KR20050011964A - Strips fixing Apparatus for forming side electrods in chip device manufacturing process - Google Patents

Abstract

PURPOSE: A strip fixing apparatus for forming side electrodes of chip components is provided to prevent the breakage of strips caused due to an impact from outside and to prevent an electrode from being formed on a portion other than the side portion of the chip components. CONSTITUTION: A strip fixing apparatus for forming side electrodes of chip components includes a mounting member(31), a cover(32), a buffer(33), and a coupler(34). A plurality of strips are mounted in one row on the mounting member and a side portion of the mounting member is opened. The cover is integratedly formed at an upper portion of the mounting member to protect the strips mounted on the mounting member. The buffer is unified with an upper portion of the cover and includes an elastic member. The coupler combines or separates the buffer and the cover with/from the mounting member.

Description

Strips fixing Apparatus for forming side electrods in chip device manufacturing process

The present invention relates to a method for manufacturing a chip component that can easily increase the density of the board mounting, and more particularly, a plurality of strip substrates formed by first division and forming a resistor and an upper / lower electrode on an insulating substrate are laminated in a vertical direction. The present invention relates to a strip fixing device for forming side electrodes of chip components that maximizes adhesion between strips to enable uniform side electrode shapes.

As miniaturization and high functionalization of various electronic devices have progressed, many of the components used in the electronic devices have also been easily used for high-density chip components.

Since such chip parts, for example, chip resistors, are used to increase the density of electronic parts to enable light and thin parts, the use thereof is rapidly increasing. For example, the manufacturing process of the chip resistors is illustrated in FIGS. 1A to 1G. As done.

Referring to the manufacturing process of the chip resistor schematically, first, as shown in Figure 1a, sputtering (sputtering) on the upper surface of the insulating substrate 11 is formed with a plurality of slits (s) along the rows and columns at predetermined intervals After applying the thin film resistor through the photolithography process, a thin film resistor 13 having a predetermined shape (pattern) is formed through the photolithography and etching process. The interval between the slits s determines the area of the unit chip component (chip resistor).

Subsequently, as in the case of forming the thin film resistor 13, thin film electrodes 15 having predetermined shapes are formed on the upper and lower surfaces of the insulating substrate 11 through sputtering, photolithography and etching processes as shown in FIG. 1C.

Then, heat treatment is performed on the resultant to stabilize the resistance value, and laser trimming is performed to obtain a precise resistance value. 1D illustrates a laser trimming process, and reference numeral 20 denotes a laser probe. Thereafter, a protective layer for protecting the thin film resistor 13 may be further formed.

Subsequently, the insulating substrate 11 is first divided along the slot s formed in the row (or column) direction to expose side surfaces of the plurality of chip resistors as shown in FIG. 1E. The insulating substrate 11a formed by the first division process shown in FIG. 1E is called a strip and will be described as a strip hereinafter.

Then, the side electrode 17 is formed by applying a sputtering process to both sides of the strip 11a obtained by the first division process as shown in FIG. 1F. Subsequently, the strip 11a on which the side electrodes 17 are formed is secondly divided to form chip units 11b, and then a plating process is performed using an alloy such as nickel, palladium-tin, or the like. To complete the final product.

In this case, the side electrodes are formed by stacking a plurality of strips 11a formed by the first division shown in FIG. 1E in the vertical direction, and then attaching the side electrodes 17 to the plurality of strips 11a by one sputtering process. Form.

FIG. 2 is a perspective view showing a conventional strip fixing device used in the side electrode forming process, in which the strips 11a are stacked in a row in the vertical direction on a lower stack portion 21 having both sides open, The cover 22 is closed and fixed to the lower loading part 21. As such, after stacking and fixing the plurality of strips 11a in the vertical direction, the side electrodes 17 are formed on both side surfaces exposed through the sputtering process.

As a result, the side electrodes of the plurality of strips 11a can be simultaneously formed through one sputtering process.

However, since the conventional strip fixing device merely performs a function of stacking a plurality of strips 11a in a line in the vertical direction, a gap between strips may increase due to bending of the stacked strips. In this case, metal ions may penetrate into the upper and lower sides of the strip 11a through the gap.

In the process of forming the side electrodes, when metal ions penetrate deeply into the inside, an electrode bleeding phenomenon may occur in which the side electrodes are formed up to the thin film resistor 13 formed on the upper surface of the strip 11a. The smearing phenomenon causes a problem of poor solderability and a short problem when the chip component is surface mounted on a circuit board.

The present invention has been proposed in order to solve the above-described problems, and an object thereof is to form a resistor and an upper / lower electrode on an insulating substrate, and to laminate a plurality of strip substrates formed by first division in a vertical direction and to maintain adhesion between strips. It is to provide a strip fixing device for forming the side electrode of the chip component to maximize the shape of the uniform side electrode.

1A to 1G are step by step process diagrams illustrating a method of manufacturing a general chip resistor.

Figure 2 is a perspective view showing a fixing jig for forming a conventional side electrode.

3 is a perspective view showing a strip fixing device according to the present invention.

Figure 4 is a perspective view showing a state in which a plurality of strips fixed with the strip fixing device according to the present invention.

<Description of Symbols for Main Parts of Drawings>

31: loading part

32: cover part

33: buffer part

34: coupling part

As a construction means for achieving the above object of the present invention, the present invention is to first divide the insulating substrate on which the thin film resistor and the upper and lower electrodes are formed into a plurality of strips, and after forming the side electrode on the side of the strip In the strip fixing device for forming a side electrode of a chip component manufactured by dividing into pieces,

A stacking unit in which the plurality of strips are stacked in a row in a vertical direction and open at sides thereof;

A cover part disposed on the loading part to protect a plurality of strips loaded on the loading part;

A buffer unit formed integrally with an upper portion of the cover unit and having an elastic body to apply an elastic force in a loading direction of the strip; And

Characterized in that it consists of a coupling portion for fixing or separating the buffer portion and the cover portion and the loading portion.

In addition, in the strip fixing device of the present invention, the shock absorbing portion and the lower frame integrally formed in the upper portion of the cover portion, and fixed to the vertical direction in the upper portion of the lower frame is fixed to the plurality of strips in the vertical direction by the cushioning function and elastic force And one or more springs to be in close contact with each other, and an upper frame for supporting the springs at the top of the one or more springs. In this case, the coupling part is applied to the spring in the vertical direction so that the spring is closely deformed. It is characterized in that it is formed to couple the upper frame and the loading portion in the vertical direction.

Preferably in the strip fixing device of the present invention, the elastic force of the buffer portion and the position of the coupling portion is characterized in that the interval between the strips loaded on the loading portion is set to 18 ~ 20㎛.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the strip fixing device for forming the side electrode of the chip component according to the present invention.

3 is a perspective view showing the configuration of the strip fixing device according to the present invention. Referring to FIG. 3, the strip fixing device has a stacking portion 31 formed so that a plurality of strips are stacked in a row in a vertical direction and the sides thereof are opened. And a cover part 32 disposed on the loading part 31 to protect the plurality of strips loaded on the loading part 31, and integrally formed on the cover part 32, The shock absorbing part 33 having an elastic body to apply an elastic force in the stacking direction, and the shock absorbing part 33 and the cover part 32 are fixed to or separated from the stacking part 31, and the shock absorbing part 33 is fixed. It is composed of a coupling portion 34 to apply a predetermined force to the elastic body of.

In the above, the mounting portion 31 is a means for stacking the strip 11a formed by primary division of the insulating substrate 11 in the column (or row) direction by the first division process illustrated in FIG. 1E. As the side of the strip 11a is exposed to the outside so that the two faces facing each other corresponding to the side of the strip 11a are opened, and the other faces adjacent to the two sides turned off The two surfaces have a width corresponding to the front and rear surfaces of the strip 11a and are formed vertically, and serve to vertically support the stacked strips 11a to be arranged in a line in the vertical direction.

In addition, the cover part 32 is formed in a shape similar to the upper end surface of the loading part 31, and performs the cover function of the loading part 31.

Next, the shock absorbing portion 33 performs a shock absorbing function by applying a predetermined force downward from the upper portion of the cover portion 32 using the elastic force of the elastic body.

More specifically, the buffer part 33 is fixedly installed in the vertical direction on the lower frame 33c and the upper part of the lower frame 33c integrally formed on the upper portion of the cover portion 32 to the buffer function and elastic force It consists of one or more springs 33b for closely contacting the strips loaded by the vertical direction, and an upper frame 33a for supporting the springs on top of the one or more springs 33b.

In the above, the upper frame 33a exerts a uniform deformation force on the one or more springs 33b, the lower frame 33a applies a force applied by the restoring force of the one or more springs 33b to the lower cover portion 32a. It is uniformly delivered to the strip (11a) through.

The one or more springs 33b are, for example, coil springs, which are compressed or tensioned in the loading direction of the strips 11a.

Subsequently, the coupling part 34 is a means for fixedly coupling the buffer part 33 and the loading part 31, and the buffer part 33 is coupled to the loading part 31 by the coupling part 34. A predetermined deformation force is applied to the spring 33b of the shock absorbing portion 33, which is applied to the strip 11a by pressing the strips 11a stacked on the stacking portion 31 vertically from the top. Absorbs and protects the strips 11a. Accordingly, the coupling part 34 is formed to couple the shock absorbing part 33, the cover 32, and the loading part 31 while applying a predetermined force to the spring 33b of the shock absorbing part 33. .

4 is a view showing the operating state of the strip fixing device according to the present invention, a plurality of strips (11a) in the stacking portion 31 to the upper end portion, and using the coupling portion 34 to the buffer portion 33 ) And the cover portion 32 and the mounting portion 31.

At this time, the spring 33b of the buffer portion 33 is in close contact with the force when fixed by the coupling portion 34, the strip (11a) in close contact with the strip (11a) loaded in the stacking portion (31). Minimizes the gap between the gaps, and also absorbs the impact applied to the strip 11a to prevent breakage of the stacked strips 11a.

In the above, the gap between the plurality of strips (11a) stacked vertically is a suitable range of approximately 18 ~ 20㎛, if the gap between the strips is larger than the above range can penetrate the metal ions and electrode phenomena may occur, If it is smaller than the above range, a force may be excessively applied to the strip 11a to cause breakage. Therefore, the elastic force of the spring 33b provided in the shock absorbing portion 33 is set such that a gap of approximately 18 to 20 μm is formed between the strips 11a disposed below in consideration of the above.

As shown in FIG. 4, after the strips 11a are mounted and fixed in the strip fixing device according to the present invention in a vertical direction, and the sputtering process is performed, the gap between the strips 11a is minimized and thus the strips 11a are provided. This prevents spreading of electrodes on the upper and lower surfaces, and absorbs external shocks that may be applied during the process, thereby preventing breakage of the strip.

According to the above, the strip fixing device according to the present invention can prevent the electrode from being formed in other parts other than the side when forming the side electrode of the chip component, and also breakage of the strip due to external impact in the side electrode forming process. There is also an excellent effect that can be prevented.

Claims (4)

In the strip fixing device for forming a side electrode of a chip component manufactured by firstly dividing an insulating substrate on which a thin film resistor and an upper / lower electrode are formed into a plurality of strips, forming a side electrode on the side of the strip, and then performing a second division. , A stacking unit in which the plurality of strips are stacked in a row in a vertical direction and open at sides thereof; A cover part disposed on the loading part to protect a plurality of strips loaded on the loading part; A buffer unit formed integrally with an upper portion of the cover unit and having an elastic body to apply an elastic force in a loading direction of the strip; Coupling portion for fixing or separating the buffer portion and the cover portion and the loading portion Stripping device for forming the side electrode of the chip component, characterized in that consisting of. The method of claim 1, wherein the buffer portion A lower frame integrally formed on an upper portion of the cover part; One or more springs fixedly installed on the upper part of the lower frame to closely adhere the plurality of strips in the vertical direction by a cushioning function and an elastic force; Stripping device for forming a side electrode of the chip component, characterized in that formed in the upper frame for supporting the spring on top of the one or more springs. The method of claim 2, wherein the coupling portion And a force applied to the spring in the buffer part in a vertical direction to couple the upper frame and the loading part in the vertical direction so that the spring is in close contact deformation. 4. The apparatus of claim 3, wherein the device is Stripping device for forming the side electrode of the chip component, characterized in that the elastic force of the spring and the position of the coupling portion is set so that the interval between the strips loaded on the loading portion is 18 ~ 20㎛.