KR20070121212A - Printed circuit board and liquid crystal display including the same - Google Patents

Abstract

A printed circuit board and a liquid crystal display having the same are provided to prevent an erroneous operation of the LCD(Liquid Crystal Display) by attenuating electromagnetic waves from plural electron components. A printed circuit board includes an insulation board(41), a wiring pattern(47), and a pair of pads(43,44). A circuit is formed on the insulation board. The wiring patterns are formed in a zigzag formation to be parallel to each other. The pads are electrically connected to both ends of the wiring pattern. Electron components are mounted on the pads. The wiring pattern includes at least three sub-lines, which are connected to each other. The wiring pattern and the pads are formed on one surface of the insulation board.

Description

Printed circuit board and liquid crystal display including the same

1 is a partial perspective view of a liquid crystal panel assembly having a printed circuit board according to an embodiment of the present invention.

FIG. 2 is a partially enlarged view of the printed circuit board of FIG. 1.

3 is a partially enlarged view of a printed circuit board according to another exemplary embodiment of FIG. 2.

FIG. 4 is a cross-sectional view of FIG. 3 taken along the line IV-IV '.

5 is an exploded perspective view of a printed circuit board according to another exemplary embodiment of FIG. 2.

6 is a cross-sectional view taken along the line VI-VI ′ after FIG. 5 is combined.

7 is an exploded perspective view of a liquid crystal display according to an exemplary embodiment of the present invention.

(Explanation of symbols for the main parts of the drawing)

100: liquid crystal panel assembly 10: liquid crystal panel

11: first display panel 13: second display panel

20, 30: tape carrier package 40: printed circuit board

41: insulating substrate 43, 44: pad portion

43a, 44a: Pad 47: Wiring Pattern

47a, 47b, 47c: sub wiring 48: through hole

48a, 49a ', 49b': conductive material 49a, 49b: contact hole

200: backlight assembly 300: liquid crystal display device

The present invention relates to a printed circuit board and a liquid crystal display including the same, and more particularly, to a printed circuit board capable of suppressing electromagnetic interference and a liquid crystal display including the same.

As the information society develops, the demand for display devices is changing in various forms, and in recent years, liquid crystal displays, organic luminescent displays, and plasma display panels have been developed. Various flat panel displays have been developed and used in various fields.

Among the flat panel display devices which are most widely used, a liquid crystal display device having excellent image quality, light weight, thinness, and low power consumption may be used. The liquid crystal display includes a liquid crystal panel including two display panels on which electrodes are formed and a liquid crystal layer interposed therebetween, and applies a voltage to the electrodes to rearrange the liquid crystal molecules of the liquid crystal layer to determine the amount of light transmitted. It is a display device to adjust. Since the liquid crystal display is a non-light emitting device, it cannot be used where there is no light. In order to compensate for these disadvantages and to enable use even in the dark, a backlight assembly for irradiating uniform light to the liquid crystal panel is mounted.

In addition, a printed circuit board is provided outside the liquid crystal panel to generate various control signals, data signals, and the like for controlling the image displayed on the liquid crystal panel by an electrical signal. The printed circuit board is electrically connected with the liquid crystal panel by, for example, a tape carrier package.

Here, various electronic components are mounted on the printed circuit board for driving and controlling the liquid crystal panel. These electronic components emit electromagnetic waves by directly or conducting electromagnetic radiation, which causes electromagnetic interference (EMI), which causes malfunction of the liquid crystal display.

It is an object of the present invention to provide a printed circuit board capable of suppressing electromagnetic interference.

Another object of the present invention is to provide a liquid crystal display device including the printed circuit board.

The technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

A printed circuit board according to an embodiment of the present invention for achieving the above technical problem, an insulating substrate and a predetermined circuit is formed on the insulating substrate, and predetermined portions are formed in a zig zag form in parallel with each other. And a wiring pattern continuously connected to each other, and a pair of pads electrically connected to both ends of the wiring pattern and mounted with electronic components.

The liquid crystal display according to the exemplary embodiment of the present invention for achieving the another technical problem includes such a printed circuit board.

Specific details of other embodiments are included in the detailed description and the drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a partial perspective view of a liquid crystal panel assembly with a printed circuit board according to an embodiment of the present invention, and FIG. 2 is a partially enlarged view of the printed circuit board of FIG. 1.

First, referring to FIG. 1, the liquid crystal panel assembly 100 largely includes a liquid crystal panel 10 and driving assemblies 20, 30, and 40. The drive assembly 20, 30, 40 may include a printed circuit board 40 and a tape carrier package 20, 30.

The liquid crystal panel 10 serves to display an image, and a liquid crystal layer (not shown) interposed between the first display panel 11, the second display panel 13, and the first display panel 11 and the second display panel 13. ).

The first display panel 11 includes a plurality of gate lines extending in a first direction at regular intervals, a plurality of data lines extending in a second direction so as to intersect the gate lines, and a matrix in a pixel area defined by the gate lines and the data lines. And a switching element that is switched by a signal of a pixel electrode and a gate line formed in a shape to transfer a signal of a data line to each pixel electrode.

In addition, the second display panel 13 includes a light blocking pattern for blocking light in portions other than the pixel area, an RGB color filter pattern for expressing color colors, and a common electrode for implementing an image.

The first and second display panels 11 and 13 are bonded in a state where a predetermined distance is maintained by a spacer or the like, wherein a liquid crystal layer having optical anisotropy is provided between the first and second display panels 11 and 13. Is formed.

The printed circuit board 40 is electrically connected to one side of the liquid crystal panel 10 by the tape carrier packages 20 and 30. The tape carrier packages 20 and 30 may include a driving IC for driving the liquid crystal panel 10, and may include a gate tape carrier package 20 and a data line of the liquid crystal panel 10 connected to the gate lines of the liquid crystal panel 10. Connected data tape carrier package 30.

The printed circuit board 40 generates drive and control signals for the liquid crystal panel 10, which are provided to the liquid crystal panel 10 through gate and data tape carrier packages 20, 30. Here, the printed circuit board 40 may be mounted with a plurality of electronic components 50 and bent to the rear side of the lower storage container (not shown).

Referring to FIG. 2, the printed circuit board 40 is provided with various electronic components 50 that receive image signals and control signals from the outside and generate driving and control signals of the liquid crystal panel.

The printed circuit board 40 may include an insulating substrate 41, a wiring pattern 47, pads 43, 44, and the like. The wiring pattern 47 may include first, second and third sub-wiring 47a, 47b, 47c, and the pad parts 43 and 44 may be electrically connected to the wiring pattern 47. In addition, the electronic components 50 may include a plurality of pads 43a and 44a on which the electronic components 50 are mounted. In other words, the pad portions 43 and 44 include a first pad portion 43 and a second pad portion 44, and the first pad portion 43 is a pair of agents formed by being opened therebetween. The first pad 43a is provided, and the second pad portion 44 is also provided with a pair of second pads 44a formed therebetween. The electronic components 50 are mounted on the pads 43a and 44a, respectively.

In addition, the first and second pads 43a and 44a are electrically connected to each other by the wiring pattern 47. Here, the wiring pattern 47 may be formed in a shape of a zig zag in which predetermined portions are parallel to each other. The wiring pattern 47 electrically connects the first pad 43a and the second pad 44a and may include at least three sub-wires 47a, 47b, and 47c connected to each other in succession.

In other words, the wiring pattern 47 includes first, second and third sub wirings 47a, 47b, and 47c. Here, one end of the first sub wiring 47a is electrically connected and connected to the first pad 43a, and the other end thereof is extended and bent to be adjacent to the second pad 44a. In addition, one end of the second sub wiring 47b is connected to the other end of the first sub wiring 47a, and the other end thereof is extended and bent to be adjacent to the first pad 43a. Then, one end of the third sub wiring 47c is connected to the other end of the second sub wiring 47b, and the other end is electrically connected and connected to the second pad 44a. Here, the first to third sub wirings 47a, 47b, and 47c are formed to be parallel to each other at a uniform distance from each other, and are continuously connected to each other.

As a result, the current flow directions of the first to third subwires 47a, 47b, and 47c are reversed, and thus, electromagnetic waves emitted through the first to third subwires 47a, 47b, and 47c may be canceled with each other. have.

In addition, the wiring pattern 47, that is, the wiring pattern 47 including the first to third sub wirings 47a, 47b, and 47c described above, has a predetermined size on the printed circuit board 40 where electromagnetic interference (EMI) is large. Region, for example, an AC input stage having an AC voltage / current component.

Hereinafter, the manufacturing method of the printed circuit board 40 will be briefly described.

First, the copper thin film is extruded on the insulating substrate 41 at a predetermined temperature and pressure to form a desired thickness. In this case, for example, an epoxy resin plate or the like may be used as the insulating substrate 41, and the copper thin film may be formed to a thickness of about 10 to 20 μm.

Next, the copper thin film is patterned through a conventional photolithography process to form the wiring pattern 47 and the pad portions 43 and 44, that is, the first and second pad portions 43 and 44. As the forming method, for example, a method using a dry film may be used, wherein the dry film may be composed of three layers, for example, a cover film, a photoresist film, and a mylar film, wherein the photoresist The film substantially acts as a resist. A method of forming the wiring pattern 47, the first pad part 43, and the second pad part 44 using the dry film will be briefly described as follows.

First, the cover film of the dry film is peeled off and then coated on the insulating substrate 41 on which the copper thin film is formed. This process is called lamination. Next, the wiring pattern 47, the first pad part 43, and the second pad part 44 closely adhere to the printed art-art film, and then irradiate ultraviolet rays. At this time, the black portion on which the wiring pattern 47, the first pad portion 43, and the second pad portion 44 of the artwork film are printed does not pass ultraviolet rays, and the other portions of the artwork film transmit ultraviolet rays to cure the dry film. Let's go. Subsequently, when the insulating substrate 41 is immersed in the developer, the cured dry film is removed, and the uncured dry film is left to complete a predetermined resist pattern. At this time, for example, sodium carbonate, calcium carbonate, or the like can be used. Subsequently, when etching is performed on the insulating substrate on which the resist pattern is formed, the portion on which the resist pattern is formed is not etched, leaving only the copper foil of the portion. Finally, when the resist pattern is removed, the wiring pattern 47, The printed circuit board 40 having the first pad part 43 and the second pad part 44 is formed. As a method of removing a resist pattern here, peeling liquid, such as sodium hydroxide or potassium hydroxide, can be used, for example.

The solder masking process is performed on the insulating substrate 41 formed by the above-described process, that is, the wiring pattern 47, the insulating substrate 41 on which the first pad portion 43 and the second pad portion 44 are formed. Here, the solder masking process, when the electronic component 50 is mounted on the printed circuit board 40, the surface of the printed circuit board 40 is exposed to the molten lead, which may cause unwanted bridge (solder bridge). For this purpose, a green film is formed on the surface of the insulating substrate 41 including the wiring pattern 47 except the first pad part 43 and the second pad part 44 except the peripheral part in which the electronic component is mounted. The process of coating. Here, the solder masking process may be used, for example, a screen printing method.

Next, nickel / gold (Ni / Au) plating is performed on the pads 43a and 44a of the first pad part 43 and the second pad part 44. This is because the contact between the electronic component 50 and the pads 43a and 44a when the electronic component 50 is mounted on the pads 43a and 44a of the first pad portion 43 and the second pad portion 44. In this case, the thickness of the nickel layer to be plated may be approximately 2.5 μm, and the thickness of the gold layer may be approximately 0.5 to 1.5 μm.

Finally, a silk screen printing process is performed to classify the electronic components 50, the electrode marking, and the component name marking, and the printed circuit board 40 is completed through a cleaning and inspection process.

Hereinafter, another embodiment of the above-described printed circuit board will be described with reference to FIGS. 3 and 4. For convenience of explanation, members having the same functions as the members shown in the drawings of the embodiments described with reference to FIGS. 1 and 2 are denoted by the same reference numerals, and thus description thereof is omitted.

FIG. 3 is a partially enlarged view of a printed circuit board according to another exemplary embodiment of FIG. 2, and FIG. 4 is a cross-sectional view of FIG. 3 taken along lines IV to IV ′.

First, referring to FIG. 3, the printed circuit board 40 includes an insulating substrate 41, pad portions 43 and 44, and a wiring pattern 47. The pad portions 43 and 44 may include first and second pad portions 43 and 44, and the first and second pad portions 43 and 44 may be formed on both surfaces of the insulating substrate 41, respectively. Can be.

In addition, the wiring pattern 47 may include first to third sub wirings 47a, 47b, and 47c, and each of the sub wirings 47a, 47b, and 47c may be formed on both surfaces of the insulating substrate 41, respectively. have. The wiring pattern 47 is electrically connected to the first and second pad portions 43 and 44.

In more detail, one end of the first sub wiring 47a of the wiring pattern 47 is connected to the first pad 43a of the first pad part 43 formed on one surface of the insulating substrate 41, and the other end thereof. Is bent to extend adjacent to the second pad 44a of the second pad portion 44. In addition, one end of the second sub wiring 47b is connected to the other end of the first sub wiring 47a, and the other end is extended and bent to be adjacent to the first pad 43a, and the bent portion of the second sub wiring 47b. The end is connected to a through-hole 48 formed on the insulating substrate 41. Subsequently, the third sub wiring 47c is formed on the other surface of the insulating substrate 41, and one end of the third sub wiring 47c is connected to the second sub wiring 47b through the through hole 48. The other end is electrically connected to and connected to the second pad 44a.

That is, the first pad part 43 including the first pad 43a, the first sub wiring 47a and the second sub wiring 47b are formed on one surface of the insulating substrate 41, and the second surface is formed on the other surface of the insulating substrate 41. The second pad part 44 and the third sub wiring 47c including the pad 44a may be formed. In this case, the second sub wiring 47b is electrically connected to the third sub wiring 47c through the through hole 48. Here, the first to third sub wirings 47a, 47b, and 47c are continuously connected as described above, and may be formed to be parallel to each other at a predetermined distance.

As a result, the current flow directions of the first to third subwires 47a, 47b, and 47c are reversed, and thus, electromagnetic waves emitted through the first to third subwires 47a, 47b, and 47c may be canceled with each other. have. In addition, the formation spaces of the wiring patterns 47 of the printed circuit board 40 may be reduced by forming the sub wirings 47a, 47b, and 47c on both surfaces of the insulating substrate 41.

In addition, a predetermined conductive material 48a may be formed on the inner surface of the through hole 48. Referring to FIG. 4, a second sub wiring 47b is formed on one surface of the insulating substrate 41, and the second sub wiring 47b is connected to the through hole 48. Here, the inner surface of the through hole 48 is formed of a predetermined conductive material 48a, and the second sub wiring 47b is formed on the other surface of the insulating substrate 41 through the conductive material 48a. Is electrically connected to 47c. In addition, the through hole 48 may be formed, for example, in a cylindrical shape, but is not limited thereto.

Hereinafter, another embodiment of the above-described printed circuit board will be described with reference to FIGS. 5 and 6. For convenience of description, members having the same functions as the members shown in the drawings of the embodiments described with reference to FIGS. 1 to 4 are denoted by the same reference numerals, and thus description thereof is omitted.

5 is an exploded perspective view of a printed circuit board according to still another embodiment of FIG. 2, and FIG. 6 is a cross-sectional view taken along lines VI to VI ′ after FIG. 5 is combined.

First, referring to FIG. 5, the printed circuit board 40 includes an insulating substrate 41, pad portions 43 and 44, and a wiring pattern 47. Here, the insulating substrate 41 is formed in a multi-layer structure composed of at least two layers. In other words, the insulating substrate 41 includes a first layer 41a and a second layer 41b on which wiring patterns 47 are formed, respectively. In this case, a predetermined insulating layer 41c may be further formed between the first layer 41a and the second layer 41b of the insulating substrate 41.

In addition, the pad portions 43 and 44 include first and second pad portions 43 and 44, and the first and second pad portions 43 and 44 may include the first pad 43a and the second pad ( 44a) respectively.

The wiring pattern 47 includes first to third sub wirings 47a, 47b, and 47c, and each of the sub wirings 47a, 47b, and 47c includes a first layer 41a or a first layer of the insulating substrate 41. It may be formed in each of the two layers 41b. The wiring pattern 47 is electrically connected to the first and second pad portions 43 and 44.

In more detail, one end of the first sub wiring 47a of the wiring pattern 47 is connected to the first pad 43a formed in the first layer 41a of the insulating substrate 41, and the other end thereof is the second end of the wiring pattern 47. It extends and bends adjacent to the pad 44a, and an end of the bent portion of the first sub wiring 47a is connected to the first contact hole 49a formed on the insulating substrate 41. In addition, the second sub wiring 47b is formed in the second layer 41b of the insulating substrate 41, and one end of the second sub wiring 47b is formed through the first contact hole 49a. 47a), the other end is bent to extend adjacent to the first pad 43a, and the end of the bent portion of the second sub-wire 47b is connected to the second contact hole 49b formed on the insulating substrate 41; Connected. Subsequently, one end of the third sub wiring 47c is connected to the second sub wiring 47b through the second contact hole 49b, and the other end thereof is electrically connected to the second pad 44a.

That is, in the first layer 41a of the insulating substrate 41, the first pad part 43 including the first pad 43a and the second pad part 44 including the second pad 44a are formed. The first sub wiring 47a and the third sub wiring 47c may be formed, and the second sub wiring 47b may be formed in the second layer 41b. In this case, the second sub wiring 47b is electrically connected to the first and third sub wirings 47a and 47c through the first and second contact holes 49a and 49b, respectively.

Here, the first to third sub wirings 47a, 47b, and 47c are continuously connected as described above, and may be formed to be parallel to each other at a predetermined distance.

As a result, the current flow directions of the first to third subwires 47a, 47b, and 47c are reversed, and thus, electromagnetic waves emitted through the first to third subwires 47a, 47b, and 47c may be canceled with each other. have. In addition, since the insulating substrate 41 is composed of at least two layers 41a and 41b, each of the sub wirings 47a, 47b, and 47c can be formed on each layer of the insulating substrate 41, respectively. The formation space of the wiring pattern 47 of 40 can be reduced.

In addition, the first and second contact holes 49a and 49b partially penetrate the insulating substrate 41, that is, the second and second layers 41b through the insulating layer 41c from the first layer 41a of the insulating substrate 41. The conductive material 49a 'and 49b' may be formed on the inner surfaces of the first and second contact holes 49a and 49b.

Referring to FIG. 6, first and third sub wirings 47a and 47c are formed on the first layer insulating substrate 41a, and second sub wirings 47b are formed on the second layer insulating substrate 41b. . The first to third sub wirings 47a, 47b, and 47c are electrically connected to the first and second contact holes 49a and 49b.

Here, predetermined conductive materials 49a 'and 49b' are formed on inner surfaces of the first and second contact holes 49a and 49b, and the first to third subs are formed through the conductive materials 49a 'and 49b'. The wirings 47a, 47b, 47c are electrically connected to each other.

In other words, the first sub wiring 47a formed in the first layer insulating substrate 41b is electrically connected to the second sub wiring 47b formed in the second layer insulating substrate 41b through the first contact hole 49a. The second sub wiring 47b is electrically connected to the third sub wiring 47c formed in the first layer insulating substrate 41a through the second contact hole 49b. Here, the first and second contact holes 49a and 49b may be formed, for example, in a cylindrical shape, but are not limited thereto.

Hereinafter, a liquid crystal display including the printed circuit board described above with reference to FIG. 7 will be described in detail. 7 is an exploded perspective view of a liquid crystal display according to an exemplary embodiment of the present invention.

Referring to FIG. 7, the liquid crystal display device 300 includes a liquid crystal panel assembly 100 and a backlight assembly 200. The liquid crystal panel assembly 100 includes the liquid crystal panel 10 and the driving assemblies 20, 30, and 40, and the detailed description of each component is as described above with reference to FIGS. 1 to 6.

The backlight assembly 200 that provides light to the liquid crystal panel 10 is positioned under the liquid crystal panel 10.

Here, the backlight assembly 200 may include a light source unit 210, a light guide plate 220, a reflective sheet 230, optical sheets 240, and the like.

The light source unit 210 is disposed on at least one side of the light guide plate 220 and includes a light source 211 and a light source cover 212 covering the light source 211. In addition, the light source unit 210 may be disposed on a long side or a short side of the light guide plate 220 having a rectangular shape, and two light sources may be disposed on the neighboring side or the opposite side.

The light guide plate 220 has a rectangular shape and guides light emitted from the light source unit 210 toward the upper side of the backlight assembly 200, that is, the liquid crystal panel 10. The light guide plate 220 may be formed of a material having good refractive index and transmittance, for example, polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene (PE), or the like.

The reflective sheet 230 is disposed under the light guide plate 220. The reflective sheet 230 reflects the light leaked to the bottom of the light guide plate 220 to the upper side of the light guide plate 220 so that the light is uniformly emitted.

The optical sheets 240 are disposed on the light guide plate 220. Here, the optical sheets 240 may be formed by stacking one or more diffusion sheets, a prism sheet, a protective sheet, and the like, and a plurality of identical optical sheets may be disposed.

Below the backlight assembly 200 having the above-described structure, a lower receiving container 250 for accommodating and supporting the liquid crystal panel 10 and the backlight assembly 200 is disposed. The lower storage container 250 may be made of a metal material such as aluminum or aluminum alloy.

The upper container 260 is coupled to the lower container 250, accommodates the liquid crystal panel 10 and the backlight assembly 200 therein, and defines an effective display area of the liquid crystal panel 10. The upper receiving container 260 may be formed of the same material as the lower receiving container 250.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

As described above, according to the printed circuit board and the liquid crystal display including the same, the electromagnetic wave emitted from the plurality of electronic components may be canceled out to suppress electromagnetic interference, thereby preventing malfunction of the liquid crystal display. .

Claims (9)

Insulating substrate; A wiring pattern forming a predetermined circuit on the insulating substrate, the predetermined portions being formed in a zig zag form in parallel with each other and continuously connected to each other; And And a pair of pads electrically connected to both ends of the wiring pattern and mounted with electronic components. According to claim 1, The wiring pattern is a printed circuit board consisting of at least three sub-wiring connected in parallel with each other. According to claim 1, The wiring pattern and the pair of pads are all formed on one surface of the insulating substrate. According to claim 1, The wiring pattern and the pair of pads are formed on both surfaces of the insulating substrate, The wiring pattern is a printed circuit board for electrically connecting the pair of pads through a through-hole formed on the insulating substrate. The method of claim 4, wherein A printed circuit board having a conductive material formed on the inner side surface of the through hole. According to claim 1, The insulating substrate may include first and second layers on which the wiring pattern is formed, respectively. And the wiring pattern electrically connects the pair of pads through at least one contact hole formed on the insulating substrate. The method of claim 6, A printed circuit board having a conductive material formed on the inner surface of the contact hole. The method of claim 6, The insulating substrate further comprises an insulating layer formed between the first and the second layer. A liquid crystal panel displaying an image; And A liquid crystal display device connected to said liquid crystal panel for providing a drive / control signal for said liquid crystal panel, said printed circuit board according to any one of claims 1 to 8.

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