KR20040010582A - 캐리어로부터 캐리어부분을 제거하기 위한 방법과 장치 및캐리리어로부터 제거된 제품 - Google Patents

캐리어로부터 캐리어부분을 제거하기 위한 방법과 장치 및캐리리어로부터 제거된 제품 Download PDF

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Publication number
KR20040010582A
KR20040010582A KR10-2003-7009927A KR20037009927A KR20040010582A KR 20040010582 A KR20040010582 A KR 20040010582A KR 20037009927 A KR20037009927 A KR 20037009927A KR 20040010582 A KR20040010582 A KR 20040010582A
Authority
KR
South Korea
Prior art keywords
carrier
cutting
edge
cutting element
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR10-2003-7009927A
Other languages
English (en)
Korean (ko)
Inventor
안드레아누스윌헬무스 반달렌
헨리조셉 반에그몬드
Original Assignee
피코 비. 브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL1017215A external-priority patent/NL1017215C2/nl
Priority claimed from NL1018511A external-priority patent/NL1018511C2/nl
Application filed by 피코 비. 브이. filed Critical 피코 비. 브이.
Publication of KR20040010582A publication Critical patent/KR20040010582A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5147—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool
    • Y10T29/5148—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means
    • Y10T29/515—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means to trim electric component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0207—Other than completely through work thickness or through work presented
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9411—Cutting couple type
    • Y10T83/9447—Shear type

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
KR10-2003-7009927A 2001-01-29 2002-01-29 캐리어로부터 캐리어부분을 제거하기 위한 방법과 장치 및캐리리어로부터 제거된 제품 Ceased KR20040010582A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
NL1017215A NL1017215C2 (nl) 2001-01-29 2001-01-29 Werkwijze en inrichting voor het uit een drager verwijderen van een draagdeel.
NL1017215 2001-01-29
NL1018511A NL1018511C2 (nl) 2001-07-11 2001-07-11 Werkwijze en inrichting voor het met een enkele bewerking uit een drager verwijderen van een dragerdeel, en een uit een drager verwijderd product.
NL1018511 2001-07-11
PCT/NL2002/000068 WO2002061822A1 (en) 2001-01-29 2002-01-29 Method and apparatus for removing a carrier part from a carrier, and a product removed from a carrier

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020087015182A Division KR100909117B1 (ko) 2001-01-29 2002-01-29 캐리어로부터 캐리어부분을 제거하기 위한 방법과 장치 및 캐리어로부터 제거된 제품

Publications (1)

Publication Number Publication Date
KR20040010582A true KR20040010582A (ko) 2004-01-31

Family

ID=26643289

Family Applications (2)

Application Number Title Priority Date Filing Date
KR10-2003-7009927A Ceased KR20040010582A (ko) 2001-01-29 2002-01-29 캐리어로부터 캐리어부분을 제거하기 위한 방법과 장치 및캐리리어로부터 제거된 제품
KR1020087015182A Expired - Fee Related KR100909117B1 (ko) 2001-01-29 2002-01-29 캐리어로부터 캐리어부분을 제거하기 위한 방법과 장치 및 캐리어로부터 제거된 제품

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020087015182A Expired - Fee Related KR100909117B1 (ko) 2001-01-29 2002-01-29 캐리어로부터 캐리어부분을 제거하기 위한 방법과 장치 및 캐리어로부터 제거된 제품

Country Status (5)

Country Link
US (1) US7162906B2 (https=)
EP (1) EP1358672A1 (https=)
JP (1) JP4225781B2 (https=)
KR (2) KR20040010582A (https=)
WO (1) WO2002061822A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7051911B2 (en) * 2001-12-21 2006-05-30 Eastman Kodak Company Apparatus and method for cutting sheet materials
JP4899864B2 (ja) * 2004-04-09 2012-03-21 トヨタ紡織株式会社 せん断加工装置
EP2155413B1 (en) * 2007-05-25 2015-08-12 Magna International Inc. Integrated die trim method
JP5383255B2 (ja) * 2009-02-27 2014-01-08 日本発條株式会社 板材の切断方法、板材の切断装置、ヘッドサスペンション及び板材の積層品
DE102016201433A1 (de) * 2016-02-01 2017-08-03 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Bearbeiten und/oder Herstellen eines Bauteils

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1434190A (en) * 1921-04-08 1922-10-31 Automatic Machinery & Equipmen Process of coining and dies therefor
DE1169404B (de) * 1959-09-02 1964-05-06 Kienzle Apparate Gmbh Werkzeug zum Stanzschneiden von Blech
US3656379A (en) * 1969-10-22 1972-04-18 Vandervell Products Ltd Methods of cutting laminated strip material
DE2526318A1 (de) 1975-06-12 1976-12-23 Siemens Ag Metallischer zwischentraeger zur halterung und kontaktierung eines halbleiterkoerpers
US4362902A (en) * 1981-03-27 1982-12-07 Amp Incorporated Ceramic chip carrier
JPS5890750A (ja) 1982-11-15 1983-05-30 Hitachi Ltd リ−ドフレ−ムの製法
JPH065758A (ja) 1992-06-19 1994-01-14 Mitsubishi Electric Corp 半導体装置の製造方法及び半導体装置の製造装置
US5458158A (en) * 1993-03-30 1995-10-17 Toyo Communication Equipment Co., Ltd. Lead cutting apparatus and an anticorrosive coat structure of lead
JPH0722554A (ja) 1993-06-30 1995-01-24 Dainippon Printing Co Ltd 薄板のトリミング装置およびその方法
JP2586352B2 (ja) 1995-01-26 1997-02-26 日本電気株式会社 半導体装置用リード切断装置
JPH09223706A (ja) 1996-02-15 1997-08-26 Sony Corp 半導体製造方法およびその製造装置
JPH09307046A (ja) 1996-05-15 1997-11-28 Nec Corp 金型及び該金型を用いたタイバ−切断方法
JP3110413B2 (ja) 1999-01-20 2000-11-20 広島日本電気株式会社 半導体装置用リード切断装置
US6401510B1 (en) * 1999-04-07 2002-06-11 3M Innovative Properties Company Method for stamping a part from a multi-layered strip

Also Published As

Publication number Publication date
KR20080064207A (ko) 2008-07-08
WO2002061822A1 (en) 2002-08-08
EP1358672A1 (en) 2003-11-05
US20040074353A1 (en) 2004-04-22
US7162906B2 (en) 2007-01-16
JP2004520712A (ja) 2004-07-08
JP4225781B2 (ja) 2009-02-18
KR100909117B1 (ko) 2009-07-23

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