JP2008243450A - Contact mechanism device, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact mechanism device without needing to form a depression on an element protecting board, and to provide a method of manufacturing the same. <P>SOLUTION: The device includes an element formation substrate 10 provided with a depression 11 for movable part formation, and protective boards 18 jointed to the front and back surfaces of the element formation substrate 10; and is characterized in that external connection terminals 17 are formed on the element formation substrate 10, an element skeleton 12 is formed in the depression 11; conductive parts 15 and 16 electrically connected to contact parts and the external connection terminals are formed on the element skeleton 12; the element skeleton 12 has a magnetic material 13; and the element skeleton 12 executes switching operation in the depression 11 by applying a magnetic field thereto. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a contact mechanism device and a manufacturing method thereof.

  Conventionally, regarding a contact mechanism device, “a contact mechanism device having a thin package and a method of manufacturing the contact mechanism device are provided. As a technology for the purpose of "a package by bonding an element forming substrate 35 on which a contact element (switch element 25) is formed and an element protection substrate 21 for protecting the contact element (switch element 25)" Is formed. Further, the contact element (switch element 25) includes magnetic bodies 26a and 28a, and switching is performed by applying a magnetic field to the magnetic bodies 26a and 28a. Is proposed (Patent Document 1).

JP 2005-108471 A (summary)

  The structure described in Patent Document 1 has a problem that the base becomes thick because a recess for accommodating the contact element is formed in the element protection substrate. Moreover, the process for forming a dent in an element protection board is required, and there also existed the subject that manufacturing cost started.

  Therefore, a contact mechanism device that does not require the formation of a recess in the element protection substrate and a manufacturing method thereof have been desired.

  A contact mechanism device according to the present invention has an element forming substrate provided with a recess for forming a movable part, and a protective substrate bonded to the front and back of the element forming substrate, and the element forming substrate has an external connection terminal. An element skeleton is formed in the recess, and a conductive portion is formed in the element skeleton to be electrically connected to the contact portion and the external connection terminal. The element skeleton has a magnetic material and applies a magnetic field. By doing so, the element skeleton performs a switching operation in the recess.

  According to the contact mechanism device according to the present invention, the element skeleton is formed in the recess of the element forming substrate, and the protective substrate is bonded to the front and back of the element substrate. Therefore, it is necessary to form a recess for housing the element on the protective substrate. In addition, the thickness of the contact mechanism device can be suppressed, and it is advantageous from the viewpoint of manufacturing cost.

Embodiment 1 FIG.
1 is a perspective view of a manufacturing process of a contact mechanism device according to Embodiment 1 of the present invention. Here, a portion to be a single contact mechanism device and its periphery are illustrated, but generally, a plurality of contact mechanism devices are created on one element configuration substrate and cut individually by scratch or the like.

First, as shown in FIG. 1A, a resist pattern is formed on the element forming substrate 10 by a photolithography method or the like, and a movable portion forming recess 11 is formed by etching.
Next, as shown in FIG. 1B, the element skeleton 12 is similarly formed.
Next, as shown in FIG. 1C, the magnetic body portion 13 and the element electrode 14 (contact portion) are formed on the element skeleton portion 12 at a predetermined position by sputtering or plating. Further, the element formation is completed by forming the conductive portions 15 and 16 that connect the element electrode 14 and the external connection terminal portion 17 formed on the element formation substrate 10.
Next, as shown in FIG. 1D, the element protection substrates 18 are bonded to the front and back surfaces of the completed element formation substrate 10 by an adhesive, anodic bonding, or the like.

FIG. 2 is an overall view before the element forming substrate 10 and the element protection substrate 18 are cut into individual contact mechanism devices.
As shown in FIG. 2A, a plurality of dents 11 are formed in one element forming substrate 10 to create individual contact mechanism devices.
Further, as shown in FIG. 2B, a resist is formed on the element protection substrate 18 that is a simple flat plate by photolithography or the like, and etching is performed to form a slit 19 so that the external terminal forming portion is exposed.

FIG. 3 is a view showing a state in which the element formation substrate 10 and the element protection substrate 18 are joined.
In order to protect the contact element formed in the recess 11, the recess 11 is covered from above with the element protection substrate 18, and the slit 19 is arranged so that a portion for forming the external connection terminal portion 17 is exposed.
Next, the contact mechanism device is completed by separating into individual pieces by scribing or the like.

FIG. 4 is a structural cross-sectional view of the completed contact mechanism device.
In the contact device formed by the process described with reference to FIG. 1, the magnetic body portion 13 and the element electrode 14 are formed on the element skeleton portion 12, respectively.
The element electrode 14 is connected to an external connection terminal portion 17 formed on the element formation substrate 10 via a conductive portion 16.
When a magnetic field is applied to the completed contact mechanism device from the outside, the magnetic parts 13 are magnetized to different polarities, and a magnetic attractive force acts between the magnetic substances, and the element skeleton parts 12a and 12b are bent by the attractive force. Then, the element electrodes 14a and 14b come into contact with each other.
As a result, the external connection terminal portions 17a and 17b are electrically connected via the conductive portions 16a and 16b and are switched on.
When the applied magnetic field is removed, the magnetization and magnetic attractive force of the magnetic body portion 13 disappears, and the contact portion returns to the original position by the spring force of the element skeleton portion 12, and there is no conduction between the contact portions, so that the switch-off It becomes a state.
As described above, a contact operation that is turned on / off by an external magnetic field can be obtained.

As described above, according to the first embodiment, the element forming substrate 10 that constitutes the spring portion of the element and has a thickness that can secure the operating gap and the conductive portion, and the minimum necessary for protection from the external environment The contact mechanism device is formed by two pieces with the element protection substrate 18 having a thickness of 5 mm.
Since the element formation substrate 10 and the element protection substrate 18 each have a simple required function, it is possible to secure a margin such as an operation gap to the minimum, and as a result, it is possible to reduce the thickness of the entire element. Become.

Further, the contact mechanism device according to the first embodiment can be manufactured by a very simple and few process as in the following (1) to (5).
(1) Recess 11 is formed (2) Element skeleton part 12 is formed (3) Magnetic body part 13 is formed (4) Element electrode 14 (contact part) and conductive parts 15 and 16 are formed (5) Element protection substrate 18 Joining

  In addition, since the element formation substrate 10 and the element protection substrate 18 are simple flat plates, there is an advantage that they do not require preliminary processing and can be obtained at low cost.

Embodiment 2. FIG.
In the first embodiment, since there is a step between the external connection terminal portion 17 and the element protection substrate 18, it is necessary to avoid the step by providing a hole in the mounting substrate when mounting the device.
Therefore, in the second embodiment of the present invention, a configuration in which the groove 21 is formed in the element forming substrate 10 and the above-described step is eliminated will be described.

FIG. 5 is a structural sectional view of a contact structure device according to Embodiment 2 of the present invention.
In the second embodiment, the groove 21 is formed in the element forming substrate 10 by etching or the like, and the contact element is configured in the region surrounded by the groove 21. The process for forming the contact element is the same as in the first embodiment.
The element protection substrate 18 is formed so as to fit into a shape including the groove 21 and the convex portion 22.

FIG. 6 is a diagram illustrating a state in which the element formation substrate 10 and the element protection substrate 18 are joined.
After the elements are formed, the protrusions 22 of the element formation substrate 10 and the slits 19 of the element protection substrate 18 are joined together. The process of separating the elements into individual pieces is the same as in the first embodiment.

  As described above, according to the second embodiment, there is no step between the external connection terminal portion 17 and the element protection substrate 18, and there is an effect that the mounting can be easily performed without performing special processing on the mounting substrate.

Embodiment 3 FIG.
FIG. 7 is a structural cross-sectional view of a contact structure device according to Embodiment 3 of the present invention.
In the third embodiment, a chip-like substrate 23 that protects each individual element is used as the element protection substrate.
In the element forming substrate 10, a recess 24 for accommodating the chip-like substrate 23 is first formed, and an element is formed in the recess 24. Note that the element formation process is the same as in the other embodiments.

FIG. 8 is a view showing a state in which the element forming substrate 10 and the chip-like substrate 23 are joined.
The chip-like substrate 23 is accommodated in the recess 24 of the element forming substrate 10 by a chip mounter, reverse insertion from a pallet, or the like, and then bonded.

  As described above, according to the third embodiment, since the element protection substrate is the chip-like substrate 23, the strength of the element protection substrate is not required in the process, and a thinner substrate can be used. There is an effect that can be further thinned.

Embodiment 4 FIG.
FIG. 9 is a structural cross-sectional view of a contact structure device according to Embodiment 4 of the present invention.
In the first to third embodiments, the external connection terminal portion 17 and the conductive portion 16 are provided on only one of the upper and lower surfaces. However, in the fourth embodiment, the external connection terminal portion 17 and the conductive portion 16 are connected to the element. It is provided on both upper and lower surfaces of the formation substrate 10. Further, the external connection terminal portion 17 is formed wider.
Other configurations and manufacturing processes are the same as those of the other embodiments.

  According to the fourth embodiment, it is possible to mount the elements without identifying the upper and lower sides at the time of mounting, and further, the contact element portion and the external connection terminal portion 17 are configured point-symmetrically, so that the functional direction of the device is also achieved. This has the effect that it can be implemented and used regardless of

Embodiment 5. FIG.
FIG. 10 is a structural sectional view of a contact structure device according to Embodiment 5 of the present invention.
In the fifth embodiment, the element skeleton part 12 is configured by a bellows-shaped spring part 25 and an element electrode 14 (contact part) at the head part of the beam part. The element skeleton parts 12a and 12b are installed on the same axis.
Other configurations and manufacturing processes are the same as those of the other embodiments.

Next, the operation of the contact structure device according to the fifth embodiment will be described.
When an external magnetic field is applied to the contact structure device, the magnetic parts 13a and 13b attract each other. At that time, the spring part 25 extends in the axial direction, so that the contact parts 14a and 14b come into contact to form electrical conduction. To do. Other operations are the same as those in the first embodiment.

  As described above, according to the fifth embodiment, since the contact portions 14a and 14b are installed on the same axis, it is possible to obtain high magnetic efficiency as compared with other embodiments, There is an effect that the cross-sectional area of the element can be further reduced.

  In the first to fifth embodiments described above, the element formation substrate 10 may be made of an insulator such as a glass substrate or a plastic substrate in addition to a silicon crystal substrate.

In the above first to fifth embodiments, it is possible to suppress malfunction due to static electricity to the contact portion by forming a conductive film on the outer surface of the element protection substrate.
In addition, it is possible to similarly suppress malfunction due to static electricity by forming a conductive film on the inner surface of the element protection substrate excluding a portion in contact with the conductive portion.

In the present invention, it is possible to realize a contact mechanism device having a function of controlling a plurality of circuits, switching circuits, and the like by forming a plurality of contact structure portions in one recess.
In addition, the structure of the present invention can be used as an acceleration detection element by changing the magnetic body portion to a mass body (weight).

5 is a perspective view of a manufacturing process of the contact mechanism device according to Embodiment 1. FIG. It is a general view before cutting the element formation substrate 10 and the element protection substrate 18 into individual contact mechanism devices. It is a figure which shows the state which joined the element formation board | substrate 10 and the element protection board | substrate 18. FIG. It is structural sectional drawing of the completed contact mechanism device. 6 is a structural cross-sectional view of a contact structure device according to Embodiment 2. FIG. It is a figure which shows a mode that the element formation board | substrate 10 and the element protection board | substrate 18 were joined. FIG. 6 is a structural cross-sectional view of a contact structure device according to a third embodiment. It is a figure which shows a mode that the element formation board | substrate 10 and the chip-shaped board | substrate 23 were joined. 6 is a structural cross-sectional view of a contact structure device according to Embodiment 4. FIG. 6 is a structural cross-sectional view of a contact structure device according to Embodiment 5. FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Element formation board | substrate, 11 Depression, 12 Element frame | skeleton part, 13 Magnetic body part, 14 Element electrode, 15, 16 Conductive part, 17 External connection terminal part, 18 Element protection board, 19 Slit, 21 Groove, 22 Convex part, 23 Chip-like substrate, 24 dents, 25 springs.

Claims (13)

An element forming substrate provided with a recess for forming a movable part;
A protective substrate bonded to the front and back of the element forming substrate;
Have
External connection terminals are formed on the element formation substrate,
An element skeleton is formed in the recess,
A conductive portion that is electrically connected to the contact portion and the external connection terminal is formed in the element skeleton,
The element skeleton has a magnetic material, and the element skeleton performs a switching operation in the recess by applying a magnetic field. On at least one of the protective substrates bonded to the front and back,
The contact mechanism device according to claim 1, wherein a slit for exposing the external connection terminal is formed. The contact mechanism device according to claim 2, wherein a recess that fits into the slit of the protection base is formed on the element forming substrate. The protective substrate is formed in a chip shape,
The contact mechanism device according to claim 2, wherein a recess that fits into the chip shape of the protection base is formed on the element forming substrate. The contact mechanism device according to any one of claims 1 to 4, wherein the element skeleton is formed in a bellows spring shape. While forming the external connection terminals on the front and back sides of the element formation substrate,
The contact mechanism device according to any one of claims 1 to 5, wherein the conductive portion that is electrically connected to each external connection terminal is formed. An element portion comprising the element skeleton, the contact portion, and the conductive portion;
The external connection terminal;
The contact mechanism device according to any one of claims 1 to 6, wherein the set is formed so as to be arranged point-symmetrically. The contact mechanism device according to claim 1, further comprising: a conductive film formed on a non-joint surface of the protective substrate, and a terminal for grounding the conductive film. The conductive substrate is formed on the inner surface of the protective substrate excluding a portion in contact with the conductive portion, and a terminal for grounding the conductive film is provided. Contact mechanism device. Forming a recess for forming the movable part on the element forming substrate;
Forming an element skeleton in the recess;
Forming a contact part and a magnetic part in the element skeleton;
Forming an external connection terminal on the element formation substrate;
Forming a conductive portion electrically connected to the external connection terminal in the element skeleton;
Bonding a protective substrate to the front and back of the element forming substrate;
A method for manufacturing a contact mechanism device, comprising: The method for manufacturing a contact mechanism device according to claim 10, further comprising: forming a slit for exposing the external connection terminal on at least one of the protective substrates bonded to the front and back sides. The method for manufacturing a contact mechanism device according to claim 11, further comprising: forming a recess that fits into the slit of the protection base on the element forming substrate. Forming the protective substrate into a chip shape;
Forming a recess that fits into the chip shape of the protection base on the element forming substrate;
The method of manufacturing a contact mechanism device according to claim 11, wherein:

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