CN114156099A - Method for processing capacitor lead - Google Patents
Method for processing capacitor lead Download PDFInfo
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- CN114156099A CN114156099A CN202111478769.0A CN202111478769A CN114156099A CN 114156099 A CN114156099 A CN 114156099A CN 202111478769 A CN202111478769 A CN 202111478769A CN 114156099 A CN114156099 A CN 114156099A
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- Prior art keywords
- lead
- capacitor
- capacitor lead
- buffer solution
- tin
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- 239000003990 capacitor Substances 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 33
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000000243 solution Substances 0.000 claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000007853 buffer solution Substances 0.000 claims abstract description 24
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000001509 sodium citrate Substances 0.000 claims abstract description 15
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims abstract description 15
- 238000002791 soaking Methods 0.000 claims abstract description 13
- 238000007598 dipping method Methods 0.000 claims abstract description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 239000011247 coating layer Substances 0.000 claims abstract description 7
- 238000005238 degreasing Methods 0.000 claims abstract description 7
- 238000005406 washing Methods 0.000 claims abstract description 5
- 238000007605 air drying Methods 0.000 claims abstract description 4
- 230000008569 process Effects 0.000 claims description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 239000010410 layer Substances 0.000 abstract description 12
- 238000000576 coating method Methods 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 4
- 150000007522 mineralic acids Chemical class 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 238000007747 plating Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000010301 surface-oxidation reaction Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/06—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00 with provision for removing metal surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/04—Drying; Impregnating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a method for processing a capacitor lead, which comprises the following steps: dissolving citric acid and sodium citrate in water according to a certain ratio to prepare weak acid buffer solution; soaking the surface of the capacitor lead in a weak acid buffer solution for a first preset time; washing the soaked capacitor lead by using clear water; carrying out alcohol degreasing and air drying on the capacitor lead washed by the clean water; and (3) carrying out hot dipping on the dried capacitor lead by using tin-lead solder to obtain the capacitor lead with a tin-lead coating layer. The sodium citrate and the citric acid in a certain proportion are dissolved in water, and the prepared weak acid buffer solution can be used for moderately and effectively treating an oxide layer on the surface of the lead so as to be beneficial to coating a new tin-lead coating layer, ensure good weldability and electric connectivity in use, and meanwhile, compared with inorganic acid, the weak acid buffer solution is more environment-friendly and is convenient to treat and recycle.
Description
Technical Field
The invention relates to the technical field of capacitor lead processing, in particular to a capacitor lead processing method.
Background
The multilayer ceramic dielectric capacitor is used for bypass, filtering, blocking and coupling in a circuit. The lead wire mounted capacitor is inserted on the circuit board by the lead wire and welded by the wave soldering process. The function of the lead wire is to achieve effective electrical connection of the capacitor to the circuit board. The material of lead wire is mostly the copper line, and in order to resist oxidation, guarantee that the weldability is good, surface tin-plating handles.
In the military field, the service time of the equipment is considered to be long, the use environment is severe, and the lead wire with a pure tin coating is not allowed to be used so as to prevent tin whisker from growing to cause circuit failure. However, with the increasing awareness of environmental protection in the whole society and the popularization of environmental regulations in China and China, the standard meeting Rohs standards is the survival baseline of tinned copper wire production enterprises, element manufacturers can hardly buy metal materials with tinned lead coatings as pins, in the field of special application, forbidden red wires with pure tin on the pin coatings can not be touched, and military electronic elements can only be specially processed by the element production enterprises in the manufacturing process. The surface oxidation layer and deplating part or all of the original plating layer of the original tin plating layer metal material are removed, and then the tin-lead plating layer which meets the requirements is formed on the surface of the newly processed material by a hot dipping tin method, but the following problems exist in the processing of the lead of the capacitor;
the hot-dip coating of the tin-lead layer is directly carried out, and due to the existence of surface oxidation layers, impurity pollutants and the like, the treatment effect is poor, and the tin-lead coating has the defects of uneven sagging, unsmooth coating, tin tip tin nodule and the like;
the lead of the capacitor is easy to be damaged by adopting fine sand paper for polishing or treating by using acid solution such as dilute hydrochloric acid and the like, the reaction degree is not easy to control, and the lead and a circuit board are easy to corrode due to residue after treatment. In addition, the inorganic acid has poor environmental friendliness, needs a special channel for recovery and harmless treatment, and has a troublesome treatment process.
Disclosure of Invention
Therefore, the invention provides a method for processing a capacitor lead wire, which solves at least one problem in the prior art.
In order to achieve the above purpose, the invention provides the following technical scheme:
the invention provides a method for processing a capacitor lead, which comprises the following steps:
dissolving citric acid and sodium citrate in water according to a certain ratio to prepare weak acid buffer solution;
soaking the surface of the capacitor lead in a weak acid buffer solution for a first preset time;
washing the soaked capacitor lead by using clear water;
carrying out alcohol degreasing and air drying on the capacitor lead washed by the clean water;
and (3) carrying out hot dipping on the dried capacitor lead by using tin-lead solder to obtain the capacitor lead with a tin-lead coating layer.
And further, carrying out hot dipping on the dried capacitor lead in tin-lead solder within a second preset time after drying.
Further, the second preset time period is 4 to 8 hours.
Further, the molar ratio of the citric acid to the sodium citrate to the water is 1.7-2.0 mol of citric acid, 0.1-0.2 mol of sodium citrate and 1L of water.
Further, the first preset time period is 20 to 120 minutes.
Furthermore, the number of times of flushing the capacitor lead by using clear water is two or more.
Further, the weak acid buffer solution in the soaking treatment process is constant in temperature.
Further, the temperature of the weak acid buffer solution in the soaking treatment process is 20-45 ℃.
Further, alcohol degreasing uses 95% alcohol.
The invention has the following advantages:
according to the method for treating the capacitor lead, the sodium citrate and the citric acid in a certain proportion are dissolved in water, and the prepared weak acid buffer solution can be used for moderately and effectively treating an oxide layer on the surface of the lead, so that a new tin-lead coating layer can be coated conveniently, good weldability and electric connectivity are ensured during use, and meanwhile, the weak acid buffer solution is more environment-friendly compared with inorganic acid and is convenient to treat and recycle.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.
FIG. 1 is a flow chart illustrating a method of processing a capacitor lead in accordance with an exemplary embodiment.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
According to an embodiment of the present invention, there is provided a method for processing a capacitor lead, as shown in fig. 1, including:
s11, dissolving citric acid and sodium citrate in water according to a certain ratio to prepare weak acid buffer solution;
s12, soaking the surface of the capacitor lead in a weak acid buffer solution for a first preset time;
s13, washing the soaked capacitor lead by using clear water;
s14, degreasing the capacitor lead washed by the clean water with alcohol and drying the capacitor lead;
and S15, carrying out hot dipping on the dried capacitor lead by using tin-lead solder to obtain the capacitor lead with the tin-lead coating layer.
According to the method for treating the capacitor lead, the sodium citrate and the citric acid in a certain proportion are dissolved in water, and the prepared weak acid buffer solution can be used for moderately and effectively treating an oxide layer on the surface of the lead, so that a new tin-lead coating layer can be coated, good weldability and electric connectivity are ensured when the method is used, and meanwhile, the weak acid buffer solution is more environment-friendly compared with inorganic acid.
And carrying out hot dipping on the dried capacitor lead in tin-lead solder within a second preset time after drying. The second preset time period is 4 to 8 hours.
The capacitor lead wire after drying carries out hot dipping with tin lead solder and goes on in 4 to 8 hours after drying, can guarantee on the one hand to dry and can not thoroughly carry out hot dipping process probably produced influence, eliminates the influence of moisture, and on the other hand, the time of also avoiding drying after too long does not carry out hot dipping and can bring new pollution for the capacitor surface. The molar ratio of the citric acid to the sodium citrate to the water is 1.7-2.0 mol of citric acid, 0.1-0.2 mol of sodium citrate and 1L of water. In the actual preparation process, 1.8mol of citric acid, 0.15mol of sodium citrate and 1L of water can be used for preparation, and the content determination process is a parameter obtained by theoretical analysis and experimental data of the inventor.
In the experimental process, if the molar ratio of citric acid to sodium citrate is 1: 1, preparing 0.1mol/L solution, and soaking the capacitor lead according to the same process steps, so that the obtained de-oxidation and deplating original plating layer has unsatisfactory effect, the surface of the capacitor lead presents non-uniform grey-white color, the new plating layer still has the conditions of non-uniform color and non-uniform brightness after hot dipping tin and lead, and simultaneously, the new plating layer has more pockmarks when touched by hands. The optimal proportioning range of the invention is found by adjusting the proportioning of two chemical reagents for a plurality of times, and the invention is applied to batch production, has stable effect and controllable quality.
The first preset time period is 20 to 120 minutes. The weak acid buffer solution in the soaking process is at a constant temperature, and the temperature of the weak acid buffer solution in the soaking process is 20-45 ℃.
The first predetermined time period is related to the temperature of the weak acid buffer solution, and may be shortened when the temperature is higher, lengthened when the temperature is lower, such as 80 minutes when the temperature of the weak acid buffer solution is 40 degrees celsius, and 100 minutes when the temperature of the weak acid buffer solution is 30 degrees celsius. For better control, soaking can be performed at constant temperature, and of course, soaking at non-constant temperature is also feasible in a room temperature environment.
The lead of the capacitor is washed twice or more times by adopting clear water. The weak acid buffer solution on the surface of the capacitor lead can be washed clean by adopting clear water for washing for many times, so that the influence on the subsequent procedures is avoided.
The alcohol degreasing adopts 95% alcohol.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (9)
1. A method of processing a capacitor lead, comprising:
dissolving citric acid and sodium citrate in water according to a certain ratio to prepare weak acid buffer solution;
soaking the surface of the capacitor lead in a weak acid buffer solution for a first preset time;
washing the soaked capacitor lead by using clear water;
carrying out alcohol degreasing and air drying on the capacitor lead washed by the clean water;
and (3) carrying out hot dipping on the dried capacitor lead by using tin-lead solder to obtain the capacitor lead with a tin-lead coating layer.
2. The method as claimed in claim 1, wherein the step of immersing the air-dried capacitor lead in tin-lead solder is performed for a second predetermined time period after the air-drying step.
3. The method as claimed in claim 2, wherein the second predetermined period of time is 4 to 8 hours.
4. The method for treating the lead wire of the capacitor as claimed in claim 1, wherein the molar ratio of the citric acid, the sodium citrate and the water is 1.7-2.0 mol of citric acid, 0.1-0.2 mol of sodium citrate and 1L of water.
5. The method as claimed in claim 1, wherein the first predetermined time period is 20 to 120 minutes.
6. The method as claimed in claim 1, wherein the number of times of rinsing the capacitor lead with clean water is two or more.
7. The method as claimed in claim 1, wherein the weak acid buffer solution is kept at a constant temperature during the soaking process.
8. The method as claimed in claim 7, wherein the weak acid buffer solution during the soaking process has a temperature of 20-45 ℃.
9. The method as claimed in claim 1, wherein the alcohol degreasing is performed with 95% alcohol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111478769.0A CN114156099A (en) | 2021-12-06 | 2021-12-06 | Method for processing capacitor lead |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111478769.0A CN114156099A (en) | 2021-12-06 | 2021-12-06 | Method for processing capacitor lead |
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| CN114156099A true CN114156099A (en) | 2022-03-08 |
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