KR20040065589A - Improved Method for Manufacturing IC Card by Laminating a Plurality of Foils - Google Patents

Abstract

PURPOSE: An improved IC card manufacturing method by layering foils is provided to complete an IC card by using a half-finished products manufacturing process and a finished-products manufacturing process. CONSTITUTION: Antenna winding(410) is wound to an antenna foil(400''). A base foil(400) is formed by compressing a blotter foil(400') to the antenna foil. The first hole inserted by a molding part(220) of a COB(Chip On Board) is formed to the base foil. An antenna electrode(212) of the COB is electrically connected to an antenna connector of the base foil. The first overlay foil(600) having no hole is layered to the base foil. The base foil and the first overlay foil are temporarily adhered. The foil having the fourth hole of the same area as a main board(210) of the COB is layered in a thickness not thinner than the main board of the COB. All layered foils are compressed.

Description

Improved Method for Manufacturing IC Card by Laminating a Plurality of Foils}

Field of invention

The present invention relates to a method of manufacturing an IC card. More specifically, the present invention is to separate the first step semi-finished product manufacturing process and the second step finished product manufacturing process of the IC card by stacking at least two or more foils with holes corresponding to COB and pressing them together to complete the IC card. A method for manufacturing an IC card.

Background of the Invention

Cards equipped with data and programs required for a chip on board (COB), that is, IC cards, are used in more and more fields because of their convenience in use and excellent information holding ability. Such an IC card generally includes a contact type IC card in which information is input and output by contacting a terminal for a card reader with an electrode, a contactless IC card having an antenna therein and capable of entering and exiting information without contacting the card reader terminal; It is divided into a combination type IC card having both the functions of the contact and contactless card.

In the conventional method of manufacturing such an IC card, as shown in FIG. 1, a plurality of foils (also called sheets) are stacked to form a card, and then a COB (Chip On Board) 200 is formed. An appropriately sized groove 800 is excavated through a milling process so that it can be mounted, the COB 200 is inserted into the groove 800, and finally covered with at least one cover foil. In this process, a step of digging a groove 800 for mounting the COB 200 on the base card plate in which a plurality of foils are stacked to complete a form is required, and the work is doubled. In particular, in the manufacture of a combination type IC card, after inserting the COB into the groove with the electrode surface for contact terminals exposed to the outside, the electrode for the antenna of the COB and the conductive antenna should be electrically connected. In the operator's eyes, there is an inconvenience in that both ends of the antenna and the antenna electrode of the COB must be connected in a state where the working state is not visible. That is, while the end of the antenna formed on the foil is exposed inside the groove, the COB is inserted into the groove with the molding portion facing downward, the antenna electrode formed on the main board of the COB is electrically connected to both ends of the antenna In this case, the main board of the COB is positioned between the operator's eyes and the groove, that is, the antenna connection part, so that the operator's field of view is obscured (in other words, the back surface of the may board which is invisible to the operator's eyes). At the electrode to connect to the antenna). Accordingly, conventionally, a conductive paste (adhesive) is applied to both ends of the antenna exposed inside the groove and the COB is inserted and then compressed, or a hot melt sheet is attached and the COB is inserted. It was bonded by heat pressing.

However, through this type of bonding, the electrical connection between the antenna connection part and the COB electrode is not satisfactory, which may cause a problem that the electric connection may be disconnected or the COB itself may be detached from the card as the IC card is used for a long time. . In addition, in order to insert the COB into the grooves formed in the laminated foil, the area of the grooves must be structurally slightly larger than the area of the COB, which causes a gap between the COB and the grooves in the completed IC card. It exists. The gap may not only allow moisture to penetrate, but there are many dissatisfaction with quality, such as COB may be released from the card plate when the card is bent. In addition, since the molding portion of the COB is stronger than the foils, when the IC card is finally manufactured, it is difficult to insert the filler in order to compensate for the disadvantages of the relatively hard and impact-resistant COB portion. there was.

As a solution to this problem, the present applicant has proposed a patent application No. 2002-77164, "Method of manufacturing IC card by lamination of foil", and the present application has been made on the extension line. The process of manufacturing the semi-finished product as a step and the process of forming the finished product as a second step are separated, which is a general manufacturing form in the art, which separates the semi-finished product manufacturer and the final finished product manufacturer, and accordingly the patent application No. 2002-77164 According to the IC card manufacturing method according to the present invention, it is necessary to provide a manufacturing method that enables the final finished product manufacturer to use a conventional production line (that is, a printing equipment, a lamination of a printed foil, and a pressing equipment) as it is. In addition, the characteristics of solving the problem of shrinkage of the hole in which the COB is inserted due to thermal expansion of the foil (for example, PVC material) that may occur during the thermal compression process during the manufacturing of the semi-finished product.

It is an object of the present invention to provide a method of manufacturing an IC card which does not have to be dug again after laminating foils.

An object of the present invention is to provide an IC card manufacturing method in which a COB and a card plate can be strongly bound.

An object of the present invention is to provide an IC card manufacturing method in which a gap does not occur between a COB and a card plate.

Still another object of the present invention is to provide a method of manufacturing an IC card in which an electrode of an COB and an antenna electrode can be strongly bound.

Still another object of the present invention is to provide a method of manufacturing an IC card in which a semi-finished product manufacturing step and a finished product manufacturing step are separated.

Another object of the present invention is to provide an IC card manufacturing method which can provide a more convenient IC card by filling a filler in the IC card.

Still another object of the present invention is to provide an IC card manufacturing method that can solve the problem of shrinkage of COB hole due to thermal compression in IC card semi-finished process.

The above and other objects of the present invention can be achieved by the present invention described below.

1 is a configuration diagram showing a manufacturing process of a conventional IC card.

FIG. 2 (A) is a cross sectional view of an IC card in which a plurality of foils are stacked according to the first step semifinished product manufacturing process, and FIG. 2 (B) is a longitudinal cross sectional view thereof.

Brief description of the main symbols in the drawings

100: IC card 200: COB (Chip On Board)

210: motherboard 211: electrode surface for contact terminals

212: antenna electrode 220: molding part

300: second overlay foil 301: second hole

400: base foil 400 ′: laminated foil

400 ″: Antenna foil 401: First hole

402: antenna hole 410: antenna winding

411 antenna connection 500 core foil

501: third hole 600: first overlay foil

700: hot melt sheet 800, 800 ′: filler

Summary of the Invention

A first feature of the IC card manufacturing method according to the present invention manufactures the IC card without going through the step of digging the groove into which the COB is to be inserted through the milling process. To this end, the present invention provides a method for winding an antenna winding to an antenna foil; Pressing a blotting foil to the antenna foil to form a base foil; Forming a first hole in the base foil into which the molding portion of the COB can be inserted; Electrically connecting the antenna electrode of the COB and the antenna connection of the base foil; Stacking the first overlay foil without holes in the base foil; And adjoining the base foil and the first overlay foil; Present a process consisting of steps

A second feature of the IC card manufacturing method according to the present invention is to separate the process of manufacturing the first step semi-finished product and the process of manufacturing the second step finished product. To this end, the first step of manufacturing the semi-finished product is in accordance with the IC card semi-finished product manufacturing method described above, and the method of manufacturing the second step of IC card is substantially in addition to the semi-finished product formed by the first step. Stacking at least one foil having a second hole of the same area substantially equal to the thickness of the motherboard of the COB; And compressing the laminated whole foils; It presents a process comprising the steps further.

Detailed Description of the Invention

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment according to the present invention.

FIG. 2 (A) is a cross sectional view of an IC card in which a plurality of foils are stacked according to the first step semifinished product manufacturing process, and FIG. 2 (B) is a longitudinal cross sectional view thereof. FIG. 2A is a cross-sectional view of the stacked IC cards including the antenna connection part 411 and the antenna electrode 212, and FIG. 2B is a cross-sectional view taken in a direction perpendicular to the stacked IC cards.

The IC card manufacturing method according to the present invention is made on the extension of the applicant's patent application No. 2002-77164, "IC card manufacturing method by lamination of foil", as described above, the general IC card manufacturing process in the art is the antenna foil Process of manufacturing a semi-finished IC card having an essential foil comprising a (hereinafter referred to as "semi-finished product manufacturing process") and a process of manufacturing a finished IC card to further laminate the printing foil and coating foil on the semi-finished product (hereinafter "IC card It is to provide a manufacturing method for manufacturing a semi-finished product of the IC card through the lamination of the foil, which is separated, that is, in the form of division of labor. Therefore, the overall process of manufacturing the IC card is similar to the patent application No. 2002-77164, "Method of manufacturing an IC card by laminating foil", and the contents disclosed in the patent application may be considered to be included in the present specification. . In brief reference to the patent application No. 2002-77164, the entire IC card manufacturing process includes a contact part terminal electrode face of a COB having a molding part, an antenna electrode for a non-contact terminal, and an electrode surface for a contact terminal. And a non-contact terminal antenna mounted inside the IC card, and stacking two or more foils to manufacture the IC card, wherein the electrode surface for the contact terminal of the COB faces downward. Positioning the COB; Stacking at least one or more foils having a first hole of substantially the same area as the main board of the COB such that the first hole is fitted in an electrode portion of the COB; An antenna foil having a second hole and an antenna formed at a point corresponding to the position of the first hole is laminated on the laminated foil so that the second hole is fitted into a molding portion of the COB; Electrically connecting a connecting portion of the antenna to an antenna electrode of the COB; A foil having no holes formed is laminated on a surface opposite to a surface on which the electrode surface of the COB of the laminated foils is exposed to the outside; And compressing the laminated foils; And wherein the molding portion and antenna electrode of the COB are exposed upwardly through the second hole, and additionally comprises a method of laminating and compressing the coating foil and the printing foils.

On the other hand, the IC card manufacturing method according to the present invention is a step of stacking the antenna foil and the core foil by inserting the COB as a first step of manufacturing a semi-finished IC card, and then the printing foil and coating foil, etc. The stacking step is separated into the second step of manufacturing the finished IC card, and in particular, when the first hole is formed in the antenna foil first and then compressed, the foil is expanded as described above. The first hole is narrowed or its position is shifted (i.e., when the first hole is formed on the left side of the IC card as shown in FIG. 2, the first hole is moved to the left finely after thermal compression. In order to improve the disadvantage that it is difficult to accurately position the COB in the thermocompression again in the two-step finished product manufacturing process, The antenna foil is first thermally compressed and then the first hole is formed (punched).

For reference, the first hole and the second hole of Patent Application No. 2002-77164 correspond to the fourth hole (not shown) and the first hole in the present invention, respectively. In addition, the COB 200 is generally used, and a chip in a wafer state is disposed on the main board 210, and a molding part 220 is formed thereon. The molding part 220 does not necessarily mean molding, but is used to include anything for protecting the chip, including potting. In addition, the foil according to the present invention can use all materials known in the art, but, if heat compression is required, it is required to have a property of melting and bonding to some extent by heat, such as PVC-based material. In addition, among the COB 200, the COB 200 used in the contact card has a lower side of the main board 210, that is, an opposite surface on which the molding part 220 is formed, and an electrode surface 211 for an external terminal. In the COB 200 used in the combi card, two antenna electrodes 212 are formed on the main board 210 to be connected to the antenna wire 410, and a lower surface of the main board 210 is provided. Is likewise an electrode surface 211 for an external terminal.

In the IC card manufacturing method according to the present invention, the first step process, which is a semi-finished product manufacturing process, is also basically performed by stacking a plurality of foils around a COB. However, as described above, prior to lamination, the base foil 400 is formed by first thermally compressing the antenna foil 400 ″ and the lamination foil 400 ′. The antenna foil 400 ″ and the lamination foil 400 ′ are first thermally compressed to thermally expand, respectively, after which the molding part 220 of the COB 200 is inserted, ie through the molding part 220. ) Forms a first hole 401 exposed upward. Preferably, prior to thermocompressing the antenna foil 400 ″ and the lamination foil 400 ′, the antenna foil 400 ″ and the lamination foil 400 ′ correspond to both ends of the antenna winding 410. An antenna hole 402 is first formed to expose the antenna connector 411. As will be described below, the operator connects the antenna connection portion 411 and the antenna electrode 212 of the COB 200 electrically by soldering, ultrasonic welding, conductive paste, or the like through the antenna hole 402. Done. At this time, two antenna holes 402 should be formed corresponding to the point where the antenna electrode 212 of the COB 200 is to be located, but it can be easily understood and implemented by those skilled in the art. After the antenna holes 402 are formed in the antenna foil 400 ″ and the lamination foil 400 ′, respectively, the antenna winding 410 is wound on one surface of the antenna foil 400 ″ in an appropriate form. However, the antenna windings 410 must cross each of the antenna holes 402, preferably both ends thereof pass through the antenna holes 402.

After forming the antenna winding 410, the laminated foil 400 ′ is thermally compressed to the antenna foil 400 ″. Preferably, the lamination foils 400 'are pressed against each other so as to cover the surface on which the antenna winding 410 of the antenna foil 400 ″ is formed. The two foil layers formed through the thermocompression will be referred to as base foil 400 hereinafter.

A first hole 401 is formed in the base foil 400 formed by thermally compressing the antenna foil 400 ″ and the lamination foil 400 ′ so that the molding part 220 of the COB 200 may be fitted. The first hole 410 should have an area that can be completely exposed when the molding portion 220 of the COB 200 is viewed from above, preferably the same shape and substantially the same as the molding portion 220 and Has an area. The process of forming the first hole 401 may be performed by an automated process using a predetermined punching machine.

As another embodiment of forming the base foil 400, an antenna hole 402 and a first hole 401 are formed in the antenna foil 400 " and the lamination foil 400 ', respectively, and the antenna foil 400 is formed. After winding the antenna winding 410 to ″), the antenna foil 400 ″ and the lamination foil 400 ′ may be thermocompressed. At this time, the antenna hole 402 and the first hole 401 have the same shape as described above, and this embodiment is suitable when the degree of expansion of the foil is small or the degree of expansion is uniform even when thermally compressed. Do.

The base foil 400 having the first hole 401 is inserted into the molding part 220 of the COB 200 through the first hole 401, and then through the antenna hole 402. The antenna connection part 411 crossing between them and the antenna electrode of the COB 200 are electrically connected. The antenna aperture 402 allows the operator to have a clear view, thereby obtaining more robust physical connections such as soldering and ultrasonic welding. However, the conductive paste may be used if necessary, and all methods for electrical connection may be used unless otherwise described.

Preferably, before inserting the base foil 400 into the molding part 220 of the COB 200, the hot melt is formed in a portion except for the molding part 220 and the antenna electrode 212 of the COB 200. The double-sided sheet 700, that is, the adhesive material to be melted and bonded when heated, is bonded to each other by bonding the lower surface of the sheet formed on both sides (by applying heat through a separate device (apparatus having a heater and a pressing plate)), and then ( That is, the upper surface is bonded to the base foil 400 to be described later when the thermal pressing in the two-step finished product manufacturing process. However, the upper surface of the hot melt sheet 700 and the base foil 400 may be adhered in advance by using the separate device. Preferably, oil paper is formed on the upper surface of the hot melt double-sided sheet 700, and then the lower surface is adhered to the upper surface of the COB 200 (adhesion by applying heat), and then the oil paper is removed, thereby The upper surface is to be adhered to the base foil 400. Preferably, the hot melt sheet 700 does not protrude outward from the outermost edge portion of the COB 200, that is, the main board 210 portion, and more preferably, the outermost edge of the hot melt sheet 700. By substantially matching the outermost edge of the main board 210, the portion bonded to the core foil 500 is as wide as possible. Preferably, the antenna connection part 411 and the antenna electrode 212 are formed by forming a sheet hole 710 or a? -Shaped groove in a portion where the hot melt sheet 700 contacts the antenna electrode 212. To be electrically connected by ultrasonic welding, adhesion through a conductive adhesive, and soldering, and the center of the hot melt sheet 700 has a center substantially the same size as that of the molding part 220. A hole may be formed to allow the molding part 220 to be fitted, or a hole smaller than the area of the molding part 220 may be formed to allow an operator to remove oil paper from the upper surface of the hot melt sheet 700.

It is preferable that the bottom surface of the base foil 400 is kept horizontal with the bottom surface of the main board. As described below, at least one other foil (for example, before the base foil 400 is laid) For example, the base foil 400 may be laminated thereon after laying the second overlay foil 300 as shown. In addition, the step of applying the hot melt sheet 700 may be changed. In this case, unlike the second case, the bottom surface of the hot melt sheet 700 is not directly bonded to the COB 200, but the second The overlay foil 300 and the antenna foil 400 are stacked on the COB 200, and then adhered to the top surface of the COB 200 through the first hole 401 of the antenna foil 400. In this case, the hot melt sheet 700 still needs a center hole 720 for exposing the molding part 220, but a sheet hole 710 for exposing the antenna electrode 212 needs to be formed. There is no. That is, while stacking the antenna foil 400, the operator can electrically connect the antenna connecting portion 411 and the antenna electrode 212 of the COB 200 while securing a sufficient field of view. The hot melt sheet 700 is bonded thereon. Therefore, the hot melt sheet 700 may be larger than the first hole 401, and the core sheet to be described below by using the hot melt sheet 700 having a larger area than the first hole 401. Adhesion with 500 may be increased.

After connecting the antenna connection portion 411 of the base foil 400 and the antenna electrode 212 of the COB 200, the first hole 401 and the hot melt sheet 700 formed in the base foil 400 The filler 800 is supplied to the formed central hole 720. Through the filler, the finished IC card can maintain a high smoothness as a whole, and preferably, by adding an adhesive filler 800 to improve adhesion between the foils. The filler 800 may be an ultraviolet filler, an instant adhesive, or an epoxy-based adhesive that cures by heat. However, in the case of using an ultraviolet filler, the transparent plate is placed on a portion supplied with the filler 800 and transmitted through UV rays to cure the adhesive, and the epoxy-based adhesive is cured through a separate heating means.

As described above, preferably, prior to stacking the antenna foil 400, a second overlay having a second hole 301 of substantially the same area and shape as the main board 210 of the COB 200. After the foil 300 is inserted into the molding part 220 of the COB 200, the antenna foil 400 is stacked. In this case, the second overlay foil 300 and the antenna foil 400 spot-bond a predetermined portion, that is, a few places by using ultrasonic waves. By stacking the second overlay foil 300, the fading of the antenna winding 410 is prevented from being seen from the outside in the completed IC card, and as shown, the difference in thickness caused by the hot melt sheet 700. To solve the problem.

After the filler 800 has been added and cured, at least one core foil 500 (only one is shown in this figure) having a third hole 501 of substantially the same shape and area as the molding part 220. Laminated. The third hole 501 is fitted into the molding part 220 of the COB 200. More preferably, before stacking the core foil 500 (or between stacking the plurality of core foils, that is, after stacking one core foil in the case of stacking two core foils), Another hot melt sheet (not shown) is adhered to completely cover the molding 220 of the COB 200. In this case, when the thermocompression bonding is performed later, a gap between the molding part 220 and the base foil 400 or the core foil 500 may be prevented. In particular, when the hot melt sheet is adhered between the base foil 400 and the core foil 500, the hot melt sheet may cover up to the first hole 401. Through this, the hot melt sheet is melted in the case of subsequent thermal compression to fill the space around the antenna connection part 411 in the first hole 401.

The antenna foil 400 ″ and the laminated foil 400 ′ may be sufficiently thickened by the thickness of the core foil 500 without stacking such a core foil 500. That is, in general, when the thickness of the molding part 220 is about 0.42 mm, the thicknesses of the antenna foil 400 ″ and the laminated foil 400 ′ may be about 0.11 mm and 0.11 mm (which may be different), respectively. The core foil 500 of 0.22 mm may be stacked thereon, or the thicknesses of the antenna foil 400 ″ and the laminated foil 400 ′ may be 0.22 mm and 0.22 mm, respectively, and the core foil 500 may be omitted.

After stacking the core foil 500, the first overlay foil 600 having no holes is stacked. The first and second overlay foils 600 and 300 may have a relatively thin thickness with respect to the base foil 400 and the core foil 500. More preferably, as a result of stacking the at least one core foil 500, the height of the top surface of the core foil 500 is slightly higher than the height of the molding part 220 of the COB 200, In addition, the filler 800 is filled in an upper portion of the molding part 220 corresponding to the height difference between the core foil 500 and the molding part 220. Through this, when subsequently thermally compressed, the thickness of the foils is not thinner than the molding part 220. In other words, the foils are reduced in thickness when thermally compressed, whereas the molding part 220 is the same as before the compression is pressed, thereby preventing the thickness of the foil layer from becoming thinner than the molding part 220 of the COB 200. do. In addition, referring to the filler 800 'and an enlarged view (shown in dashed circles) between the core foil 500 and the molding portion 220, the corners of the molding portion 220 are generally squared. Since the filler 800 'is supplied, the gap between the molding part 220 and the core foil 500 can be filled to improve the smoothness of the final IC card. have. The filler 800 ′ may be the same as the filler 800 described above.

In the method of manufacturing an IC card according to the present invention, a second step process for manufacturing the finished IC card is as follows. For the IC card semi-finished product formed through the above-described first step process, at least one or more foils having a fourth hole (not shown) having substantially the same area as the main board 210 of the COB 200 may be formed. Lay down under overlay foil 300, but not less than the thickness of the COB mainboard (because of thermal bonding, the portion of the foil can be reduced in thickness). In this case, the at least one foil may be a printing foil as necessary, and a coating foil for preventing abrasion. Preferably, the method may further include laminating at least one other foil for coating on the first overlay foil 600. Finally, the laminated whole foils are pressed while applying heat.

The IC card manufacturing method according to the present invention provides a method of manufacturing an IC card of higher smoothness by thermal compression in a semi-finished product manufacturing process and thermal compression in a finished product manufacturing process, that is, two thermal compressions.

According to the present invention, there is no step of digging again after laminating the foil, and the COB and the card plate can be strongly bound, there is no gap between the COB and the card plate, and the electrode and antenna electrode of the COB can be strongly bound. Provides IC card manufacturing method, separates the process of manufacturing IC card semi-finished product from the finished product manufacturing process for the rest, enables the division of labor in accordance with the card manufacturing process of the industry, and performs the finished product manufacturing process more effectively It is possible to manufacture a semi-finished product so that it can be, and also has the effect of providing a method of manufacturing an IC card with improved smoothness.

Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be seen to be included in the scope of the present invention.

Claims (23)

The electrode terminal for the contact terminal of the COB having a molding unit, the antenna electrode for the contactless terminal, the electrode surface for the contact terminal is exposed to the outside of the IC card, the antenna for the contactless terminal is mounted in the IC card In the method of manufacturing the semi-finished product of Winding the antenna winding to the antenna foil; Pressing a laminated foil onto the antenna foil to form a base foil; Forming a first hole in the base foil into which the molding portion of the COB can be inserted; Electrically connecting the antenna electrode of the COB and the antenna connection of the base foil; And Stacking the first overlay foil without holes in the base foil; And Abutting the base foil and the first overlay foil; IC card semi-finished product manufacturing method comprising the steps. The method of manufacturing an IC card semi-finished product according to claim 1, further comprising laminating a core foil having a second hole for exposing the molding part of the COB on the antenna foil. 2. The antenna of claim 1, wherein a second overlay foil having a second hole for exposing the molding part of the COB and the antenna electrode is inserted before the stacking of the antenna foil, and the antenna is placed on the second overlay foil. Stacking the foils, and adhering the second overlay foil and the antenna foil to each other. The method of manufacturing a semi-finished IC card according to claim 1, further comprising the step of laminating a core foil having a third hole exposing the molding part of the COB on the antenna foil. The method of manufacturing an IC card semi-finished product according to claim 1 or 4, wherein the step of welding is performed by ultrasonic spot welding at at least one position in the foil. The method of claim 1, further comprising adding a filler to an upper surface of the molding part. The method of manufacturing an IC card semi-finished product according to claim 1, further comprising applying a filler to the antenna hole after the antenna connection part and the antenna electrode are electrically connected. The method of manufacturing an IC card semi-finished product according to claim 6 or 7, wherein the filler is an ultraviolet ray filler, and further comprising the step of exposing the portion to which the filler is applied to ultraviolet rays to cure the portion after the filler is added. . The method of manufacturing a semi-finished IC card according to claim 1, further comprising a step of adhering a bottom surface of the first hot melt sheet having a sheet hole for exposing the antenna electrode of the COB to the COB. The method of claim 1, further comprising forming two antenna holes at predetermined positions of the antenna foil to correspond to the antenna electrodes of the COB, and winding the antennas such that the antenna connection portions are respectively exposed to the antenna holes. IC card semi-finished product manufacturing method characterized in that. The electrode terminal for the contact terminal of the COB having a molding part, the antenna electrode for the contactless terminal, and the electrode surface for the contact terminal is exposed outside the IC card, the antenna for the contactless terminal is mounted inside the IC card, and In the method of manufacturing the IC card by laminating two or more foils, the IC card manufacturing method comprises a method of manufacturing a first stage semi-finished IC card and a method of manufacturing a second stage finished IC card, The method of manufacturing the first step IC card is Winding the antenna winding to the antenna foil; Pressing a blotting foil to the antenna foil to form a base foil; Forming a first hole in the base foil into which the molding portion of the COB can be inserted; Electrically connecting the antenna electrode of the COB and the antenna connection of the base foil; And Stacking the first overlay foil without holes in the base foil; And Abutting the base foil and the first overlay foil; Consists of steps, The method of manufacturing the second step IC card is Stacking at least one or more foils having a fourth hole of substantially the same area as the motherboard of the COB to a thickness not less than the thickness of the motherboard of the COB; And Compressing the laminated whole foils; An IC card manufacturing method comprising the steps. 12. The method of claim 11, further comprising stacking a core foil having a second hole for exposing the molding portion of the COB, on the antenna foil. 12. The method according to claim 11, wherein the second overlay foil having a second hole for exposing the molding portion and the antenna electrode of the COB is inserted into the molding portion prior to stacking the antenna foil, and the antenna is placed on the second overlay foil. Stacking the foils, and adhering the second overlay foil and the antenna foil to each other. The method of manufacturing an IC card semi-finished product according to claim 11, further comprising the step of laminating a core foil having a third hole exposing the molding part of the COB on the antenna foil. The method of manufacturing an IC card semi-finished product according to claim 11 or 14, wherein the step of welding is performed by ultrasonic spot welding at at least one position in the foil. 12. The method of claim 11, further comprising adding a filler to an upper surface of the molding part. 12. The method of claim 11, further comprising applying a filler to the antenna hole after the antenna connection part and the antenna electrode are electrically connected. 18. The method of claim 16 or 17, wherein the filler is an ultraviolet filler, and further comprising the step of exposing the portion to which the filler is applied to ultraviolet rays to cure the filler after applying the filler. . 12. The method of claim 11, further comprising adhering the bottom surface of the first hot melt sheet having a sheet hole for exposing the antenna electrode of the COB to the COB. 12. The method of claim 11, further comprising forming two antenna holes at predetermined positions of the antenna foil so as to correspond to the antenna electrodes of the COB, and winding the antennas such that the antenna connection portions are respectively exposed to the antenna holes. IC card semi-finished product manufacturing method characterized in that. The electrode terminal for the contact terminal of the COB having a molding unit, the antenna electrode for the contactless terminal, the electrode surface for the contact terminal is exposed to the outside of the IC card, the antenna for the contactless terminal is mounted in the IC card In the method of manufacturing the semi-finished product of Forming two antenna holes corresponding to the antenna electrode of the COB and a first hole corresponding to the molding part of the COB at a predetermined position of the antenna foil; Winding an antenna winding to the antenna foil such that antenna connections are respectively exposed to the antenna aperture; A base foil is formed by pressing a laminated foil having two antenna holes respectively corresponding to the antenna holes of the antenna foil and another first hole corresponding to the first hole of the antenna foil, to the antenna foil; Electrically connecting the antenna electrode of the COB and the antenna connection of the base foil; And Stacking the first overlay foil without holes in the base foil; And Abutting the base foil and the first overlay foil; IC card semi-finished product manufacturing method comprising the steps. 22. The method of manufacturing a semi-finished IC card according to claim 21, further comprising laminating a core foil having a second hole for exposing the molding portion of the COB, over the antenna foil. 22. The method of claim 21, wherein a second overlay foil having a second hole for exposing the molding portion of the COB and the antenna electrode is inserted before the stacking of the antenna foil, and the antenna is placed on the second overlay foil. Stacking the foils, and adhering the second overlay foil and the antenna foil to each other.