JP4019256B2 - Nickel or nickel alloy stripper - Google Patents
Nickel or nickel alloy stripper Download PDFInfo
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- JP4019256B2 JP4019256B2 JP2002157954A JP2002157954A JP4019256B2 JP 4019256 B2 JP4019256 B2 JP 4019256B2 JP 2002157954 A JP2002157954 A JP 2002157954A JP 2002157954 A JP2002157954 A JP 2002157954A JP 4019256 B2 JP4019256 B2 JP 4019256B2
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
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- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
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- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、ニッケルまたはニッケル合金とそれら以外の金属が存在する材料からニッケルまたはニッケル合金を選択的に溶解する剥離液に関する。本発明の剥離液は、半導体製品、プリント配線板等の電子部品の製造に有用である。
【０００２】
【従来の技術】
プリント配線板の銅配線を製造する工程で、一時的に銅配線をマスクするためにニッケルメッキ皮膜が施されるが、最終的にはニッケルメッキ皮膜は溶解して除去される。その際、最近のプリント配線板はファイン化が進んでいるため、ニッケルメッキ皮膜以外の金属を溶解させないことが要求されている。
【０００３】
ニッケル剥離液としては、過酸化水素−硝酸系、過酸化水素−フッ化物系が知られているが、いずれの剥離液も銅又は銅合金ならびに錫又は錫合金（半田）を溶解するという問題がある。又、過酸化水素−硫酸−有機酸系はニッケルの溶解速度が遅いという問題がある。従って、ニッケル又はニッケル合金皮膜を、選択的に高速度で溶解するための剥離液の早急な実用化が求められている。
【０００４】
【発明が解決しようとする課題】
本発明の目的は、ニッケルまたはニッケル合金以外の金属、特に銅および銅合金皮膜ならびに錫および錫合金皮膜を溶解せず、ニッケル又はニッケル合金皮膜を選択的に高速度で溶解するための剥離液を提供することである。
【０００５】
【問題を解決するための手段】
本発明者らは鋭意検討を重ねた結果、過酸化水素−無機酸系にニッケル溶解促進剤及び金属溶解抑制剤を添加することで、銅又は銅合金皮膜及び錫又は錫合金皮膜は溶解せず、ニッケル又はニッケル合金皮膜を選択的に高速で溶解出来ることを見出し、本発明を完成させるに至った。
【０００６】
即ち、本発明は、（ａ）過酸化水素、（ｂ）無機酸、（ｃ）第四級アンモニウム塩、および（ｄ）炭素数３〜７の脂肪族アルコールを含有する水溶液であるニッケル又はニッケル合金の剥離液に関するものである。
【０００７】
【発明の実施の形態】
本発明の過酸化水素の濃度は、１〜３０重量％であり、好ましくは５〜２０重量％である。濃度が１重量％未満では酸化効果が不十分であり十分な溶解速度が得られず、また添加量が３０重量％を越えるとそれ以上の酸化効果が得られず経済上好ましくない。
【０００８】
無機酸は、硫酸、硝酸、燐酸、硼酸等が挙げられるが、これらのうち好ましいものは、硫酸、硝酸である。無機酸の濃度は、１〜３０重量％であり、好ましくは１０〜２５重量％である。添加量が１重量％未満では十分な溶解速度が得られず、また添加量が３０重量％を越えるとそれ以上の溶解速度向上が得られず経済上好ましくない。
【０００９】
第四級アンモニウム塩は、金属溶解抑制剤としての効果がある。主なものとしては、テトラメチルアンモニウムクロライド、トリメチルベンジルアンモニウムクロライド、トリエチルベンジルアンモニウムクロライド、トリブチルベンジルアンモニウムクロライド、トリオクチルメチルアンモニウムクロライド、トリメチルドデシルアンモニウムクロライド、トリメチルラウリルアンモニウムクロライド、Ｎ−ラウリルピリジウムクロライド、ジメチルピロリジニウムクロライド、トリメチルフェニルアンモニウムブロマイド、トリエチルベンジルアンモニウムブロマイド、テトラメチルアンモニウムブロマイド、テトラエチルアンモニウムブロマイド、テトラ−ｎ−ブチルアンモニウムブロマイド、ジメチルピロリジニウムブロマイド、テトラメチルアンモニウムヨーダイド、テトラ−ｎ−ブチルアンモニウムヨーダイド等が挙げられる。これらのうち好ましいものは、テトラメチルアンモニウムクロライド、テトラメチルアンモニウムブロマイド、トリメチルドデシルアンモニウムクロライド、トリメチルラウリルアンモニウムクロライド、ジメチルピロリジニウムクロライドであり、より好ましいものはトリメチルドデシルアンモニウムクロライド、トリメチルラウリルアンモニウムクロライド、ジメチルピロリジニウムクロライドである。
【００１０】
第四級アンモニウム塩の濃度は、０．０１〜１重量％であり、好ましくは０．０１〜０．５重量％で、より好ましくは０．０５〜０．５重量％である。濃度が０．０１重量％未満では十分な金属溶解抑制効果が得られず、また添加量が１重量％を越えるとニッケルの溶解速度が低下し好ましくない。
【００１１】
炭素数３〜７の脂肪族アルコールは、ニッケル溶解促進剤としての効果がある。主なものとしては、１−プロパノール、２−プロパノール、１−ブタノール、２−ブタノール、３−ブタノール、イソブタノール、１−ペンタノール、２−ペンタノール、３−ペンタノール、イソペンタノール、１−ヘキサノール、２−ヘキサノール、３−ヘキサノール、１−ヘプタノール、２−ヘプタノール、３−ヘプタノール、４−ヘプタノール等が挙げられる。これらのうち好ましいものは１−プロパノール、１−ブタノール、２−ブタノール、１−ペンタノール、１−ヘキサノールであり、より好ましいものは１−プロパノール、１−ブタノール、２−ブタノールである。
【００１２】
脂肪族アルコールの濃度は、０．１〜１０重量％であり、好ましくは０．５〜５重量％で、より好ましくは０．５〜３重量％である。添加量が０．１重量％未満では、ニッケル溶解促進剤としての効果が十分に得られない場合があり、また添加量が１０重量％を越えるとそれ以上のニッケル溶解促進剤としての効果が無く経済上好ましくない。脂肪族アルコールは、一種類のみを添加しても良いし、二種類以上添加しても良い。
【００１３】
本発明の剥離液の使用温度に関しては特に制限はないが、２０〜５０℃が好ましい。使用温度が高いほどニッケル溶解速度は早くなるが、５０℃を越えると過酸化水素の分解が激しくなり好ましくない。
【００１４】
本発明の剥離液による処理方法に関しては、特に制限はないが浸漬、噴霧等の手段による。又、処理時間に関しては溶解されるニッケル皮膜の厚さにより適宜選択される。
【００１５】
【実施例】
以下に実施例及び比較例により、本発明を具体的に説明するが、本発明は以下の実施例に限定されるものではない。
【００１６】
実施例１
過酸化水素５重量％、硝酸１０重量％、トリメチルドデシルアンモニウムクロライド０．１重量％および１−プロパノール１重量％を含有する水溶液である剥離液に、ニッケル板テストピース（５０×３０×０．３ｍｍ）、純銅板テストピース（５０×３０×０．３ｍｍ）、錫−鉛メッキ（錫：鉛＝９：１）１０μｍを施した板（５０×３０×０．３ｍｍ）を同時に３０℃で１分間浸漬させた。ニッケル、純銅、錫合金の溶解速度を表１に示す。
【００１７】
実施例２
過酸化水素７重量％、硫酸１５重量％、トリメチルラウリルアンモニウムクロライド０．２重量％、１−ブタノール１重量％含有する剥離液を用いる以外は、実施例１と同様に行った。結果を表１に示す。
【００１８】
実施例３
過酸化水素３重量％、硝酸１０重量％、ジメチルピロリジニウムクロライド０．０５重量％、２−ブタノール１重量％含有する剥離液を用いる以外は、実施例１と同様に行った。結果を表１に示す。
【００１９】
実施例４
過酸化水素５重量％、硝酸１０重量％、テトラメチルアンモニウムクロライド０．０５重量％、１−プロパノール２重量％含有する剥離液を用いる以外は、実施例１と同様である。結果を表１に示す。
【００２０】
比較例１
硝酸１０重量％、トリメチルドデシルアンモニウムクロライド０．１重量％、１−プロパノール１重量％含有する剥離液を用いる以外は、実施例１と同様に行った。結果を表１に示す。
【００２１】
比較例２
過酸化水素５重量％、トリメチルドデシルアンモニウムクロライド０．１重量％、１−プロパノール１重量％含有する剥離液を用いる以外は、実施例１と同様に行った。結果を表１に示す。
【００２２】
比較例３
過酸化水素５重量％、硝酸１０重量％、１−プロパノール１重量％添加された剥離液を用いる以外は、実施例１と同様に行った。結果を表１に示す。
【００２３】
比較例４
過酸化水素５重量％、硝酸１０重量％、トリメチルドデシルアンモニウムクロライド０．１重量％含有する剥離液を用いる以外は、実施例１と同様に行った。結果を表１に示す。
【００２４】
比較例５
過酸化水素５重量％、硝酸１０重量％、ベンゾトリアゾール０．１重量％、１−プロパノール１重量％含有する剥離液を用いる以外は、実施例１と同様に行った。結果を表１に示す。
【００２５】
【表１】
表１に示されるように、本発明の剥離液は、ニッケルの溶解量が大きく、しかも銅、錫−鉛の溶解量はわずかであった。
【００２７】
【発明の効果】
本発明の剥離液により、ニッケル又はニッケル合金皮膜を選択的に高速で溶解することが可能となる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a stripping solution that selectively dissolves nickel or a nickel alloy from a material containing nickel or a nickel alloy and other metals. The stripping solution of the present invention is useful for producing electronic parts such as semiconductor products and printed wiring boards.
[0002]
[Prior art]
In the process of manufacturing the copper wiring of the printed wiring board, a nickel plating film is applied to temporarily mask the copper wiring, but the nickel plating film is finally dissolved and removed. At that time, since the recent printed wiring board has been made finer, it is required not to dissolve metals other than the nickel plating film.
[0003]
As the nickel stripping solution, hydrogen peroxide-nitric acid system and hydrogen peroxide-fluoride system are known, but any stripping solution has a problem of dissolving copper or copper alloy and tin or tin alloy (solder). is there. Further, the hydrogen peroxide-sulfuric acid-organic acid system has a problem that the dissolution rate of nickel is slow. Accordingly, there is a demand for rapid practical application of a stripping solution for selectively dissolving nickel or a nickel alloy film at a high speed.
[0004]
[Problems to be solved by the invention]
An object of the present invention is to provide a stripping solution for selectively dissolving nickel or nickel alloy film at a high speed without dissolving metals other than nickel or nickel alloy, particularly copper and copper alloy film and tin and tin alloy film. Is to provide.
[0005]
[Means for solving problems]
As a result of intensive studies, the present inventors did not dissolve the copper or copper alloy film and the tin or tin alloy film by adding a nickel dissolution accelerator and a metal dissolution inhibitor to the hydrogen peroxide-inorganic acid system. The inventors have found that nickel or a nickel alloy film can be selectively dissolved at high speed, and have completed the present invention.
[0006]
That is, the present invention relates to nickel or nickel which is an aqueous solution containing (a) hydrogen peroxide, (b) an inorganic acid, (c) a quaternary ammonium salt, and (d) an aliphatic alcohol having 3 to 7 carbon atoms. The present invention relates to an alloy stripping solution.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
The concentration of the hydrogen peroxide of the present invention is 1 to 30% by weight, preferably 5 to 20% by weight. If the concentration is less than 1% by weight, the oxidation effect is insufficient and a sufficient dissolution rate cannot be obtained. If the added amount exceeds 30% by weight, no further oxidation effect can be obtained, which is economically undesirable.
[0008]
Examples of the inorganic acid include sulfuric acid, nitric acid, phosphoric acid, boric acid and the like. Among these, sulfuric acid and nitric acid are preferable. The concentration of the inorganic acid is 1 to 30% by weight, preferably 10 to 25% by weight. When the addition amount is less than 1% by weight, a sufficient dissolution rate cannot be obtained, and when the addition amount exceeds 30% by weight, no further improvement in dissolution rate is obtained, which is economically undesirable.
[0009]
The quaternary ammonium salt has an effect as a metal dissolution inhibitor. The main ones are tetramethylammonium chloride, trimethylbenzylammonium chloride, triethylbenzylammonium chloride, tributylbenzylammonium chloride, trioctylmethylammonium chloride, trimethyldodecylammonium chloride, trimethyllaurylammonium chloride, N-laurylpyridium chloride, dimethyl Pyrrolidinium chloride, trimethylphenylammonium bromide, triethylbenzylammonium bromide, tetramethylammonium bromide, tetraethylammonium bromide, tetra-n-butylammonium bromide, dimethylpyrrolidinium bromide, tetramethylammonium iodide, tetra-n-butylammonium Umuyodaido, and the like. Among these, preferred are tetramethylammonium chloride, tetramethylammonium bromide, trimethyldodecylammonium chloride, trimethyllaurylammonium chloride and dimethylpyrrolidinium chloride, and more preferred are trimethyldodecylammonium chloride, trimethyllaurylammonium chloride, dimethyl Pyrrolidinium chloride.
[0010]
The concentration of the quaternary ammonium salt is 0.01 to 1% by weight, preferably 0.01 to 0.5% by weight, more preferably 0.05 to 0.5% by weight. If the concentration is less than 0.01% by weight, a sufficient metal dissolution inhibiting effect cannot be obtained, and if the added amount exceeds 1% by weight, the dissolution rate of nickel is undesirably reduced.
[0011]
The C3-C7 aliphatic alcohol has an effect as a nickel dissolution promoter. The main ones include 1-propanol, 2-propanol, 1-butanol, 2-butanol, 3-butanol, isobutanol, 1-pentanol, 2-pentanol, 3-pentanol, isopentanol, 1- Examples include hexanol, 2-hexanol, 3-hexanol, 1-heptanol, 2-heptanol, 3-heptanol, and 4-heptanol. Among these, 1-propanol, 1-butanol, 2-butanol, 1-pentanol and 1-hexanol are preferable, and 1-propanol, 1-butanol and 2-butanol are more preferable.
[0012]
The concentration of the aliphatic alcohol is 0.1 to 10% by weight, preferably 0.5 to 5% by weight, and more preferably 0.5 to 3% by weight. When the addition amount is less than 0.1% by weight, the effect as a nickel dissolution promoter may not be sufficiently obtained. When the addition amount exceeds 10% by weight, there is no further effect as a nickel dissolution promoter. Economically unfavorable. Only one type of aliphatic alcohol may be added, or two or more types may be added.
[0013]
Although there is no restriction | limiting in particular regarding the operating temperature of the peeling liquid of this invention, 20-50 degreeC is preferable. The higher the operating temperature, the faster the nickel dissolution rate. However, if the temperature exceeds 50 ° C., the decomposition of hydrogen peroxide becomes severe, which is not preferable.
[0014]
Although there is no restriction | limiting in particular regarding the processing method by the peeling liquid of this invention, By means, such as immersion and spraying. The processing time is appropriately selected depending on the thickness of the nickel film to be dissolved.
[0015]
【Example】
EXAMPLES The present invention will be specifically described below with reference to examples and comparative examples, but the present invention is not limited to the following examples.
[0016]
Example 1
To a stripping solution, which is an aqueous solution containing 5% by weight of hydrogen peroxide, 10% by weight of nitric acid, 0.1% by weight of trimethyldodecyl ammonium chloride and 1% by weight of 1-propanol, a nickel plate test piece (50 × 30 × 0.3 mm) ), A pure copper plate test piece (50 × 30 × 0.3 mm), a plate (50 × 30 × 0.3 mm) subjected to tin-lead plating (tin: lead = 9: 1) 10 μm, simultaneously at 30 ° C. for 1 minute Soaked. Table 1 shows the dissolution rates of nickel, pure copper, and tin alloy.
[0017]
Example 2
The same procedure as in Example 1 was performed except that a stripping solution containing 7% by weight of hydrogen peroxide, 15% by weight of sulfuric acid, 0.2% by weight of trimethyllauryl ammonium chloride, and 1% by weight of 1-butanol was used. The results are shown in Table 1.
[0018]
Example 3
The same procedure as in Example 1 was performed except that a stripping solution containing 3% by weight of hydrogen peroxide, 10% by weight of nitric acid, 0.05% by weight of dimethylpyrrolidinium chloride and 1% by weight of 2-butanol was used. The results are shown in Table 1.
[0019]
Example 4
The same as Example 1 except that a stripping solution containing 5% by weight of hydrogen peroxide, 10% by weight of nitric acid, 0.05% by weight of tetramethylammonium chloride and 2% by weight of 1-propanol was used. The results are shown in Table 1.
[0020]
Comparative Example 1
The same procedure as in Example 1 was performed except that a stripping solution containing 10% by weight of nitric acid, 0.1% by weight of trimethyldodecyl ammonium chloride and 1% by weight of 1-propanol was used. The results are shown in Table 1.
[0021]
Comparative Example 2
The same procedure as in Example 1 was performed except that a stripping solution containing 5% by weight of hydrogen peroxide, 0.1% by weight of trimethyldodecyl ammonium chloride and 1% by weight of 1-propanol was used. The results are shown in Table 1.
[0022]
Comparative Example 3
The same procedure as in Example 1 was carried out except that a stripping solution containing 5% by weight of hydrogen peroxide, 10% by weight of nitric acid and 1% by weight of 1-propanol was used. The results are shown in Table 1.
[0023]
Comparative Example 4
The same procedure as in Example 1 was carried out except that a stripping solution containing 5% by weight of hydrogen peroxide, 10% by weight of nitric acid and 0.1% by weight of trimethyldodecyl ammonium chloride was used. The results are shown in Table 1.
[0024]
Comparative Example 5
The same procedure as in Example 1 was performed except that a stripping solution containing 5% by weight of hydrogen peroxide, 10% by weight of nitric acid, 0.1% by weight of benzotriazole, and 1% by weight of 1-propanol was used. The results are shown in Table 1.
[0025]
[Table 1]
As shown in Table 1, the stripping solution of the present invention had a large amount of nickel dissolved and a slight amount of copper and tin-lead dissolved.
[0027]
【The invention's effect】
The stripping solution of the present invention can selectively dissolve nickel or a nickel alloy film at high speed.
Claims (4)
ッケル皮膜の剥離液であって、（ａ）過酸化水素、（ｂ）無機酸、（ｃ）トリメチルラウ
リルアンモニウムクロライドまたはジメチルピロリジニウムクロライドから選ばれた少な
くとも一種である第四級アンモニウム塩および（ｄ）炭素数３〜７の脂肪族アルコールを
含有する水溶液である銅上に施したニッケル皮膜の剥離液。 In the process of manufacturing copper wiring, the nickel plating on the copper is dissolved and removed on the copper.
A peeling liquid for a nickel film comprising: (a) hydrogen peroxide, (b) an inorganic acid, (c) trimethyl laur
A small amount selected from ril ammonium chloride or dimethyl pyrrolidinium chloride
A stripping solution for a nickel film applied on copper, which is an aqueous solution containing at least one quaternary ammonium salt and (d) an aliphatic alcohol having 3 to 7 carbon atoms.
ニウム塩０．０１〜１重量％および（ｄ）脂肪族アルコール０．１〜１０重量％を含有す
る請求項１記載の銅上に施したニッケル皮膜の剥離液。(A) hydrogen peroxide 1-30% by weight, (b) inorganic acid 1-30% by weight, (c) quaternary ammonium salt 0.01-1% by weight, and (d) aliphatic alcohol 0.1-10%. A stripping solution for a nickel film applied on copper according to claim 1, which contains wt%.
したニッケル皮膜の剥離液。The stripping solution for a nickel film applied on copper according to claim 1, wherein the inorganic acid is at least one selected from sulfuric acid and nitric acid.
ばれた少なくとも一種である請求項１記載の銅上に施したニッケル皮膜の剥離液。The stripping solution for a nickel film applied on copper according to claim 1, wherein the aliphatic alcohol is at least one selected from 1-propanol, 1-butanol and 2-butanol.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002157954A JP4019256B2 (en) | 2002-05-30 | 2002-05-30 | Nickel or nickel alloy stripper |
| TW092113984A TW589402B (en) | 2002-05-30 | 2003-05-23 | Exfoliating solution for nickel or nickel alloy |
| KR1020030034323A KR100938735B1 (en) | 2002-05-30 | 2003-05-29 | Solution for Detaching Nickel or Nickel Alloy |
| CNB031407153A CN1274880C (en) | 2002-05-30 | 2003-05-30 | Stripping lqiuid nickel or nickel alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002157954A JP4019256B2 (en) | 2002-05-30 | 2002-05-30 | Nickel or nickel alloy stripper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003342756A JP2003342756A (en) | 2003-12-03 |
| JP4019256B2 true JP4019256B2 (en) | 2007-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002157954A Expired - Lifetime JP4019256B2 (en) | 2002-05-30 | 2002-05-30 | Nickel or nickel alloy stripper |
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| Country | Link |
|---|---|
| JP (1) | JP4019256B2 (en) |
| KR (1) | KR100938735B1 (en) |
| CN (1) | CN1274880C (en) |
| TW (1) | TW589402B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286371A (en) * | 2005-03-31 | 2006-10-19 | Ngk Spark Plug Co Ltd | Method for manufacturing sparking plug |
| KR101298766B1 (en) | 2011-05-20 | 2013-08-21 | 주식회사 익스톨 | Etching solution composites for nickel, chrome, and/or nickel-chrome alloy and etching method using the etching solution composites |
| KR101495421B1 (en) * | 2013-05-03 | 2015-02-24 | 주식회사 포스코 | Gas detector, solution for quantitative analysis of nikel about nickel coated steel sheet and method using the same |
| CN109112544A (en) * | 2017-06-22 | 2019-01-01 | 海门市源美美术图案设计有限公司 | A kind of selective etching liquid of nickel |
| CN114156099A (en) * | 2021-12-06 | 2022-03-08 | 北京七星飞行电子有限公司 | Method for processing capacitor lead |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06322560A (en) * | 1993-05-07 | 1994-11-22 | Okuno Chem Ind Co Ltd | Nickel or nickel alloy coating film remover |
| JPH08311663A (en) * | 1995-05-18 | 1996-11-26 | Merutetsukusu Kk | Release liquid for nickel coating film or nickel alloy coating film |
| JPH10158869A (en) * | 1996-11-27 | 1998-06-16 | Nippon Hyomen Kagaku Kk | Chemical polishing liquid for iron-nickel alloy or iron-nickel-cobalt alloy and chemical polishing method therefor |
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2002
- 2002-05-30 JP JP2002157954A patent/JP4019256B2/en not_active Expired - Lifetime
-
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- 2003-05-23 TW TW092113984A patent/TW589402B/en not_active IP Right Cessation
- 2003-05-29 KR KR1020030034323A patent/KR100938735B1/en active IP Right Grant
- 2003-05-30 CN CNB031407153A patent/CN1274880C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR100938735B1 (en) | 2010-01-26 |
| CN1274880C (en) | 2006-09-13 |
| CN1461822A (en) | 2003-12-17 |
| TW589402B (en) | 2004-06-01 |
| TW200401050A (en) | 2004-01-16 |
| KR20030094014A (en) | 2003-12-11 |
| JP2003342756A (en) | 2003-12-03 |
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