KR20050001782A - A multi-layer pcb and the fabricating method - Google Patents

Abstract

PURPOSE: A multi-layer PCB(Printed Circuit Board) and a manufacturing method thereof are provided to intercept heat generated by circuit components loaded on the multi-layer PCB, thereby preventing brightness variation of an LCD(Liquid Crystal Display) panel. CONSTITUTION: The second copper thin layer(31) is formed at the entire surface of a substrate(30) with a predetermined pattern. The third copper thin layer(32) is formed at the rear of the substrate. The first pre-frag layer(33) is formed at the second copper thin layer. The second pre-frag layer(34) is formed at the third copper thin layer. The first copper thin layer(35) is formed at the first pre-frag layer. A circuit part(37) loaded on the first copper thin layer. The fourth copper thin layer(36) is formed at the second pre-frag layer. The pattern formed on the second copper thin layer is formed at the position corresponding to the circuit part formed on the first copper thin layer.

Description

Multilayer printed circuit board and its manufacturing method {A MULTI-LAYER PCB AND THE FABRICATING METHOD}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed circuit board and a method of manufacturing the same. In particular, it is possible to prevent a change in luminance of a liquid crystal panel by preventing heat generated by circuit components stacked on the multilayer printed circuit board from being transferred into the liquid crystal panel. A multilayer printed circuit board and a method of manufacturing the same.

In recent years, the need for a flat panel display has emerged in order to meet the times of thinning, weight reduction, and low power consumption. Accordingly, a thin film transistor type liquid crystal display device (hereinafter referred to as TFT-LCD) having excellent color reproducibility and thinness has been developed.

In general, a liquid crystal display (LCD) displays an image corresponding to a data signal on a panel by adjusting light transmittance of liquid crystal cells arranged in a matrix form on a liquid crystal panel with a video data signal supplied thereto. do.

The driving driver IC is electrically connected to the thin film transistor substrate of the liquid crystal display device panel.

Various methods can be used to connect the driving driver IC to the liquid crystal display, and generally, a TAB mounting technology using a tape carrier package (TCP) is used.

The TAB mounting technology is largely divided into a process of connecting TCP to a liquid crystal display panel and a process of connecting the TCP to a printed circuit board (hereinafter, referred to as a PCB). type) TCP and benttype TCP.

On the other hand, the printed circuit board having the drive driver IC is wired to one side or both sides of a board made of various thermosetting synthetic resins, and then the IC or the electronic components are placed and fixed on the board, and the electrical wiring is implemented to coat them with an insulator. It is done by

Since the development of multilayer printed circuit boards that overlap circuit conductors due to the development of electronic components, the research on the high density of multilayer printed circuit boards has been actively conducted in recent years, and among them, build-up multilayer printing Circuit boards have been developed and widely used.

1 is an exploded perspective view schematically illustrating a structure of a conventional multilayer printed circuit board. As shown therein, the structure of the multilayer printed circuit board includes: an inner layer substrate 10; Second and third copper foil layers 11 and 12 formed on the front and rear surfaces of the substrate 10; A first prepreg layer 13 formed on the second copper foil layer 11; A second prepreg layer (14) formed on the third copper foil layer (12); A first copper foil layer (15) formed on the first prepreg layer (13); The 4th copper foil layer 16 formed in the said 2nd prepreg layer 14 is comprised.

In addition, circuit components such as a drive driver IC are mounted on the first copper foil layer 15.

An example of a method for manufacturing a multilayer printed circuit board having the above structure is a pre-multi process.

In the pre-multi process, first, the copper foil laminate prepared by the raw material maker is cut to meet the specifications and the efficiency of the work product to form an inner layer foundation, and performs a process of forming the shape of the circuit to be formed in the cut product.

When the process of corroding copper foil to form a circuit proceeds, a process of generating roughness by chemically treating the surface of copper in order to increase adhesion of the bonding sheet is performed.

Lay-up is performed by placing the bonding sheet between the prepared inner layers and fixing the inner layers in accordance with the product specifications, and placing the bonding sheets between the outer layer copper foil and matching the positions between the panels. The process is carried out.

Then, a press process for joining the bonding sheets in layup and layup preparation with a constant pressure and heat is performed, and then a post-treatment process for inserting a direction and a guide for the next process is performed.

FIG. 2 is a diagram illustrating that heat generated by a circuit component formed on a multilayer printed circuit board according to the related art is transferred to a panel of a liquid crystal display. As shown in the drawing, when heat is generated by the circuit component 17 mounted on the multilayer printed circuit board having the above structure, the heat is transferred to the first copper foil layer 15.

In addition, the heat transferred to the first copper foil layer 15 is sequentially again in the lower portion of the first prepreg layer 13, the second copper foil layer 11, the substrate 10, and the third copper foil layer 12. And transfer to the second prepreg layer 14 and the fourth copper foil layer 16.

As a result, the heat transferred to the fourth copper foil layer 16 is locally transferred to the polarizer 21 attached to the panel 20 of the liquid crystal display.

Therefore, the heat transmitted locally to the polarizing plate 21 has a problem in that a change in luminance between the region (a) and the region (b) of the panel 20 is large, resulting in spots on the liquid crystal panel.

The present invention provides a multilayer printed circuit board and a method of manufacturing the same, which can prevent a change in luminance of a liquid crystal panel by preventing heat generated by circuit components stacked on the multilayer printed circuit board from being transferred into the liquid crystal panel. There is a purpose.

1 is an exploded perspective view schematically showing the structure of a conventional multilayer printed circuit board.

2 is a view showing that heat generated by a circuit component formed on a multilayer printed circuit board according to the related art is transferred to a panel of a liquid crystal display device.

Figure 3 is an exploded cross-sectional view of a first embodiment schematically showing the structure of a multilayer printed circuit board according to the present invention.

Figures 4a to 4c is a flow chart of a first embodiment of a method of manufacturing a multilayer printed circuit board according to the present invention.

Figure 5 is an exploded cross-sectional view of a second embodiment schematically showing the structure of a multilayer printed circuit board according to the present invention.

6a to 6c are flowcharts of a second embodiment of a method of manufacturing a multilayer printed circuit board according to the present invention;

Figure 7 is an exploded cross-sectional view of a third embodiment schematically showing the structure of a multilayer printed circuit board according to the present invention.

8A to 8C are flowcharts of a third embodiment of a method of manufacturing a multilayer printed circuit board according to the present invention.

<Description of the symbols for the main parts of the drawings>

30, 50, 70 --- Substrate 31, 51, 71 --- Second Copper Foil Layer

32, 52, 72 --- 3rd copper foil layer 33, 53, 73 --- 1st prepreg layer

34, 54, 74 --- 2nd prepreg layer 35, 55, 75 --- 1st copper foil layer

36, 56, 76 --- 4th copper foil layer 37, 57, 77 --- Circuit components

In order to achieve the above object, a multilayer printed circuit board according to the present invention is a multi-layer printed circuit board formed of four layers of copper foil layers in which circuit components are stacked on a first copper foil layer.

A substrate;

A second copper foil layer formed on the front surface of the substrate by removing copper foil of a portion corresponding to the circuit component;

A third copper foil layer formed on a rear surface of the substrate by removing copper foil of a portion corresponding to the circuit component;

A first prepreg layer formed between the first copper foil layer and the second copper foil layer;

A second prepreg layer formed on the third copper foil layer;

It is characterized by including the fourth copper foil layer formed by removing the copper foil of the part corresponding to the said circuit component on the said 2nd prepreg layer.

Here, in particular, the first prepreg layer and the second prepreg layer formed are characterized in that the thermosetting resin insulating material.

In order to achieve the above object, the multilayer printed circuit board according to the present invention is a multilayer printed circuit board in which a circuit component is loaded and formed of a multilayer copper foil layer and a prepreg layer between the copper foil layers.

The feature is that the copper foil of each copper foil layer in a portion corresponding to the portion on which the circuit component is loaded is selectively removed.

In addition, in order to achieve the above object, a method for manufacturing a multilayer printed circuit board according to the present invention is a method for manufacturing a multilayer printed circuit board formed of four layers of copper foil layers in which circuit components are placed on a first copper foil layer.

Depositing a second copper foil layer and a third copper foil layer on the front and back surfaces of the substrate;

Removing copper foil of a portion corresponding to the circuit component in the second copper foil layer and the third copper foil layer;

Forming a first prepreg layer and a second prepreg layer on the second copper foil layer and the third copper foil layer;

Forming a first copper foil layer on the first prepreg layer, and forming a fourth copper foil layer on the second prepreg layer;

And removing the copper foil of the portion corresponding to the circuit component on the fourth copper foil layer.

Here, in particular, the first prepreg layer and the second prepreg layer formed are characterized in that the thermosetting resin insulating material.

According to the present invention, it is possible to prevent the change in the luminance of the liquid crystal panel by preventing the heat generated by the circuit components stacked on the multilayer printed circuit board to be transferred into the liquid crystal panel.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is an exploded cross-sectional view of a first embodiment schematically showing the structure of a multilayer printed circuit board according to the present invention. As shown therein, the structure of the multilayer printed circuit board includes a substrate 30; A second copper foil layer 31 formed on the front surface of the substrate 30 with a predetermined pattern; A third copper foil layer 32 formed on the rear surface of the substrate 30; A first prepreg layer 33 formed on the second copper foil layer 31; A second prepreg layer 34 formed on the third copper foil layer 32; A first copper foil layer 35 formed on the first prepreg layer 33; A circuit component (37) mounted on the first copper foil layer (35); It is comprised including the 4th copper foil layer 36 formed in the said 2nd prepreg layer 34. As shown in FIG.

In addition, the pattern formed on the second copper foil layer 31 is formed at a position corresponding to the circuit component 37 formed on the first copper foil layer 35.

As an example of a method for manufacturing a multilayer printed circuit board having the above structure, a pre-multi process will be applied.

4A to 4C are flowcharts of a first embodiment of a method of manufacturing a multilayer printed circuit board according to the present invention. As shown in FIG. 4A, first, a process of constructing a circuit according to specifications and efficiency of a work product by depositing the second copper foil layer 31 and the third copper foil layer 32 on the front and rear surfaces of the prepared substrate 30. Do this.

In more detail, a process of forming a circuit by etching the second copper foil layer 31 and the third copper foil layer 32 is performed.

At this time, on the second copper foil layer 31, a portion corresponding to the position where the circuit component is to be deposited later is patterned and removed.

In this case, the pattern of the second copper foil layer 31 is not directly transmitted to the second copper foil layer 31 having good thermal conductivity, but is indirectly transmitted, so that heat conduction is reduced.

Then, when the process of forming the circuit by etching the second copper foil layer 31 is in progress, the surface of the second copper foil layer 31 and the third copper foil layer 32 to increase the adhesion of the bonding sheet (Bonding Sheet) Chemical process is performed.

Subsequently, as shown in FIG. 4B, the first prepreg layer 33 and the second prepreg layer 34, which are thermosetting resin insulating materials, on the second copper foil layer 31 and the third copper foil layer 32. Will form.

4C, a first copper foil layer 35 is formed on the formed first prepreg layer 33, and a fourth copper foil layer 36 is formed on the second prepreg layer 34. ).

In more detail, the substrate formed as described above is subjected to lay-up for matching the positions of the formed layers. This is a press process of joining the first and second prepreg layers 33 and 35 in preparation for layup and layup with a constant pressure and heat.

In addition, the circuit components 37 may be stacked on the first copper foil layer 35 in accordance with a circuit formed in the first copper foil layer 35.

Therefore, in the structure formed as described above, the heat transferred to the first prepreg layer 33 is not directly transferred by the pattern formed on the second copper foil layer 31, so that the heat transferred is also reduced.

5 is an exploded cross-sectional view of a second embodiment schematically showing the structure of a multilayer printed circuit board according to the present invention. As shown therein, the multilayer printed circuit board according to the present invention includes a substrate 50; A second copper foil layer 51 formed on the front surface of the substrate 50 with a predetermined pattern; A third copper foil layer 52 having a pattern formed on a rear surface of the substrate 50 corresponding to the same position as a predetermined pattern of the second copper foil layer 51; A first prepreg layer 53 formed on the second copper foil layer 52; A second prepreg layer 54 formed on the third copper foil layer 52; A first copper foil layer 55 formed on the first prepreg layer 53; A circuit component (57) mounted on the first copper foil layer (55); It is comprised including the 4th copper foil layer 56 formed in the said 2nd prepreg layer 54. As shown in FIG.

In addition, the pattern formed on the second copper foil layer 51 is formed at a position corresponding to the circuit component 57 mounted on the first copper foil layer 55.

In addition, the pattern formed in the third copper foil layer 52 is formed corresponding to the same position as the pattern formed in the second copper foil layer 51 to reduce the transfer of heat by the circuit component 57.

As an example of a method for manufacturing a multilayer printed circuit board having the above structure, a pre-multi process will be applied.

6a to 6c are flowcharts of a second embodiment of a method of manufacturing a multilayer printed circuit board according to the present invention. As shown in FIG. 6A, a process of constructing a circuit according to specifications and efficiency of a work product by first depositing a second copper foil layer 51 and a third copper foil layer 52 on the front and rear surfaces of the prepared substrate 50. Do this.

In more detail, a process of forming a circuit by etching the second copper foil layer 51 and the third copper foil layer 52 is performed.

In this case, a portion corresponding to the position where the circuit component 57 is to be deposited later is patterned on the second copper foil layer 51, and the third copper foil layer 52 is removed from the second copper foil layer 51. It is removed by patterning at a position corresponding to the pattern formed in.

Here, the pattern formed on the second copper foil layer 51 and the third copper foil layer 52 is the second copper foil layer 51 and the third copper foil layer 52 where heat transferred from the circuit component has a good thermal conductivity. By indirectly, rather than being transmitted to the wire, heat conductivity is reduced.

The detailed description of the processes of FIGS. 6B, 6C, and 6D sequentially performed after the process of FIG. 6A will be omitted herein with reference to the description of the first embodiment.

Accordingly, as described above, a pattern may be formed on the third copper foil layer 52 as well as the second copper foil layer 51 to reduce heat transferred locally to the liquid crystal panel.

On the other hand, Figure 7 is an exploded cross-sectional view of a third embodiment schematically showing the structure of a multilayer printed circuit board according to the present invention. As shown therein, the structure of the multilayer printed circuit board includes a substrate 70; A second copper foil layer 71 formed on the front surface of the substrate 70 with a predetermined pattern; A third copper foil layer 72 having a pattern formed at a position corresponding to a predetermined pattern of the second copper foil layer 71 on a rear surface of the substrate 70; A first prepreg layer 73 formed on the second copper foil layer 71; A second prepreg layer 74 formed on the third copper foil layer 72; A first copper foil layer 75 formed on the first prepreg layer 73; A circuit component (77) mounted on the first copper foil layer (75); The second prepreg layer 74 includes a fourth copper foil layer 76 having a pattern formed at a position corresponding to the pattern of the third copper foil layer 72.

In addition, the pattern formed on the second copper foil layer 71 is formed at a position corresponding to the circuit component 77 formed on the first copper foil layer 75.

As an example of a method for manufacturing a multilayer printed circuit board having the above structure, a pre-multi process will be applied.

8A to 8C are flowcharts of a third embodiment of a method of manufacturing a multilayer printed circuit board according to the present invention. As shown in FIG. 8A, a process of constructing a circuit according to specifications and efficiency of a work product by first depositing a second copper foil layer 71 and a third copper foil layer 72 on the front and rear surfaces of the prepared substrate 70. Do this.

In more detail, a process of forming a circuit by etching the second copper foil layer 71 and the third copper foil layer 72 is performed.

In this case, the portion corresponding to the position where the circuit component is to be deposited later is patterned on the second copper foil layer 71, and the third copper foil layer 72 is formed on the second copper foil layer 71. It is removed by patterning at the position corresponding to.

In addition, the fourth copper foil layer 76 forms a pattern at a position corresponding to the pattern formed on the third copper foil layer 72.

As a result, the patterns formed on the second copper foil layer 71, the third copper foil layer 72, and the fourth copper foil layer 76 are formed at positions corresponding to the circuit components 77, thereby being generated by the circuit components. The heat is finally reduced to the heat transmitted to the liquid crystal panel.

Therefore, the heat transmitted to the region (a) and the region (b) of the liquid crystal panel is the same, thereby reducing the luminance change rate of the panel.

Meanwhile, detailed descriptions of the processes of FIGS. 8B, 8C, and 8D performed after the process of FIG. 8A will be omitted herein with reference to the first embodiment.

As described above, in the multilayered printed circuit board according to the present invention, by selectively forming a pattern on each copper foil layer corresponding to the position where the circuit component is loaded, the rate of change in luminance of the liquid crystal panel is minimized by minimizing the transfer of heat generated from the circuit component. Will be reduced.

Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

As described above, the multilayer printed circuit board and the method of manufacturing the same according to the present invention prevent the heat generated by the circuit components stacked on the multilayer printed circuit board from being transferred into the liquid crystal panel, thereby preventing the luminance change of the liquid crystal panel. can do.

Claims (5)

In a multilayer printed circuit board formed of four layers of copper foil layers on which circuit components are placed on a first copper foil layer, A substrate; A second copper foil layer formed on the front surface of the substrate by removing copper foil of a portion corresponding to the circuit component; A third copper foil layer formed on a rear surface of the substrate by removing copper foil of a portion corresponding to the circuit component; A first prepreg layer formed between the first copper foil layer and the second copper foil layer; A second prepreg layer formed on the third copper foil layer; And a fourth copper foil layer formed on the second prepreg layer by removing copper foil of a portion corresponding to the circuit component. The method of claim 1, And said first prepreg layer and said second prepreg layer are thermosetting resin insulating materials. In a multilayer printed circuit board which loads circuit components and is formed as a prepreg layer between the multilayer copper foil layer and each of the copper foil layers, And selectively removing the copper foil of each copper foil layer in the portion corresponding to the portion on which the circuit component is loaded. In the manufacturing method of the multilayer printed circuit board formed from the four-layer copper foil layer which mounted the circuit component on the 1st copper foil layer, Depositing a second copper foil layer and a third copper foil layer on the front and back surfaces of the substrate; Removing copper foil of a portion corresponding to the circuit component in the second copper foil layer and the third copper foil layer; Forming a first prepreg layer and a second prepreg layer on the second copper foil layer and the third copper foil layer; Forming a first copper foil layer on the first prepreg layer, and forming a fourth copper foil layer on the second prepreg layer; Removing the copper foil of the portion corresponding to the circuit component on the fourth copper foil layer. The method of claim 4, wherein Wherein the first prepreg layer and the second prepreg layer are formed of a thermosetting resin insulating material.