KR20030094014A - Solution for Detaching Nickel or Nickel Alloy - Google Patents
Solution for Detaching Nickel or Nickel Alloy Download PDFInfo
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- KR20030094014A KR20030094014A KR10-2003-0034323A KR20030034323A KR20030094014A KR 20030094014 A KR20030094014 A KR 20030094014A KR 20030034323 A KR20030034323 A KR 20030034323A KR 20030094014 A KR20030094014 A KR 20030094014A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
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Abstract
본 발명은 니켈 또는 니켈 합금 이외의 금속, 특히 구리 및 구리 합금 피막, 및 주석 및 주석 합금 피막을 박리하지 않고, 니켈 또는 니켈 합금 피막을 선택적으로 고속도로 박리하기 위한 박리액을 제공한다.The present invention provides a peeling liquid for selectively peeling off a nickel or nickel alloy film at high speed without peeling metals other than nickel or nickel alloys, especially copper and copper alloy films, and tin and tin alloy films.
(a) 과산화수소, (b) 무기산, (c) 4급 암모늄염 및 (d) 탄소수 3 내지 7의 지방족 알코올을 함유하는 수용액인 니켈 또는 니켈 합금의 박리액.A stripper of nickel or a nickel alloy, which is an aqueous solution containing (a) hydrogen peroxide, (b) inorganic acid, (c) quaternary ammonium salt, and (d) aliphatic alcohol having 3 to 7 carbon atoms.
Description
본 발명은 니켈 또는 니켈 합금과, 이들 이외의 금속이 존재하는 재료로부터 니켈 또는 니켈 합금을 선택적으로 용해하는 박리액에 관한 것이다. 본 발명의 박리액은 반도체 제품, 프린트 배선판 등의 전자 부품의 제조에 유용하다.The present invention relates to a stripping solution for selectively dissolving nickel or a nickel alloy from nickel or a nickel alloy and a material other than these. The peeling liquid of this invention is useful for manufacture of electronic components, such as a semiconductor product and a printed wiring board.
프린트 배선판의 구리 배선을 제조하는 공정에서, 일시적으로 구리 배선을 매스킹(masking)하기 위해서 니켈 도금 피막이 실시되지만, 최종적으로는 니켈 도금 피막은 용해되어 제거된다. 이 때, 최근의 프린트 배선판은 미세화(fine)화가 진행되고 있기 때문에, 니켈 도금 피막 이외의 금속을 용해시키지 않는 것이 요구되고 있다.In the process of manufacturing the copper wiring of a printed wiring board, a nickel plating film is performed in order to temporarily mask copper wiring, but finally, a nickel plating film is melted and removed. At this time, since the refinement | miniaturization of the printed wiring board of recent years is progressing, it is calculated | required not to melt | dissolve metal other than a nickel plating film.
니켈 박리액으로서는, 과산화수소-질산계, 과산화수소-불화물계가 알려져 있지만, 어느 박리액도 구리 또는 구리 합금 및 주석 또는 주석 합금(땜납)을 용해시킨다고 하는 문제가 있다. 또한, 과산화수소-황산-유기산계는 니켈의 용해 속도가 느리다고 하는 문제가 있다. 따라서, 니켈 또는 니켈 합금 피막을 선택적으로 고속도로 용해하기 위한 박리액의 시급한 실용화가 요망되고 있다.Hydrogen peroxide-nitric acid type and hydrogen peroxide-fluoride type are known as nickel stripping solution, but there is a problem that any stripping solution dissolves copper or copper alloy and tin or tin alloy (solder). In addition, the hydrogen peroxide-sulfuric acid-organic acid system has a problem that the dissolution rate of nickel is slow. Therefore, there is a demand for an urgent practical use of a stripping solution for selectively melting a nickel or nickel alloy film at high speeds.
본 발명의 목적은 니켈 또는 니켈 합금 이외의 금속, 특히 구리 및 구리 합금 피막, 및 주석 및 주석 합금 피막을 용해시키지 않고, 니켈 또는 니켈 합금 피막을 선택적으로 고속도로 용해하기 위한 박리액을 제공하는 것이다.It is an object of the present invention to provide a stripper for selectively dissolving nickel or nickel alloy coatings at high speed without dissolving metals other than nickel or nickel alloys, especially copper and copper alloy coatings, and tin and tin alloy coatings.
본 발명자들은 예의 검토를 거듭한 결과, 과산화수소-무기산계에 니켈 용해 촉진제 및 금속 용해 억제제를 첨가함으로써 구리 또는 구리 합금 피막, 및 주석 또는 주석 합금 피막은 용해시키지 않고, 니켈 또는 니켈 합금 피막을 선택적으로 고속으로 용해할 수 있는 것을 발견하고 본 발명을 완성하였다.As a result of intensive studies, the inventors have added nickel dissolution accelerators and metal dissolution inhibitors to the hydrogen peroxide-inorganic acid system to selectively dissolve the nickel or nickel alloy films without dissolving the copper or copper alloy films and the tin or tin alloy films. The present invention was found to be capable of dissolving at high speed.
즉, 본 발명은 (a) 과산화수소, (b) 무기산, (c) 4급 암모늄염, 및 (d) 탄소수 3 내지 7의 지방족 알코올을 함유하는 수용액인 니켈 또는 니켈 합금의 박리액에 관한 것이다.That is, the present invention relates to a stripping solution of nickel or nickel alloy which is an aqueous solution containing (a) hydrogen peroxide, (b) inorganic acid, (c) quaternary ammonium salt, and (d) aliphatic alcohol having 3 to 7 carbon atoms.
본 발명의 과산화수소 농도는 1 내지 30 중량%이고, 바람직하게는 5 내지 20 중량%이다. 농도가 1 중량% 미만이면 산화 효과가 불충분하여 충분한 용해 속도가 얻어지지 않고, 또한 첨가량이 30 중량%를 넘으면 그 이상의 산화 효과가 얻어지지 않아 경제적으로 바람직하지 않다.The hydrogen peroxide concentration of the present invention is 1 to 30% by weight, preferably 5 to 20% by weight. If the concentration is less than 1% by weight, the oxidation effect is insufficient, and a sufficient dissolution rate is not obtained. If the addition amount is more than 30% by weight, further oxidation effect is not obtained, which is economically undesirable.
무기산은 황산, 질산, 인산, 붕산 등을 들 수 있지만, 이들 중에서 바람직한 것은 황산, 질산이다. 무기산의 농도는 1 내지 30 중량%이고, 바람직하게는 10 내지 25 중량%이다. 첨가량이 1 중량% 미만이면 충분한 용해 속도가 얻어지지 않고, 또한 첨가량이 30 중량%를 넘으면 그 이상의 용해 속도 향상이 얻어지지 않아 경제적으로 바람직하지 않다.Examples of the inorganic acid include sulfuric acid, nitric acid, phosphoric acid, and boric acid. Among these, sulfuric acid and nitric acid are preferable. The concentration of the inorganic acid is 1 to 30% by weight, preferably 10 to 25% by weight. If the addition amount is less than 1% by weight, a sufficient dissolution rate cannot be obtained. If the addition amount is more than 30% by weight, further dissolution rate improvement cannot be obtained, which is economically undesirable.
4급 암모늄염은 금속 용해 억제제로서의 효과가 있다. 주된 것으로서는 테트라메틸암모늄클로라이드, 트리메틸벤질암모늄클로라이드, 트리에틸벤질암모늄클로라이드, 트리부틸벤질암모늄클로라이드, 트리옥틸메틸암모늄클로라이드, 트리메틸도데실암모늄클로라이드, 트리메틸라우릴암모늄클로라이드, N-라우릴피리듐클로라이드, 디메틸피롤리디늄클로라이드, 트리메틸페닐암모늄브로마이드, 트리에틸벤질암모늄브로마이드, 테트라메틸암모늄브로마이드, 테트라에틸암모늄브로마이드, 테트라-n-부틸암모늄브로마이드, 디메틸피롤리디늄브로마이드, 테트라메틸암모늄요오다이드, 테트라-n-부틸암모늄요오다이드 등을 들 수 있다. 이들 중에서 바람직한 것은 테트라메틸암모늄클로라이드, 테트라메틸암모늄브로마이드, 트리메틸도데실암모늄클로라이드, 트리메틸라우릴암모늄클로라이드, 디메틸피롤리디늄클로라이드이고, 보다 바람직한 것은 트리메틸도데실암모늄클로라이드, 트리메틸라우릴암모늄클로라이드, 디메틸피롤리디늄클로라이드이다.Quaternary ammonium salts have an effect as metal dissolution inhibitors. Main examples include tetramethylammonium chloride, trimethylbenzylammonium chloride, triethylbenzylammonium chloride, tributylbenzylammonium chloride, trioctylmethylammonium chloride, trimethyldodecylammonium chloride, trimethyllaurylammonium chloride, N-laurylpyridium chloride , Dimethylpyrrolidinium chloride, trimethylphenylammonium bromide, triethylbenzylammonium bromide, tetramethylammonium bromide, tetraethylammonium bromide, tetra-n-butylammonium bromide, dimethylpyrrolidinium bromide, tetramethylammonium iodide, tetra -n-butylammonium iodide etc. are mentioned. Of these, preferred are tetramethylammonium chloride, tetramethylammonium bromide, trimethyldodecylammonium chloride, trimethyllaurylammonium chloride, dimethylpyrrolidinium chloride, and more preferred trimethyldodecylammonium chloride, trimethyllaurylammonium chloride, dimethylpyri. Lolidinium chloride.
4급 암모늄염의 농도는 0.01 내지 1 중량%이고, 바람직하게는 0.01 내지 0.5 중량%이고, 보다 바람직하게는 0.05 내지 0.5 중량%이다. 농도가 0.01 중량% 미만이면 충분한 금속 용해 억제 효과가 얻어지지 않고, 또한 첨가량이 1 중량%를 넘으면 니켈의 용해 속도가 저하되어 바람직하지 않다.The concentration of the quaternary ammonium salt is 0.01 to 1% by weight, preferably 0.01 to 0.5% by weight, more preferably 0.05 to 0.5% by weight. If the concentration is less than 0.01% by weight, sufficient metal dissolution inhibiting effect is not obtained, and if the addition amount exceeds 1% by weight, the dissolution rate of nickel is lowered, which is not preferable.
탄소수 3 내지 7의 지방족 알코올은 니켈 용해 촉진제로서의 효과가 있다. 주된 것으로서는 1-프로판올, 2-프로판올, 1-부탄올, 2-부탄올, 3-부탄올, 이소부탄올, 1-펜탄올, 2-펜탄올, 3-펜탄올, 이소펜탄올, 1-헥산올, 2-헥산올, 3-헥산올,1-헵탄올, 2-헵탄올, 3-헵탄올, 4-헵탄올 등을 들 수 있다. 이들 중에서 바람직한 것은 1-프로판올, 1-부탄올, 2-부탄올, 1-펜탄올, 1-헥산올이고, 보다 바람직한 것은 1-프로판올, 1-부탄올, 2-부탄올이다.Aliphatic alcohols having 3 to 7 carbon atoms have an effect as a nickel dissolution accelerator. The main ones include 1-propanol, 2-propanol, 1-butanol, 2-butanol, 3-butanol, isobutanol, 1-pentanol, 2-pentanol, 3-pentanol, isopentanol, 1-hexanol, 2-hexanol, 3-hexanol, 1-heptanol, 2-heptanol, 3-heptanol, 4-heptanol, etc. are mentioned. Among these, 1-propanol, 1-butanol, 2-butanol, 1-pentanol and 1-hexanol are more preferable, and 1-propanol, 1-butanol and 2-butanol.
지방족 알코올의 농도는 0.1 내지 10 중량%이고, 바람직하게는 0.5 내지 5 중량%이고, 보다 바람직하게는 0.5 내지 3 중량%이다. 첨가량이 0.1 중량% 미만이면 니켈 용해 촉진제로서의 효과가 충분히 얻어지지 않은 경우가 있고, 또한 첨가량이 10 중량%를 넘으면 그 이상의 니켈 용해 촉진제로서의 효과가 없어져 경제적으로 바람직하지 않다. 지방족 알코올은 1종류만을 첨가할 수도 있고, 2종류 이상을 첨가할 수도 있다.The concentration of aliphatic alcohol is 0.1 to 10% by weight, preferably 0.5 to 5% by weight, more preferably 0.5 to 3% by weight. If the amount is less than 0.1% by weight, the effect as a nickel dissolution accelerator may not be sufficiently obtained. If the amount is more than 10% by weight, the effect as a nickel dissolution accelerator is no longer effective, which is economically undesirable. Only one type of aliphatic alcohol may be added, or two or more types may be added.
본 발명의 박리액의 사용 온도에 관해서는 특별히 제한되지 않지만, 20 내지 50 ℃가 바람직하다. 사용 온도가 높을수록 니켈 용해 속도는 빨라지지만, 50 ℃을 초과하면 과산화수소의 분해가 심해져 바람직하지 않다.Although it does not restrict | limit especially about the use temperature of the peeling liquid of this invention, 20-50 degreeC is preferable. The higher the use temperature is, the faster the nickel dissolution rate is. However, when the temperature is higher than 50 ° C., decomposition of hydrogen peroxide is severe, which is not preferable.
본 발명의 박리액에 의한 처리 방법에 관해서는 특별히 제한되지 않지만, 침지, 분무 등의 수단에 의한다. 또한, 처리 시간에 관해서는, 용해되는 니켈 피막의 두께에 따라 적절하게 선택된다.Although it does not restrict | limit especially about the processing method by the peeling liquid of this invention, It depends on means, such as immersion and spraying. In addition, the treatment time is appropriately selected depending on the thickness of the nickel film to be dissolved.
<실시예><Example>
이하에 실시예 및 비교예에 의해 본 발명을 구체적으로 설명하지만, 본 발명은 이하의 실시예에 한정되지 않는다.Although an Example and a comparative example demonstrate this invention concretely below, this invention is not limited to a following example.
<실시예 1><Example 1>
과산화수소 5 중량%, 질산 10 중량%, 트리메틸도데실암모늄클로라이드 0.1중량% 및 1-프로판올 1 중량%를 함유하는 수용액인 박리액에, 니켈판 테스트 피스(piece)(50×30×0.3 mm), 순 구리판 테스트 피스(50×30×0.3 mm), 주석-납 도금(주석:납=9:1) 10 μm를 실시한 판(50×30×0.3 mm)을 동시에 30 ℃에서 1 분간 침지시켰다. 니켈, 순 구리, 주석 합금의 용해 속도를 표 1에 나타내었다.In a stripping solution containing an aqueous solution containing 5% by weight of hydrogen peroxide, 10% by weight of nitric acid, 0.1% by weight of trimethyldodecylammonium chloride, and 1% by weight of 1-propanol, a nickel plate test piece (50 × 30 × 0.3 mm), A pure copper plate test piece (50 × 30 × 0.3 mm) and a plate (50 × 30 × 0.3 mm) subjected to 10 μm of tin-lead plating (tin: lead = 9: 1) were simultaneously immersed at 30 ° C. for 1 minute. Table 1 shows the dissolution rates of nickel, pure copper and tin alloys.
<실시예 2><Example 2>
과산화수소 7 중량%, 황산 15 중량%, 트리메틸라우릴암모늄클로라이드 0.2 중량%, 1-부탄올 1 중량% 함유하는 박리액을 사용하는 것 이외에는, 실시예 1과 동일하게 수행하였다. 결과를 표 1에 나타내었다.The same procedure as in Example 1 was carried out except that a stripper containing 7 wt% hydrogen peroxide, 15 wt% sulfuric acid, 0.2 wt% trimethyllaurylammonium chloride, and 1 wt% 1-butanol was used. The results are shown in Table 1.
<실시예 3><Example 3>
과산화수소 3 중량%, 질산 10 중량%, 디메틸피롤리디늄클로라이드 0.05 중량%, 2-부탄올 1 중량% 함유하는 박리액을 사용하는 것 이외에는, 실시예 1과 동일하게 수행하였다. 결과를 표 1에 나타내었다.The same procedure as in Example 1 was carried out except that a stripper containing 3% by weight of hydrogen peroxide, 10% by weight of nitric acid, 0.05% by weight of dimethylpyrrolidinium chloride, and 1% by weight of 2-butanol was used. The results are shown in Table 1.
<실시예 4><Example 4>
과산화수소 5 중량%, 질산 10 중량%, 테트라메틸암모늄클로라이드 0.05 중량%, 1-프로판올 2 중량% 함유하는 박리액을 사용하는 것 이외에는, 실시예 1과 동일하였다. 결과를 표 1에 나타내었다.It was the same as that of Example 1 except using the stripper containing 5 weight% of hydrogen peroxide, 10 weight% of nitric acid, 0.05 weight% of tetramethylammonium chloride, and 2 weight% of 1-propanol. The results are shown in Table 1.
<비교예 1>Comparative Example 1
질산 10 중량%, 트리메틸도데실암모늄클로라이드 0.1 중량%, 1-프로판올 1 중량% 함유하는 박리액을 사용하는 것 이외에는, 실시예 1과 동일하게 수행하였다. 결과를 표 1에 나타내었다.The same procedure as in Example 1 was carried out except that a stripping solution containing 10% by weight of nitric acid, 0.1% by weight of trimethyldodecylammonium chloride, and 1% by weight of 1-propanol was used. The results are shown in Table 1.
<비교예 2>Comparative Example 2
과산화수소 5 중량%, 트리메틸도데실암모늄클로라이드 0.1 중량%, 1-프로판올 1 중량% 함유하는 박리액을 사용하는 것 이외에는, 실시예 1과 동일하게 수행하였다. 결과를 표 1에 나타내었다.The same procedure as in Example 1 was carried out except that a stripper containing 5% by weight of hydrogen peroxide, 0.1% by weight of trimethyldodecylammonium chloride, and 1% by weight of 1-propanol was used. The results are shown in Table 1.
<비교예 3>Comparative Example 3
과산화수소 5 중량%, 질산 10 중량%, 1-프로판올 1 중량%가 첨가된 박리액을 사용하는 것 이외에는, 실시예 1과 동일하게 수행하였다. 결과를 표 1에 나타내었다.The same procedure as in Example 1 was carried out except that a stripping solution containing 5% by weight of hydrogen peroxide, 10% by weight of nitric acid, and 1% by weight of 1-propanol was used. The results are shown in Table 1.
<비교예 4><Comparative Example 4>
과산화수소 5 중량%, 질산 10 중량%, 트리메틸도데실암모늄클로라이드 0.1 중량% 함유하는 박리액을 사용하는 것 이외에는, 실시예 1과 동일하게 수행하였다. 결과를 표 1에 나타내었다.The same procedure as in Example 1 was carried out except that a stripper containing 5% by weight of hydrogen peroxide, 10% by weight of nitric acid, and 0.1% by weight of trimethyldodecylammonium chloride was used. The results are shown in Table 1.
<비교예 5>Comparative Example 5
과산화수소 5 중량%, 질산 10 중량%, 벤조트리아졸 0.1 중량%, 1-프로판올 1 중량% 함유하는 박리액을 사용하는 것 이외에는, 실시예 1과 동일하게 수행하였다. 결과를 표 1에 나타내었다.The same procedure as in Example 1 was carried out except that a stripper containing 5% by weight of hydrogen peroxide, 10% by weight of nitric acid, 0.1% by weight of benzotriazole, and 1% by weight of 1-propanol was used. The results are shown in Table 1.
표 1에 나타낸 바와 같이, 본 발명의 박리액은 니켈의 용해량이 크고, 또한 구리, 주석-납의 용해량은 근소하였다.As shown in Table 1, in the stripping solution of the present invention, the dissolved amount of nickel was large, and the dissolved amounts of copper and tin-lead were small.
본 발명의 박리액에 의해 니켈 또는 니켈 합금 피막을 선택적으로 고속으로 용해시키는 것이 가능해진다.By the stripper of the present invention, it becomes possible to selectively dissolve the nickel or nickel alloy film at high speed.
Claims (5)
Applications Claiming Priority (2)
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JP2002157954A JP4019256B2 (en) | 2002-05-30 | 2002-05-30 | Nickel or nickel alloy stripper |
JPJP-P-2002-00157954 | 2002-05-30 |
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KR1020090089569A Division KR20090106380A (en) | 2002-05-30 | 2009-09-22 | Solution for Detaching Nickel or Nickel Alloy |
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JP2006286371A (en) * | 2005-03-31 | 2006-10-19 | Ngk Spark Plug Co Ltd | Method for manufacturing sparking plug |
KR101298766B1 (en) | 2011-05-20 | 2013-08-21 | 주식회사 익스톨 | Etching solution composites for nickel, chrome, and/or nickel-chrome alloy and etching method using the etching solution composites |
KR101495421B1 (en) * | 2013-05-03 | 2015-02-24 | 주식회사 포스코 | Gas detector, solution for quantitative analysis of nikel about nickel coated steel sheet and method using the same |
CN109112544A (en) * | 2017-06-22 | 2019-01-01 | 海门市源美美术图案设计有限公司 | A kind of selective etching liquid of nickel |
CN114156099A (en) * | 2021-12-06 | 2022-03-08 | 北京七星飞行电子有限公司 | Method for processing capacitor lead |
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JPH06322560A (en) * | 1993-05-07 | 1994-11-22 | Okuno Chem Ind Co Ltd | Nickel or nickel alloy coating film remover |
JPH08311663A (en) * | 1995-05-18 | 1996-11-26 | Merutetsukusu Kk | Release liquid for nickel coating film or nickel alloy coating film |
JPH10158869A (en) * | 1996-11-27 | 1998-06-16 | Nippon Hyomen Kagaku Kk | Chemical polishing liquid for iron-nickel alloy or iron-nickel-cobalt alloy and chemical polishing method therefor |
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JP4019256B2 (en) | 2007-12-12 |
KR100938735B1 (en) | 2010-01-26 |
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TW200401050A (en) | 2004-01-16 |
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