KR20030097881A - 반도체 메모리 장치의 제조 방법 - Google Patents
반도체 메모리 장치의 제조 방법 Download PDFInfo
- Publication number
- KR20030097881A KR20030097881A KR10-2003-7015025A KR20037015025A KR20030097881A KR 20030097881 A KR20030097881 A KR 20030097881A KR 20037015025 A KR20037015025 A KR 20037015025A KR 20030097881 A KR20030097881 A KR 20030097881A
- Authority
- KR
- South Korea
- Prior art keywords
- region
- memory device
- layer
- manufacturing
- memory
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10124366.9 | 2001-05-18 | ||
DE10124366A DE10124366A1 (de) | 2001-05-18 | 2001-05-18 | Verfahren zum Herstellen einer Halbleiterspeichereinrichtung |
PCT/DE2002/001651 WO2002095827A2 (de) | 2001-05-18 | 2002-05-07 | Verfahren zum herstellen einer halbleiterspeichereinrichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20030097881A true KR20030097881A (ko) | 2003-12-31 |
Family
ID=7685353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2003-7015025A KR20030097881A (ko) | 2001-05-18 | 2002-05-07 | 반도체 메모리 장치의 제조 방법 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR20030097881A (zh) |
CN (1) | CN1509498A (zh) |
DE (1) | DE10124366A1 (zh) |
WO (1) | WO2002095827A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10804320B2 (en) | 2017-06-05 | 2020-10-13 | Samsung Electronics Co., Ltd. | Insulation layer arrangement for magnetic tunnel junction device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6784091B1 (en) * | 2003-06-05 | 2004-08-31 | International Business Machines Corporation | Maskless array protection process flow for forming interconnect vias in magnetic random access memory devices |
US11437431B2 (en) | 2020-01-15 | 2022-09-06 | Taiwan Semiconductor Manufacturing Company Limited | Memory device with flat-top bottom electrodes and methods for forming the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5650958A (en) * | 1996-03-18 | 1997-07-22 | International Business Machines Corporation | Magnetic tunnel junctions with controlled magnetic response |
US5838608A (en) * | 1997-06-16 | 1998-11-17 | Motorola, Inc. | Multi-layer magnetic random access memory and method for fabricating thereof |
EP1097457B1 (de) * | 1998-07-15 | 2003-04-09 | Infineon Technologies AG | Speicherzellenanordnung, bei der ein elektrischer widerstand eines speicherelements eine information darstellt und durch ein magnetfeld beeinflussbar ist, und verfahren zu deren herstellung |
EP1157388B1 (de) * | 1999-02-26 | 2002-07-31 | Infineon Technologies AG | Speicherzellenanordnung und verfahren zu deren herstellung |
US6165803A (en) * | 1999-05-17 | 2000-12-26 | Motorola, Inc. | Magnetic random access memory and fabricating method thereof |
DE10043159A1 (de) * | 2000-09-01 | 2002-03-21 | Infineon Technologies Ag | Speicherzellenanordnung und Verfahren zu deren Herstellung |
-
2001
- 2001-05-18 DE DE10124366A patent/DE10124366A1/de not_active Withdrawn
-
2002
- 2002-05-07 CN CNA028101804A patent/CN1509498A/zh active Pending
- 2002-05-07 WO PCT/DE2002/001651 patent/WO2002095827A2/de active Application Filing
- 2002-05-07 KR KR10-2003-7015025A patent/KR20030097881A/ko not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10804320B2 (en) | 2017-06-05 | 2020-10-13 | Samsung Electronics Co., Ltd. | Insulation layer arrangement for magnetic tunnel junction device |
US11462584B2 (en) | 2017-06-05 | 2022-10-04 | Samsung Electronics Co., Ltd. | Insulation layer arrangement for magnetic tunnel junction device |
Also Published As
Publication number | Publication date |
---|---|
WO2002095827A3 (de) | 2003-08-21 |
CN1509498A (zh) | 2004-06-30 |
DE10124366A1 (de) | 2002-11-28 |
WO2002095827A2 (de) | 2002-11-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20230088093A1 (en) | Semiconductor structure and method of forming the same | |
US11489107B2 (en) | Memory cell with top electrode via | |
US9343659B1 (en) | Embedded magnetoresistive random access memory (MRAM) integration with top contacts | |
US10109790B2 (en) | Method for manufacturing mixed-dimension and void-free MRAM structure | |
KR100694566B1 (ko) | Mram 기술에서 자기 스택의 표면 비평탄성을 개선하는바이레이어 cmp 공정 | |
US7442624B2 (en) | Deep alignment marks on edge chips for subsequent alignment of opaque layers | |
US7829923B2 (en) | Magnetic tunnel junction and method of fabrication | |
TWI781406B (zh) | 記憶體裝置、磁性穿隧接面記憶體裝置及其形成方法 | |
US20180166501A1 (en) | Structure and formation method of integrated circuit structure | |
US9082695B2 (en) | Vialess memory structure and method of manufacturing same | |
US7381574B2 (en) | Method of forming dual interconnects in manufacturing MRAM cells | |
CN111261773A (zh) | 半导体存储器元件及其制作方法 | |
CN100426476C (zh) | 具有凹陷的对准标记的平面磁隧道结衬底 | |
US20210336130A1 (en) | Method of manufacturing mram device with enhanced etch control | |
CN111106237A (zh) | 集成芯片及其形成方法 | |
US20180233661A1 (en) | Device alignment mark using a planarization process | |
US20230380291A1 (en) | Method of manufacturing mram device with enhanced etch control | |
US20210159215A1 (en) | Bonded assembly containing laterally bonded bonding pads and methods of forming the same | |
US6913990B2 (en) | Method of forming isolation dummy fill structures | |
KR20030097881A (ko) | 반도체 메모리 장치의 제조 방법 | |
US20040175934A1 (en) | Method for improving etch selectivity effects in dual damascene processing | |
US10627720B2 (en) | Overlay mark structures | |
US20220271087A1 (en) | Memory device and method for forming thereof | |
US20230189671A1 (en) | Recessed local interconnect semiconductor memory device | |
US7259024B2 (en) | Method of treating a substrate in manufacturing a magnetoresistive memory cell |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |