be formed in the circuit board, and the second coupling part may be provided as an opening, and a fastening means may be fastened through the second through hole and the second coupling part.

In addition, a connection hole is formed in the electronic component, and the third coupling part is provided as an opening, and a fastening means can be fastened through the connection hole and the third coupling part.

Hereinafter, with reference to the accompanying drawings, it will be described in detail a preferred embodiment of the present invention.

1 is an exploded perspective view of a plasma display device according to an exemplary embodiment of the present invention, and FIG. 2 is a diagram illustrating a coupling state between an electronic component and a chassis member of the plasma display device shown in FIG. 1. 3 is a diagram illustrating a coupling state between an electronic component and a chassis member of a plasma display device according to another embodiment of the present invention, and FIGS. 4 and 5 are diagrams illustrating a plasma display device according to another preferred embodiment of the present invention. Cross-sectional views.

Referring to FIG. 1, the plasma display apparatus 1 includes a plasma display panel 5, a heat dissipation sheet 30, a chassis base 60, a circuit board 80, the chassis base 5, and a circuit board. It is provided with the chassis member 70 interposed between 80.

The plasma display panel 5 is provided with a front panel 10 and a back panel 20 bonded to each other. The plasma display panel 5 made of a glass material becomes an image display unit for implementing an image by using a discharge phenomenon.

A heat dissipation sheet 30 is interposed between the plasma display panel 5 and the chassis base 60, and the heat dissipation sheet 30 transfers heat generated inside the plasma display panel 5 to the chassis base 60. It serves to convey.

The rear surface of the chassis base 60 is provided with a circuit board 80 and the chassis member 70, for this purpose, it is provided with a concave-convex shape such as boss 61 or a hole (not shown) for passing the wiring. .

Since the chassis base 60 serves as a heat sink to promote heat dissipation of the plasma display panel 5 and the circuit board 80, the chassis base 60 is made of a material such as aluminum having excellent thermal conductivity. The chassis base 60 may be manufactured by die casting.

A circuit board 80 is installed on the rear surface of the chassis base 60, and the circuit board 80 includes various circuit boards such as a common circuit board, a power circuit board, and a digital circuit board.

In the plasma display device 1 configured as described above, according to an aspect of the present invention, a chassis member 70 is interposed between the chassis base 60 and the circuit board 80, and the circuit board 80 is disposed. An electronic component 83 provided at is coupled to the chassis member 70.

As shown in FIG. 1, the chassis member 70 may be provided with a plate formed with a step, and the chassis member 70 may include a chassis member 70 and a chassis base 60 and a circuit board 80. A first coupling portion 71 for coupling, a second coupling portion 72 for coupling with the circuit board 80, and a third coupling portion 73 for coupling with the electronic component 83 are provided.

As shown in FIG. 1, the first coupling part 71 fixing the chassis member 70 between the chassis base 60 and the circuit board 80 is provided with an opening formed in the chassis member 70. In addition, a first through hole 81 is formed in the circuit board 80, and a boss 61 is formed on the rear surface of the chassis base 60 so that the fastening means 100, for example, a screw passes through the first through hole 81. Through the ball 81 and the first coupling portion 71 is screwed to the boss 61 formed in the chassis base 60, the chassis member 70 is the chassis base 60 and the circuit board 80 It is fixed in between.

On the other hand, the edge of the chassis member 70 is provided with a step, and the second coupling portion 72 is provided on one surface protruding to form the step. The second coupling portion 72 is provided with an opening, and a second through hole 82 is formed in the circuit board 80 so that the fastening means 100, for example, a bolt is connected to the second coupling portion 72. The chassis member 70 and the circuit board 80 are coupled by penetrating through the second through hole 82.

When the circuit board 80 is completely sealed by the edge where the step is formed, since the outside air may be blocked and heat dissipation of the circuit board 80 may be lowered, the inflow and exhaust of the outside air is illustrated in FIG. 1. As noted, it is preferably provided in an open form.

As shown in FIGS. 1 and 2, a step is formed at one side of the edge of the chassis member 70, and a third coupling part 73 is formed at one surface which protrudes and forms the step. The third coupling part 73 may be provided as an opening, and a connection hole 83a is formed in the electronic component 83 provided in the circuit board 80, so that the connection hole 83a and the third coupling part are provided. The chassis member 70 and the electronic component 83 are coupled to each other by fastening means 100, for example, a bolt, to penetrate 73.

On the other hand, the chassis member 70 is preferably provided with a high thermal conductivity material such as aluminum to promote the heat dissipation of the circuit board 80 and the electronic component 83.

If the chassis member 70 of the present invention is provided, the following effects can be obtained.

According to the present invention, the electronic component 83 is directly coupled to the chassis member 70 having a large heat dissipation area, thereby facilitating heat dissipation of the electronic component 83. Here, since heat generated in the electronic component 83 is transferred to the chassis base 60 through the chassis member 70, the other circuit elements constituting the circuit board 80 are prevented from deteriorating, and the circuit The substrate 80 can be protected efficiently.

In addition, it is possible to shorten the process required to prepare and install a plurality of heat sinks separately attached to the electronic component 83 and to reduce manufacturing costs.

In addition, when two or more circuit boards 80 are coupled to one chassis member 70 together, a plurality of circuit boards 80 may be handled integrally, and thus workability for installation of the circuit boards 80 and Handleability can be improved.

According to the present invention, by holding various kinds of chassis members 70 corresponding to circuit boards 80 having different holding conditions, the holding conditions of each circuit board 80 can be actively accommodated. For example, in the case of a circuit board having a large amount of heat generation, a thicker chassis member 70 may be used to increase the heat capacity.

In addition, by changing only the structure of the chassis member 70, which is relatively easy to change the design, it is possible to cope with changes in the maintenance conditions, the connection specifications and the like. For example, by changing the positions of the coupling parts 71 and 72 provided in the chassis member 70 in response to the change of the positions of the through holes 81 and 82 formed in the circuit board 80, this may be corresponded. . Therefore, the design freedom of the circuit board 80 or the like is improved.

Meanwhile, according to another exemplary embodiment of the present invention, the electronic component 83 may be attached to the chassis member 70 using the thermally conductive adhesive 90, as shown in FIG. 3. . In this case, the electronic component 83 and the chassis member 70 need not be provided with the connection hole and the third coupling portion, respectively.

In addition, as shown in FIG. 4, the chassis member 70 may be attached to the chassis base 60 using a double-sided tape 91 having thermal conductivity, or a heat dissipation material (not shown) or the like. The chassis member 70 and the chassis base 60 may be coupled to each other by using a thermally conductive adhesive (not shown).

In addition, as shown in FIG. 5, heat generated from the circuit board 80 is interposed between the chassis member 70 and the circuit board 80 through the heat dissipating member 92. It can be delivered to the chassis member (70). In this case, the adhesion between the chassis member 70 and the circuit board 80 may be improved by interposing the heat dissipating member 92.

In the case of the chassis member 70, the heat dissipation portion at the center thereof is provided in a plane, but in addition, the heat dissipation portion may have a concave-convex shape to improve the contact area with the outside air.

According to the plasma display device configured as described above, the following effects can be achieved.

First, heat dissipation of electronic components can be promoted by allowing electronic components such as FETs to be directly coupled to the chassis member of the present invention having a large heat dissipation area. Here, since the heat generated in the electronic component is transferred to the chassis base side through the chassis member, the other circuit elements constituting the circuit board can be prevented from being deteriorated, and the circuit board can be efficiently protected. Therefore, the driving efficiency of the plasma display device is improved, and the product quality is improved.

In addition, according to the present invention, since a plurality of electronic components may be coupled to one chassis member, the process may be shortened and manufacturing costs may be reduced as compared with a method in which a heat sink is attached to each element individually.

Second, when two or more circuit boards are coupled together to one chassis member, the plurality of circuit boards can be handled integrally, thereby improving workability and handling for installation of the circuit board.

Third, according to the present invention, since the circuit board is not directly coupled to the chassis base, but the chassis member of the present invention is coupled to the chassis base through the chassis member, even if the connection specification is changed due to a design change of the circuit board, for example, Without fabricating the chassis base, it is possible to cope with this by changing the structure of the chassis member, which is relatively easy to manufacture. Therefore, the freedom of designing the part including the circuit board can be secured, and the structural change can be minimized.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and various modifications and equivalent other embodiments are possible for those skilled in the art to which the present invention pertains. You will understand the point. Accordingly, the true scope of protection of the invention should be defined by the appended claims.

1 is an exploded perspective view of a plasma display device according to an embodiment of the present invention;

FIG. 2 is a diagram illustrating a state in which an electronic component and a chassis member of the plasma display device of FIG.

3 is a diagram illustrating a coupling state between an electronic component and a chassis member of a plasma display device according to another embodiment of the present invention;

4 and 5 are cross-sectional views of a plasma display device according to an exemplary embodiment of the present invention, which are different from each other.

<Description of the symbols for the main parts of the drawings>

1 ... plasma display device 5 ... plasma display panel

10 ... front panel 20 ... rear panel

Heat dissipation sheet 60 Chassis base

61 Boss 70 Chassis member

71 ... first coupling part 72 ... second coupling part

73 third coupling part 80 circuit board

81 ... first through hole 82 ... second through hole

83 ... electronic components 83a ... connector

90 Adhesive 91 Double Sided Tape

92 Heat dissipation material 100 Fastening means

Claims (7)

A plasma display device comprising: a plasma display panel; a chassis base disposed in parallel with the plasma display panel; and at least one circuit board coupled to the chassis base to drive the plasma display panel. At least one chassis member is further provided between the circuit board and the chassis base, and an electronic component provided on the circuit board is coupled to the chassis member. The plasma display apparatus of claim 1, wherein the chassis member is formed of a thermally conductive plate. The plasma display apparatus of claim 1, wherein at least one of the chassis members is coupled to at least one of the circuit boards. The plasma display device of claim 1, wherein the chassis member includes a first coupling portion coupled to the chassis base, a second coupling portion coupled to the circuit board, and a third coupling portion coupled to the electronic component. Display device. According to claim 4, wherein the chassis base is provided with a boss, the circuit board is provided with a first through hole, the first coupling portion is provided with an opening, the fastening means is penetrated through the first through hole and the first coupling portion Plasma display device, characterized in that coupled to the boss. The plasma board of claim 4, wherein a second through hole is formed in the circuit board, and the second coupling part is formed as an opening, and the fastening means is fastened through the second through hole and the second coupling part. Display device. The plasma display apparatus of claim 4, wherein a connection hole is formed in the electronic component, and the third coupling part is formed as an opening, and the fastening means is fastened through the connection hole and the third coupling part.