KR20040028736A - 열처리 장치 - Google Patents
열처리 장치 Download PDFInfo
- Publication number
- KR20040028736A KR20040028736A KR10-2003-7013401A KR20037013401A KR20040028736A KR 20040028736 A KR20040028736 A KR 20040028736A KR 20037013401 A KR20037013401 A KR 20037013401A KR 20040028736 A KR20040028736 A KR 20040028736A
- Authority
- KR
- South Korea
- Prior art keywords
- pressure
- exhaust
- heat treatment
- treatment apparatus
- gas
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims description 30
- 238000012545 processing Methods 0.000 claims description 48
- 238000011282 treatment Methods 0.000 claims description 17
- 230000001105 regulatory effect Effects 0.000 claims description 5
- 230000001276 controlling effect Effects 0.000 claims description 2
- 230000006837 decompression Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 21
- 239000007789 gas Substances 0.000 description 39
- 239000010408 film Substances 0.000 description 11
- 238000001514 detection method Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 238000002485 combustion reaction Methods 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 3
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000011946 reduction process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009279 wet oxidation reaction Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 208000037998 chronic venous disease Diseases 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
- Muffle Furnaces And Rotary Kilns (AREA)
- Furnace Details (AREA)
Abstract
Description
Claims (9)
- 열처리 장치에 있어서,피처리체를 수용하는 처리로와,상기 처리로 내에 처리 가스를 공급하는 처리 가스 공급계와,상기 처리로를 가열하는 히터와,상기 처리로 내를 배기하기 위한 배기 통로를 갖는 배기계와,상기 배기 통로 내의 배기 압력을 조절하는 배기압 조절 장치와,상기 배기 통로 내의 배기 압력을 대기압과의 차압으로서 검출하는 차압계와,상기 대기압을 절대압으로서 검출하는 기압계와,상기 차압계에 의해 검출된 배기 압력과 상기 기압계에 의해 검출된 대기압으로부터 얻을 수 있는 절대압으로서의 배기 압력을 기초로 하여, 상기 배기압 조절 장치를 제어하는 제어부를 구비한 것을 특징으로 하는 열처리 장치.
- 제1항에 있어서, 상기 배기압 조정 장치는 배기 압력을 조절할 수 있는 압력 가변 밸브를 포함하고 있는 것을 특징으로 하는 열처리 장치.
- 제2항에 있어서, 상기 압력 가변 밸브는 상기 배기 통로 내의 배기의 흐름을 차단 가능하게 구성되어 있는 것을 특징으로 하는 열처리 장치.
- 제2항에 있어서, 배기 압력을 감압하는 이젝터를 더 구비한 것을 특징으로 하는 열처리 장치.
- 제1항에 있어서, 상기 배기압 조정 장치는 이젝터와, 상기 이젝터에 공급되는 작동 기체의 유량을 조정하는 조절기를 포함하고 있는 것을 특징으로 하는 열처리 장치.
- 제1항에 있어서, 상기 배기 통로는 미소 감압 공장 배기계에 접속되어 있고, 상기 배기 통로에는 이젝터가 설치되어 있는 것을 특징으로 하는 열처리 장치.
- 제6항에 있어서, 상기 배기압 조정 장치는 압력 가변 밸브를 포함하고 있는 것을 특징으로 하는 열처리 장치.
- 제1항에 있어서, 상기 차압계는 상기 처리로를 대기 개방함으로써 영점 조정 가능하게 구성되어 있는 것을 특징으로 하는 열처리 장치.
- 제1항에 기재된 열처리 장치를 복수 구비하고, 이들 복수의 열처리 장치에서 1개의 기압계가 공용되는 것을 특징으로 하는 열처리 장치 세트.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001230315A JP3554847B2 (ja) | 2001-07-30 | 2001-07-30 | 熱処理装置 |
JPJP-P-2001-00230315 | 2001-07-30 | ||
PCT/JP2002/002711 WO2003012849A1 (fr) | 2001-07-30 | 2002-03-20 | Appareil de traitement thermique |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040028736A true KR20040028736A (ko) | 2004-04-03 |
KR100814582B1 KR100814582B1 (ko) | 2008-03-17 |
Family
ID=19062545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020037013401A KR100814582B1 (ko) | 2001-07-30 | 2002-03-20 | 열처리 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7044731B2 (ko) |
EP (1) | EP1414061A4 (ko) |
JP (1) | JP3554847B2 (ko) |
KR (1) | KR100814582B1 (ko) |
CN (1) | CN1218370C (ko) |
WO (1) | WO2003012849A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101966875B1 (ko) * | 2018-10-25 | 2019-04-08 | 센서클라우드주식회사 | 차압 측정 장치 및 이의 보정 방법 |
KR20200032269A (ko) * | 2017-08-18 | 2020-03-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 고압 및 고온 어닐링 챔버 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3543949B2 (ja) * | 1999-11-09 | 2004-07-21 | 東京エレクトロン株式会社 | 熱処理装置 |
JP4010314B2 (ja) * | 2004-12-17 | 2007-11-21 | 東京エレクトロン株式会社 | ゲートバルブ装置、処理システム及びシール部材の交換方法 |
JP4813854B2 (ja) * | 2005-09-09 | 2011-11-09 | 株式会社日立国際電気 | 基板処理装置及び半導体の製造方法 |
CN100378912C (zh) * | 2005-09-28 | 2008-04-02 | 联华电子股份有限公司 | 快速热处理机台 |
US7682987B2 (en) | 2006-06-28 | 2010-03-23 | Hitachi Kokusai Electric Inc. | Device for processing substrate and method of manufacturing semiconductor device |
KR100782484B1 (ko) | 2006-07-13 | 2007-12-05 | 삼성전자주식회사 | 열처리 설비 |
JP5015541B2 (ja) * | 2006-10-07 | 2012-08-29 | 昭和鉄工株式会社 | 熱処理装置 |
TWI442012B (zh) * | 2011-11-17 | 2014-06-21 | Kern Energy Entpr Co Ltd | 垂直式熱處理爐結構 |
CN104685312B (zh) * | 2012-10-03 | 2016-12-28 | 夏普株式会社 | 基板烧成装置 |
JP6413293B2 (ja) * | 2014-03-27 | 2018-10-31 | 東京エレクトロン株式会社 | 成膜方法及び記憶媒体 |
JP2016172646A (ja) * | 2015-03-16 | 2016-09-29 | 東洋インキScホールディングス株式会社 | カーボンナノチューブの製造装置 |
KR20230135517A (ko) | 2022-03-16 | 2023-09-25 | 도쿄엘렉트론가부시키가이샤 | 열처리 장치 및 열처리 방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2598637B2 (ja) | 1987-02-26 | 1997-04-09 | 東京エレクトロン株式会社 | 酸化・拡散装置 |
US5088922A (en) * | 1990-01-23 | 1992-02-18 | Tokyo Electron Sagami Limited | Heat-treatment apparatus having exhaust system |
JPH0513544A (ja) | 1991-06-28 | 1993-01-22 | Kawasaki Steel Corp | 真空チヤンバを有する半導体製造装置 |
US5837903A (en) * | 1995-09-22 | 1998-11-17 | The Scott Fetzer Company Inc. | Device for measuring exhaust flowrate using laminar flow element |
TW430866B (en) * | 1998-11-26 | 2001-04-21 | Tokyo Electron Ltd | Thermal treatment apparatus |
JP3543949B2 (ja) | 1999-11-09 | 2004-07-21 | 東京エレクトロン株式会社 | 熱処理装置 |
US7076920B2 (en) * | 2000-03-22 | 2006-07-18 | Mks Instruments, Inc. | Method of using a combination differential and absolute pressure transducer for controlling a load lock |
JP3872952B2 (ja) * | 2000-10-27 | 2007-01-24 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理方法 |
WO2002035590A1 (fr) | 2000-10-27 | 2002-05-02 | Tokyo Electron Limited | Dispositif de traitement thermique |
JP4618912B2 (ja) * | 2001-03-12 | 2011-01-26 | Okiセミコンダクタ株式会社 | 被処理体の加熱処理装置及びその排気方法 |
-
2001
- 2001-07-30 JP JP2001230315A patent/JP3554847B2/ja not_active Expired - Fee Related
-
2002
- 2002-03-20 WO PCT/JP2002/002711 patent/WO2003012849A1/ja not_active Application Discontinuation
- 2002-03-20 US US10/485,155 patent/US7044731B2/en not_active Expired - Lifetime
- 2002-03-20 CN CN028066383A patent/CN1218370C/zh not_active Expired - Fee Related
- 2002-03-20 KR KR1020037013401A patent/KR100814582B1/ko active IP Right Grant
- 2002-03-20 EP EP02705409A patent/EP1414061A4/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200032269A (ko) * | 2017-08-18 | 2020-03-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 고압 및 고온 어닐링 챔버 |
US11462417B2 (en) | 2017-08-18 | 2022-10-04 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
US11469113B2 (en) | 2017-08-18 | 2022-10-11 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
KR101966875B1 (ko) * | 2018-10-25 | 2019-04-08 | 센서클라우드주식회사 | 차압 측정 장치 및 이의 보정 방법 |
Also Published As
Publication number | Publication date |
---|---|
WO2003012849A1 (fr) | 2003-02-13 |
US7044731B2 (en) | 2006-05-16 |
JP3554847B2 (ja) | 2004-08-18 |
US20040175666A1 (en) | 2004-09-09 |
CN1218370C (zh) | 2005-09-07 |
CN1496583A (zh) | 2004-05-12 |
EP1414061A4 (en) | 2004-12-29 |
KR100814582B1 (ko) | 2008-03-17 |
EP1414061A1 (en) | 2004-04-28 |
JP2003045867A (ja) | 2003-02-14 |
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