KR20040002866A - 인터페이스 재료 및 인터페이스 재료의 생산과 사용방법 - Google Patents

인터페이스 재료 및 인터페이스 재료의 생산과 사용방법 Download PDF

Info

Publication number
KR20040002866A
KR20040002866A KR10-2003-7010597A KR20037010597A KR20040002866A KR 20040002866 A KR20040002866 A KR 20040002866A KR 20037010597 A KR20037010597 A KR 20037010597A KR 20040002866 A KR20040002866 A KR 20040002866A
Authority
KR
South Korea
Prior art keywords
thermally conductive
interface
laminated
fibers
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR10-2003-7010597A
Other languages
English (en)
Korean (ko)
Inventor
마이 엔구엔
낸시 딘
겐니치로 후쿠야마
Original Assignee
허니웰 인터내셔날 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/047,617 external-priority patent/US6673434B2/en
Application filed by 허니웰 인터내셔날 인코포레이티드 filed Critical 허니웰 인터내셔날 인코포레이티드
Publication of KR20040002866A publication Critical patent/KR20040002866A/ko
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/10—Layered products comprising a layer of natural or synthetic rubber next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H10W40/735—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state by melting or evaporation of solids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/103—Metal fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2319/00—Synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR10-2003-7010597A 2001-05-30 2002-05-30 인터페이스 재료 및 인터페이스 재료의 생산과 사용방법 Ceased KR20040002866A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US29443301P 2001-05-30 2001-05-30
US60/294,433 2001-05-30
US10/047,617 2002-01-14
US10/047,617 US6673434B2 (en) 1999-12-01 2002-01-14 Thermal interface materials
PCT/US2002/017331 WO2002096636A1 (en) 2001-05-30 2002-05-30 Interface materials and methods of production and use thereof

Publications (1)

Publication Number Publication Date
KR20040002866A true KR20040002866A (ko) 2004-01-07

Family

ID=26725250

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-7010597A Ceased KR20040002866A (ko) 2001-05-30 2002-05-30 인터페이스 재료 및 인터페이스 재료의 생산과 사용방법

Country Status (7)

Country Link
EP (1) EP1401641A4 (https=)
JP (1) JP4237505B2 (https=)
KR (1) KR20040002866A (https=)
CN (1) CN1267268C (https=)
CA (1) CA2433637A1 (https=)
TW (1) TWI286514B (https=)
WO (1) WO2002096636A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200028488A (ko) * 2017-09-08 2020-03-16 허니웰 인터내셔날 인코포레이티드 실리콘-무함유 열 겔

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US7608324B2 (en) 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof
CN1841713A (zh) 2005-03-31 2006-10-04 清华大学 热界面材料及其制作方法
CN100358132C (zh) * 2005-04-14 2007-12-26 清华大学 热界面材料制备方法
JP2007251002A (ja) * 2006-03-17 2007-09-27 Toshiba Corp ヒートシンク、電子デバイス、ヒートシンクの製造方法及び電子デバイスの製造方法
US9279178B2 (en) 2007-04-27 2016-03-08 Honeywell International Inc. Manufacturing design and processing methods and apparatus for sputtering targets
US7808099B2 (en) 2008-05-06 2010-10-05 International Business Machines Corporation Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method
US9269603B2 (en) 2013-05-09 2016-02-23 Globalfoundries Inc. Temporary liquid thermal interface material for surface tension adhesion and thermal control
EP3105300B1 (en) 2014-02-13 2019-08-21 Honeywell International Inc. Compressible thermal interface materials
DE102015223443A1 (de) * 2015-11-26 2017-06-01 Robert Bosch Gmbh Elektrische Vorrichtung mit einer Umhüllmasse
US10781349B2 (en) 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
CN112004890B (zh) * 2018-04-17 2022-05-10 三井化学株式会社 热固性树脂组合物、预涂金属用涂覆材、固化物及层叠体
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250600A (en) * 1992-05-28 1993-10-05 Johnson Matthey Inc. Low temperature flexible die attach adhesive and articles using same
US5852548A (en) * 1994-09-09 1998-12-22 Northrop Grumman Corporation Enhanced heat transfer in printed circuit boards and electronic components thereof
US5725707A (en) * 1995-04-10 1998-03-10 Northrop Grumman Corporation Enhanced conductive joints from fiber flocking
WO1999067811A2 (en) * 1998-06-24 1999-12-29 Johnson Matthey Electronics, Inc. Electronic device having fibrous interface
AU1616300A (en) * 1998-12-02 2000-06-19 Intel Corporation A fibrous thermal interface adaptor
JP2000273196A (ja) * 1999-03-24 2000-10-03 Polymatech Co Ltd 熱伝導性樹脂基板および半導体パッケージ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200028488A (ko) * 2017-09-08 2020-03-16 허니웰 인터내셔날 인코포레이티드 실리콘-무함유 열 겔
KR20220050241A (ko) * 2017-09-08 2022-04-22 허니웰 인터내셔날 인코포레이티드 실리콘-무함유 열 겔

Also Published As

Publication number Publication date
WO2002096636A1 (en) 2002-12-05
EP1401641A4 (en) 2007-12-12
CA2433637A1 (en) 2002-12-05
CN1267268C (zh) 2006-08-02
JP2005508767A (ja) 2005-04-07
CN1512933A (zh) 2004-07-14
TWI286514B (en) 2007-09-11
JP4237505B2 (ja) 2009-03-11
EP1401641A1 (en) 2004-03-31

Similar Documents

Publication Publication Date Title
US7867609B2 (en) Thermal interface materials
CN110023444B (zh) 膜状粘接剂、使用了膜状粘接剂的半导体封装体的制造方法
JP2006522491A (ja) 熱相互接続および界面システム、製造方法、およびその使用方法
EP1797155B1 (en) Thermally conductive composition and method for preparing the same
CN1696231B (zh) 可再加工的传导粘合剂组合物及其制备方法
KR20040002866A (ko) 인터페이스 재료 및 인터페이스 재료의 생산과 사용방법
US20070051773A1 (en) Thermal interface materials, methods of preparation thereof and their applications
US20070241303A1 (en) Thermally conductive composition and method for preparing the same
JP2005538535A (ja) 熱的インターコネクトおよびインターフェースシステム、製造方法およびその使用
US20010052652A1 (en) Electronic device having fibrous interface
US7608324B2 (en) Interface materials and methods of production and use thereof
WO2007084572A2 (en) Thermal interconnect and interface systems, methods of production and uses thereof
JP6418348B1 (ja) 複合部材
TW202600778A (zh) 半導體元件的製造方法、導熱薄片、及導熱薄片的製造方法
WO2008014163A2 (en) Synergistically-modified surfaces and surface profiles for use with thermal interconnect and interface materials, methods of production and uses thereof
CN115004358A (zh) 导热性片、叠层体及半导体装置
KR20050019873A (ko) 열적 상호연결 및 인터페이스 시스템, 이들의 제조 방법및 용도

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20030812

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20061121

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20070911

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20080422

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20070911

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I