CN109898085A - It moves back tin combination liquid and moves back tin method - Google Patents
It moves back tin combination liquid and moves back tin method Download PDFInfo
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- CN109898085A CN109898085A CN201910285094.4A CN201910285094A CN109898085A CN 109898085 A CN109898085 A CN 109898085A CN 201910285094 A CN201910285094 A CN 201910285094A CN 109898085 A CN109898085 A CN 109898085A
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- tin
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- acid
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- moves back
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 297
- 239000007788 liquid Substances 0.000 title claims abstract description 204
- 238000000034 method Methods 0.000 title claims abstract description 22
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 51
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000008367 deionised water Substances 0.000 claims abstract description 28
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 28
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 27
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000012964 benzotriazole Substances 0.000 claims abstract description 22
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 20
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 19
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims abstract description 17
- 230000007797 corrosion Effects 0.000 claims abstract description 14
- 238000005260 corrosion Methods 0.000 claims abstract description 14
- 150000007524 organic acids Chemical class 0.000 claims abstract description 14
- 230000000740 bleeding effect Effects 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 36
- 239000010949 copper Substances 0.000 claims description 36
- 229910052802 copper Inorganic materials 0.000 claims description 35
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical group CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 18
- 235000015165 citric acid Nutrition 0.000 claims description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 15
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 12
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 claims description 8
- -1 glycolic Chemical compound 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- 150000002460 imidazoles Chemical class 0.000 claims description 7
- 150000003536 tetrazoles Chemical class 0.000 claims description 7
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 6
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 6
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 5
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims description 5
- 235000005979 Citrus limon Nutrition 0.000 claims description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 239000003945 anionic surfactant Substances 0.000 claims description 4
- 150000003852 triazoles Chemical class 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 3
- ZWFDBRUSCVLUPK-BTJKTKAUSA-N (z)-but-2-enedioic acid;hexanedioic acid Chemical compound OC(=O)\C=C/C(O)=O.OC(=O)CCCCC(O)=O ZWFDBRUSCVLUPK-BTJKTKAUSA-N 0.000 claims description 3
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 3
- OQSQRYMTDPLPNY-UHFFFAOYSA-O 2,3-diethyl-1h-imidazol-3-ium Chemical compound CC[NH+]1C=CN=C1CC OQSQRYMTDPLPNY-UHFFFAOYSA-O 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- LJDSTRZHPWMDPG-UHFFFAOYSA-N 2-(butylamino)ethanol Chemical compound CCCCNCCO LJDSTRZHPWMDPG-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 3
- WFCSWCVEJLETKA-UHFFFAOYSA-N 2-piperazin-1-ylethanol Chemical compound OCCN1CCNCC1 WFCSWCVEJLETKA-UHFFFAOYSA-N 0.000 claims description 3
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 claims description 3
- KBIWNQVZKHSHTI-UHFFFAOYSA-N 4-n,4-n-dimethylbenzene-1,4-diamine;oxalic acid Chemical compound OC(=O)C(O)=O.CN(C)C1=CC=C(N)C=C1 KBIWNQVZKHSHTI-UHFFFAOYSA-N 0.000 claims description 3
- 244000248349 Citrus limon Species 0.000 claims description 3
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 claims description 3
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 claims description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Natural products OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 3
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 3
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- 229940043237 diethanolamine Drugs 0.000 claims description 3
- 229940102253 isopropanolamine Drugs 0.000 claims description 3
- 239000004310 lactic acid Substances 0.000 claims description 3
- 235000014655 lactic acid Nutrition 0.000 claims description 3
- 239000001630 malic acid Substances 0.000 claims description 3
- 235000011090 malic acid Nutrition 0.000 claims description 3
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 claims description 3
- 235000001968 nicotinic acid Nutrition 0.000 claims description 3
- 229960003512 nicotinic acid Drugs 0.000 claims description 3
- 239000011664 nicotinic acid Substances 0.000 claims description 3
- 239000002736 nonionic surfactant Substances 0.000 claims description 3
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 125000005605 benzo group Chemical group 0.000 claims description 2
- 125000003916 ethylene diamine group Chemical group 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 6
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims 1
- 244000131522 Citrus pyriformis Species 0.000 claims 1
- 238000002242 deionisation method Methods 0.000 claims 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 claims 1
- 229960004418 trolamine Drugs 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 abstract description 13
- 239000002699 waste material Substances 0.000 abstract description 11
- 230000001681 protective effect Effects 0.000 abstract description 8
- 239000010808 liquid waste Substances 0.000 abstract description 5
- 239000000779 smoke Substances 0.000 abstract description 5
- 239000011135 tin Substances 0.000 description 249
- 229910052718 tin Inorganic materials 0.000 description 246
- 239000010410 layer Substances 0.000 description 24
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 11
- 238000005530 etching Methods 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000011259 mixed solution Substances 0.000 description 6
- 229910017604 nitric acid Inorganic materials 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical compound [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 4
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000648 terne Inorganic materials 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000005864 Sulphur Substances 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 2
- GSJBKPNSLRKRNR-UHFFFAOYSA-N $l^{2}-stannanylidenetin Chemical compound [Sn].[Sn] GSJBKPNSLRKRNR-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 229910000925 Cd alloy Inorganic materials 0.000 description 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- RCEAADKTGXTDOA-UHFFFAOYSA-N OS(O)(=O)=O.CCCCCCCCCCCC[Na] Chemical compound OS(O)(=O)=O.CCCCCCCCCCCC[Na] RCEAADKTGXTDOA-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- CSBHIHQQSASAFO-UHFFFAOYSA-N [Cd].[Sn] Chemical compound [Cd].[Sn] CSBHIHQQSASAFO-UHFFFAOYSA-N 0.000 description 1
- PPIIGEJBVZHNIN-UHFFFAOYSA-N [Cu].[Sn].[Pb] Chemical compound [Cu].[Sn].[Pb] PPIIGEJBVZHNIN-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000004630 mental health Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229940051841 polyoxyethylene ether Drugs 0.000 description 1
- 229920000056 polyoxyethylene ether Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000000837 restrainer Substances 0.000 description 1
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Abstract
Tin combination liquid is moved back the present invention provides one kind and moves back tin method.Moving back tin combination liquid includes that moving back of individually storing and moves back tin B liquid at tin A liquid, and moving back tin A liquid with the weight percent for moving back tin B liquid is 1:0.2~1.2.Move back each component that tin A liquid includes following weight percent: sulfuric acid 30~40%, hydrogen peroxide 1~5%, organic acid 5~10%, bleeding agent 0.5~1.5%, corrosion inhibiter 1~3%, promotor 0.5~1.5%, deionized water surplus；Move back each component that tin B liquid includes following weight percent: ferric trichloride 5~15%, benzotriazole 2~8%, citric acid 0.5~5%, deionized water surplus.Of the invention moves back tin combination liquid when stripping metallic tin or tin alloy layers, and it is fast to move back tin speed, and moves back non smoke volatilization generation during tin, solves and moves back tin combination liquid in use to the pollution problem of air.Liquid waste processing after moving back tin is simple, solves the problems, such as waste liquid to water resource pollution, moves back the environmentally protective of tin combination liquid to realize.
Description
Technical field
The present invention relates to wiring board processing technique field, in particular to one kind moves back tin combination liquid and moves back tin method.
Background technique
In printed wiring board manufacturing, substrate is first generally subjected to electro-coppering, graphic plating is then carried out in layers of copper
Tin or tin alloy later etch the layers of copper that do not protected by tin layers, and retain the tin layers for being plated to figure or tin alloy layers and its cover
The bottom copper of lid.It needs to remove the tin layers of copper excess surface and tin alloy layers after the completion of etching work procedure, that is, moves back tin process.
Currently, it is traditional move back tin combination liquid and generally include fluorine-containing type etching agent, organic acid type etching agent and nitric acid type move back tin
Agent.But fluorine-containing type etching agent can release toxic fluoro-gas in process of production, and since fluoride is easy attack corruption
The glass fiber component for losing board substrate insulating layer, causes substrate to be easily damaged, while fluorine-containing type etching agent moves back moving back after tin
Tin waste liquid is difficult to handle.Not only cost of material is at high cost for organic acid type etching agent, and contains large amount of organic in tin removal waste liquor, place
It is big to manage difficulty.Violent chemical reaction occurs for nitric acid type etching agent nitric acid and tin, copper metal during moving back tin, releases a large amount of
Nitrogen oxide NOx smog and pollute workshop and ambient enviroment, work in such circumstances for a long time and human body physical and mental health caused to hurt
Evil.And contain a large amount of nitric acid in tin removal waste liquor, therefore the liquid waste processing difficulty discharged after recycling metal in tin removal waste liquor is big.
Summary of the invention
The purpose of the present invention is to provide it is a kind of it is environmentally protective move back tin combination liquid and move back tin method, to solve the prior art
The problems in.
In order to solve the above technical problems, the present invention, which provides one kind, moves back tin combination liquid, moves back tin A liquid including what is individually stored and move back
Tin B liquid, in which: it is described move back tin A liquid include following weight percent each component: sulfuric acid 30-40%, hydrogen peroxide 1~5%,
Organic acid 5~10%, bleeding agent 0.5~1.5%, corrosion inhibiter 1~3%, promotor 0.5~1.5%, deionized water surplus；Institute
State each component for moving back that tin B liquid includes following weight percent: ferric trichloride 5~15%, benzotriazole 2~8%, citric acid
0.5~5%, deionized water surplus.
In a wherein embodiment, the weight percent for moving back tin A liquid and moving back tin B liquid is 1:(0.2~1.2).
It is described to move back each component that tin A liquid includes following weight percent: sulfuric acid 35%, mistake in a wherein embodiment
Hydrogen oxide 2%, organic acid 8%, bleeding agent 1%, corrosion inhibiter 2%, promotor 1%, deionized water surplus；It is described to move back tin B liquid packet
Each component containing following weight percent: ferric trichloride 10%, benzotriazole 5%, citric acid 3%, deionized water surplus.
In a wherein embodiment, the organic acid is selected from methane sulfonic acid, acetic acid, propionic acid, acrylic acid, ethanedioic acid, third
In diacid, succinic acid, glutaric acid, adipic acid maleic acid, glycolic, lactic acid, malic acid and citric acid, sulfamic acid and niacin
It is one or more.
In a wherein embodiment, the organic acid is selected from one of acetic acid, methane sulfonic acid and sulfamic acid or more
Kind.
In a wherein embodiment, the bleeding agent is selected from propylene glycol, ethylene glycol monobutyl ether, non-ionic surface active
One of agent, anionic surfactant or multiple combinations.
In a wherein embodiment, the bleeding agent is selected from one or both of propylene glycol, ethylene glycol monobutyl ether group
It closes.
In a wherein embodiment, the corrosion inhibiter is selected from imidazoles, 2-methylimidazole, 1,2- diethyl imidazolium, benzo
One of imidazoles, triazole and benzotriazole, methylbenzotrazole, tetrazole, 5- methyl benzo tetrazole, 5- aminotetrazole
Or it is several.
In a wherein embodiment, the corrosion inhibiter is selected from one or more of imidazoles, tetrazole, benzotriazole
Combination.
In a wherein embodiment, the promotor be selected from ethylenediamine, monoethanolamine, cyclohexylamine, N- methylethanolamine,
N- ehtylethanolamine, N- butylethanolamine, N, N- dimethylethanolamine, diethanol amine, N methyldiethanol amine, triethanolamine,
One of isopropanolamine, hydroxyethyl piperazine or multiple combinations.
In a wherein embodiment, the promotor be selected from one of monoethanolamine, cyclohexylamine or triethanolamine or
Multiple combinations.
The present invention also provides one kind to move back tin method, combines liquid using tin is moved back described in item as above, comprising the following steps:
S1, at 10~50 DEG C of temperature, by tin plating copper-clad plate be soaked in it is described move back the moving back 30 in tin A liquid of tin combination liquid~
It 120 seconds, completes to move back tin for the first time, obtains copper sheet；
S2, the copper sheet is washed using deionized water；
S3, at 10~50 DEG C of temperature, the copper sheet after washing is soaked in and described moves back the moving back in tin B liquid of tin combination liquid
15~30 seconds.
As shown from the above technical solution, the advantages and positive effects of the present invention are:
It is of the invention move back tin combination liquid include individually store move back tin A liquid and move back tin B liquid, first pass through and move back tin A liquid to tin layers
It carries out quickly and largely strips work, then tin layers and the copper-tin alloy of copper junction are stripped by moving back tin B liquid, i.e., it is complete
Tin work is moved back on copper-clad plate material.And move back tin combination liquid and stripping metallic tin or when tin alloy layers, it is fast to move back tin speed, moves back tin mistake
Non smoke volatilization generates in journey, solves and moves back tin combination liquid in use to the pollution problem of air.Liquid waste processing after moving back tin
Simply, it solves the problems, such as waste liquid to water resource pollution, moves back the environmentally protective of tin combination liquid to realize.
Detailed description of the invention
Fig. 1 is the flow chart that the present invention moves back tin method.
Specific embodiment
The exemplary embodiment for embodying feature of present invention and advantage will describe in detail in the following description.It should be understood that
The present invention can have various variations in different embodiments, neither depart from the scope of the present invention, and theory therein
Bright and diagram inherently is illustrated as being used, rather than to limit the present invention.
Principle and structure in order to further illustrate the present invention carry out the preferred embodiment of the present invention now in conjunction with attached drawing detailed
It describes in detail bright.
The present invention provides one kind and moves back tin combination liquid, carries out moving back Xi Chu to plate suitable for printed circuit board manufacturing process
Reason.This, which moves back tin combination liquid, can be used for stripping metallic tin and tin alloy layers on printed circuit board.
Wherein, tin alloy can be terne metal, can also be sn-ag alloy, sn-bi alloy, tin cadmium alloy, tin-indium alloy
Or other alloys.
In addition, carried out on the plate for cover copper it is tin plating after, also will form 0.05-0.10 micron thickness between copper and tin engaging portion
Copper-tin alloy layer.It is understood that cover the plate terne coating of copper, then it can also shape between copper and terne metal engaging portion
At copper-lead-tin.Also in this way, will not repeat them here between other tin alloys and the engaging portion of copper.
Tin combination liquid is moved back when stripping metallic tin and tin alloy coat in the present invention, it is fast to move back tin speed, and move back tin process
Middle non smoke volatilization generates, and solves and moves back tin combination liquid in use to the pollution problem of air.Liquid waste processing letter after moving back tin
It is single, it solves the problems, such as waste liquid to water resource pollution, moves back the environmentally protective of tin combination liquid to realize.
It this is described in detail in detail below moves back tin combination liquid and move back tin principle.
Moving back tin combination liquid includes that moving back of individually storing and moves back tin B liquid at tin A liquid, moves back tin A liquid and moves back the weight percent of tin B liquid
For 1:(0.2~1.2).
Wherein, moving back tin A liquid includes sulfuric acid, hydrogen peroxide, organic acid, bleeding agent, corrosion inhibiter, promotor and deionized water.
This move back tin A liquid move back tin key reaction formula it is as follows:
Sn+H2SO4+H2O2=SnSO4+2H2O
Cu+H2SO4+H2O2=CuSO4+2H2O
Formula can be seen that the reaction and generate without gas from the reactions above, and the component of effluent after moving back tin is simple, and most of is sulphur
Sour stannous, only a small amount of copper ion.Stannous sulfate cooperation reclaimer can recycle most tin, tin metal recycling
Waste liquid afterwards can also reuse, and then realize and move back the environmentally protective of tin combination liquid.
In the reaction, the reaction speed of tin and sulfuric acid, hydrogen peroxide is fast, can reach 5-10 [mu.
In above-mentioned reaction, the main function of sulfuric acid is to react with metallic tin and dissolve tin, hydrogen peroxide as oxidant,
Tin and copper can be oxidized to stannous oxide and copper oxide, sulfuric acid reacts with stannous oxide and copper oxide and dissolves tin and copper and tin conjunction
Gold.
Organic acid inhibits the solution rate of copper for improving Theil indices in solution.Organic acid be selected from methane sulfonic acid, acetic acid,
Propionic acid, acrylic acid, ethanedioic acid, malonic acid, succinic acid, glutaric acid, adipic acid maleic acid, glycolic, lactic acid, malic acid and lemon
One of acid, sulfamic acid and niacin are a variety of.
Bleeding agent makes this move back tin combination liquid and is easier to infiltration tin or tin alloy for reducing the surface tension for moving back tin combination liquid.
Bleeding agent is selected from one of propylene glycol, ethylene glycol monobutyl ether, nonionic surfactant, anionic surfactant or a variety of
Combination.Nonionic surfactant such as OP-10, fatty alcohol polyoxyethylene ether, anionic surfactant such as detergent alkylate sulphur
Hydrochlorate, lauryl sodium sulfate.
Corrosion inhibiter is for inhibiting corrosion of metal.Corrosion inhibiter is selected from imidazoles, 2-methylimidazole, 1,2- diethyl imidazolium, benzene
And imidazoles, triazole and benzotriazole, methylbenzotrazole, tetrazole, 5- methyl benzo tetrazole, one in 5- aminotetrazole
Kind is several.
Promotor is used for stable peroxide hydrogen, and then improves and move back tin speed, reduces tin ion Precipitation.Promotor is selected from
Ethylenediamine, monoethanolamine, cyclohexylamine, N- methylethanolamine, N- ehtylethanolamine, N- butylethanolamine, N, N- dimethyl ethanol
One of amine, diethanol amine, N methyldiethanol amine, triethanolamine, isopropanolamine, hydroxyethyl piperazine or multiple combinations.
Move back tin A liquid to complete etching work procedure after tin layers carry out moving back tin, and move back tin A liquid be basically completed it is big on copper-clad plate material
The stripping of part tin.
Moving back tin B liquid includes ferric trichloride, benzotriazole, citric acid and deionized water.This moves back tin B liquid and moves back the main anti-of tin
Answer formula as follows:
2FeCl3+ Sn=SnCl2+2FeCl2
2FeCl3+ Cu=CuCl2+2FeCl2
Wherein, ferric trichloride dissolution tin and copper, to complete the stripping of the copper-tin alloy of tin layers and copper junction.
Benzotriazole and copper form complex compound as protective film, prevent the corrosion of copper, and then reach the corruption for inhibiting copper
The effect of erosion.
Citric acid and copper complexing and bright copper face.
After moving back tin A liquid to the stripping for covering on tin copper sheet most of tin layers, moves back tin B liquid and further strip and cover on tin copper sheet
Tin and tin alloy in small-bore, guarantee the quality of final printed circuit board.
Moving back tin combination liquid includes that moving back of individually storing and moves back tin B liquid at tin A liquid, first pass through move back tin A liquid tin layers are carried out it is quick
And largely strip work, then strip to tin layers and the copper-tin alloy of copper junction by moving back tin B liquid, i.e. completion copper-clad plate
Tin work is moved back on material.
This move back tin combination liquid to move back tin method as follows:
S1, at 10~50 DEG C of temperature, tin plating copper-clad plate is soaked in and moves back tin combination liquid and moves back in tin A liquid 30~120 seconds,
It completes to move back tin for the first time, obtains copper sheet；
S2, copper sheet is washed using deionized water；
S3, at 10~50 DEG C of temperature, the copper sheet after washing is soaked in and moves back tin combination liquid and moves back 15~30 in tin B liquid
Second.
Moving back tin carries out stripping work to a large amount of tin layers of tin plating copper-clad plate by moving back tin A liquid for the first time, after washing
Tin layers and the copper-tin alloy of copper junction are stripped by moving back tin B liquid again.Using two-step method, respectively to the tin and tin on surface layer
Layer and the copper-tin alloy of copper junction are stripped, and are adequately protected copper, be ensure that the quality of wiring board.
The content of each component is introduced by the following examples.
Embodiment 1
For preparing and move back tin A liquid and move back each 1kg of tin B liquid, moves back tin combination liquid each component and content is as follows:
Move back tin A liquid:
The present embodiment 1 moves back tin A liquid making method, comprising the following steps:
A1 measures 98% concentrated sulfuric acid of 163.04mL, is slowly added in deionized water while stirring, it is molten to obtain sulfuric acid
Liquid；
A2 measures 17.73mL hydrogen peroxide, is added in sulfuric acid solution, obtains mixed solution |；
A3 measures 33.80mL methane sulfonic acid, and 4.83mL propylene glycol and 9.80mL monoethanolamine are added in sulfuric acid solution,
Stirring is allowed to uniformly mixed, obtains mixed solution II；
A3, weighs 10.00g tetrazole, and mixed solution is added | in, stirring makes tetrazole dissolve and be uniformly mixed, then plus
Enter mixed solution II to continue to stir, be uniformly mixed, and deionized water, which is added, makes weight 1Kg to get to moving back tin A liquid.
Move back tin B liquid:
Ferric trichloride 50.00g
Benzotriazole 20.00g
Citric acid 30.00g
Deionized water surplus.
The present embodiment 1 moves back tin B liquid making method, comprising the following steps:
A1, weighs the ferric trichloride of 50.00g, and the benzotriazole of 20.00g is dissolved in deionized water, is mixed
Solution III；
A2 measures the citric acid of 30.00mL, is added in above-mentioned mixed solution III, is uniformly mixed, and deionized water is added to make
Weight is 1Kg to get to moving back tin B liquid.
It is 1:(0.2~1.2 that basis, which moves back tin A liquid with the weight percent for moving back tin B liquid, when in use) it carries out moving back tin.
Embodiment 2
For preparing and move back tin A liquid 1 and move back each 1kg of tin B liquid, moves back tin combination liquid each component and content is as follows:
Move back tin A liquid:
Move back tin B liquid:
Ferric trichloride 150.00g
Benzotriazole 80.00g
Citric acid 3.00g
Deionized water surplus.
Moving back for the present embodiment and moves back the preparation method reference implementation example 1 of tin B liquid at tin A liquid, and details are not described herein.
It is 1:(0.2~1.2 that basis, which moves back tin A liquid with the weight percent for moving back tin B liquid, when in use) it carries out moving back tin.
Embodiment 3
For preparing and move back tin A liquid and move back each 1kg of tin B liquid, moves back tin combination liquid each component and content is as follows:
Move back tin A liquid:
Move back tin B liquid:
Ferric trichloride 80.00g
Benzotriazole 40.00g
Citric acid 12.00g
Deionized water surplus.
Moving back for the present embodiment and moves back the preparation method reference implementation example 1 of tin B liquid at tin A liquid, and details are not described herein.
It is 1:(0.2~1.2 that basis, which moves back tin A liquid with the weight percent for moving back tin B liquid, when in use) it carries out moving back tin.
Embodiment 4
For preparing and move back tin A liquid and move back each 1kg of tin B liquid, moves back tin combination liquid each component and content is as follows:
Move back tin A liquid:
Move back tin B liquid:
Ferric trichloride 120.00g
Benzotriazole 6.00g
Citric acid 24.00g
Deionized water surplus.
Moving back for the present embodiment and moves back the preparation method reference implementation example 1 of tin B liquid at tin A liquid, and details are not described herein.
It is 1:(0.2~1.2 that basis, which moves back tin A liquid with the weight percent for moving back tin B liquid, when in use) it carries out moving back tin.
Embodiment 5
For preparing and move back tin A liquid and move back each 1kg of tin B liquid, moves back tin combination liquid each component and content is as follows:
Move back tin A liquid:
Move back tin B liquid:
Ferric trichloride 100.00g
Benzotriazole 30.00g
Citric acid 18.00g
Deionized water surplus.
Moving back for the present embodiment and moves back the preparation method reference implementation example 1 of tin B liquid at tin A liquid, and details are not described herein.
It is 1:(0.2~1.2 that basis, which moves back tin A liquid with the weight percent for moving back tin B liquid, when in use) it carries out moving back tin.
Embodiment 6
For preparing and move back tin A liquid and move back each 1kg of tin B liquid, moves back tin combination liquid each component and content is as follows:
Move back tin A liquid:
Move back tin B liquid:
Ferric trichloride 100.00g
Benzotriazole 30.00g
Citric acid 18.00g
Deionized water surplus.
Moving back for the present embodiment and moves back the preparation method reference implementation example 1 of tin B liquid at tin A liquid, and details are not described herein.
It is 1:(0.2~1.2 that basis, which moves back tin A liquid with the weight percent for moving back tin B liquid, when in use) it carries out moving back tin.
Embodiment 7
For preparing and move back tin A liquid and move back each 1kg of tin B liquid, moves back tin combination liquid each component and content is as follows:
Move back tin A liquid:
Move back tin B liquid:
Ferric trichloride 100.00g
Benzotriazole 30.00g
Citric acid 18.00g
Deionized water surplus.
Moving back for the present embodiment and moves back the preparation method reference implementation example 1 of tin B liquid at tin A liquid, and details are not described herein.
It is 1:(0.2~1.2 that basis, which moves back tin A liquid with the weight percent for moving back tin B liquid, when in use) it carries out moving back tin.
Embodiment 8
For preparing and move back tin A liquid and move back each 1kg of tin B liquid, moves back tin combination liquid each component and content is as follows:
Move back tin A liquid:
Move back tin B liquid:
Ferric trichloride 100.00g
Benzotriazole 30.00g
Citric acid 18.00g
Deionized water surplus.
Moving back for the present embodiment and moves back the preparation method reference implementation example 1 of tin B liquid at tin A liquid, and details are not described herein.
It is 1:(0.2~1.2 that basis, which moves back tin A liquid with the weight percent for moving back tin B liquid, when in use) it carries out moving back tin.
Embodiment 9
For preparing and move back tin A liquid and move back each 1kg of tin B liquid, moves back tin combination liquid each component and content is as follows:
Move back tin A liquid:
Move back tin B liquid:
Ferric trichloride 100.00g
Benzotriazole 30.00g
Citric acid 18.00g
Deionized water surplus.
Moving back for the present embodiment and moves back the preparation method reference implementation example 1 of tin B liquid at tin A liquid, and details are not described herein.
It is 1:(0.2~1.2 that basis, which moves back tin A liquid with the weight percent for moving back tin B liquid, when in use) it carries out moving back tin.
Comparative example 1
Its tin stripping liquid includes each component of following weight percent:
68% nitric acid 50%, ferric nitrate 10%, benzotriazole 5%, restrainer lan-826 3%, deionized water
Surplus.
Comparative example 2
Tin commodity are moved back in market sale, are nitric acid-ferric nitrate system.
Comparative example 3
Tin commodity are moved back in market sale, are nitric acid system.
Tin plating copper-clad plate (tin plating thickness 5-10um) is cut into 50mm × 50mm size, as test substrate, is used
Tin speed and erosion amount of copper are moved back in the tin combination liquid test of moving back prepared, and observe copper-clad plate face phenomenon.It is combined using the tin that moves back of embodiment 1-9
The tin stripping liquid of liquid and comparative example 1-3 carry out moving back tin at a temperature of 30 DEG C.The tin combination liquid that moves back of embodiment 1-9 is moved back using of the invention
Tin method carries out moving back tin, and comparative example 1 carries out moving back tin according to its corresponding method.
After moving back tin, by the weight of the test substrate before and after calculation processing, etching speed is calculated according to the following formula.
Move back tin speed (μm/minute)=[weight (g)-treated weight (g)] before processing ÷ substrate area (m2)÷
7.28(g/cm3) ÷ processing time (minute)；
Sting copper speed (μm/minute)=[weight (g)-treated weight (g)] before processing ÷ substrate area (m2)÷
8.92(g/cm3) ÷ processing time (minute)
Test result is as shown in table 1.
Table 1
As can be seen from the above table, of the invention to move back tin combination liquid to move back tin speed fast, and non smoke volatilization produces during moving back tin
It is raw, it solves and moves back tin combination liquid in use to the pollution problem of air.Liquid waste processing after moving back tin is simple, solves waste liquid pair
The problem of water resource pollution, moves back the environmentally protective of tin combination liquid to realize.
As shown from the above technical solution, the advantages and positive effects of the present invention are:
It is of the invention move back tin combination liquid include individually store move back tin A liquid and move back tin B liquid, first pass through and move back tin A liquid to tin layers
It carries out quickly and largely strips work, then tin layers and the copper-tin alloy of copper junction are stripped by moving back tin B liquid, i.e., it is complete
Tin work is moved back on copper-clad plate material.And tin combination liquid is moved back when stripping metallic tin or tin alloy layers, it is fast to move back tin speed, and move back tin
Non smoke volatilization in the process generates, and solves and moves back tin combination liquid in use to the pollution problem of air.At waste liquid after moving back tin
Reason is simple, solves the problems, such as waste liquid to water resource pollution, moves back the environmentally protective of tin combination liquid to realize.
Although describing the present invention with reference to several exemplary embodiments, it is to be understood that, term used be explanation and
Term exemplary, and not restrictive.Due to the present invention can be embodied in a variety of forms without departing from invention spirit or
Essence, it should therefore be appreciated that above embodiment is not limited to any of the foregoing details, and should be defined by the appended claims
The whole change and modification widely explained, therefore fallen into claim or its equivalent scope in spirit and scope all should be with
Attached claim is covered.
Claims (12)
1. one kind moves back tin combination liquid, which is characterized in that tin A liquid and move back tin B liquid including moving back of individually storing, in which:
It is described to move back each component that tin A liquid includes following weight percent: sulfuric acid 30-40%, hydrogen peroxide 1~5%, organic acid 5
~10%, bleeding agent 0.5~1.5%, corrosion inhibiter 1~3%, promotor 0.5~1.5%, deionized water surplus；
It is described to move back each component that tin B liquid includes following weight percent: ferric trichloride 5~15%, benzotriazole 2~8%, lemon
Lemon acid 0.5~5%, deionized water surplus.
2. according to claim 1 move back tin combination liquid, which is characterized in that the weight percent moved back tin A liquid and move back tin B liquid
Than for 1:(0.2~1.2).
3. according to claim 1 move back tin combination liquid, which is characterized in that the tin A liquid that moves back includes following weight percent
Each component: sulfuric acid 35%, hydrogen peroxide 2%, organic acid 8%, bleeding agent 1%, corrosion inhibiter 2%, promotor 1%, deionization
Water surplus；
It is described to move back each component that tin B liquid includes following weight percent: ferric trichloride 10%, benzotriazole 5%, citric acid
3%, deionized water surplus.
4. according to claim 1 move back tin combination liquid, which is characterized in that the organic acid is selected from methane sulfonic acid, acetic acid, third
Acid, acrylic acid, ethanedioic acid, malonic acid, succinic acid, glutaric acid, adipic acid maleic acid, glycolic, lactic acid, malic acid and lemon
One of acid, sulfamic acid and niacin are a variety of.
5. it is according to claim 4 move back tin combination liquid, which is characterized in that the organic acid be selected from acetic acid, methane sulfonic acid and
One of sulfamic acid is a variety of.
6. according to claim 1 move back tin combination liquid, which is characterized in that the bleeding agent is selected from propylene glycol, ethylene glycol list
One of butyl ether, nonionic surfactant, anionic surfactant or multiple combinations.
7. according to claim 6 move back tin combination liquid, which is characterized in that the bleeding agent is selected from propylene glycol, ethylene glycol list
The combination of one or both of butyl ether.
8. it is according to claim 1 move back tin combination liquid, which is characterized in that the corrosion inhibiter be selected from imidazoles, 2-methylimidazole,
1,2- diethyl imidazolium, benzimidazole, triazole and benzotriazole, methylbenzotrazole, tetrazole, 5- methyl benzo tetrazole,
One or more of 5- aminotetrazole.
9. according to claim 8 move back tin combination liquid, which is characterized in that the corrosion inhibiter is selected from imidazoles, tetrazole, benzo
The combination of one or more of triazole.
10. according to claim 1 move back tin combination liquid, which is characterized in that the promotor is selected from ethylenediamine, monoethanol
Amine, cyclohexylamine, N- methylethanolamine, N- ehtylethanolamine, N- butylethanolamine, N, N- dimethylethanolamine, diethanol amine, N-
One of methyl diethanolamine, triethanolamine, isopropanolamine, hydroxyethyl piperazine or multiple combinations.
11. according to claim 10 move back tin combination liquid, which is characterized in that the promotor is selected from monoethanolamine, hexamethylene
One of amine or triethanolamine or multiple combinations.
12. one kind moves back tin method, which is characterized in that move back tin combination liquid, packet using as described in claim 1-11 any one
Include following steps:
Tin plating copper-clad plate is soaked in the tin that moves back and combines moving back in tin A liquid 30~120 seconds for liquid by S1 at 10~50 DEG C of temperature,
It completes to move back tin for the first time, obtains copper sheet；
S2, the copper sheet is washed using deionized water；
S3, at 10~50 DEG C of temperature, by the copper sheet after washing be soaked in it is described move back the moving back 15 in tin B liquid of tin combination liquid~
30 seconds.
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| CN112111741A (en) * | 2020-09-25 | 2020-12-22 | 深圳市祺鑫环保科技有限公司 | Tin stripping liquid copper protecting agent and tin stripping liquid |
| CN112553627A (en) * | 2020-12-09 | 2021-03-26 | 淮安中顺环保科技有限公司 | Two-stage tin stripping method |
| US20210269971A1 (en) * | 2020-02-28 | 2021-09-02 | Sixring Inc. | Modified alkanesulfonic acid and uses thereof |
| US20210309935A1 (en) * | 2020-04-03 | 2021-10-07 | Fluid Energy Group Ltd. | Hard Surface Cleaner |
| CN114156099A (en) * | 2021-12-06 | 2022-03-08 | 北京七星飞行电子有限公司 | Method for processing capacitor lead |
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| CN110760922A (en) * | 2019-10-30 | 2020-02-07 | 昆山金易得环保科技有限公司 | Tin stripping liquid, method for removing tin-containing layer on substrate and method for recovering tin |
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| US20210309935A1 (en) * | 2020-04-03 | 2021-10-07 | Fluid Energy Group Ltd. | Hard Surface Cleaner |
| US11965145B2 (en) * | 2020-04-03 | 2024-04-23 | Fluid Energy Group Ltd | Hard surface cleaner |
| CN112111741A (en) * | 2020-09-25 | 2020-12-22 | 深圳市祺鑫环保科技有限公司 | Tin stripping liquid copper protecting agent and tin stripping liquid |
| CN112553627A (en) * | 2020-12-09 | 2021-03-26 | 淮安中顺环保科技有限公司 | Two-stage tin stripping method |
| US20220267954A1 (en) * | 2021-02-25 | 2022-08-25 | Sixring Inc. | Modified sulfuric acid and uses thereof |
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| US20220267951A1 (en) * | 2021-02-25 | 2022-08-25 | Sixring Inc. | Modified sulfuric acid and uses thereof |
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| US11965289B2 (en) * | 2021-02-25 | 2024-04-23 | Sixring Inc. | Modified sulfuric acid and uses thereof |
| CN114156099A (en) * | 2021-12-06 | 2022-03-08 | 北京七星飞行电子有限公司 | Method for processing capacitor lead |
| CN116583026A (en) * | 2023-07-13 | 2023-08-11 | 深圳市板明科技股份有限公司 | Tin stripping method for IC carrier plate and application thereof |
| CN116583026B (en) * | 2023-07-13 | 2023-09-08 | 深圳市板明科技股份有限公司 | Tin stripping method for IC carrier plate and application thereof |
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